< Silicon RF Power MOS FET (Discrete) > RD12MVS1 RoHS Compliance, Silicon MOSFET Power Transistor, 175MHz, 12W DESCRIPTION OUTLINE DRAWING RD12MVS1 is a MOS FET type transistor 6.0+/-0.15 0.2+/-0.05 amplifiers applications. (0.22) specifically designed for VHF RF power 4.6+/-0.05 3.3+/-0.05 0.8+/-0.05 2.0+/-0.05 2 High Power Gain: (0.25) High Efficiency: 57%typ. (175MHz) APPLICATION (0.25) Terminal No. 1.Drain (output) 2.Source (GND) 3.Gate (input) 0.9+/-0.1 0.2+/-0.05 INDEX MARK (Gate) Note ( ):center value UNIT:mm For output stage of high power amplifiers in VHF band mobile radio sets. RoHS COMPLIANT is a RoHS compliant products. RoHS compliance is indicating by the letter “G” after the Lot Marking. This product includes the lead in high melting temperature type solders. However, it is applicable to the following exceptions of RoHS Directions. 1.Lead in high melting temperature type solders (i.e.tin-lead older alloys containing more than85% lead.) ABSOLUTE MAXIMUM RATINGS (Tc=25°C, UNLESS OTHERWISE NOTED) SYMBOL PARAMETER CONDITIONS RATINGS UNIT VDSS Drain to Source Voltage VGS=0V 50 V VGSS Gate to Source Voltage VDS=0V +/- 20 V ID Drain Current 4 A Pin Input Power Zg=Zl=50 2 W Pch Channel Dissipation Tc=25°C 50 W Tj Junction Temperature 150 °C Tstg Storage Temperature -40 to +125 °C Rthj-c Thermal Resistance 2.5 °C/W Junction to Case Note: Above parameters are guaranteed independently. Publication Date : Oct．2011 1 (0.22) 3 Pout>11.5W, Gp>12dB@Vdd=7.2V,f=175MHz RD12MVS1-101,T112 3.5+/-0.05 FEATURES 1.0+/-0.05 4.9+/-0.15 1 < Silicon RF Power MOS FET (Discrete) > RD12MVS1 RoHS Compliance, Silicon MOSFET Power Transistor, 175MHz, 12W ELECTRICAL CHARACTERISTICS SYMBOL PARAMETER (Tc=25°C, UNLESS OTHERWISE NOTED) CONDITIONS LIMITS UNIT MIN. TYP. MAX. IDSS Zero Gate Voltage Drain Current VDS=17V, VGS=0V - - 10 uA IGSS Gate to Source Leak Current VGS=10V, VDS=0V - - 1 uA VTH Gate Threshold Voltage VDS=12V, IDS=1mA 1.8 - 4.4 V Pout Output Power f=175MHz,VDD=7.2V 11.5 12 - W Drain Efficiency Pin=1.0W,Idq=1.0A 55 57 - % D VDD=9.2V,Po=12W(Pin Control) Load VSWR tolerance f=175MHz,Idq=1.0A,Zg=50 Load VSWR=20:1(All Phase) Note: Above parameters, ratings, limits and conditions are subject to change. Publication Date : Oct．2011 2 Not destroy - < Silicon RF Power MOS FET (Discrete) > RD12MVS1 RoHS Compliance, Silicon MOSFET Power Transistor, 175MHz, 12W TYPICAL CHARACTERISTICS CHANNEL DISSIPATION VS. AMBIENT TEMPERATURE CHANNEL DISSIPATION Pch(W) ... 60 Vgs-Ids CHARACTERISTICS 10 Ta=+25°C Vds=10V *1:The material of the PCB Glass epoxy (t=0.6 mm) 50 8 Ids(A),GM(S) 40 On PCB(*1) with Heat-sink 30 On PCB(*1) with throgh hole and Heat-sink 20 Ids 6 4 GM 2 10 0 0 0 40 80 120 160 AMBIENT TEMPERATURE Ta(°C) 200 0 Vds-Ids CHARACTERISTICS Vgs=7.5V 5 6 7 120 Ciss(pF) 5 Vgs=5.5V 4 Vgs=5.0V 3 Ta=+25°C f=1MHz 140 Vgs=6.0V 6 Ids(A) 3 4 Vgs(V) 160 Ta=+25°C 7 Vgs=4.5V 100 80 60 2 Vgs=4.0V 40 1 Vgs=3.5V 20 0 0 0 2 4 6 Vds(V) 8 10 0 Vds VS. Coss CHARACTERISTICS 5 10 Vds(V) 15 20 Vds VS. Crss CHARACTERISTICS 180 20 Ta=+25°C f=1MHz 160 Ta=+25°C f=1MHz 18 16 140 14 Crss(pF) 120 Coss(pF) 2 Vds VS. Ciss CHARACTERISTICS 9 8 1 100 80 60 12 10 8 6 40 4 20 2 0 0 0 5 10 Vds(V) 15 20 0 Publication Date : Oct．