SLLS430B − NOVEMBER 2000 − REVISED OCTOBER 2004 D Sixteen Low-Voltage Differential Transceivers Designed for Signaling Rates† D D D D D D D D D Up to 630 Mbps Simplex (Point-to-Point) and Half-Duplex (Multipoint) Interface Typical Differential Output Voltage of 340 mV Into a 50-Ω Load Integrated 110-Ω Line Termination on ‘LVDM1677 Product Propagation Delay Time: − Driver: 2.5 ns Typ − Receiver: 3 ns Typ Recommended Maximum Transfer Rate: − Driver: 650 M-Transfers/s − Receiver: 350 M-Transfers/s Driver is High Impedance When Disabled or With VCC < 1.5 V for Power Up/Down Glitch-Free Performance and Hot-Plugging Events Bus-Terminal ESD Protection Exceeds 12 kV Low-Voltage TTL (LVTTL) Logic Input Levels Are 5-V Tolerant Packaged in Thin Shrink Small-Outline Package With 20 mil Terminal Pitch description SN65LVDM1676DGG ( Marked as LVDM1676) SN65LVDM1677DGG (Marked as LVDM1677) (TOP VIEW) GND VCC VCC GND ATX/RX A1A A2A A3A A4A BTX/RX B1A B2A B3A B4A GND VCC VCC GND C1A C2A C3A C4A CTX/RX D1A D2A D3A D4A DTX/RX GND VCC VCC GND 1 64 2 63 3 62 4 61 5 60 6 59 7 58 8 57 9 56 10 55 11 54 12 53 13 52 14 51 15 50 16 49 17 48 18 47 19 46 20 45 21 44 22 43 23 42 24 41 25 40 26 39 A1Y A1Z A2Y A2Z A3Y A3Z A4Y A4Z B1Y B1Z B2Y B2Z B3Y B3Z B4Y B4Z C1Y C1Z C2Y C2Z C3Y C3Z C4Y C4Z D1Y D1Z D2Y D2Z D3Y D3Z D4Y D4Z The SN65LVDM1676 and SN65LVDM1677 27 38 (integrated termination) are sixteen differential 28 37 line drivers and receivers configured as trans29 36 ceivers that use low-voltage differential signaling 30 35 (LVDS) to achieve signaling rates in excess of 31 34 600 Mbps. These products are similar to 32 33 TIA/EIA-644 standard compliant devices (SN65LVDS) counterparts except that the output current of the drivers are doubled. This modification provides a minimum differential output voltage magnitude of 247 mV into a 50-Ω load and allows double-terminated lines and half-duplex operation. The receivers detect a voltage difference of 100 mV with up to 1 V of ground potential difference between a transmitter and receiver. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. † Signaling rate, 1/t, where t is the minimum unit interval and is expressed in the units bits/s (bits per second) Copyright 2001 − 2004, Texas Instruments Incorporated ! " #$%! " &$'(#! )!%* )$#!" # ! "&%##!" &% !+% !%" %," "!$%!" "!)) -!.* )$#! &#%""/ )%" ! %#%""(. #($)% !%"!/ (( &%!%"* WWW.TI.COM 1 SLLS430B − NOVEMBER 2000 − REVISED OCTOBER 2004 description (continued) The intended application of this device and signaling technique is for point-to-point baseband data transmission over controlled impedance media of approximately 100 Ω. The transmission media may be printed-circuit board traces, backplanes, or cables. The large number of transceivers integrated into the same substrate along with the low pulse skew of balanced signaling, allows extremely precise timing alignment of clock and data for synchronous parallel data transfers. (Note: The ultimate rate and distance of data transfer is dependent upon the attenuation characteristics of the media, the noise coupling to the environment, and other system characteristics.) The SN65LVDM1676 and SN65LVDM1677 are characterized for operation from −40°C to 85°C. FUNCTION TABLE INPUTS OUTPUTS (Y − Z) TX/RX A Y Z A VID ≥ 100 mV −100 mV < VID < 100 mV L