STMICROELECTRONICS STM1068

STM1068
Smart voltage supervisor
Features
■
Operating voltage 2.7 V to 5.5 V
■
Supply current of 1.5 µA (typ)
■
Factory-trimmed voltage threshold from 3.2 V
to 3.5 V in 50 mV increments
■
3% voltage threshold accuracy across
temperature
■
Enable and inhibit inputs (EN, INH)
■
Power supply transient immunity
■
Current limited output of 15 mA (max)
■
Available in flip chip 8-bump package
■
Operating temperature –30°C to +85°C
Flip chip
(8-bump)
Applications
■
Portable devices
■
Cell phones/smart phones
■
PDA
■
Palmtops
■
Organizers
■
Portable audio/video players
■
Portable terminals
May 2008
Rev 6
1/22
www.st.com
1
Contents
STM1068
Contents
1
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2
Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.1
Output, OUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.2
Enable input, EN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.3
Inhibit input, INH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.4
Pass gate, PKX and POX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3
Typical operating characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4
Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5
DC and AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
6
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
7
Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
8
Package marking information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
9
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
2/22
STM1068
List of tables
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Truth table for output, OUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Truth table for pass gate between PKX and POX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Operating and AC measurement conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
DC and AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Flip chip 8-bump, package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Factory-trimmed thresholds with marking description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3/22
List of figures
STM1068
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
4/22
Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
8-bump flip chip connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Hardware hookup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Supply current vs. supply voltage, VEN = 4 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Supply current vs. temperature, VEN = 4 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Supply current vs. supply voltage, VEN = 0 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Supply current vs. temperature, VEN = 0 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Rising voltage detector threshold vs. temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Threshold hysteresis vs. temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Flip chip 8-bump, package mechanical outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Flip chip tape and reel specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
STM1068
1
Description
Description
STM1068 device monitors supply voltage VCC and the state of EN and INH inputs.
Depending on logical combination of these inputs, the output OUT is connected to VIN or
GND and the pass gate between PKX and POX is either enabled or disabled (see Table 2
and Table 3 for more details).
The device offers several voltage thresholds, VTH+ (see Table 9) and it is available in
miniature flip chip 8-bump package.
Figure 1.
Logic diagram
VCC
VIN
EN
OUT
INH
STM1068
POX
PKX
GND
ai13958
5/22
Description
STM1068
Table 1.
Pin descriptions
Pin
Symbol
1A
VIN
Supply for output pin (OUT)
1B
EN
Enable from USB VBUS
1C
GND
Ground
1D
PKX
Pass gate input
2A
OUT
Output
2B
INH
Inhibit input
2C
VCC
Supply voltage
2D
POX
Pass gate output
Figure 2.
Function
8-bump flip chip connections
A
B
C
D
1
VIN
EN
GND
PKX
2
OUT
IN H
VCC
POX
bottom view, bumps up
A
B
C
D
2
OUT
IN H
VCC
POX
1
VIN
EN
GND
PKX
top view, bumps down
ai13959
6/22
STM1068
Description
Figure 3.
Block diagram
VIN
VCC
Current
source
Bandgap
+
-
GND
Level
shifter
OUT
LOGIC
Delay
2µs
EN
VCC
POX
INH
8kV ESD
Protection
PKX
ai13960
Figure 4.
Hardware hookup
USB charging and
transceiver circuits
VBUS
USB connector
VBAT DC-DC step-up
converter
VCC
EN
OUT
GND
R1
R2
VBOOST
C3
VBAT
C1
EN
Inhibit
control
VCC
ASIC
VIN
VOUT
STM1068
POX
INH
GND
VCHARGER
Power key
PKX
C2
Power
key
ai13961
7/22
Operation
2
STM1068
Operation
The STM1068 device monitors supply voltage VCC and logic states of EN and INH inputs.
According to detected states is the output OUT connected to VIN or GND and the pass gate
between PKX and POX is either enabled or disabled (see Table 2, Table 3 , and Figure 11
for more details).
2.1
Output, OUT
If the enable input is in a logic high state and inhibit input is in a logic low state, the output
will be connected to VIN input as VCC rises above the VTH+ voltage threshold. Otherwise, the
output is connected to ground GND. The output is current limited (see Table 6).
