STMICROELECTRONICS STTH5L06FP

STTH5L06
Turbo 2 ultrafast high voltage rectifier
Main product characteristics
IF(AV)
5A
VRRM
600 V
IR (max)
125 µA / 150 µA
Tj (max)
175 °C
VF (max)
1.05 V
trr (max)
95 ns
K
A
A
K
TO-220AC
STTH5L06D
K
TO-220FPAC
STTH5L06FP
K
Features and benefits
A
■
Ultrafast switching
■
Low reverse recovery current
■
Reduces switching & conduction losses
■
Low thermal resistance
Description
NC
DPAK
STTH5L06B
Order codes
The STTH5L06, which uses ST Turbo 2 600V
technology, is specially suited as boost diode in
discontinuous or critical mode power factor
corrections.
This device, available in TO-220AC, TO-220FPAC
DPAK and DO-201AD, is also intended for use as
a free wheeling diode in power supplies and other
power switching applications
March 2007
DO-201AD
STTH5L06
Rev 2
Part number
Marking
STTH5L06
STTH5L06
STTH5L06RL
STTH5L06
STTH5L06D
STTH5L06D
STTH5L06B
STTH5L06B
STTH5L06B-TR
STTH5L06B
STTH5L06FP
STTH5L06FP
1/10
www.st.com
10
Characteristics
STTH5L06
1
Characteristics
Table 1.
Absolute ratings (limiting values)
Symbol
Parameter
VRRM
Repetitive peak reverse voltage
IF(RMS)
RMS forward current
Average forward
current
IF(AV)
Tstg
10
TI = 50° C
TO-220FPAC
Tc = 135 °C
IFSM
tp = 10 ms Sinusoidal
δ = 0.5
5
A
tp = 5 µs, F = 5 kHz square
65
A
TO-220AC, TO-220FPAC
90
DO-201AD
110
DPAK
60
δ = 0.5
Maximum operating junction temperature
Table 2.
A
δ = 0.5
Storage temperature range
Tj
V
DPAK
DO-210AD
Surge non repetitive
forward current
600
20
Tc = 150 °C
Repetitive peak forward current
Unit
TO-220AC, TO-220FPAC,
DO-201AD
TO-220AC, DPAK
IFRM
Value
A
- 65 + 175
°C
+ 175
°C
Maximu
m
Unit
Thermal parameters
Symbol
Parameter
Rth(j-c)
Junction to case
Rth(j-l)
Junction to lead
Rth(j-a)
Junction to ambient (1)
TO-220AC, DPAK
3.5
TO-220FPAC
6.0
°C/W
20
L = 10 mm
DO-201AD
75
1. With recommended pad layout (see Figure 15)
Table 3.
Symbol
Static electrical characteristics
Parameter
Tests conditions
Min.
Typ.
Tj = 25°C
IR
Reverse leakage current VR = 600 V
Forward voltage drop
IF = 5 A
TO-220AC, DPAK,
Tj = 150°C TO-220FPAC
2/10
10
125
25
150
Tj = 25°C
Tj = 150°C
To evaluate the maximum conduction losses use the following equation:
P = 0.89 x IF(AV) + 0.033 IF2(RMS)
Unit
5
DO-201AD
VF
Max.
µA
1.3
V
0.85
1.05
STTH5L06
Table 4.
Characteristics
Dynamic electrical characteristics
Symbol
Parameter
Tests conditions
Min.
Typ.
Max.
Unit
65
95
ns
trr
Reverse recovery time
IF = 1 A dIF/dt = - 50 A/µs
VR = 30V
Tj = 25°C
tfr
Forward recovery time
IF = 5 A dIF/dt = 100 A/µs
VFR = 1.1 x VFmax
Tj = 25°C
150
ns
VFP
Forward recovery time
IF = 5 A dIF/dt = 100 A/µs
Tj = 25°C
7
V
Figure 1.
Conduction losses versus average Figure 2.
current
Forward voltage drop versus
forward current
IFM(A)
P(W)
7
δ = 0.1
δ = 0.2
100.0
δ = 0.5
δ = 0.05
6
Tj=150°C
(maximum values)
5
δ=1
Tj=150°C
(typical values)
10.0
4
Tj=25°C
(maximum values)
3
1.0
2
T
1
IF(AV)(A)
δ=tp/T
0
0.0
0.5
1.0
Figure 3.