NA Z Z H L NA Z Z ? VID ≤ 100 mV Open circuit L NA Z Z L L NA Z Z H NA H L L H Z NA H H H L Z H = high level, L= low level, Z= high impedance, ? = indeterminate LVD Transceiver Y A Z TX/RX 2 WWW.TI.COM SLLS430B − NOVEMBER 2000 − REVISED OCTOBER 2004 logic diagram (positive logic) A1A A1Y B1A A1Z A2A B1Z A2Y B2A A2Z BTX/RX A3Y B3A A3Z A4A A4Y B4A C1Y D1A C2Y D2A D2Y D2Z CTX/RX DTX/RX C3Y D3A C3Z C4A D1Y D1Z C2Z C3A B4Y B4Z C1Z C2A B3Y B3Z A4Z C1A B2Y B2Z ATX/RX A3A B1Y D3Y D3Z C4Y D4A C4Z D4Y D4Z WWW.TI.COM 3 SLLS430B − NOVEMBER 2000 − REVISED OCTOBER 2004 equivalent input and output schematic diagrams VCC VCC 50 Ω A, TX/RX Input 10 kΩ 5Ω Y or Z Output 7V 300 kΩ 7V VCC 300 kΩ VCC 300 kΩ 5Ω A Output Z Input Y Input 7V 7V 110 Ω ’LVDM1677 Product Only 4 WWW.TI.COM 7V SLLS430B − NOVEMBER 2000 − REVISED OCTOBER 2004 absolute maximum ratings over operating free-air temperature (unless otherwise noted)† Supply voltage range, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4 V Input voltage range: A, TX/RX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 6 V Y or Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4 V Differential input voltage magnitude, VID, (SN65LVDM1677 only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 V Receiver output current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Electrostatic discharge: Y, Z, and GND (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . Class 3, A:8 kV, B:600 V Continuous power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 3, A:7 kV, B:500 V Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltage values, except differential I/O bus voltages, are with respect to network ground terminal. 2. Tested in accordance with MIL-STD-883C Method 3015.7. 3. This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no airflow. DISSIPATION RATING TABLE TA ≤ 25°C POWER RATING PACKAGE OPERATING FACTOR‡ ABOVE TA = 25°C DGG 2094 mW 16.7 mW/°C ‡ All typical values are at 25°C and with a 3.3-V supply. TA = 85°C POWER RATING 1089 mW recommended operating conditions MIN NOM MAX Supply voltage, VCC 3 3.3 3.6 High-level input voltage, VIH 2 0.1 ŤVIDŤ Common-mode input voltage, VIC 2.4 – 2 0.8 V 0.6 V ŤVIDŤ Receiver low-level output current, IOL −8 Operating free-air temperature, TA V 2 VCC−0.8 8 Receiver high-level output current, IOH V V Low-level input voltage, VIL Magnitude of differential input voltage, VID UNIT V mA mA −40 85 °C electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) device TYP‡ MAX Driver enabled, receiver disabled, RL 50 Ω 140 175 Driver disabled, receiver enabled, no load 45 60 PARAMETER ICC Supply current TEST CONDITIONS MIN UNIT mA ‡ All typical values are at 25°C and with a 3.3-V supply. WWW.TI.COM 5 SLLS430B − NOVEMBER 2000 − REVISED OCTOBER 2004 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) (continued) driver PARAMETER TEST CONDITIONS VOD Differential output voltage magnitude ∆VOD Change in differential output voltage magnitude between logic states VOC(SS) Steady-state common-mode output voltage ∆VOC(SS) Change in steady-state common-mode output voltage between logic states VOC(PP) IIH Peak-to-peak common-mode output voltage IIL Low-level input current IOS Short-circuit output current IO(OFF) CIN Power-off output current RL = 50 Ω, See Figure 1 and Figure 2 See