2.2
Enable input, EN
A logic low on the enable input disconnects the output, OUT, from VIN, the POX will follow
the PKX and the device enters a standby mode with very low current consumption (see
Table 6).
2.3
Inhibit input, INH
A logic high on the inhibit input disconnects the output, OUT, from VIN and the POX will
follow the PKX.
2.4
Pass gate, PKX and POX
Pass gate between PKX and POX is disabled only if enable input is in logic high, inhibit input
is in logic low and the supply voltage is below the voltage threshold.
Table 2.
Truth table for output, OUT
EN(1)
INH
VCC
OUT
L
x
x
connected to GND
x
H
x
connected to GND
x
x
<VTH+ (rising edge)
<VTH- (falling edge)
connected to GND
H
L
>VTH+ (rising edge)
>VTH- (falling edge)
connected to VIN
1. Once the device is disabled by EN input, the VCC must be above VTH+ to reconnect output to VIN.
8/22
STM1068
Operation
Table 3.
Note:
Truth table for pass gate between PKX and POX
EN
INH
VCC
POX
L
x
x
follows PKX
x
H
x
follows PKX
x
x
>VTH+ (rising edge)
>VTH- (falling edge)
follows PKX
H
L
<VTH+ (rising edge)
<VTH- (falling edge)
open
Table valid for VCC > 2.7 V.
9/22
Typical operating characteristics
3
STM1068
Typical operating characteristics
Figure 5.
Supply current vs. supply voltage, VEN = 4 V
3.0
Supply Current, ICC (µA)
2.5
2.0
1.5
TA = -30 ˚C
TA = 25 ˚C
TA = 0˚C
TA = 85˚C
1.0
0.5
0.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
Supply Voltage, VCC (V)
ai13942
Figure 6.
Supply current vs. temperature, VEN = 4 V
Supply Current, ICC (µA)
2.5
2.0
1.5
1.0
VCC = 2.70 V
VCC = 3.50 V
VCC = 4.25 V
VCC = 5.00 V
VCC = 5.50 V
0.5
0.0
-30
-20
-10
0
10
20
30
40
50
60
70
80
Temperature, TA (˚C)
ai13943
10/22
STM1068
Typical operating characteristics
Figure 7.
Supply current vs. supply voltage, VEN = 0 V
0.8
Supply Current, ICC (µA)
0.7
0.6
0.5
0.4
TA = -30 ˚C
0.3
TA = 85 ˚C
0.2
TA = 25 ˚C
0.1
TA = 0 ˚C
0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
Supply Voltage, VCC (V)
ai13944
Figure 8.
Supply current vs. temperature, VEN = 0 V
Supply Current, ICC (µA)
0.65
0.60
0.55
VCC = 2.70 V
VCC = 3.50 V
0.50
VCC = 4.25 V
VCC = 5.00 V
VCC = 5.50 V
0.45
-30
-20
-10
0
10
20
30
40
50
60
70
80
Temperature, TA (˚C)
ai13945
11/22
Typical operating characteristics
Rising voltage detector threshold, VTH+ (V)
Figure 9.
STM1068
Rising voltage detector threshold vs. temperature
3.50
maximum value
3.45
3.40
3.35
typical value
3.30
minimum value
3.25
3.20
-30
-20
-10
0
10
20
30
40
50
60
70
80
Temperature, TA (˚C)
ai13946
Figure 10. Threshold hysteresis vs. temperature
Threshold Hysteresis, VHYST (mV)
550
maximum value
500
450
400
350
minimum value
300
250
-30
-20
-10
0
10
20
30
40
50
60
70
80
Temperature, TA (˚C)
ai13947
12/22
STM1068
4
Maximum ratings
Maximum ratings
Stressing the device above the rating listed in the “Absolute maximum ratings” table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the Operating sections of
this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics SURE
Program and other relevant quality documents.
Table 4.