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
VFM(V)
tp
0.1
5.5
6.0
0.0
Relative variation of thermal
Figure 4.
impedance junction to case versus
pulse duration (TO-220AC, DPAK)
Zth(j-c)/Rth(j-c)
1.0
1.5
2.0
2.5
3.0
Relative variation of thermal
impedance junction to case versus
pulse duration (TO-220FPAC)
Zth(j-c)/Rth(j-c)
1.0
1.0
0.9
0.9
0.8
0.8
0.7
0.7
0.6
0.5
δ = 0.5
0.6
δ = 0.5
0.5
0.5
0.4
δ = 0.2
0.3
δ = 0.1
0.4
0.3
T
0.2
0.2
Single pulse
0.1
1.E-02
δ = 0.1
T
0.1
tp(s)
δ=tp/T
0.0
1.E-03
δ = 0.2
1.E-01
tp(s)
Single pulse
tp
0.0
1.E+00
1.E-03
1.E-02
1.E-01
δ=tp/T
1.E+00
tp
1.E+01
3/10
Characteristics
STTH5L06
Figure 6.
Relative variation of thermal
impedance junction ambient versus
pulse duration (Epoxy FR4, Lleads =
10 mm) (DO-201AD)
Figure 5.
Zth(j-c)/Rth(j-c)
Peak reverse recovery current
versus dIF/dt (90% confidence)
IRM(A)
1.0
8
VR=400V
Tj=125°C
0.9
7
IF=2 x IF(AV)
0.8
6
IF=IF(AV)
0.7
5
0.6
IF=0.5 x IF(AV)
δ = 0.5
0.5
4
IF=0.25 x IF(AV)
0.4
3
0.3
δ = 0.2
2
T
0.2
δ = 0.1
0.1
1
tp(s)
Single pulse
δ=tp/T
0.0
1.E-01
1.E+00
Figure 7.
1.E+01
dIF/dt(A/µs)
tp
0
1.E+02
1.E+03
0
10
Reverse recovery time versus dIF/dt Figure 8.
(90% confidence)
20
30
40
50
60
70
80
90
100
Reverse recovery charges versus
dIF/dt (90% confidence)
Qrr(nC)
trr(ns)
500
1000
VR=400V
Tj=125°C
900
800
400
700
350
IF=2 x IF(AV)
600
IF=IF(AV)
IF=0.5 x IF(AV)
300
IF=IF(AV)
500
IF=2 x IF(AV)
VR=400V
Tj=125°C
450
250
IF=0.5 x IF(AV)
400
200
300
150
200
100
100
50
dIF/dt(A/µs)
0
dIF/dt(A/µs)
0
0
10
Figure 9.
20
30
40
50
60
70
80
90
100
Softness factor versus dIF/dt
(typical values)
0
10
20
30
50
60
70
80
90
100
Figure 10. Relative variations of dynamic
parameters versus junction
temperature
S factor
1.25
2.4
S factor
IF=IF(AV)
VR=400V
Tj=125°C
2.2
40
1.00
2.0
1.8
IRM
1.6
0.75
QRR
1.4
1.2
0.50
1.0
0.8
0.25
0.6
Tj(°C)
0.4
dIF/dt(A/µs)
0.00
0.2
25
0
4/10
10
20
30
40
50
60
IF=IF(AV)
VR=400V
Reference: Tj=125°C
70
80
90
100
50
75
100
125
STTH5L06
Characteristics
Figure 11. Transient peak forward voltage
versus dIF/dt (90% confidence)
Figure 12. Forward recovery time versus dIF/dt
(90% confidence)
tfr(ns)
VFP(V)
10
200
IF=IF(AV)
Tj=125°C
9
IF=IF(AV)
VFR=1.1 x VF max.
Tj=125°C
180
8
160
7
140
6
120
5
100
4
80
3
60
2
40
1
20
dIF/dt(A/µs)
0
dIF/dt(A/µs)
0
0
20
40
60
80
100
120
140
160
180
200
Figure 13. Junction capacitance versus
reverse voltage applied (typical
values)
0
20
40
60
80
100
120
140
160
180
200
Figure 14. Thermal resistance junction to
ambient versus copper surface
under tab (epoxy FR4, eCU = 35 µm)
(DPAK)
C(pF)
100
Rth(j-a)(°C/W)
F=1MHz
VOSC=30mV
Tj=25°C
80
70
60
50
10
40
30
20
10
VR(V)
SCU(cm²)
0
1
0
1
10
100
2
4
6
8
10
12
14
16
18
20
1000
Figure 15. Thermal resistance junction to
ambient versus copper surface
under each lead (epoxy printed
circuit board FR4, copper
thickness: 35µm) (DO-201AD)
Rth(j-a)(°C/W)
80
70
60
DO-201AD
50
40
30
20
10
SCU(cm²)
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5/10
Package information
2
STTH5L06
Package information
■
Epoxy meets UL94, V0
■
Cooling method: by conduction (C)
■
Recommended torque value: 0.8 Nm (TO-220FPAC) / 0.55 Nm (TO-220AC)
■
Maximum torque value: 1.0 Nm (TO-220FPAC) / 0.70 Nm (TO-220AC)
Table 5.
