STB55NF06 - STB55NF06-1 STP55NF06 - STP55NF06FP N-channel 60V - 0.015Ω - 50A - D2PAK/I2PAK/TO-220/TO-220FP STripFET™ II Power MOSFET General features Type VDSS RDS(on) ID STB55NF06 60V <0.018Ω 50A STB55NF06-1 60V <0.018Ω 50A STP55NF06 60V <0.018Ω 50A 3 3 STP55NF06FP 60V <0.018Ω 50A 1 2 1 D2PAK TO-220 (1) 1. Refer to soa for the max allowable current value on FP-type due to Rth value ■ ■ 100% avalanche tested 3 12 3 1 Exceptional dv/dt capability 2 TO-220FP I2PAK Description This Power MOSFET is the latest development of STMicroelectronis unique "Single Feature Size™" strip-based process. The resulting transistor shows extremely high packing density for low onresistance, rugged avalanche characteristics and less critical alignment steps therefore a remarkable manufacturing reproducibility. Internal schematic diagram Applications ■ Switching application Order codes Part number STB55NF06T4 Marking Package B55NF06 Packaging 2PAK Tape & reel 2PAK Tube D STB55NF06-1 B55NF06 STP55NF06FP P55NF06FP TO-220FP Tube STP55NF06 P55NF06 TO-220 Tube June 2006 I Rev 10 1/18 www.st.com 18 Contents STB55NF06 - STB55NF06-1 - STP55NF06 - STP55NF06FP Contents 1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Electrical characteristics (curves) ............................. 6 3 Test circuit 4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 5 Packaging mechanical data 6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 2/18 ............................................... 9 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 STB55NF06 - STB55NF06-1 - STP55NF06 - STP55NF06FP 1 Electrical ratings Electrical ratings Table 1. Absolute maximum ratings Symbol Parameter Value Unit TO-220 D2PAK TO-220FP I2PAK VDS Drain-source voltage (VGS = 0) VGS Gate- source voltage IDM (2) Ptot EAS (3) dv/dt (4) V A 35 35(1) A Drain current (pulsed) 200 200(1) A Total dissipation at TC = 25°C 110 30 W Derating Factor 0.73 0.20 W/°C Single pulse avalanche energy 340 mJ 7 V/ns Peak diode recovery voltage slope VISO Insulation withstand voltage (DC) Tstg Storage temperature Tj ± 20 50(1) Drain current (continuous) at TC = 100°C ID V 50 Drain current (continuous) at TC = 25°C ID 60 - 2500 -55 to 175 V °C Max. operating junction temperature 1. Refer to soa for the max allowable current value on FP-type due to Rth value 2. Pulse width limited by safe operating area. 3. Starting Tj = 25°C, VDD = 30V, ID =25A 4. ISD ≤50A, di/dt ≤400A/µs, VDD ≤V(BR)DSS, Tj ≤TJMAX Table 2. Thermal data TO-220 D2PAK TO-220FP I2PAK Rthj-case Thermal resistance junction-case max 1.36 5 °C/W Rthj-amb Thermal resistance junction-ambient max 62.5 °C/W TJ Maximum lead temperature for soldering purpose(1) 300 °C 1. for 10 sec. 1.6mm from case 3/18 Electrical characteristics 2 STB55NF06 - STB55NF06-1 - STP55NF06 - STP55NF06FP Electrical characteristics (TCASE=25°C unless otherwise specified) Table 3. On/off states Symbol Parameter V(BR)DSS Drain-source breakdown voltage ID = 250µA, VGS =0 IDSS Zero gate voltage drain current (VGS = 0) VDS = max ratings VDS = max ratings, TC = 125°C IGSS Gate-body leakage current (VDS = 0) VGS = ± 20V VGS(th) Gate threshold voltage VDS = VGS, ID = 250µA RDS(on) Static drain-source on resistance VGS = 10V, ID = 27.5A Table 4. Symbol Test conditions Typ. Max. 60 2 Unit V 1 10 µA µA ±100 nA 3 4 V 0.015 0.018 Ω Typ. Max. Unit Dynamic Parameter Test conditions Min. gfs (1) Forward transconductance VDS = 15V, ID = 27.5A 18 S Ciss Coss Crss Input capacitance Output capacitance Reverse transfer capacitance VDS = 25V, f = 1MHz, VGS = 0 1300 300 105 pF pF pF td(on) tr td(off) tf Turn-on delay time Rise time Turn-off delay time Fall time VDD = 30V, ID = 27.5A RG = 4.7Ω VGS = 10V (see Figure 14) 20 50 36 15 ns ns ns ns Qg Qgs Qgd Total gate charge Gate-source charge Gate-drain charge VDD = 48V, ID = 55A, VGS = 10V (see Figure 15) 44.5 10.5 17.5 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %. 4/18 Min. 60 nC nC nC STB55NF06 - STB55NF06-1 - STP55NF06 - STP55NF06FP Table 5. Symbol Source drain diode Parameter ISDM (1) Source-drain current Source-drain current (pulsed) VSD (2) Forward on voltage ISD trr Qrr IRRM Electrical characteristics Test conditions Min. Typ. ISD = 50A, VGS = 0 ISD = 50A, Reverse recovery time di/dt = 100A/µs, Reverse recovery charge VDD = 30V, Tj = 150°C Reverse recovery current (see Figure 16) 75 170 4.5 Max. Unit 50 200 A A 1.5 V ns nC A 1. Pulse width limited by safe operating area. 2. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 % 5/18 Electrical characteristics STB55NF06 - STB55NF06-1 - STP55NF06 - STP55NF06FP 2.1 Electrical characteristics (curves) Figure 1. Safe operating area for TO220/D2PAK/I2PAK Figure 2. Thermal impedance TO220/D2PAK/I2PAK Figure 3. Safe operating area for TO-220FP Figure 4. Thermal impedance TO-220FP Figure 5. Output characterisics Figure 6. Transfer characteristics 6/18 STB55NF06 - STB55NF06-1 - STP55NF06 - STP55NF06FP Figure 7. Transconductance Figure 9. Gate charge vs gate-source voltage Figure 10. Capacitance variations Figure 11. Normalized gate threshold voltage vs temperature Figure 8. Electrical characteristics Static drain-source on resistance Figure 12. Normalized on resistance vs temperature 7/18 Electrical characteristics Figure 13. Source-drain diode forward characteristics 8/18 STB55NF06 - STB55NF06-1 - STP55NF06 - STP55NF06FP STB55NF06 - STB55NF06-1 - STP55NF06 - STP55NF06FP 3 Test circuit Test circuit Figure 14. Switching times test circuit for resistive load Figure 15. Gate charge test circuit Figure 16. Test circuit for inductive load Figure 17. Unclamped Inductive load test switching and diode recovery times circuit Figure 18. Unclamped inductive waveform Figure 19. Switching time waveform 9/18 Test circuit STB55NF06 - STB55NF06-1 - STP55NF06 - STP55NF06FP Figure 20. Diode recovery times waveform 10/18 STB55NF06 - STB55NF06-1 - STP55NF06 - STP55NF06FP 4 Package mechanical data Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com 11/18 Package mechanical data STB55NF06 - STB55NF06-1 - STP55NF06 - STP55NF06FP D2PAK MECHANICAL DATA TO-247 MECHANICAL DATA mm. inch DIM. MIN. TYP MAX. MIN. TYP. MAX. A 4.4 4.6 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.7 