STMICROELECTRONICS STPS40170CG-TR

STPS40170C
®
HIGH VOLTAGE POWER SCHOTTKY RECTIFIER
Table 1: Main Product Characteristics
IF(AV)
2 x 20 A
VRRM
170 V
Tj
175 °C
VF(max)
0.75 V
A1
K
A2
K
K
FEATURES AND BENEFITS
■
■
■
■
■
■
High junction temperature capability
Low leakage current
Good trade off between leakage current and
forward voltage drop
Low thermal resistance
High frequency operation
Avalanche specification
A2
A2
A1
K
A1
D2PAK
STPS40170CG
TO-220AB
STPS40170CT
DESCRIPTION
A2
Dual center tab Schottky rectifier suited for High
Frequency Switched Mode Power Supplies.
Packaged in TO-220AB, D2PAK and TO-247,
these devices are intended for use to enhance the
reliability of the application.
K
A1
TO-247
STPS40170CW
Table 2: Order Codes
September 2005
Part Numbers
Marking
STPS40170CT
STPS40170CT
STPS40170CG
STPS40170CG
STPS40170CG-TR
STPS40170CG
STPS40170CW
STPS40170CW
REV. 1
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STPS40170C
Table 3: Absolute Ratings (limiting values, per diode)
Symbol
VRRM
IF(RMS)
Parameter
Value
Unit
Repetitive peak reverse voltage
170
V
RMS forward current
60
A
20
40
A
Per diode
Per device
Tc = 150 °C δ = 0.5
IF(AV)
Average forward current
IFSM
Surge non repetitive forward current
tp = 10 ms sinusoidal
250
A
PARM
Repetitive peak avalanche power
tp = 1 µs Tj = 25 °C
14100
W
-65 to + 175
°C
175
°C
10000
V/µs
Tstg
Storage temperature range
Tj
Maximum operating junction temperature *
dV/dt
dPtot
* : --------------dTj
Critical rate of rise of reverse voltage
1
- thermal runaway condition for a diode on its own heatsink
< ------------------------Rth ( j – a )
Table 4: Thermal Parameters
Symbol
Rth(j-c)
Parameter
Junction to case
Rth(c)
Value
Unit
Per diode
Total
1.2
0.85
°C/W
Coupling
0.5
When the diodes 1 and 2 are used simultaneously:
∆ Tj(diode 1) = P(diode 1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c)
Table 5: Static Electrical Characteristics (per diode)
Symbol
IR *
Parameter
Reverse leakage current
Tests conditions
Tj = 25 °C
Tj = 125 °C
Tj = 25 °C
VF **
Forward voltage drop
Tj = 125 °C
Tj = 25 °C
Tj = 125 °C
Pulse test:
Min.
VR = VRRM
7
Max.
Unit
30
µA
30
mA
0.92
IF = 20A
0.69
0.75
1.00
IF = 40A
0.79
* tp = 5 ms, δ < 2%
** tp = 380 µs, δ < 2%
2
To evaluate the conduction losses use the following equation: P = 0.64 x IF(AV) + 0.055 IF (RMS)
2/8
Typ
0.86
V
STPS40170C
Figure 1: Average forward power dissipation
versus average forward current (per diode)
Figure 2: Average forward current versus
ambient temperature (δ = 0.5, per diode)
IF(AV)(A)
PF(AV)(W)
22
d=0.1
d=0.05
20
d=0.5
d=0.2
22
d=1
Rth(j-a)=Rth(j-c)
20
18
18
16
16
14
14
12
12
10
10
8
Rth(j-a)=15°C/W
8
6
6
T
4
T
4
2
d=tp/T
IF(AV)(A)
2
tp
0
d=tp/T
tp
Tamb (°C)
0
0
2
4
6
8
10
12
14
16
18
20
22
Figure 3: Normalized avalanche
derating versus pulse duration
24
26
28
power
PARM (t p )
PARM (1µs)
0
50
75
100
125
150
Figure 4: Normalized avalanche
derating versus junction temperature
1.2
1
25
175
power
PARM (t p )
PARM (25°C)
1
0.1
0.8
0.6
0.01
0.4
0.2
Tj (°C)
t p (µs)
0.001
0.01
0.1
1
10
100
1000
Figure 5: Non repetitive surge peak forward
current versus overload duration (maximum
values, per diode)
0
25
50
75
100
125
150
Figure 6: Relative variation of thermal
impedance junction to case versus pulse
duration
IM(A)
Zth(j-c)/Rth(j-c)
250
1.0
0.9
200
0.8
0.7
TC=50°C
150
TC=75°C
100
d=0.5
0.6
0.5
0.4
d=0.2
0.3
d=0.1
T
TC=125°C
50
0.2
IM
t
0
1.E-03
0.1
t(s)
d =0.5
1.E-02
1.E-01
1.E+00
Single pulse
0.0
1.E-03
d=tp/T
tP(s)
1.E-02
1.E-01
tp
1.E+00
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STPS40170C
Figure 7: Reverse leakage current versus
reverse voltage applied (typical values, per
diode)
Figure 8: Junction capacitance versus reverse
voltage applied (typical values, per diode)
IR(µA)
C(pF)
1000
1.E+05
F=1MHz
VOSC=30mVRMS
Tj=25°C
Tj=150°C
1.E+04
Tj=125°C
1.E+03
Tj=100°C
1.E+02
100
Tj=75°C
Tj=50°C
1.E+01
Tj=25°C
1.E+00
VR(V)
VR(V)
10
1.E-01
0
1
10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 160 170
Figure 9: Forward voltage drop versus forward
current (per diode, low level)
10
100
1000
Figure 10: Forward voltage drop versus
forward current (per diode, high level)
IFM(A)
IFM(A)
20
1000
18
Tj=125°C
(Maximum values)
16
Tj=125°C
(Maximum values)
14
100
12
Tj=125°C
(Typical values)
10
Tj=125°C
(Typical values)
Tj=25°C
(Maximum values)
8
10
6
4
Tj=25°C
(Maximum values)
2
VFM(V)
VFM(V)
1
0
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
Figure 11: Thermal resistance junction to ambient versus copper surface under tab (epoxy
printed board FR4, Cu = 35µm) (D2PAK)
Rth(j-a) (°C/W)
80
D²PAK
70
60
50
40
30
20
10
SCU(cm²)
0
0
4/8
5
10
15
20
25
30
35
40
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
STPS40170C
Figure 12: D2PAK Package Mechanical Data
REF.