Absolute maximum ratings
Symbol
Parameter
Min
Typ
Max
Unit
Remarks
VCC
Supply voltage
–0.2
+7.0
V
VIN
Output source voltage
–0.2
+7.0
V
Independent of VCC
VEN
VBUS input
–0.2
VCC + 0.3
V
Series 1M external resistor
for protection
VOUT
Output pin
–0.3
VIN + 0.3
V
VINH
Inhibit pin
–0.3
VCC + 0.3
V
–2
+2
kV
Human body model
(all pins)
–8
+8
kV
Human body model
(PKX only)
VESD
Electrostatic protection
VESD
Electrostatic protection
–500
+500
V
Charged device model
VESD
Electrostatic protection
–100
+100
V
Machine model
VESD
Point discharge on PKX key
–8
+8
kV
IEC61000-4-2
VESD
Air discharge on PKX key
–15
+15
kV
IEC61000-4-2
Operating ambient temperature
–30
+85
°C
Storage temperature
–45
+150
°C
TA
13/22
DC and AC characteristics
5
STM1068
DC and AC characteristics
This section summarizes the operating measurement conditions and the DC and AC
characteristics of the device. The parameters in the DC and AC characteristics tables that
follow are derived from tests performed under the measurement conditions summarized in
Table 5: Operating and AC measurement conditions. Designers should check that the
operating conditions in their circuit match the operating conditions when relying on the
quoted parameters.
Table 5.
Operating and AC measurement conditions
Parameter
Condition
Unit
VCC supply voltage
2.7 to 5.5
V
Ambient operating temperature (TA)
–30 to 85
°C
≤5
ns
Input rise and fall times
Figure 11. Waveforms
VCC
(VBAT)
VTH+
VTH-
~2.3V
~2.1V
EN
(VBUS)
VEN-IH
VEN-IL
INH
VIN
OUT
OUT
follows
VIN
OUT
follows
VIN
OUT
follows VIN
POX
POX follows PKX
ai13962
Note:
14/22
VIN assumed to be from 1.65 V to 5.5 V. No VIN means no signal on OUT pin. If there is no
VCC then there will be no VIN.
STM1068
Table 6.
DC and AC characteristics
DC and AC characteristics
Sym
Parameter
VCC
Supply voltage
ICC
Supply current into VCC pin
ICC +IIN
Current into VCC + VIN pins
VTH+
VHYST
VTH-
Test condition(1)
Min
Typ
2.7
Max
Unit
5.5
V
VEN = 0 V
0.6
1
µA
VEN = 4 V
1.5
15
µA
VEN = 0 V
5
µA
VEN = 4 V
15
µA
+3%
V
0.5
V
Rising voltage detector threshold (see
Table 8 on page 19 for detailed listing)
–3%
Threshold hysteresis
VTH+
0.3
VTH+ - VHYST
V
tPD-FALL(2) VCC falling to OUT delay
VCC falling from
(VTH- + 100 mV) to
(VTH- - 100 mV) at
10 mV/µs
30
µs
tPD-RISE(2) VCC rising to OUT delay
VCC rising from
(VTH+ - 100 mV) to
(VTH+ + 100 mV) at
10 mV/µs
70
µs
VIN
Falling voltage detector threshold
Voltage on VIN pin
Supply for output pin
Allows 2.5 V rail,
VBAT or +5 V
2.4
5.5
V
VIN - 0.2
VIN
V
0.3
V
15
mA
Output pin, OUT(3)
VOUT-OH
Output high voltage
ISOURCE = 5 mA
VOUT-OL
Output low voltage
ISINK = 10 mA
IOUT
Output current
5
Enable input, EN
VEN-IH
When VBUS is valid
VEN-IL
When VBUS is not valid
0.4
V
IEN-IN
Enable input current
0.1
µA
EN glitch immunity
1.2
V
1
µs
1.2
V
Inhibit input, INH
VINH-IH
Inhibit logic high
VINH-IL
Inhibit logic low
0.4
V
VINH-IN
Inhibit input current
0.1
µA
INH glitch immunity
1
µs
15/22
DC and AC characteristics
Table 6.