Figure 3 High-level input current MIN TYP MAX 247 340 454 mV −50 50 1.125 1.375 −50 50 mV 50 150 mV 3 20 µA 2 10 µA 10 mA 10 mA ±10 µA VIH = 2 V VIL = 0.8 V VOY or VOZ = 0 V VOD = 0 V VCC = 1.5 V, VO = 2.4 V VI = 0.4 sin (4E6pt) + 0.5 V Input capacitance UNIT 5 V pF receiver PARAMETER TEST CONDITIONS VIT+ VIT− Positive-going differential input voltage threshold VOH VOL High-level output voltage II Input current (Y or Z inputs) IID Differential input current |IIY − IIZ| (inputs) See Figure 6 and Table 1 IOH = −8 mA IOL = 8 mA Low-level output voltage ’LVDM1676 ’LVDM1677 6 TYP† MAX UNIT 100 Negative-going differential input voltage threshold II(OFF) Power-off input current (Y or Z inputs) † All typical values are at 25°C and with a 3.3-V supply. MIN 2.4 VIY = 0.2 V and VIZ = 0 V, VIY = 2.4 V and VIZ = 2.2 V WWW.TI.COM V 0.4 VI = 0 V VI = 2.4 V VIY = 0 V and VIZ = 100 mV, VIY = 2.4 V and VIZ = 2.3 V VCC = 0 V, mV −100 VI = 2.4 V −24 −1.2 5 1.5 −40 −8 V µA A 10 µA 2.2 mA ±25 µA SLLS430B − NOVEMBER 2000 − REVISED OCTOBER 2004 switching characteristics over recommended operating free-air temperature range (unless otherwise noted) driver PARAMETER TEST CONDITIONS MIN TYP MAX UNIT tPLH tPHL Propagation delay time, low-to-high-level output 1.3 2.5 3.6 ns Propagation delay time, high-to-low-level output 1.3 2.5 3.6 ns tr tf Differential output signal rise time 0.5 1.2 ns 0.5 1.2 ns tsk(p) tsk(o) Pulse skew (|tPHL − tPLH|) 0.1 0.6 ns 0.1 0.4 ns 1 ns 11 20 ns 10 20 ns 3 10 ns tsk(pp) tPZH tPZL tPHZ RL = 50 Ω, CL = 10 pF, See Figure 4 Differential output signal fall time Channel-to-channel output skew† Part-to-part skew‡ Propagation delay time, high-impedance-to-high-level output Propagation delay time, high-impedance-to-low-level output Propagation delay time, high-level-to-high-impedance output See Figure 5 tPLZ Propagation delay time, low-level-to-high-impedance output 3 10 ns † tsk(o) is the skew between specified outputs of a single device with all driving inputs connected together and the outputs switching in the same direction while driving identical specified loads. ‡ tsk(PP) is the magnitude of the difference in propagation delay times between any specified terminals of two devices when both devices operate with the same supply voltages, at the same temperature, and have identical packages and test circuits. receiver PARAMETER TEST CONDITIONS MIN TYP§ MAX UNIT tPLH tPHL Propagation delay time, low-to-high-level output 1.5 3 4.5 ns Propagation delay time, high-to-low-level output 1.5 3 4.5 ns tr tf Output signal rise time 0.6 1.6 ns 0.6 1.6 ns tsk(p) tsk(o) Pulse skew (|tPHL − tPLH|) 0.2 0.8 ns Channel-to-channel output skew† Part-to-part skew‡ 0.7 1.2 ns 1 ns 9 15 ns 8 15 ns 12 20 tsk(pp) tPZH tPZL tPHZ CL = 10 pF, See Figure 7 Output signal fall time Propagation delay time, high-impedance-to-high-level output See Figure 8 Propagation delay time, high-impedance-to-low-level output See Figure 8 Propagation delay time, high-level-to-high-impedance output ns See Figure 8 tPLZ Propagation delay time, low-level-to-high-impedance output 11 20 ns † tsk(o) is the skew between specified outputs of a single device with all driving inputs connected together and the outputs switching in the same direction while driving identical specified loads. ‡ tsk(pp) is the