STA2062 Cartesio™ Infotainment application processor with embedded GPS Data Brief Features ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ High performance ARM926 MCU (up to 333MHz) MCU memory organization – Cache: 16KByte instruction, 16KByte data – 8KByte instruction TCM (tightly coupled memory) – 8KByte data TCM – 32KByte embedded ROM for boot – Two banks of 64KByte embedded SRAM – 512Byte embedded SRAM for back-up – 4GByte total linear address space – Memory extension through: Flexible static memory controller-FSMC (NOR/NAND Flash, CF/CF+, ROM, SRAM support) Mobile DDR/SDRAM controller: 16bit data @166MHz, 2 Chip Select, 512Kbit each Interrupt – 64-channel interrupt controller (VIC) – 16-vectorized interrupts with 16 programmable priority Level DMA – Two 8-channel double port system DMA controllers – 32 DMA request for each controller – Two external DMA requests are supported 32 channel high performance GPS correlation embedded subsystem Eight 32-bit free running timers/counters Four 16-bit extended function timer (EFT) with input capture/output compare and PWM Real time clock (RTC) Pulse width light modulator (PWL) 32-bit watchdog timer Four autobaud UART with 64X8 transmit and 64x12 receive FIFO with DMA and hardware flow control One IrDA(SIR/MIR/FIR) interface Three I2C multi-master/slave interfaces Two synchronous serial port (SSP) with 32x32 separate transmit and receive FIFO with Motorola-SPI, National-MicroWire and TexasSSI support modes October 2007 LFBGA361 (16x16x1.4mm) ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ Four multichannel serial ports (MSP) with 32x8 separate transmit and receive FIFO Color LCD controller for STN,TFT or HR-TFT panels USB 2.0 OTG high speed dual role controller (ULPI interface) USB full speed dual role controller with integrated 1.1 physical layer transceiver Two secure-digital multimedia memory card Interface (SD/SDIO/MMC) up to 8 bit data SPDIF input interface C3 hardware Reed-Solomon decoder Hardware sample rate converter (SaRaC) Two controller area network (CAN) Four 32-bit GPIO ports JTAG based in-circuit emulator (ICE) with embedded medium trace module Typical working condition: Vdd: 1.2 ±10%V, VIO: 1.8V Overdrive: Vdd: 1.4 ±5%V, VIO: 1.8 ±10%V, 2.5 ±10%V Bus frequency: 166 MHz (overdrive) Bus/DDR frequency: 166 MHz HCMOS 0.90µm process Package: – LFBGA16x16x1.4mm (19x19balls) – 0.8mm ball pitch, (0.4mm ball) – Full array Ambient temperature range: -40 / +85°C Table 1. Rev 2 For further information contact your local STMicroelectronics sales office. Device summary Order code Package Packing STA2062 LFBGA361 Tray 1/5 www.st.com 5 2/5 MSP(0,1,2,3) M APB SPDIFIN IOs SaRaC BD CHITF C3 SPDIF EFT(0,3) APB I/F APB I/F APB I/F APB I/F PORT SDMC VDD12 VDD33 VDDPLL PLL Audio & Automotive Bridge SUPPLY CORE S S S AHB / APB USB FS USB PHY USB OTG HS DMA 0 M0 CAN(0,1) DMA1 M0 GPIO(0,3) OCMPxA/OCMPxB ICAPxA/ICAPxB ECLK0-3 CANTxx CANRxx S AHB / APB Core Peripheral Bridge S LCD CTRL APB I/F MSPSCKx MSPRXDx MSPRFSx APB I/F MSPTFSx MSPTCKx MSPRCKx MSPTXDx SSP(0,1) UUID Support MTU(0,1) APB I/F APB I/F SSPCLKx SSPFRMx PMU WDT RTT APB I/F SSPTXDx URXD0 UCTSxn UDCD0n UDSR0n URI0n APB I/F APB I/F SSPTXDx UART(0,3) APB I/F RTC BACKUP PWL SRC APB I/F APB I/F MCDAT[7:0] APB I/F SD/SDIO/MMC(0,1) PWLOUT UTXDx URTSxn UDTR0n PLL2 PLL1 S VIC APB I/F MCDIR0 MCDIR2 MCDIR31 MCDIR74 I2C(0,1,2) DM ULPI Interface APB I/F MCFBCLK MCCMD MCCMDDIR MCCLK SXTAL MXTAL IM LCDC Interface APB I/F I2CSCLx APB I/F I2CSDAx IrDA S AHB / APB DMA Bridge 16 KB I / 16KB DCACHE 8K ITCM / 8K DTCM ARM926EJ DMA 0 DREQ1 M1 S M0 APB I/F (FIR/MIR/SIR) S S M0 S M1 DACK1 APB I/F FIRTXD SDMC FSMC DREQ0 DMA 1 DACK0 APB I/F FIRRXD DATA CTRL PORT FSMC ADDRESS DATA CTRL ADDRESS JTAG TEST PORT (JTAG) LCD AHB DMA 0/1 M1 ARM AHB Instruction ARM AHB Data S S S eROM (128 x 32) RAM BACKUP (32K x 32) eSRAM (8K x 32) Figure 1. MCU APB 1 MXTAL ETM Description STA2062 Description The STA2062 is an highly integrated SOC application processor combining host capability with embedded GPS. STA2062 targets in vehicle and mobile navigation (PND), telematics, advance audio and connectivity systems. Figure 1: block diagram gives an overview of the complete processor, showing how the ARM926 microcontroller and its peripherals are interfaced. block diagram STA2062 2 Package information Package information In order to meet environmental requirements, ST offers this device in ECOPACK® packages. This package has a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 2. LFBGA361 (16x16x1.4mm) mechanical data & package dimensions mm inch DIM. MIN. TYP. A A1 MAX. MIN. TYP. 1.400 0.210 MAX. 0.0551 0.0082 A2 0.985 A3 0.200 A4 0.0387 0.0079 0.800 b 0.350 15.850 16.000 16.150 0.6240 0.6299 0.6358 E 0.400 0.0315 D D1 OUTLINE AND MECHANICAL DATA 0.450 0.0138 0.0157 0.0177 14.400 0.5669 15.850 16.000 16.150 0.6240 0.6299 0.6358 E1 14.400 0.5669 e 0.800 0.0315 F 0.800 0.0315 Body: 16 x 16 x 1.4mm ddd 0.100 0.0039 eee 0.150 0.0059 fff 0.080 0.0031 LFBGA361 Low profile Fine Pitch Ball Grid Array 8033008 B 3/5 Revision history 3 STA2062 Revision history Table 2. 4/5 Document revision history Date Revision Changes 3-Oct-2007 1 Initial release. 12-Oct-2007 2 Minor changes. STA2062 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2007 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 5/5