STTH506 Turbo 2 ultrafast - high voltage rectifier Main product characteristics A K K IF(AV) 5A VRRM 600 V Tj 175° C VF (typ) 1.1 V trr (max) 30 ns A NC DPAK STTH506B Features and benefits A ■ Ultrafast switching ■ Low reverse current ■ Low thermal resistance ■ Reduces conduction and switching losses ■ Insulated package TO-220FPAC – Insulated voltage: 2500 VRMS – Typical package capacitance: 12 pF K TO-220AC STTH506D The STTH506 uses ST Turbo2 600V technology. This device is specially suited for use in switching power supplies, and industrial applications. 1. Part Number Marking STTH506B STTH506B STTH506B-TR STTH506B STTH506D STTH506D STTH506FP STTH506FP Absolute ratings (limiting values per diode at 25° C, unless otherwise specified) Symbol Parameter VRRM Repetitive peak reverse voltage IF(RMS) RMS forward current IF(AV) Average forward current, δ = 0.5 IFSM Surge non repetitive forward current Tstg Storage temperature range Tj K TO-220FPAC STTH506FP Order codes Description Table 1. A Value Unit 600 V TO-220AC, TO220FPAC 20 A DPAK 10 A Tc = 145° C TO-220AC, DPAK 5 A Tc = 120° C TO-220FPAC 5 A tp = 10 ms Sinusoidal TO-220AC, TO220FPAC 70 A DPAK 55 A -65 to + 175 °C 175 °C (1) Maximum operating junction temperature dP tot thermal runaway condition for a diode on its own heatsink 1 --------------- < -------------------------dTj R th ( j – a ) May 2006 Rev 1 1/9 www.st.com Characteristics STTH506 1 Characteristics Table 2. Thermal parameters Symbol Parameter TO-220AC, DPAK Junction to case Rth(j-c) Table 3. Value Unit 3.5 TO-220FPAC ° C/W 6 Static electrical characteristics Symbol Parameter IR(1) Reverse leakage current VF(2) Forward voltage drop Test conditions Tj = 25° C Min. Tj = 25° C 13 130 1.10 1.40 Unit µA 1.85 IF = 5 A Tj = 150° C Max. 5 VR = VRRM Tj = 150° C Typ V 1. Pulse test: tp = 5 ms, δ < 2 % 2. Pulse test: tp = 380 µs, δ < 2 % To evaluate the conduction losses use the following equation: P = 1.07 x IF(AV) + 0.066 IF2(RMS) Table 4. Dynamic characteristics Symbol trr tfr VFP Min. Typ IF = 0.5 A, Irr = 0.25 A, IR = 1 A, Tj = 25° C Reverse recovery time IRM Max. ns 35 50 Reverse recovery current IF = 5 A, dIF/dt = -100 A/µs, VR = 400 V, Tj = 25° C 3.5 5 Forward recovery time dIF/dt = 100 A/µs IF = 5 A VFR = 1.1 x VFmax, Tj = 25° C Forward recovery voltage IF = 5 A dIF/dt = 100 A/µs VFR = 1.1 x VFmax, Tj = 25° C Conduction losses versus average current Figure 2. PF(AV)(W) 100 δ = 0.05 8 δ = 0.1 δ = 0.5 δ = 0.2 Unit 30 IF = 1 A, dIF/dt = -50 A/µs, VR = 30 V, Tj = 25° C Figure 1. 9 Test conditions Parameter 180 ns 4 V Forward voltage drop versus forward current IFM(A) 90 80 7 Tj=150°C (maximum values) 70 6 δ=1 60 5 50 Tj=150°C (typical values) 4 40 3 20 IF(AV)(A) 1 δ=tp/T VFM(V) 10 tp 0 0 0.0 2/9 Tj=25°C (maximum values) 30 T 2 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 STTH506 Characteristics Figure 3. Relative variation of thermal Figure 4. impedance junction to case versus pulse duration (TO-220AC, DPAK) Zth(j-c)/Rth(j-c) 1.0 1.0 Single pulse TO-220AC DPAK 0.9 0.8 Relative variation of thermal impedance junction to case versus pulse duration (TO-220FPAC) Zth(j-c)/Rth(j-c) 0.9 Single pulse TO-220FPAC 0.8 0.7 0.7 0.6 0.6 0.5 0.5 0.4 0.4 0.3 0.3 0.2 0.2 0.1 tp(s) 0.1 tp(s) 0.0 0.0 1.E-03 1.E-02 Figure 5. 1.E-01 1.E+00 Peak reverse recovery current versus dIF/dt (typical values) 1.E-02 Figure 6. IRM(A) 14 1.E-03 250 1.E-01 1.E+00 Reverse recovery time versus dIF/dt (typical values) trr(ns) VR=400V Tj=125°C VR=400V Tj=125°C 12 1.E+01 200 IF=2 x IF(AV) 10 IF=2 x IF(AV) IF=IF(AV) 150 IF=0.5 x IF(AV) 8 IF=IF(AV) IF=0.5 x IF(AV) 6 IF=0.25 x IF(AV) 100 4 50 2 dIF/dt(A/µs) dIF/dt(A/µs) 0 0 0 50 Figure 7. 