FREESCALE MPXH6250AC6U

Pressure
Freescale Semiconductor
Document Number: MPXH6250A
Rev 3.2, 07/2012
Data Sheet: Technical Data
High Temperature Accuracy
Integrated Silicon Pressure Sensor
for Measuring Absolute Pressure,
On-Chip Signal Conditioned,
Temperature Compensated and
Calibrated
The Freescale MPXH6250A series sensor integrates on-chip, bipolar op
amp circuitry and thin film resistor networks to provide a high output signal
and temperature compensation. The small form factor and high reliability of
on-chip integration make the Freescale MAP sensor a logical and economical
choice for automotive system designers.
The MPXH6250A series piezoresistive transducer is a state-of-the-art,
monolithic, signal conditioned, silicon pressure sensor. This sensor combines
advanced micromachining techniques, thin film metallization, and bipolar
semiconductor processing to provide an accurate, high level analog output
signal that is proportional to applied pressure.
MPXH6250A
MPXHZ6250A
Series
20 to 250 kPa (3 to 36 psi)
0.3 to 4.9 V Output
Application Examples
• Industrial Controls
• Engine Control/Manifold Absolute
Pressure (MAP)/Liquefied Petroleum
Gas (LPG)
Features
•
•
•
•
•
•
Improved Accuracy at High Temperature
Available in Super Small Outline Package
1.5% Maximum Error over 0 to 85C
Ideally suited for Microprocessor or Microcontroller-Based Systems
Temperature Compensated from -40 to +125C
Durable Thermoplastic (PPS) Surface Mount Package
ORDERING INFORMATION
# of Ports
Case
Device Name
No.
None
Single
Dual
Super Small Outline Package (MPXH6250A Series)
MPXH6250A6U
1317
•
MPXH6250A6T1
1317
•
MPXH6250AC6U
1317A
•
MPXH6250AC6T1
1317A
•
Super Small Outline Package (Media Resistant Gel) (MPXHZ6250A Series)
MPXHZ6250A6T1
1317
•
MPXHZ6250A6U
1317
•
MPXHZ6250AC6T1
1317A
•
Gauge
Pressure Type
Differential
SUPER SMALL OUTLINE PACKAGE
MPXH6250A6U/6T1
MPXHZ6250A6U/6T1
CASE 1317
MPXH6250AC6U/C6T1
MPXHZ6250AC6T1
CASE 1317A
© 2007-2009, 2012 Freescale Semiconductor, Inc. All rights reserved.
Absolute
Device
Marking
•
•
•
•
MPXH6250A
MPXH6250A
MPXH6250A
MPXH6250A
•
•
•
MPXHZ6250A
MPXHZ6250A
MPXHZ6250A
Pressure
Operating Characteristics
Table 1. Operating Characteristics (VS = 5.1 Vdc, TA = 25°C unless otherwise noted, P1 > P2.)
Characteristic
Symbol
Min
Typ
Max
Unit
Pressure Range
POP
20
—
250
kPa
Supply Voltage(1)
VS
4.74
5.1
5.46
Vdc
Supply Current
Io
—
6.0
10
mAdc
0.133
0.204
0.274
4.826
4.896
4.966
4.552
4.692
4.833
—
—
—
1.5
%VFSS
V/P
—
20.4
—
mV/kPa
Response Time(6)
tR
—
1.0
—
ms
Warm-Up Time(7)
—
—
20
—
ms
Offset Stability(8)
—
—
0.25
—
%VFSS
Minimum Pressure Offset
@ VS = 5.1 Volts(2)
(0 to 85C)
Full Scale Output
@ VS = 5.1 Volts(3)
(0 to 85C)
Full Scale Span
@ VS = 5.1 Volts(4)
(0 to 85C)
Accuracy(5)
(0 to 85C)
Sensitivity
Vdc
Voff
Vdc
VFSO
Vdc
VFSS
1. Device is ratiometric within this specified excitation range.
2. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
3. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
4. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
5. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span
at 25C due to all sources of error including the following:
Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and
from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or
maximum rated pressure, at 25C.
TcSpan: Output deviation over the temperature range of 0 to 85C, relative to 25C.
TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85C, relative to 25C.
Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25C.
6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
7. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.
8. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
MPXH6250A
2
Sensors
Freescale Semiconductor, Inc.
Pressure
Maximum Ratings
Table 2. Maximum Ratings(1)
Rating
Symbol
Value
Unit
Maximum Pressure (P1 > P2)
PMAX
1000
kPa
Storage Temperature
TSTG
-40 to +125
C
Operating Temperature
TA
-40 to +125
C
Output Source Current @ Full Scale Output(2)
Io+
0.5
mAdc
Output Sink Current @ Minimum Pressure Offset2
Io –
-0.5
mAdc
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
2. Maximum Output Current is controlled by effective impedance from Vout to GND or Vout to VS in the application circuit.
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
VS
2
Thin Film
Temperature
Compensation
and
Gain Stage #1
Sensing
Element
Gain Stage #2
and
Ground
Reference
Shift Circuitry
4
Vout
3
GND
Pins 1, 5, 6, 7, and 8 are NO CONNECTS
for super small outline package devices.
Figure 1. Integrated Pressure Sensor Schematic
MPXH6250A
Sensors
Freescale Semiconductor, Inc.