magnitude of the difference in propagation delay times between any specified terminals of two devices when both devices operate with the same supply voltages, at the same temperature, and have identical packages and test circuits. § All typical values are at 25°C and with a 3.3-V supply. WWW.TI.COM 7 SLLS430B − NOVEMBER 2000 − REVISED OCTOBER 2004 PARAMETER MEASUREMENT INFORMATION IOY Y II Z VOD IOZ VOY VI VOC VOZ (VOY + VOZ)/2 Figure 1. Driver Voltage and Current Definitions 3.75 kΩ Y VOD Input Z RL 3.75 kΩ ± 0 V ≤ VTEST ≤ 2.4 V Figure 2. Driver VOD Test Circuit Y 25 Ω ± 1% (2 Places) 3V A 0V Input Z VOC(PP) VOC CL = 10 pF (2 Places) VOC(SS) VOC NOTE: All input pulses are supplied by a generator having the following characteristics: tr or tf ≤ 1 ns, pulse repetition rate (PRR) = 0.5 Mpps, pulse width = 500 ± 10 ns. CL includes instrumentation and fixture capacitance within 0,06 m of the D.U.T. The measurement of VOC(PP) is made on test equipment with a −3 dB bandwidth of at least 300 MHz. Figure 3. Test Circuit and Definitions for the Driver Common-Mode Output Voltage 8 WWW.TI.COM SLLS430B − NOVEMBER 2000 − REVISED OCTOBER 2004 PARAMETER MEASUREMENT INFORMATION 3V VCC/2 0V Input tpLH Y Input VOD Z tpHL 50 Ω ± 1 % 100% 80% VOD(H) Output CL = 10 pF (2 Places) 0V VOD(L) 20% 0% tf tr NOTE: All input pulses are supplied by a generator having the following characteristics: tr or tf ≤ 1 ns, pulse repetition rate (PRR) = 0.5 Mpps, pulse width = 10 ± 0.2 ns. CL includes instrumentation and fixture capacitance within 0,06 m of the D.U.T. Figure 4. Test Circuit, Timing, and Voltage Definitions for the Differential Output Signal 25 Ω ± 1% (2 Places) Y 0.8 V or 2 V Z CL = 10 pF (2 Places) TX/RX VOY VOZ + − 1.2 V 3V VCC/2 0V TX/RX tpZH tpHZ ≅ 1.4 V 1.25 V 1.2 V VOY or VOZ tpZL tpLZ 1.2 V 1.15 V ≅1V NOTE: All input pulses are supplied by a generator having the following characteristics: tr or tf ≤ 1 ns, pulse repetition rate (PRR) = 0.5 Mpps, pulse width = 500 ± 10 ns. CL includes instrumentation and fixture capacitance within 0,06 m of the D.U.T. VOZ or VOY Figure 5. Enable and Disable Time Circuit and Definitions WWW.TI.COM 9 SLLS430B − NOVEMBER 2000 − REVISED OCTOBER 2004 PARAMETER MEASUREMENT INFORMATION Y Y VID Z (VIY + VIZ)/2 VIY VIC VO VIZ Figure 6. Voltage Definitions Table 1. Receiver Minimum and Maximum Input Threshold Test Voltages APPLIED VOLTAGES RESULTING DIFFERENTIAL INPUT VOLTAGE RESULTING COMMONMODE INPUT VOLTAGE VIY 1.25 V VIZ 1.15 V VID 100 mV VIC 1.2 V 1.15 V 1.25 V −100 mV 1.2 V 2.4 V 2.3 V 100 mV 2.35 V 2.3 V 2.4 V −100 mV 2.35 V 0.1 V 0V 100 mV 0.05 V 0V 0.1 V −100 mV 0.05 V 1.5 V 0.9 V 600 mV 1.2 V 0.9 V 1.5 V −600 mV 1.2 V 2.4 V 1.8 V 600 mV 2.1 V 1.8 V 2.4 V −600 mV 2.1 V 0.6 V 0V 600 mV 0.3 V 0V 0.6 V −600 mV 0.3 V VID VIY 1.4 V VIZ 1V VID 0.4 V 0V VIY VIZ CL = 10 pF VO −0.4 V tpHL VO tpLH 80% 20% tf ~VCC VCC/2 ~0V tr NOTE: All input pulses are supplied by a generator having the following characteristics: tr or tf ≤ 1 ns, pulse repetition rate (PRR) = 0.5 Mpps, pulse width = 10 ± 0.2 ns. CL includes instrumentation and fixture capacitance within 0,06 m of the D.U.T. Figure 7. Timing Test Circuit and Waveforms 10 WWW.TI.COM SLLS430B − NOVEMBER 2000 − REVISED OCTOBER 2004 PARAMETER MEASUREMENT INFORMATION 1.2 V Z 500 Ω A Y 10 pF VO ± VTEST