350 100 150 200 250 300 350 400 450 0 500 Reverse recovery charges versus dIF/dt (typical values) Qrr(nC) Figure 8. 2.50 VR=400V Tj=125°C 100 150 200 250 300 350 400 450 500 Softness factor versus dIF/dt (typical values) S factor IF = 2 x IF(AV) VR = 400 V Tj = 125° C 2.25 IF=2 x IF(AV) 300 50 2.00 IF=IF(AV) 250 1.75 200 1.50 IF=0.5 x IF(AV) 1.25 150 1.00 100 0.75 dIF/dt(A/µs) dIF/dt(A/µs) 50 0.50 0 50 100 150 200 250 300 350 400 450 500 0 50 100 150 200 250 300 350 400 450 500 3/9 Characteristics Figure 9. STTH506 Relative variations of dynamic parameters versus junction temperature Figure 10. Transient peak forward voltage versus dIF/dt (typical values) VFP(V) 26 1.50 IF=IF(AV) VR=400V Reference: Tj=125°C 1.25 IF=IF(AV) Tj=125°C 24 22 20 18 1.00 16 14 0.75 IRM and S factor 12 10 0.50 QRR 8 6 0.25 4 Tj(°C) dIF/dt(A/µs) 2 0.00 25 50 75 100 125 0 0 Figure 11. Forward recovery time versus dIF/dt (typical values) 220 100 200 300 400 Figure 12. Junction capacitance versus reverse voltage applied (typical values) tfr(ns) 100 C(pF) F=1MHz VOSC=30mVRMS Tj=25°C IF=IF(AV) VFR=1.1 x VF max. Tj=125°C 200 180 500 160 140 120 10 100 80 60 40 VR(V) dIF/dt(A/µs) 20 0 1 0 100 200 300 400 500 Figure 13. Thermal resistance junction to ambient versus copper surface under tab (printed circuit board FR4, eCU = 35 µm) 100 Rth(j-a)(°C/W) DPAK 90 80 70 60 50 40 30 20 10 S(Cu)(cm²) 0 0 4/9 5 10 15 20 25 30 35 40 1 10 100 1000 STTH506 2 Package mechanical data Package mechanical data Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.80 Nm Maximum torque value: 1.0 Nm Table 5. DPAK Dimensions Dimensions Ref. E A B2 C2 L2 D R H L4 A1 B R G C A2 0.60 MIN. Inches Min. Max Min. Max. A 2.20 2.40 0.086 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009 B 0.64 0.90 0.025 0.035 B2 5.20 5.40 0.204 0.212 C 0.45 0.60 0.017 0.023 C2 0.48 0.60 0.018 0.023 D 6.00 6.20 0.236 0.244 E 6.40 6.60 0.251 0.259 G 4.40 4.60 0.173 0.181 H 9.35 10.10 0.368 0.397 L2 V2 Millimeters 0.80 typ. 0.031 typ. L4 0.60 1.00 0.023 0.039 V2 0° 8° 0° 8° 3 1.6 Figure 14. DPAK Footprint dimensions (in mm) 6.7 3 2.3 6.7 2.3 1.6 5/9 Package mechanical data Table 6. STTH506 TO-220AC Dimensions Dimensions Ref. A H2 ØI C L5 L7 L6 L2 F1 Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.066 G 4.95 5.15 0.194 0.202 H2 10.00 10.40 0.393 0.409 L2 L4 F M E 16.40 typ. 0.645 typ. L4 13.00 14.00 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 M Diam. I 6/9 Inches D L9 G Millimeters 2.6 typ. 3.75 3.85 0.102 typ. 0.147 0.151 STTH506 Package mechanical data Table 7. TO-220FPAC Dimensions Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 4.4 4.6 0.173 0.181 B 2.5 2.7 0.098 0.106 D 2.5 2.75 0.098 0.108 E 0.45 0.70 0.018 0.027 F 0.75 1 0.030 0.039 F1 1.15 1.70 0.045 0.067 G 4.95 5.20 0.195 0.205 G1 2.4 2.7 0.094 0.106 H 10 10.4 0.393 0.409 A B H Dia L6 L2 L7 L3 L5 F1 D L4 L2 F E 16 Typ. 0.63 Typ. L3 28.6 30.6 1.126 1.205 L4 9.8 10.6 0.386 0.417 L5 2.9 3.6 0.114 0.142 L6 15.9 16.4 0.626 0.646 L7 9.00 9.30 0.354 0.366 Dia. 3.00 3.20 0.118 0.126 G1 G In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 7/9 Ordering information 3 4 8/9 STTH506 Ordering information Part Number Marking Package Weight Base qty Delivery mode STTH506B STTH506B DPAK 0.3 g 75 Tube STTH506B-TR STTH506B DPAK 0.3 g 2500 Tape and reel STTH506D STTH506D TO-220AC 1.86 50 Tube STTH506FP STTH506FP TO-220FPAC 1.8 g 50 Tube Revision history Date Revision 18-May-2006 1 Description of Changes First issue. 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