STMICROELECTRONICS STB55NF06T4

STB55NF06 - STB55NF06-1
STP55NF06 - STP55NF06FP
N-channel 60V - 0.015Ω - 50A - D2PAK/I2PAK/TO-220/TO-220FP
STripFET™ II Power MOSFET
General features
Type
VDSS
RDS(on)
ID
STB55NF06
60V
<0.018Ω
50A
STB55NF06-1
60V
<0.018Ω
50A
STP55NF06
60V
<0.018Ω
50A
3
3
STP55NF06FP
60V
<0.018Ω
50A
1
2
1
D2PAK
TO-220
(1)
1. Refer to soa for the max allowable current value on
FP-type due to Rth value
■
■
100% avalanche tested
3
12
3
1
Exceptional dv/dt capability
2
TO-220FP
I2PAK
Description
This Power MOSFET is the latest development of
STMicroelectronis unique "Single Feature Size™"
strip-based process. The resulting transistor
shows extremely high packing density for low onresistance, rugged avalanche characteristics and
less critical alignment steps therefore a
remarkable manufacturing reproducibility.
Internal schematic diagram
Applications
■
Switching application
Order codes
Part number
STB55NF06T4
Marking
Package
B55NF06
Packaging
2PAK
Tape & reel
2PAK
Tube
D
STB55NF06-1
B55NF06
STP55NF06FP
P55NF06FP
TO-220FP
Tube
STP55NF06
P55NF06
TO-220
Tube
June 2006
I
Rev 10
1/18
www.st.com
18
Contents
STB55NF06 - STB55NF06-1 - STP55NF06 - STP55NF06FP
Contents
1
Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1
Electrical characteristics (curves)
............................. 6
3
Test circuit
4
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5
Packaging mechanical data
6
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2/18
............................................... 9
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
STB55NF06 - STB55NF06-1 - STP55NF06 - STP55NF06FP
1
Electrical ratings
Electrical ratings
Table 1.
Absolute maximum ratings
Symbol
Parameter
Value
Unit
TO-220
D2PAK
TO-220FP
I2PAK
VDS
Drain-source voltage (VGS = 0)
VGS
Gate- source voltage
IDM
(2)
Ptot
EAS
(3)
dv/dt
(4)
V
A
35
35(1)
A
Drain current (pulsed)
200
200(1)
A
Total dissipation at TC = 25°C
110
30
W
Derating Factor
0.73
0.20
W/°C
Single pulse avalanche energy
340
mJ
7
V/ns
Peak diode recovery voltage slope
VISO
Insulation withstand voltage (DC)
Tstg
Storage temperature
Tj
± 20
50(1)
Drain current (continuous) at TC = 100°C
ID
V
50
Drain current (continuous) at TC = 25°C
ID
60
-
2500
-55 to 175
V
°C
Max. operating junction temperature
1. Refer to soa for the max allowable current value on FP-type due to Rth value
2. Pulse width limited by safe operating area.
3. Starting Tj = 25°C, VDD = 30V, ID =25A
4. ISD ≤50A, di/dt ≤400A/µs, VDD ≤V(BR)DSS, Tj ≤TJMAX
Table 2.
Thermal data
TO-220
D2PAK
TO-220FP
I2PAK
Rthj-case
Thermal resistance junction-case max
1.36
5
°C/W
Rthj-amb
Thermal resistance junction-ambient max
62.5
°C/W
TJ
Maximum lead temperature for soldering
purpose(1)
300
°C
1. for 10 sec. 1.6mm from case
3/18
Electrical characteristics
2
STB55NF06 - STB55NF06-1 - STP55NF06 - STP55NF06FP
Electrical characteristics
(TCASE=25°C unless otherwise specified)
Table 3.
On/off states
Symbol
Parameter
V(BR)DSS
Drain-source
breakdown voltage
ID = 250µA, VGS =0
IDSS
Zero gate voltage
drain current (VGS = 0)
VDS = max ratings
VDS = max ratings,
TC = 125°C
IGSS
Gate-body leakage
current (VDS = 0)
VGS = ± 20V
VGS(th)
Gate threshold voltage
VDS = VGS, ID = 250µA
RDS(on)
Static drain-source on
resistance
VGS = 10V, ID = 27.5A
Table 4.
Symbol
Test conditions
Typ.
Max.
60
2
Unit
V
1
10
µA
µA
±100
nA
3
4
V
0.015
0.018
Ω
Typ.
Max.