2011 3 5 10 Vds(V) 15 20 < Silicon RF Power MOS FET (Discrete) > RD12MVS1 RoHS Compliance, Silicon MOSFET Power Transistor, 175MHz, 12W TYPICAL CHARACTERISTICS Pin-Po CHARACTERISTICS @f=175M Hz 14 80 ηｄ 30 60 Gp 20 40 10 20 10 15 Pin(dBm) 20 25 4 30 0 2 5 1 Ids(A),GM(S) 10 Idd(A) Po(W) 3 -25°C +75°C 4 2 0 0 10 20 1000 6 Idd 8 V dd(V ) 800 +25°C V ds=10V Tc=-25~+75°C 4 15 6 400 600 Pin(mW) 8 Po 0 200 V gs -Ids CHARACTORISTICS 2 5 4 40 Idd 0 30 25 20 60 50 V dd-Po CHARACTERISTICS @f=175M Hz Ta=25°C f=175MHz Pin=0.3W Icq=700mA Zg=ZI=50 ohm 70 6 0 5 ηd 8 80 Ta=25°C f=175MHz Vdd=7.2V Idq=1.0A 2 0 0 Po 10 Ｉｄｄ -5 90 12 ηd(%) Po(dBm) , Gp(dB) , Idd(A) 40 Po Pout(W) , Idd(A) Ta=+25°C f=175MHz Vdd=7.2V Idq=1.0A 0 12 Publication Date : Oct．2011 4 ηd(%) Pin-Po CHARACTERISTICS @f=175M Hz 2 4 V gs(V ) 6 8 < Silicon RF Power MOS FET (Discrete) > RD12MVS1 RoHS Compliance, Silicon MOSFET Power Transistor, 175MHz, 12W TEST CIRCUIT (f=175MHz) Vgg Vdd C2 C1 C3 W W L2 24.9nH 47pF 330pF RF-in 35mm 3mm 4.7kOHM L1 8nH 4mm Contact 3.5mm Contact 3.5mm 33pF 6.0mm 25mm 5.0mm 330pF 20mm 100pF RF-OUT 12mm RD12MV S1 15pF Note:Boad material PTFE substrate Micro strip line width=2.2mm/50、er:2.7、t=0.8mm W:Line width=1.0mm Chip Condencer :GRM40 Copper Board spring t=0.1mm 24pF 68pF L:Enameled Wire L1:4Turns、D:0.43mm、φ1.66mm(outside diameter) L2:6Turns、D:0.43mm、φ2.46mm(outside diameter) C1、C2:1000ｐF C3: 10μF、50V INPUT / OUTPUT IMPEDANCE VS. FREQUENCY CHARACTERISTICS 175MHz Zin* Zout* Zo=50Ω Vdd=7.2V, Idq=1.0A(Vgg adj.), Pin=1.0W f=175MHz Zout* Zin*=0.965-j7.73 Zout*=1.73-j1.14 Zin*: Complex conjugate of input impedance Zout*: Complex conjugate of output impedance f=175MHz Zin* Publication Date : Oct．2011 5 < Silicon RF Power MOS FET (Discrete) > RD12MVS1 RoHS Compliance, Silicon MOSFET Power Transistor, 175MHz, 12W RD12MVS1 S-PARAMETER DATA (@Vdd=7.2V, Id=900mA) Freq. [MHz] 25 50 75 100 125 150 175 200 225 250 275 300 325 350 375 400 425 450 475 500 525 550 575 600 625 650 675 700 725 750 775 800 825 850 875 900 925 950 975 1000 S11 (mag) 0.824 0.816 0.817 0.829 0.837 0.845 0.852 0.860 0.870 0.876 0.886 0.891 0.902 0.903 0.909 0.907 0.912 0.923 0.928 0.934 0.932 0.936 0.932 0.935 0.939 0.939 0.943 0.945 0.943 0.939 0.943 0.948 0.951 0.953 0.952 0.954 0.944 0.951 0.954 0.955 (ang) -159.3 -169.0 -171.7 -172.8 -173.4 -173.9 -174.0 -174.3 -175.0 -175.0 -175.6 -175.8 -175.9 -176.2 -176.7 -177.6 -177.9 -178.3 -178.5 -178.6 -178.8 -179.2 179.6 179.1 179.2 179.4 179.1 178.7 177.5 177.2 176.9 176.8 177.1 176.7 176.1 175.4 174.4 174.6 175.0 175.0 S21 (mag) (ang) 26.397 93.4 13.193 85.2 8.716 79.3 6.537 74.5 5.110 68.5 4.117 64.2 3.402 60.8 2.896 57.2 2.525 53.2 2.175 48.9 1.897 46.5 1.675 43.6 1.496 41.0 1.348 38.3 1.208 35.7 1.087 33.7 0.996 31.6 0.912 29.7 0.836 27.9 0.748 25.8 0.707 23.6 0.647 23.2 0.591 20.8 0.562 20.0 0.520 17.4 0.485 15.5 0.460 15.6 0.435 15.5 0.407 13.3 0.380 12.2 0.358 10.8 0.327 8.6 0.308 8.0 0.314 8.5 0.284 7.0 0.269 9.7 0.254 6.7 0.250 6.0 0.232 1.9 0.227 7.8 Publication Date : Oct．