3
Pressure
On-chip Temperature Compensation and Calibration
Figure 2 illustrates the absolute sensing chip in the basic
Super Small Outline chip carrier (Case 1317). Figure 3
illustrates a typical application circuit (output source current
operation).
Figure 4 shows the sensor output signal relative to
pressure input. Typical minimum and maximum output
curves are shown for operation over 0 to 85C temperature
range. The output will saturate outside of the rated pressure
range.
A fluorosilicone gel isolates the die surface and wire bonds
from the environment, while allowing the pressure signal to
be transmitted to the silicon diaphragm. The MPXH6250A
series pressure sensor operating characteristics, internal
reliability and qualification tests are based on use of dry air as
the pressure media. Media other than dry air may have
adverse effects on sensor performance and long-term
reliability. Contact the factory for information regarding media
compatibility in your application.
Fluorosilicone
Gel Die Coat
Stainless Steel Cap
Die
P1
Wire Bond
Thermoplastic Case
Lead Frame
Absolute Element
Die Bond
Sealed Vacuum Reference
Figure 2. Cross Sectional Diagram SSOP
(not to scale)
+5.1 V
VS Pin 2
MPXH6250A
VOUT Pin 4
100 nF
To ADC
47 pF
GND Pin 3
51 K
Figure 3. Typical Application Circuit
(Output Source Current Operation)
5.0
4.5
4.0
Output (Volts)
3.5
Transfer Function:
Vout = Vs*(0.0040*P-0.040) ± Error
VS = 5.1 Vdc
Temperature = 0 to 85°C
3.0
2.5
MAX
TYP
2.0
1.5
0.5
0
MIN
20.0
31.5
43.0
54.5
66.0
77.5
89.0
100.5
112.0
123.5
135.0
146.5
158.0
169.5
181.0
192.5
204.0
215.5
227.0
238.5
250.0
1.0
Pressure (Reference to Sealed Vacuum) in kPa
Figure 4. Output vs. Absolute Pressure
MPXH6250A
4
Sensors
Freescale Semiconductor, Inc.
Pressure
Transfer Function
Nominal Transfer Value: Vout = VS x (0.004 x P - 0.040)
± (Pressure Error x Temp Factor x 0.004 x VS)
VS = 5.1  0.36 Vdc
Temperature Error Band
4.0
Break Points
3.0
Temperature
Error
Factor
2.0
Temp
Multiplier
-40
0 to 85
125
3
1
1.75
1.0
0.0
-40
-20
0
20
40
80
60
100
120
140
Temperature in C
NOTE: The Temperature Multiplier is a linear response from 0 C to -40 C and from 85 C to 125 C.
Pressure Error Band
4.0
Error Limits for Pressure
Pressure Error (kPa)
3.0
2.0
1.0
0.0
20
-1.0
60
100
140
180
220
260
Pressure (in kPa)
300
-2.0
-3.0
Pressure
-4.0
20 to 250 (kPa)
Error (Max)
±3.45 (kPa)
SURFACE MOUNTING INFORMATION
Minimum Recommended Footprint for Super Small Outline Packages
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor package must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct pad
geometry, the packages will self-align when subjected to a
solder reflow process. It is always recommended to fabricate
boards with a solder mask layer to avoid bridging and/or
shorting between solder pads, especially on tight tolerances
and/or tight layouts.
0.050
1.27
TYP
0.387
9.83
0.150
3.81
0.027 TYP 8X
0.69
0.053 TYP 8X
1.35
inch
mm
Figure 5. SSOP Footprint (Case 1317 and 1317A)
MPXH6250A
Sensors
Freescale Semiconductor, Inc.
5
Pressure
PACKAGE DIMENSIONS
PAGE 1 OF 3
CASE 1317-04
ISSUE H
SUPER SMALL OUTLINE PACKAGE
MPXH6250A
6
Sensors
Freescale Semiconductor, Inc.
Pressure
PACKAGE DIMENSIONS
PAGE 2 OF 3
CASE 1317-04
ISSUE H
SUPER SMALL OUTLINE PACKAGE
MPXH6250A
Sensors
Freescale Semiconductor, Inc.
7
Pressure
PACKAGE DIMENSIONS
PAGE 3 OF 3
CASE 1317-04
ISSUE H
SUPER SMALL OUTLINE PACKAGE
MPXH6250A
8
Sensors
Freescale Semiconductor, Inc.
Pressure
PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 1317A-04
ISSUE D
SUPER SMALL OUTLINE PACKAGE
MPXH6250A
Sensors
Freescale Semiconductor, Inc.
9
Pressure
PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 1317A-04
ISSUE D
SUPER SMALL OUTLINE PACKAGE
MPXH6250A
10
Sensors
Freescale Semiconductor, Inc.
Pressure
Table 3. Revision History
Revision
number
Revision
date
3.1
05/2012
• Updated Package Drawing 98ARH99066A was Rev. F, updated to Rev. H.
3.2
07/2012
• Changed Figure 1 Vout form pin 1 to pin 4.
Description of changes
MPXH6250A
Sensors
Freescale Semiconductor, Inc.
11
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© 2012 Freescale Semiconductor, Inc. All rights reserved.
MPXH6250A
Rev. 3.2
07/2012