STMICROELECTRONICS STI270N4F3

STB270N4F3
STI270N4F3 - STP270N4F3
N-channel 40 V - 2.1 mΩ - 160 A - TO-220 - D2PAK - I2PAK
STripFET™ Power MOSFET
Features
Type
VDSS
RDS(on)
max
STB270N4F3
40 V
< 2.5 mΩ
ID
PTOT
160 A 330 W
STI270N4F3
40 V
< 2.9 mΩ
120 A 330 W
STP270N4F3
40 V
< 2.9 mΩ
120 A 330 W
■
100% avalanche tested
■
Standard threshold drive
3
12
3
1
2
I²PAK
TO-220
3
1
Applications
D²PAK
■
High current, switching application
■
Automotive
Figure 1.
Internal schematic diagram
Description
This n-channel enhancement mode Power
MOSFET is the latest refinement of
STMicroelectronics unique “single feature
size“strip-based process with less critical
alignment steps and therefore a remarkable
manufacturing reproducibility. The resulting
transistor shows extremely high packing density
for low on-resistance, rugged avalanche
characteristics and low gate charge.
Table 1.
Device summary
Order codes
Marking
Package
Packaging
STB270N4F3
270N4F3
D²PAK
Tape and reel
STI270N4F3
270N4F3
I²PAK
Tube
STP270N4F3
270N4F3
TO-220
Tube
April 2008
Rev 2
1/15
www.st.com
15
Contents
STB270N4F3 - STI270N4F3 - STP270N4F3
Contents
1
Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1
Electrical characteristics (curves)
............................. 6
3
Test circuit
4
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5
Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
6
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2/15
................................................ 8
STB270N4F3 - STI270N4F3 - STP270N4F3
1
Electrical ratings
Electrical ratings
Table 2.
Absolute maximum ratings
Value
Symbol
Parameter
Unit
TO-220/I²PAK
D²PAK
VDS
Drain-source voltage (VGS = 0)
VGS
Gate-source voltage
ID(1)
Drain current (continuous) at TC = 25 °C
120
160
A
ID(1)
Drain current (continuous) at TC=100 °C
120
160
A
Drain current (pulsed)
480
640
A
IDM
(2)
PTOT
40
V
± 20
V
Total dissipation at TC = 25 °C
330
W
Derating factor
2.2
W/°C
dv/dt(3)
Peak diode recovery voltage slope
3.5
V/n
EAS(4)
Single pulse avalanche energy
1
J
TJ
Operating junction temperature
Storage temperature
-55 to 175
°C
Tstg
1. Current limited by package
2. Pulse width limited by safe operating area
3. ISD ≤ 120A, di/dt ≤ 200A/µs, VDD ≤ V(BR)DSS, Tj ≤ TJMAX
4. Starting Tj=25°C, ID =80A, VDD= 32V
Table 3.
Thermal data
Value
Symbol
Parameter
Unit
TO-220/I²PAK
Rthj-case
Rthj-pcb
(1)
Thermal resistance junction-case max
Thermal resistance junction-pcb max
D²PAK
0.45
°C/W
--
35
°C/W
Rthj-a
Thermal resistance junction-ambient max
62.5
--
°C/W
Tl
Maximum lead temperature for soldering
purpose (for 10 sec, 1.6 mm from case)
300
--
°C
1. When mounted on 1inch² FR-4 board, 2 oz Cu.
3/15
Electrical characteristics
2
STB270N4F3 - STI270N4F3 - STP270N4F3
Electrical characteristics
(TCASE=25 °C unless otherwise specified)
Table 4.
Symbol
V(BR)DSS
On/off states
Parameter
Drain-source
breakdown voltage
Test conditions
ID = 250 µA, VGS= 0
Typ. Max. Unit
40
V
VDS = Max rating,
10
µA
@125 °C
100
µA
Gate body leakage
current (VDS = 0)
VGS = ±20 V
±200
nA
VGS(th)
Gate threshold voltage
VDS= VGS, ID = 250 µA
4
V
RDS(on)
Static drain-source on
resistance
IDSS
IGSS
Table 5.