2011 6 S12 (mag) 0.018 0.016 0.016 0.016 0.016 0.015 0.016 0.012 0.014 0.013 0.012 0.012 0.014 0.012 0.009 0.009 0.009 0.004 0.008 0.007 0.005 0.006 0.004 0.003 0.003 0.003 0.003 0.002 0.004 0.001 0.004 0.002 0.003 0.003 0.006 0.003 0.007 0.006 0.003 0.003 S22 (ang) -3.3 1.4 -10.9 -14.1 -18.2 -18.3 -15.1 -30.4 -29.9 -24.5 -39.4 -53.1 -32.9 -32.2 -29.2 -21.6 -32.5 -37.2 -25.9 -21.3 -46.6 -25.0 -40.9 -33.6 17.7 25.4 51.4 5.7 5.6 -16.1 58.8 -6.7 40.4 77.0 46.5 64.5 60.3 69.7 80.3 86.7 (mag) 0.761 0.765 0.778 0.787 0.800 0.796 0.810 0.836 0.858 0.855 0.859 0.860 0.886 0.898 0.898 0.893 0.903 0.910 0.917 0.925 0.922 0.922 0.939 0.939 0.938 0.930 0.932 0.946 0.949 0.940 0.935 0.943 0.945 0.948 0.946 0.950 0.946 0.952 0.959 0.950 (ang) -160.3 -168.1 -170.7 -170.3 -171.7 -172.3 -172.3 -172.2 -172.2 -173.0 -173.3 -173.4 -174.5 -174.6 -175.0 -175.6 -175.7 -176.6 -176.8 -177.3 -177.6 -177.6 -178.0 -178.9 -179.3 -179.5 -179.9 -179.9 179.3 179.0 178.8 178.2 177.5 176.8 176.7 176.7 176.0 175.7 175.0 174.8 < Silicon RF Power MOS FET (Discrete) > RD12MVS1 RoHS Compliance, Silicon MOSFET Power Transistor, 175MHz, 12W ATTENTION: 1.High Temperature ; This product might have a heat generation while operation,Please take notice that have a possibility to receive a burn to touch the operating product directly or touch the product until cold after switch off. At the near the product,do not place the combustible material that have possibilities to arise the fire. 2.Generation of High Frequency Power ; This product generate a high frequency power. Please take notice that do not leakage the unnecessary electric wave and use this products without cause damage for human and property per normal operation. 3.Before use; Before use the product,Please design the equipment in consideration of the risk for human and electric wave obstacle for equipment. PRECAUTIONS FOR THE USE OF MITSUBISHI SILICON RF POWER DEVICES: 1. The specifications of mention are not guarantee values in this data sheet. Please confirm additional details regarding operation of these products from the formal specification sheet. For copies of the formal specification sheets, please contact one of our sales offices. 2.RA series products (RF power amplifier modules) and RD series products (RF power transistors) are designed for consumer mobile communication terminals and were not specifically designed for use in other applications. In particular, while these products are highly reliable for their designed purpose, they are not manufactured under a quality assurance testing protocol that is sufficient to guarantee the level of reliability typically deemed necessary for critical communications elements and In the application, which