STP130NS04ZB - STB130NS04ZB-1 STB130NS04ZB - STW130NS04ZB N-channel clamped - 7 mΩ - 80A TO-220/I2/D2PAK/TO-247 Fully protected mesh overlay™ MOSFET General features Type VDSS RDS(on) ID STP130NS04ZB clamped <9 mΩ 80A STB130NS04ZB clamped <9 mΩ 80A STW130NS04ZB clamped <9 mΩ 80A STB130NS04ZB clamped <9 mΩ 80A ■ 100% avalanche tested ■ Low capacitance and gate charge ■ 175°C maximum junction temperature 3 1 2 TO-247 TO-220 3 3 12 1 D²PAK I²PAK Description This fully clamped MOSFET is produced by using the latest advanced Company’s Mesh Overlay process which is based on a novel strip layout. The inherent benefits of the new technology coupled with the extra clamping capabilities make this product particularly suitable for the harshest operation conditions such as those encountered in the automotive environment .Any other application requiring extra ruggedness is also recommended. Internal schematic diagram Applications ■ High switching current ■ Linear applications Order codes Part number Marking Package Packaging STP130NS04ZB P130NS04ZB TO-220 Tube STB130NS04ZBT4 B130NS04ZB D²PAK Tape & reel STW130NS04ZB W130NS04ZB TO-247 Tube STB130NS04ZB-1 B130NS04ZB I²PAK Tube October 2006 Rev 3 1/16 www.st.com 16 Contents STP130NS04ZB-STB130NS04ZB-STW130NS04ZB-STB130NS04ZB-1 Contents 1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Electrical characteristics (curves) ............................ 6 3 Test circuit 4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 5 Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 2/16 ................................................ 8 STP130NS04ZB-STB130NS04ZB-STW130NS04ZB-STB130NS04ZB-1 1 Electrical ratings Electrical ratings Table 1. Absolute maximum ratings Symbol Parameter Value Unit VDS Drain-source voltage (VGS = 0) clamped V VGS Gate-source voltage clamped V ID Drain current (continuous) at TC = 25°C 80 A ID Drain current (continuous) at TC = 100°C 60 A IDG Drain gate current (continuous) ± 50 mA IGS Gate source current (continuous) ± 50 mA IDM(1) Drain current (pulsed) 320 A PTOT Total dissipation at TC = 25°C 300 W Derating factor 2.0 W/°C 4 KV -55 to 175 °C VESD(G-S) TJ Tstg Gate-source ESD(HBM-C=100 pF, R=1.5 KΩ) Operating junction temperature Storage temperature 1. Pulse width limited by safe operating area Table 2. Thermal data TO-220 Rthj-case Rthj-pcb(1) D²PAK/I²PA K TO-247 Unit Thermal resistance junction-case Max 0.50 °C/W Thermal resistance junction-pcb Max 35 °C/W Rthj-a Thermal resistance junction-ambient Max Tl(2) Maximum lead temperature for soldering purpose 62.5 50 300 °C 1. When mounted on 1 inch² FR4 2oZ Cu 2. (1.6 mm from case, for 10 sec) Table 3. Symbol Avalanche characteristics Parameter Value Unit IAS Avalanche current, repetitive or not-repetitive (pulse width limited by Tj Max) 80 A EAS Single pulse avalanche energy (starting Tj=25°C, Id=Iar, Vdd=30V) 500 mJ 3/16 Electrical characteristics 2 STP130NS04ZB-STB130NS04ZB-STW130NS04ZB-STB130NS04ZB-1 Electrical characteristics (TCASE=25°C unless otherwise specified) Table 