Unit
Dynamic
Parameter
Test conditions
Min.
gfs (1)
Forward
transconductance
VDS = 15V, ID = 27.5A
18
S
Ciss
Coss
Crss
Input capacitance
Output capacitance
Reverse transfer
capacitance
VDS = 25V, f = 1MHz,
VGS = 0
1300
300
105
pF
pF
pF
td(on)
tr
td(off)
tf
Turn-on delay time
Rise time
Turn-off delay time
Fall time
VDD = 30V, ID = 27.5A
RG = 4.7Ω VGS = 10V
(see Figure 14)
20
50
36
15
ns
ns
ns
ns
Qg
Qgs
Qgd
Total gate charge
Gate-source charge
Gate-drain charge
VDD = 48V, ID = 55A,
VGS = 10V
(see Figure 15)
44.5
10.5
17.5
1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.
4/18
Min.
60
nC
nC
nC
STB55NF06 - STB55NF06-1 - STP55NF06 - STP55NF06FP
Table 5.
Symbol
Source drain diode
Parameter
ISDM (1)
Source-drain current
Source-drain current
(pulsed)
VSD (2)
Forward on voltage
ISD
trr
Qrr
IRRM
Electrical characteristics
Test conditions
Min.
Typ.
ISD = 50A, VGS = 0
ISD = 50A,
Reverse recovery time
di/dt = 100A/µs,
Reverse recovery charge
VDD = 30V, Tj = 150°C
Reverse recovery current
(see Figure 16)
75
170
4.5
Max.
Unit
50
200
A
A
1.5
V
ns
nC
A
1. Pulse width limited by safe operating area.
2. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %
5/18
Electrical characteristics
STB55NF06 - STB55NF06-1 - STP55NF06 - STP55NF06FP
2.1
Electrical characteristics (curves)
Figure 1.
Safe operating area for TO220/D2PAK/I2PAK
Figure 2.
Thermal impedance TO220/D2PAK/I2PAK
Figure 3.
Safe operating area for TO-220FP
Figure 4.
Thermal impedance TO-220FP
Figure 5.
Output characterisics
Figure 6.
Transfer characteristics
6/18
STB55NF06 - STB55NF06-1 - STP55NF06 - STP55NF06FP
Figure 7.
Transconductance
Figure 9.
Gate charge vs gate-source voltage Figure 10. Capacitance variations
Figure 11. Normalized gate threshold voltage
vs temperature
Figure 8.
Electrical characteristics
Static drain-source on resistance
Figure 12. Normalized on resistance vs
temperature
7/18
Electrical characteristics
Figure 13. Source-drain diode forward
characteristics
8/18
STB55NF06 - STB55NF06-1 - STP55NF06 - STP55NF06FP
STB55NF06 - STB55NF06-1 - STP55NF06 - STP55NF06FP
3
Test circuit
Test circuit
Figure 14. Switching times test circuit for
resistive load
Figure 15. Gate charge test circuit
Figure 16. Test circuit for inductive load
Figure 17. Unclamped Inductive load test
switching and diode recovery times
circuit
Figure 18. Unclamped inductive waveform
Figure 19. Switching time waveform
9/18
Test circuit
STB55NF06 - STB55NF06-1 - STP55NF06 - STP55NF06FP
Figure 20. Diode recovery times waveform
10/18
STB55NF06 - STB55NF06-1 - STP55NF06 - STP55NF06FP
4
Package mechanical data
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect . The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com
11/18
Package mechanical data
STB55NF06 - STB55NF06-1 - STP55NF06 - STP55NF06FP
D2PAK MECHANICAL DATA
TO-247 MECHANICAL DATA
mm.
inch
DIM.
MIN.
TYP
MAX.
MIN.
TYP.
MAX.
A
4.4
4.6
0.173
0.181
A1
2.49
2.69
0.098
0.106
A2
0.03
0.23
0.001
0.009
B
0.7
0.93
0.027
0.036
B2
1.14
1.7
0.044
0.067
C
0.45
0.6
0.017
0.023
C2
1.23
1.36
0.048
0.053
D
8.95
9.35
0.352
D1
E
8
10
E1
0.368
0.315
10.4
0.393
8.5
0.334
G
4.88
5.28
0.192
0.208
L
15
15.85
0.590
0.625
L2
1.27
1.4
0.050
0.055
L3
1.4
1.75
0.055
0.068
M
2.4
3.2
0.094
0.126
R
0º
0.015
4º
3
V2
0.4
1
12/18
STB55NF06 - STB55NF06-1 - STP55NF06 - STP55NF06FP
Package mechanical data
TO-262 (I2PAK) MECHANICAL DATA
mm.
inch
DIM.
MIN.
TYP
MAX.
MIN.