0.93 0.027 0.036 B2 1.14 1.7 0.044 0.067 C 0.45 0.6 0.017 0.023 C2 1.23 1.36 0.048 0.053 D 8.95 9.35 0.352 D1 E 8 10 E1 0.368 0.315 10.4 0.393 8.5 0.334 G 4.88 5.28 0.192 0.208 L 15 15.85 0.590 0.625 L2 1.27 1.4 0.050 0.055 L3 1.4 1.75 0.055 0.068 M 2.4 3.2 0.094 0.126 R 0º 0.015 4º 3 V2 0.4 1 12/18 STB55NF06 - STB55NF06-1 - STP55NF06 - STP55NF06FP Package mechanical data TO-262 (I2PAK) MECHANICAL DATA mm. inch DIM. MIN. TYP MAX. MIN. TYP. MAX. A 4.40 4.60 0.173 0.181 A1 2.40 2.72 0.094 0.107 b 0.61 0.88 0.024 0.034 b1 1.14 1.70 0.044 0.066 c 0.49 0.70 0.019 0.027 c2 1.23 1.32 0.048 0.052 D 8.95 9.35 0.352 0.368 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.194 0.202 E 10 10.40 0.393 0.410 L 13 14 0.511 0.551 L1 3.50 3.93 0.137 0.154 L2 1.27 1.40 0.050 0.055 13/18 Package mechanical data STB55NF06 - STB55NF06-1 - STP55NF06 - STP55NF06FP TO-220 MECHANICAL DATA DIM. mm. MIN. inch MAX. MIN. TYP. MAX. A 4.40 4.60 0.173 0.181 b 0.61 0.88 0.024 0.034 b1 1.15 1.70 0.045 0.066 c 0.49 0.70 0.019 0.027 D 15.25 15.75 0.60 0.620 E 10 10.40 0.393 0.409 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.194 0.202 F 1.23 1.32 0.048 0.052 H1 6.20 6.60 0.244 0.256 J1 2.40 2.72 0.094 0.107 0.551 L 13 14 0.511 L1 3.50 3.93 0.137 L20 16.40 L30 14/18 TYP 0.154 0.645 28.90 1.137 øP 3.75 3.85 0.147 0.151 Q 2.65 2.95 0.104 0.116 STB55NF06 - STB55NF06-1 - STP55NF06 - STP55NF06FP Package mechanical data TO-220FP MECHANICAL DATA mm. DIM. MIN. A 4.4 inch TYP MAX. MIN. TYP. 4.6 0.173 0.181 MAX. 0.106 B 2.5 2.7 0.098 D 2.5 2.75 0.098 0.108 E 0.45 0.7 0.017 0.027 F 0.75 1 0.030 0.039 F1 1.15 1.7 0.045 0.067 F2 1.15 1.7 0.045 0.067 G 4.95 5.2 0.195 0.204 G1 2.4 2.7 0.094 0.106 H 10 10.4 0.393 0.409 L2 16 0.630 28.6 30.6 1.126 1.204 L4 9.8 10.6 .0385 0.417 L5 2.9 3.6 0.114 0.141 L6 15.9 16.4 0.626 0.645 L7 9 9.3 0.354 0.366 Ø 3 3.2 0.118 0.126 B D A E L3 L3 L6 F2 H G G1 F F1 L7 L2 L5 1 2 3 L4 15/18 Packaging mechanical data 5 STB55NF06 - STB55NF06-1 - STP55NF06 - STP55NF06FP Packaging mechanical data D2PAK FOOTPRINT TAPE AND REEL SHIPMENT REEL MECHANICAL DATA DIM. mm MIN. A B 1.5 C 12.8 D 20.2 G 24.4 N 100 T TAPE MECHANICAL DATA DIM. mm MIN. MAX. MIN. A0 10.5 10.7 0.413 0.421 B0 15.7 15.9 0.618 0.626 D 1.5 1.6 0.059 0.063 D1 1.59 1.61 0.062 0.063 E 1.65 1.85 0.065 0.073 F 11.4 11.6 0.449 0.456 K0 4.8 5.0 0.189 0.197 P0 3.9 4.1 0.153 0.161 P1 11.9 12.1 0.468 0.476 P2 1.9 2.1 0.075 0.082 MAX. R 50 1.574 T 0.25 0.35 0.0098 0.0137 W 23.7 24.3 * on sales type 16/18 inch 0.933 0.956 inch MAX. MIN. MAX. 330 12.992 13.2 0.504 0.520 26.4 0.960 1.039 0.059 0795 3.937 30.4 1.197 BASE QTY BULK QTY 1000 1000 STB55NF06 - STB55NF06-1 - STP55NF06 - STP55NF06FP 6 Revision history Revision history Table 6. Revision history Date Revision Changes 19-Oct-2005 7 Preliminary document 02-Dec-2005 8 New datasheet according to PCN MLD-PMT/05/1115 28-Mar-2006 9 Inserted ecopack indication 26-Jun-2006 10 New template, no content change 17/18 STB55NF06 - STB55NF06-1 - STP55NF06 - STP55NF06FP Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. 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