4. Symbol On/off states Parameter Test conditions Typ. Max. Unit Drain-source breakdown voltage ID = 1 mA, VGS = 0 -40 < Tj < 175 °C IDSS Zero gate voltage drain current (VGS = 0) VDS = 16 V,Tj = 25 °C VDS = 16 V,Tj = 125 °C 10 100 µA µA IGSS Gate body leakage current (VDS = 0) VGS = ±10 V, Tj = 25 °C 10 nA VGSS Gate-source breakdown voltage IGS= ± 100µA 18 VGS(th) Gate threshold voltage VDS = VGS = ID = 1 mA 2 RDS(on) Static drain-source on resistance VGS = 10 V ,ID = 40 A V(BR)DSS Table 5. Symbol 33 V V 7 4 V 9 mΩ Dynamic Parameter Test conditions gfs (1) Forward transconductance VDS =15V, ID = 40A Ciss Coss Crss Input capacitance Output capacitance Reverse transfer capacitance VDS =25V, f=1 MHz, VGS=0 td(on) tr Turn-on delay time Rise time td(off) tf Qg Qgs Qgd Min. Typ. Max. Unit 50 S 2700 1275 285 pF pF pF VDD = 17.5 V, ID = 40 A, RG = 4.7 Ω, VGS = 10 V (see Figure 13) 40 10 ns ns Turn-off delay time Fall time VDD = 17.5 V, ID = 40 A, RG = 4.7 Ω, VGS = 10 V (see Figure 13) 220 100 ns ns Total gate charge Gate-source charge Gate-drain charge VDD=20V, ID = 80A VGS =10V (see Figure 14) 80 20 27 1. Pulsed: pulse duration=300µs, duty cycle 1.5% 4/16 Min. 105 nC nC nC STP130NS04ZB-STB130NS04ZB-STW130NS04ZB-STB130NS04ZB-1 Table 6. Symbol Electrical characteristics Source drain diode Max Unit Source-drain current 80 A ISDM(1) Source-drain current (pulsed) 320 A VSD(2) Forward on voltage 1.5 V ISD trr Qrr IRRM Parameter Reverse recovery time Reverse recovery charge Reverse recovery current Test conditions Min Typ. ISD=80A, VGS=0 ISD=80A, di/dt = 100A/µs, VDD=25V, Tj=150°C (see Figure 15) 90 0.18 4 ns µC A 1. Pulse width limited by safe operating area 2. Pulsed: pulse duration=300µs, duty cycle 1.5% 5/16 Electrical characteristics STP130NS04ZB-STB130NS04ZB-STW130NS04ZB-STB130NS04ZB-1 2.1 Electrical characteristics (curves) Figure 1. Safe operating area Figure 2. Thermal impedance Figure 3. Output characterisics Figure 4. Transfer characteristics Figure 5. Transconductance Figure 6. Static drain-source on resistance 6/16 STP130NS04ZB-STB130NS04ZB-STW130NS04ZB-STB130NS04ZB-1 Figure 7. Gate charge vs gate-source voltage Figure 8. Figure 9. Normalized gate threshold voltage vs temperature Figure 11. Capacitance variations Electrical characteristics Normalized on resistance vs temperature Figure 10. Source-drain diode forward characteristics Figure 12. Normalized BVDSS vs temperature 7/16 Test circuit 3 STP130NS04ZB-STB130NS04ZB-STW130NS04ZB-STB130NS04ZB-1 Test circuit Figure 13. Switching times test circuit for resistive load Figure 14. Gate charge test circuit Figure 15. Test circuit for inductive load Figure 16. Unclamped Inductive load test switching and diode recovery times circuit Figure 17. Unclamped inductive waveform 8/16 Figure 18. Switching time waveform STP130NS04ZB-STB130NS04ZB-STW130NS04ZB-STB130NS04ZB-1 4 Package mechanical data Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com 9/16 Package mechanical data STP130NS04ZB-STB130NS04ZB-STW130NS04ZB-STB130NS04ZB-1 TO-220 MECHANICAL DATA