Symbol
gfs (1)
Ciss
Coss
Crss
Qg
Qgs
Qgd
Zero gate voltage drain
current (VGS = 0)
VDS = Max rating
VGS= 10 V, ID= 80 A
2
TO-220
I²PAK
2.5
2.9
mΩ
D²PAK
2.1
2.5
mΩ
Dynamic
Parameter
Test conditions
Min.
Typ.
Max. Unit
Forward
transconductance
VDS =15 V, ID = 80 A
200
S
Input capacitance
Output capacitance
Reverse transfer
capacitance
VDS =25 V, f=1 MHz, VGS=0
7400
1800
47
pF
pF
pF
Total gate charge
Gate-source charge
gate-drain charge
VDD=20 V, ID = 160 A
VGS =10 V
(see Figure 14)
1. Pulsed: pulse duration=300µs, duty cycle 1.5%
4/15
Min.
110
27
25
150
nC
nC
nC
STB270N4F3 - STI270N4F3 - STP270N4F3
Table 6.
Symbol
td(on)
tr
td(off)
tf
Table 7.
Symbol
ISD
ISDM
(1)
VSD(2)
trr
Qrr
IRRM
Electrical characteristics
Switching times
Parameter
Test conditions
Min.
VDD=20 V, ID= 80 A,
Turn-on delay time
Rise time
RG=4.7 Ω, VGS=10 V
(see Figure 16)
VDD=20 V, ID= 80 A,
Turn-off delay time
Fall time
RG=4.7 Ω, VGS=10 V
(see Figure 16)
Typ.
Max.
Unit
22
180
ns
ns
110
45
ns
ns
Source drain diode
Parameter
Source-drain current
Source-drain current
(pulsed)
Test conditions
Max
Unit
D²PAK
160
A
TO-220
I²PAK
120
A
D²PAK
640
A
TO-220
I²PAK
480
A
1.5
V
Forward on voltage
Reverse recovery time
Reverse recovery charge
Reverse recovery current
Min
Typ.
ISD=80 A, VGS=0
ISD=160 A,
di/dt = 100 A/µs,
VDD=32 V, Tj=150 °C
(see Figure 15)
70
225
3.2
ns
nC
A
1. Pulse width limited by safe operating area
2. Pulsed: pulse duration=300 µs, duty cycle 1.5%
5/15
Electrical characteristics
STB270N4F3 - STI270N4F3 - STP270N4F3
2.1
Electrical characteristics (curves)
Figure 2.
Safe operating area
Figure 3.
Thermal impedance
Figure 4.
Output characteristics
Figure 5.
Transfer characteristics
Figure 6.
Static drain-source on resistance
Figure 7.
Normalized BVDSS vs temperature
6/15
STB270N4F3 - STI270N4F3 - STP270N4F3
Figure 8.
Electrical characteristics
Gate charge vs gate-source voltage Figure 9.