is base station applications and fixed station applications that operate with long term continuous transmission and a higher on-off frequency during transmitting, please consider the derating, the redundancy system, appropriate setting of the maintain period and others as needed. For the reliability report which is described about predicted operating life time of Mitsubishi Silicon RF Products , please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor. 3. RD series products use MOSFET semiconductor technology. They are sensitive to ESD voltage therefore appropriate ESD precautions are required. 4. In the case of use in below than recommended frequency, there is possibility to occur that the device is deteriorated or destroyed due to the RF-swing exceed the breakdown voltage. 5. In order to maximize reliability of the equipment, it is better to keep the devices temperature low. It is recommended to utilize a sufficient sized heat-sink in conjunction with other cooling methods as needed (fan, etc.) to keep the channel temperature for RD series products lower than 120deg/C(in case of Tchmax=150deg/C) ,140deg/C(in case of Tchmax=175deg/C) under standard conditions. 6. Do not use the device at the exceeded the maximum rating condition. In case of plastic molded devices, the exceeded maximum rating condition may cause blowout, smoldering or catch fire of the molding resin due to extreme short current flow between the drain and the source of the device. These results causes in fire or injury. 7. For specific precautions regarding assembly of these products into the equipment, please refer to the supplementary items in the specification sheet. 8. Warranty for the product is void if the products protective cap (lid) is removed or if the product is modified in any way from it’s original form. 9. For additional “Safety first” in your circuit design and notes regarding the materials, please refer the last page of this data sheet. 10. Please refer to the additional precautions in the formal specification sheet. Publication Date : Oct．2011 7 < Silicon RF Power MOS FET (Discrete) > RD12MVS1 RoHS Compliance, Silicon MOSFET Power Transistor, 175MHz, 12W Keep safety first in your circuit designs! Mitsubishi Electric Corporation puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of non-flammable material or (iii) prevention against any malfunction or mishap. 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Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. •The prior written approval of Mitsubishi Electric Corporation is necessary to reprint or reproduce in whole or in part these materials. •If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or re-export contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. •Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor for further details on these materials or the products contained therein. © 2011 MITSUBISHI ELECTRIC CORPORATION. ALL RIGHTS RESERVED. Publication Date : Oct．2011 8