TX/RX NOTE: All input pulses are supplied by a generator having the following characteristics: tr or tf ≤ 1 ns, pulse repetition rate (PRR) = 0.5 Mpps, pulse width = 500 ± 10 ns. CL includes instrumentation and fixture capacitance within 0,06 m of the D.U.T. 2.5 V VTEST Y 1V 3V VCC/2 0V TX/RX tpLZ tpZL 2.5 V VCC/2 A VOL + 0.5 V VOL 0V VTEST Y 1.4 V 3V VCC/2 0V TX/RX tpHZ tpZH V − OH 0.5 V A VOH VCC/2 0V Figure 8. Enable/Disable Time Test Circuit and Waveforms WWW.TI.COM 11 SLLS430B − NOVEMBER 2000 − REVISED OCTOBER 2004 TYPICAL CHARACTERISTICS COMMON-MODE INPUT VOLTAGE vs DIFFERENTIAL INPUT VOLTAGE 2.5 VIC − Common-Mode Input Voltage − V VCC > 3.15 V VCC = 3 V 2 1.5 1 0.5 MIN 0 0 0.1 0.2 0.4 0.3 0.5 0.6 |VID|− Differential Input Voltage − V Figure 9 DRIVER DRIVER LOW-LEVEL OUTPUT VOLTAGE vs LOW-LEVEL OUTPUT CURRENT HIGH-LEVEL OUTPUT VOLTAGE vs HIGH-LEVEL OUTPUT CURRENT 3.5 VCC = 3.3 V TA = 25°C VCC = 3.3 V TA = 25°C V OH − High-Level Output Voltage − V V OL − Low-Level Output Voltage − V 4 3 2 1 0 2.5 2 1.5 1 .5 0 0 2 4 6 8 10 12 IOL − Low-Level Output Current − mA 0 −2 −4 −6 IOH − High-Level Output Current − mA Figure 10 12 3 Figure 11 WWW.TI.COM −8 SLLS430B − NOVEMBER 2000 − REVISED OCTOBER 2004 TYPICAL CHARACTERISTICS RECEIVER RECEIVER HIGH-LEVEL OUTPUT VOLTAGE vs HIGH-LEVEL OUTPUT CURRENT LOW-LEVEL OUTPUT VOLTAGE vs LOW-LEVEL OUTPUT CURRENT 5 4 VCC = 3.3 V TA = 25°C VOL − Low-Level Output Votlage − V VOH − High-Level Output Voltage − V VCC = 3.3 V TA = 25°C 3 2 1 4 3 2 1 0 0 0 −20 −40 −60 IOH − High-Level Output Current − mA −80 0 20 40 60 IOL − Low-Level Output Current − mA 80 Figure 13 Figure 12 WWW.TI.COM 13 SLLS430B − NOVEMBER 2000 − REVISED OCTOBER 2004 TYPICAL CHARACTERISTICS driver eye pattern test conditions D VCC = 3.3 V D TA = 25°C (ambient temperature) D All 16 channels switching simultaneously with NRZ data. Scope is triggered at the same frequency with pulse. Input signal level = 0 to 3 V single ended. D Resistive loading with no added capacitance equipment HP E8043A Mainframe System Tektronix PS2521 Programmable Power Supply HPE4841A 660 MHz Data Generator 4 HPE4841A 660 MHz Data Generator 4 Bench Test Board HPE4841A 660 MHz Data Generator 4 Tektronix P6248 1.7 GHz Differential Probe HPE4841A 660 MHz Data Generator 4 Tektronix TDS 784 1 GHz Oscilloscope Figure 14. Driver Test Equipment Setup 100 Mbps 650 Mbps Figure 15. Typical Driver Eye Pattern for the SN65LVDM1676 14 WWW.TI.COM SLLS430B − NOVEMBER 2000 − REVISED OCTOBER 2004 TYPICAL CHARACTERISTICS receiver eye pattern test conditions D VCC = 3.3 V D TA = 25°C (ambient temperature) D All 16 channels switching simultaneously with NRZ data. Scope is pulse-triggered simultaneously with NRZ data. Input signal level is 1 V to 1.4 V differential. D 50-Ω resistive loading with no added capacitance equipment HP E8043A Mainframe System Tektronix PS2521 Programmable Power Supply HPE4841A 660 MHz Data Generator 8 HPE4841A 660 MHz Data Generator 8 Bench Test Board HPE4841A 660 MHz Data Generator 8 Tektronix P6248 1.7 GHz Differential Probe HPE4841A 660 MHz Data Generator 8 Tektronix TDS 784 1 GHz Oscilloscope Figure 16. Receiver Test Equipment Setup 100 Mbps 350 Mbps Figure 17. Typical Receiver Eye Pattern for the SN65LVDM1677 WWW.TI.COM 15 SLLS430B − NOVEMBER 2000 − REVISED OCTOBER 2004 