Figure 10. Normalized gate threshold voltage
vs temperature
Capacitance variations
Figure 11. Normalized on resistance vs
temperature
Figure 12. Source-drain diode forward
characteristics
7/15
Test circuit
3
STB270N4F3 - STI270N4F3 - STP270N4F3
Test circuit
Figure 13. Switching times test circuit for
resistive load
Figure 14. Gate charge test circuit
Figure 15. Test circuit for inductive load
Figure 16. Unclamped Inductive load test
switching and diode recovery times
circuit
Figure 17. Unclamped inductive waveform
8/15
Figure 18. Switching time waveform
STB270N4F3 - STI270N4F3 - STP270N4F3
4
Package mechanical data
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com
9/15
Package mechanical data
STB270N4F3 - STI270N4F3 - STP270N4F3
TO-220 mechanical data
mm
inch
Dim
Min
A
b
b1
c
D
D1
E
e
e1
F
H1
J1
L
L1
L20
L30
∅P
Q
10/15
Typ
4.40
0.61
1.14
0.48
15.25
Max
Min
4.60
0.88
1.70
0.70
15.75
0.173
0.024
0.044
0.019
0.6
10.40
2.70
5.15
1.32
6.60
2.72
14
3.93
0.393
0.094
0.194
0.048
0.244
0.094
0.511
0.137
1.27
10
2.40
4.95
1.23
6.20
2.40
13
3.50
Max
0.181
0.034
0.066
0.027
0.62
0.050
16.40
28.90
3.75
2.65
Typ
0.409
0.106
0.202
0.051
0.256
0.107
0.551
0.154
0.645
1.137
3.85
2.95
0.147
0.104
0.151
0.116
STB270N4F3 - STI270N4F3 - STP270N4F3
Package mechanical data
I²PAK (TO-262) mechanical data
mm
inch
Dim
Min
A
A1
b
b1
c
c2
D
e
e1
E
L
L1
L2
4.40
2.40
0.61
1.14
0.49
1.23
8.95
2.40
4.95
10
13
3.50
1.27
Typ
Max
Min
4.60
2.72
0.88
1.70
0.70
1.32
9.35
2.70
5.15
10.40
14
3.93
1.40
0.173
0.094
0.024
0.044
0.019
0.048
0.352
0.094
0.194
0.393
0.511
0.137
0.050
Typ
Max
0.181
0.107
0.034
0.066
0.027
0.052
0.368
0.106
0.202
0.410
0.551
0.154
0.055
11/15
Package mechanical data
STB270N4F3 - STI270N4F3 - STP270N4F3
D²PAK (TO-263) mechanical data
mm
inch
Dim
Min
A
A1
b
b2
c
c2
D
D1
E
E1
e
e1
H
J1
L
L1
L2
R
V2
Max
Min
4.60
0.23
0.93
1.70
0.60
1.36
9.35
0.173
0.001
0.027
0.045
0.017
0.048
0.352
0.295
0.394
0.334
10.40
2.54
4.88
15
2.49
2.29
1.27
1.30
Typ
Max
0.181
0.009
0.037
0.067
0.024
0.053
0.368
0.409
0.1
5.28
15.85
2.69
2.79
1.40
1.75
0.192
0.590
0.099
0.090
0.05
0.051
8°
0°
0.4
0°
0079457_M
12/15
Typ
4.40
0.03
0.70
1.14
0.45
1.23
8.95
7.50
10
8.50
0.208
0.624
0.106
0.110
0.055
0.069
0.016
8°
STB270N4F3 - STI270N4F3 - STP270N4F3
5
Packaging mechanical data
Packaging mechanical data
D2PAK FOOTPRINT
TAPE AND REEL SHIPMENT
REEL MECHANICAL DATA
DIM.
mm
MIN.
A
B
1.5
C
12.8
D
20.2
G
24.4
N
100
T
TAPE MECHANICAL DATA
DIM.
mm
inch
MIN.
MAX.
MIN.
A0
10.5
10.7
0.413 0.421
B0
15.7
15.9
0.618 0.626
D
1.5
1.6
0.059 0.063
D1
1.59
1.61
0.062 0.063
E
1.65
1.85
0.065 0.073
F
11.4
11.6
0.449 0.456
K0
4.8
5.0
0.189 0.197
P0
3.9
4.1
0.153 0.161
P1
11.9
12.1
0.468 0.476
P2
1.9
2.1
0.075 0.082
inch
MAX.
MIN.
MAX.
330
12.992
13.2
0.504 0.520
26.4
0.960 1.039
0.059
0795
3.937
30.4
1.197
BASE QTY
BULK QTY
1000
1000
MAX.
R
50
1.574
T
0.25
0.35 0.0098 0.0137
W
23.7
24.3
0.933 0.956
* on sales type
13/15
Revision history
6
STB270N4F3 - STI270N4F3 - STP270N4F3
Revision history
Table 8.
14/15
Revision history
Date
Revision
Changes
07-Feb-2007
1
Initial release.
02-Apr-2008
2
Some value changes onTable 2
STB270N4F3 - STI270N4F3 - STP270N4F3
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15/15