TYP.
MAX.
A
4.40
4.60
0.173
0.181
A1
2.40
2.72
0.094
0.107
b
0.61
0.88
0.024
0.034
b1
1.14
1.70
0.044
0.066
c
0.49
0.70
0.019
0.027
c2
1.23
1.32
0.048
0.052
D
8.95
9.35
0.352
0.368
e
2.40
2.70
0.094
0.106
e1
4.95
5.15
0.194
0.202
E
10
10.40
0.393
0.410
L
13
14
0.511
0.551
L1
3.50
3.93
0.137
0.154
L2
1.27
1.40
0.050
0.055
13/18
Package mechanical data
STB55NF06 - STB55NF06-1 - STP55NF06 - STP55NF06FP
TO-220 MECHANICAL DATA
DIM.
mm.
MIN.
inch
MAX.
MIN.
TYP.
MAX.
A
4.40
4.60
0.173
0.181
b
0.61
0.88
0.024
0.034
b1
1.15
1.70
0.045
0.066
c
0.49
0.70
0.019
0.027
D
15.25
15.75
0.60
0.620
E
10
10.40
0.393
0.409
e
2.40
2.70
0.094
0.106
e1
4.95
5.15
0.194
0.202
F
1.23
1.32
0.048
0.052
H1
6.20
6.60
0.244
0.256
J1
2.40
2.72
0.094
0.107
0.551
L
13
14
0.511
L1
3.50
3.93
0.137
L20
16.40
L30
14/18
TYP
0.154
0.645
28.90
1.137
øP
3.75
3.85
0.147
0.151
Q
2.65
2.95
0.104
0.116
STB55NF06 - STB55NF06-1 - STP55NF06 - STP55NF06FP
Package mechanical data
TO-220FP MECHANICAL DATA
mm.
DIM.
MIN.
A
4.4
inch
TYP
MAX.
MIN.
TYP.
4.6
0.173
0.181
MAX.
0.106
B
2.5
2.7
0.098
D
2.5
2.75
0.098
0.108
E
0.45
0.7
0.017
0.027
F
0.75
1
0.030
0.039
F1
1.15
1.7
0.045
0.067
F2
1.15
1.7
0.045
0.067
G
4.95
5.2
0.195
0.204
G1
2.4
2.7
0.094
0.106
H
10
10.4
0.393
0.409
L2
16
0.630
28.6
30.6
1.126
1.204
L4
9.8
10.6
.0385
0.417
L5
2.9
3.6
0.114
0.141
L6
15.9
16.4
0.626
0.645
L7
9
9.3
0.354
0.366
Ø
3
3.2
0.118
0.126
B
D
A
E
L3
L3
L6
F2
H
G
G1
F
F1
L7
L2
L5
1 2 3
L4
15/18
Packaging mechanical data
5
STB55NF06 - STB55NF06-1 - STP55NF06 - STP55NF06FP
Packaging mechanical data
D2PAK FOOTPRINT
TAPE AND REEL SHIPMENT
REEL MECHANICAL DATA
DIM.
mm
MIN.
A
B
1.5
C
12.8
D
20.2
G
24.4
N
100
T
TAPE MECHANICAL DATA
DIM.
mm
MIN.
MAX.
MIN.
A0
10.5
10.7
0.413 0.421
B0
15.7
15.9
0.618 0.626
D
1.5
1.6
0.059 0.063
D1
1.59
1.61
0.062 0.063
E
1.65
1.85
0.065 0.073
F
11.4
11.6
0.449 0.456
K0
4.8
5.0
0.189 0.197
P0
3.9
4.1
0.153 0.161
P1
11.9
12.1
0.468 0.476
P2
1.9
2.1
0.075 0.082
MAX.
R
50
1.574
T
0.25
0.35 0.0098 0.0137
W
23.7
24.3
* on sales type
16/18
inch
0.933 0.956
inch
MAX.
MIN.
MAX.
330
12.992
13.2
0.504 0.520
26.4
0.960 1.039
0.059
0795
3.937
30.4
1.197
BASE QTY
BULK QTY
1000
1000
STB55NF06 - STB55NF06-1 - STP55NF06 - STP55NF06FP
6
Revision history
Revision history
Table 6.
Revision history
Date
Revision
Changes
19-Oct-2005
7
Preliminary document
02-Dec-2005
8
New datasheet according to PCN MLD-PMT/05/1115
28-Mar-2006
9
Inserted ecopack indication
26-Jun-2006
10
New template, no content change
17/18
STB55NF06 - STB55NF06-1 - STP55NF06 - STP55NF06FP
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18/18