APPLICATION INFORMATION fail safe One of the most common problems with differential signaling applications is how the system responds when no differential voltage is present on the signal pair. The LVDS receiver is like most differential line receivers, in that its output logic state can be indeterminate when the differential input voltage is between −50 mV and 50 mV and within its recommended input common-mode voltage range. TI’s LVDS receiver is different, however, in how it handles the open-input circuit situation. Open-circuit means that there is little or no input current to the receiver from the data line itself. This could be when the driver is in a high-impedance state or the cable is disconnected. When this occurs, the LVDS receiver will pull each line of the signal pair to near VCC through 300-kΩ resistors as shown in Figure 18. The fail-safe feature uses an AND gate with input voltage thresholds at about 2.3 V to detect this condition and force the output to a high-level, regardless of the differential input voltage. VCC 300 kΩ 300 kΩ A Rt = 100 Ω (Typ) Y B VIT ≈ 2.3 V Figure 18. Open-Circuit Fail Safe of the LVDS Receiver It is only under these conditions that the output of the receiver will be valid with less than a 50-mV differential input voltage magnitude. The presence of the termination resistor, Rt, does not affect the fail-safe function as long as it is connected as shown in the figure. Other termination circuits may allow a dc current to ground that could defeat the pullup currents from the receiver and the fail-safe feature. 16 WWW.TI.COM SLLS430B − NOVEMBER 2000 − REVISED OCTOBER 2004 MECHANICAL DATA DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0,27 0,17 0,50 48 0,08 M 25 6,20 6,00 8,30 7,90 0,15 NOM Gage Plane 1 0,25 24 0°−ā 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 48 56 64 A MAX 12,60 14,10 17,10 A MIN 12,40 13,90 16,90 DIM 4040078 / F 12/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold protrusion not to exceed 0,15. Falls within JEDEC MO-153 WWW.TI.COM 17 PACKAGE OPTION ADDENDUM www.ti.com 17-Nov-2005 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN65LVDM1676DGG ACTIVE TSSOP DGG 64 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR SN65LVDM1676DGGG4 ACTIVE TSSOP DGG 64 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR SN65LVDM1676DGGR ACTIVE TSSOP DGG 64 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR SN65LVDM1676DGGRG4 ACTIVE TSSOP DGG 64 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR SN65LVDM1677DGG ACTIVE TSSOP DGG 64 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR SN65LVDM1677DGGG4 ACTIVE TSSOP DGG 64 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR SN65LVDM1677DGGR ACTIVE TSSOP DGG 64 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR SN65LVDM1677DGGRG4 ACTIVE TSSOP DGG 64 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 MECHANICAL DATA MTSS003D – JANUARY 1995 – REVISED JANUARY 1998 DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0,27 0,17 0,50 48 0,08 M 25 6,20 6,00 8,30 7,90 0,15 NOM Gage Plane 1 0,25 24 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 48 56 64 A MAX 12,60 14,10 17,10 A MIN 12,40 13,90 16,90 DIM 4040078 / F 12/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. 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