STM1068
DC and AC characteristics (continued)
Sym
Parameter
Test condition(1)
Min
Typ
Max
Unit
Pass gate between PKX and POX
RDS(on)
Static pass gate on resistance
300
Ω
1. Valid for ambient operating temperature: TA = –30°C to +85°C; VCC = 2.7 V to 5.5 V (except where noted).
2. Guaranteed by design.
3. For VCC below VTH-, the output remains low down to VCC = 1 V. Below VCC = 1 V the voltage VIN must be less than VOUT-OL
(max.) to guarantee output low voltage less than 0.3 V.
16/22
STM1068
6
Package mechanical data
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Figure 12. Flip chip 8-bump, package mechanical outline
17/22
Package mechanical data
Table 7.
STM1068
Flip chip 8-bump, package mechanical data
mm
inches
Symbol
Min
Typ
Max
Min
Typ
Max
A
0.54
0.60
0.66
0.021
0.024
0.026
A1
0.170
0.205
0.240
0.007
0.008
0.009
A2
0.395
0.015
b
0.215
0.255
0.295
0.008
0.010
0.012
D
1.570
1.600
1.605
0.062
0.063
0.063
D1
1.20
0.047
e
0.36
0.40
0.44
0.014
0.016
0.017
E
0.77
0.80
0.83
0.030
0.031
0.033
E1
0.36
0.40
0.44
0.014
0.016
0.017
SE
0.18
0.20
0.22
0.007
0.008
0.009
f
0.20
0.008
ccc
0.05
0.002
$
0.035
0.045
0.050
0.001
0.002
0.002
Figure 13. Flip chip tape and reel specifications
0.92
±0.05
All dimensions in mm
TxS
yww
TxS
yww
TxS
yww
TxS
yww
4.00±0.10
User direction of unreeling
3.50±0.05
TxS
yww
–0.10
8.00 +0.30
1.66
±0.05
0.200±0.015
18/22
200±0.05
1.5
5±0
0.71±0.05
4.00±0.10
1.75±0.10
.05
Dot identifying pin A1 location
STM1068
7
Part numbering
Part numbering
Table 8.
Ordering information scheme
Example:
STM1068
C35
F3
8
F
Device type
STM1068
Threshold voltage (3.2V to 3.5V in 0.05V increments)
C20: 3.20V(1)
C25: 3.25V(1)
C30: 3.30V(1)
C35: 3.35V
C40: 3.40V(1)
C45: 3.45V(1)
C50: 3.50V(1)
Package
F3: Flip chip, lead-free, pitch = 400µm, bump = 250µm, 8-bump
Temperature range
8: –30°C to 85°C
Shipping method
F = ECOPACK® package, tape & reel
1.
Contact local ST sales office for availability.
19/22
Package marking information
STM1068
8
Package marking information
Table 9.
Factory-trimmed thresholds with marking description
Part number
Rising voltage detector threshold VTH+ at ambient temperature
TA from –30 to +85°C
Topside marking(1)
Min (–3%)
Typ
Max (+3%)
STM1068C20F38F
3.104
3.20
3.296
THS
yww
STM1068C25F38F
3.152
3.25
3.348
TIS
yww
STM1068C30F38F
3.201
3.30
3.399
TJS
yww
STM1068C35F38F
3.249
3.35
3.451
TKS
yww
STM1068C40F38F
3.298
3.40
3.502
TLS
yww
STM1068C45F38F
3.346
3.45
3.554
TMS
yww
STM1068C50F38F
3.395
3.50
3.605
TNS
yww
1. Where “y” = assembly year (0 to 9) and “ww” = assembly work week (01 to 52).
20/22
STM1068
9
Revision history
Revision history
Table 10.
Document revision history
Date
Revision
Changes
31-Aug-2007
1
Initial release.
07-Sep-2007
2
Updated cover page, Section 1: Description, Figure 3, and Table 6.
03-Jan-2008
3
Updated Figure 1, 11, 13, and Table 3, 5, 6, 9; added Section 3:
Typical operating characteristics; minor presentation changes.
26-Mar-2008
4
Updated Table 6, 7.
09-Apr-2008
5
Document status upgraded to full datasheet; updated Figure 12.
27-May-2008
6
Minor document reformatting.
21/22
STM1068
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2008 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
22/22