TO-220AC dimensions
Dimensions
Ref.
A
H2
ØI
C
L5
L7
L6
L2
F1
D
L9
F
M
E
G
Max.
Min.
Max.
A
4.40
4.60
0.173
0.181
C
1.23
1.32
0.048
0.051
D
2.40
2.72
0.094
0.107
E
0.49
0.70
0.019
0.027
F
0.61
0.88
0.024
0.034
F1
1.14
1.70
0.044
0.066
G
4.95
5.15
0.194
0.202
H2
10.00
10.40
0.393
0.409
16.40 typ.
0.645 typ.
L4
13.00
14.00
0.511
0.551
L5
2.65
2.95
0.104
0.116
L6
15.25
15.75
0.600
0.620
L7
6.20
6.60
0.244
0.259
L9
3.50
3.93
0.137
0.154
M
Diam.
I
6/10
Inches
Min.
L2
L4
Millimeters
2.6 typ.
3.75
3.85
0.102 typ.
0.147
0.151
STTH5L06
Package information
Table 6.
TO-220FPAC dimensions
Dimensions
Ref.
A
Millimeters
Inches
Min.
Max.
Min.
Max.
A
4.4
4.6
0.173
0.181
B
2.5
2.7
0.098
0.106
D
2.5
2.75
0.098
0.108
E
0.45
0.70
0.018
0.027
F
0.75
1
0.030
0.039
F1
1.15
1.70
0.045
0.067
G
4.95
5.20
0.195
0.205
G1
2.4
2.7
0.094
0.106
H
10
10.4
0.393
0.409
B
H
Dia
L6
L7
L2
L3
L5
D
F1
L2
L4
F
E
G1
G
Table 7.
16 Typ.
0.63 Typ.
L3
28.6
30.6
1.126
1.205
L4
9.8
10.6
0.386
0.417
L5
2.9
3.6
0.114
0.142
L6
15.9
16.4
0.626
0.646
L7
9.00
9.30
0.354
0.366
Dia.
3.00
3.20
0.118
0.126
DO-201AD dimensions
Dimensions
Ref.
Millimeters
Min.
B
E
Min.
Max.
B
A
Note 1
Max.
Inches
E
Note 1
A
B
9.50
25.40
0.374
1.000
ØD
Note 2
ØC
C
5.30
0.209
D
1.30
0.051
E
1.25
0.049
Notes
1 - The lead diameter ø D is not
controlled over zone E
2 - The minimum length which must stay
straight between the right angles after
bending is 0.59"(15mm)
7/10
Package information
Table 8.
STTH5L06
DPAK dimensions
Dimensions
Ref.
E
A
B2
C2
L2
Millimeters
Inches
Min.
Max.
Min.
Max.
A
2.20
2.40
0.086
0.094
A1
0.90
1.10
0.035
0.043
A2
0.03
0.23
0.001
0.009
B
0.64
0.90
0.025
0.035
B2
5.20
5.40
0.204
0.212
C
0.45
0.60
0.017
0.023
C2
0.48
0.60
0.018
0.023
D
6.00
6.20
0.236
0.244
E
6.40
6.60
0.251
0.259
G
4.40
4.60
0.173
0.181
H
9.35
10.10
0.368
0.397
D
R
H
L4
A1
B
G
R
C
A2
0.60 MIN.
V2
L2
0.80 typ.
0.031 typ.
L4
0.60
1.00
0.023
0.039
V2
0°
8°
0°
8°
Figure 16. DPAK footprint (dimensions in mm)
6.7
3
3
1.6
2.3
6.7
2.3
1.6
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
8/10
STTH5L06
3
4
Ordering information
Ordering information
Ordering code
Marking
STTH5L06
STTH5L06
STTH5L06RL
STTH5L06
STTH5L06D
STTH5L06D
STTH5L06B
STTH5L06B
STTH5L06B-TR
STTH5L06B
STTH5L06FP
STTH5L06FP
Package
Weight
DO-201AD
1.16 G
TO-220AC
1.9 g
DPAK
0.3 g
TO-220FPAC
1.7 g
Base qty
Delivery
mode
600
Ammopack
1900
Tape & reel
50
Tube
75
Tube
2500
Tape & reel
50
Tube
Revision history
Date
Revision
Nov-2001
1A
31-Mar-2007
2
Changes
Last release.
Merge with TO-220AC, TO-220FPAC and DPAK version.
9/10
STTH5L06
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10/10