DIM. mm. MIN. inch MAX. MIN. TYP. MAX. A 4.40 4.60 0.173 0.181 b 0.61 0.88 0.024 0.034 b1 1.15 1.70 0.045 0.066 c 0.49 0.70 0.019 0.027 D 15.25 15.75 0.60 0.620 E 10 10.40 0.393 0.409 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.194 0.202 F 1.23 1.32 0.048 0.052 H1 6.20 6.60 0.244 0.256 J1 2.40 2.72 0.094 0.107 0.551 L 13 14 0.511 L1 3.50 3.93 0.137 L20 16.40 L30 10/16 TYP 0.154 0.645 28.90 1.137 øP 3.75 3.85 0.147 0.151 Q 2.65 2.95 0.104 0.116 STP130NS04ZB-STB130NS04ZB-STW130NS04ZB-STB130NS04ZB-1 Package mechanical data D2PAK MECHANICAL DATA TO-247 MECHANICAL DATA mm. inch DIM. MIN. TYP MAX. MIN. TYP. MAX. A 4.4 4.6 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.7 0.93 0.027 0.036 B2 1.14 1.7 0.044 0.067 C 0.45 0.6 0.017 0.023 C2 1.23 1.36 0.048 0.053 D 8.95 9.35 0.352 0.368 10.4 0.393 D1 E 8 10 E1 0.315 8.5 0.334 G 4.88 5.28 0.192 0.208 L 15 15.85 0.590 0.625 L2 1.27 1.4 0.050 0.055 L3 1.4 1.75 0.055 0.068 M 2.4 3.2 0.094 R 0º 0.126 0.015 4º 3 V2 0.4 1 11/16 Package mechanical data STP130NS04ZB-STB130NS04ZB-STW130NS04ZB-STB130NS04ZB-1 TO-247 MECHANICAL DATA DIM. mm. MIN. inch MAX. MIN. TYP. MAX. A 4.85 5.15 0.19 0.20 A1 2.20 2.60 0.086 0.102 b 1.0 1.40 0.039 0.055 b1 2.0 2.40 0.079 0.094 0.134 b2 3.0 3.40 0.118 c 0.40 0.80 0.015 0.03 D 19.85 20.15 0.781 0.793 E 15.45 15.75 0.608 e 5.45 0.620 0.214 L 14.20 14.80 0.560 L1 3.70 4.30 0.14 L2 18.50 0.582 0.17 0.728 øP 3.55 3.65 0.140 0.143 øR 4.50 5.50 0.177 0.216 S 12/16 TYP 5.50 0.216 STP130NS04ZB-STB130NS04ZB-STW130NS04ZB-STB130NS04ZB-1 Package mechanical data TO-262 (I2PAK) MECHANICAL DATA mm. inch DIM. MAX. MIN. A 4.40 MIN. TYP 4.60 0.173 TYP. MAX. A1 2.40 2.72 0.094 0.107 b 0.61 0.88 0.024 0.034 b1 1.14 1.70 0.044 0.066 c 0.49 0.70 0.019 0.027 0.181 c2 1.23 1.32 0.048 0.052 D 8.95 9.35 0.352 0.368 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.194 0.202 E 10 10.40 0.393 0.410 L 13 14 0.511 0.551 L1 3.50 3.93 0.137 0.154 L2 1.27 1.40 0.050 0.055 13/16 Packaging mechanical data STP130NS04ZB-STB130NS04ZB-STW130NS04ZB-STB130NS04ZB-1 5 Packaging mechanical data D2PAK FOOTPRINT TAPE AND REEL SHIPMENT REEL MECHANICAL DATA DIM. mm MIN. A B 1.5 C 12.8 D 20.2 G 24.4 N 100 T TAPE MECHANICAL DATA DIM. mm MIN. MAX. MIN. A0 10.5 10.7 0.413 0.421 B0 15.7 15.9 0.618 0.626 D 1.5 1.6 0.059 0.063 D1 1.59 1.61 0.062 0.063 E 1.65 1.85 0.065 0.073 F 11.4 11.6 0.449 0.456 K0 4.8 5.0 0.189 0.197 P0 3.9 4.1 0.153 0.161 P1 11.9 12.1 0.468 0.476 P2 1.9 2.1 0.075 0.082 MAX. R 50 1.574 T 0.25 0.35 0.0098 0.0137 W 23.7 24.3 * on sales type 14/16 inch 0.933 0.956 inch MAX. MIN. MAX. 330 12.992 13.2 0.504 0.520 26.4 0.960 1.039 0.059 0795 3.937 30.4 1.197 BASE QTY BULK QTY 1000 1000 STP130NS04ZB-STB130NS04ZB-STW130NS04ZB-STB130NS04ZB-1 6 Revision history Revision history Table 7. Revision history Date Revision Changes 10-Feb-2005 1 First release. 14-Jan-2006 2 Inserted D²PAK, complete version. 03-Oct-2006 3 Inserted I²PAK. 15/16 STP130NS04ZB-STB130NS04ZB-STW130NS04ZB-STB130NS04ZB-1 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 16/16