A
E
C2
L2
D
L
L3
A1
B2
R
C
B
G
A2
M
*
V2
* FLAT ZONE NO LESS THAN 2mm
A
A1
A2
B
B2
C
C2
D
E
G
L
L2
L3
M
R
V2
DIMENSIONS
Millimeters
Inches
Min.
Max.
Min.
Max.
4.40
4.60
0.173
0.181
2.49
2.69
0.098
0.106
0.03
0.23
0.001
0.009
0.70
0.93
0.027
0.037
1.14
1.70
0.045
0.067
0.45
0.60
0.017
0.024
1.23
1.36
0.048
0.054
8.95
9.35
0.352
0.368
10.00
10.40
0.393
0.409
4.88
5.28
0.192
0.208
15.00
15.85
0.590
0.624
1.27
1.40
0.050
0.055
1.40
1.75
0.055
0.069
2.40
3.20
0.094
0.126
0.40 typ.
0.016 typ.
0°
8°
0°
8°
Figure 13: Foot Print Dimensions (in millimeters)
16.90
10.30
5.08
1.30
3.70
8.90
5/8
STPS40170C
Figure 14: TO-247 Package Mechanical Data
DIMENSIONS
REF.
Millimeters
Min.
V
A
V
Dia
4.85
L2
L4
F2
F1
L1
F4
D
L3
M
G
E
2.60 0.086
0.102
0.031
F
1.00
1.40 0.039
0.055
3.00
0.118
2.00
0.078
F3
2.00
2.40 0.078
0.094
F4
3.00
3.40 0.118
0.133
10.90
0.429
H
15.45
15.75 0.608
0.620
L
19.85
20.15 0.781
0.793
L1
3.70
4.30 0.145
0.169
18.50
14.20
0.728
14.80 0.559
0.582
L4
34.60
1.362
L5
5.50
0.216
M
2.00
3.00 0.078
0.118
V
5°
5°
V2
60°
60°
Dia.
6/8
0.203
0.80 0.015
L3
F(x3)
5.15 0.191
Max.
2.20
L2
F3
V2
Typ.
0.40
G
L
Min.
E
F2
L5
Max.
D
F1
A
H
Typ.
Inches
3.55
3.65 0.139
0.143
STPS40170C
Figure 15: TO-220AB Package Mechanical Data
REF.
A
H2
Dia
C
L5
L7
L6
L2
F2
F1
D
L9
L4
F
M
G1
E
G
A
C
D
E
F
F1
F2
G
G1
H2
L2
L4
L5
L6
L7
L9
M
Diam.
DIMENSIONS
Millimeters
Inches
Min.
Max.
Min.
Max.
4.40
4.60
0.173
0.181
1.23
1.32
0.048
0.051
2.40
2.72
0.094
0.107
0.49
0.70
0.019
0.027
0.61
0.88
0.024
0.034
1.14
1.70
0.044
0.066
1.14
1.70
0.044
0.066
4.95
5.15
0.194
0.202
2.40
2.70
0.094
0.106
10
10.40
0.393
0.409
16.4 typ.
0.645 typ.
13
14
0.511
0.551
2.65
2.95
0.104
0.116
15.25
15.75
0.600
0.620
6.20
6.60
0.244
0.259
3.50
3.93
0.137
0.154
2.6 typ.
0.102 typ.
3.75
3.85
0.147
0.151
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These
packages have a Lead-free second level interconnect . The category of second level interconnect is
marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The
maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an
ST trademark. ECOPACK specifications are available at: www.st.com.
Table 6: Ordering Information
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■
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■
Ordering type
Marking
Package
Weight
Base qty
Delivery
mode
STPS40170CT
STPS40170CT
TO-220AB
2.20 g
50
Tube
STPS40170CG
STPS40170CG
Tube
STPS40170CG
1.48 g
50
STPS40170CG-TR
D2PAK
1000
Tape & reel
STPS40170CW
STPS40170CW
TO-247
4.4 g
30
Tube
Epoxy meets UL94, V0
Cooling method: by conduction (C)
TO-220 - Recommended torque value: 0.55 Nm, Maximum torque value: 0.7 Nm.
TO-247 - Recommended torque value: 0.8 Nm, Maximum torque value: 1.0 Nm.
Table 7: Revision History
Date
Revision
16-Sep-2005
1
Description of Changes
First issue.
7/8
STPS40170C
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics.
All other names are the property of their respective owners
© 2005 STMicroelectronics - All rights reserved
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