ONSEMI M74HCT4851ADWR2G

MC74HCT4851A,
MC74HCT4852A
Analog Multiplexers/
Demultiplexers with
Injection Current Effect
Control with LSTTL
Compatible Inputs
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MARKING
DIAGRAMS
Automotive Customized
16
This device is pin compatible to standard HC405x and MC1405xB
analog mux/demux devices, but feature injection current effect
control. This makes them especially suited for usage in automotive
applications where voltages in excess of normal logic voltage are
common.
The injection current effect control allows signals at disabled analog
input channels to exceed the supply voltage range without affecting
the signal of the enabled analog channel. This eliminates the need for
external diode/ resistor networks typically used to keep the analog
channel signals within the supply voltage range.
The devices utilize low power silicon gate CMOS technology. The
Channel Select and Enable inputs are compatible with standard CMOS
or LSTTL outputs.
• Injection Current Cross−Coupling Less than 1mV/mA
•
•
•
16
1
16
SOIC−16 WIDE
DW SUFFIX
CASE 751G
16
1
HCT485xA
AWLYWWG
1
16
TSSOP−16
DT SUFFIX
CASE 948F
1
(See Figure 6)
Pin Compatible to HC405x and MC1405xB Devices
Power Supply Range (VCC − GND) = 4.5 to 5.5 V
In Compliance With the Requirements of JEDEC Standard
No. 7 A
Chip Complexity: 154 FETs or 36 Equivalent Gates
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These Devices are Pb−Free and are RoHS Compliant
HCT485xAG
AWLYWW
1
16
Features
•
•
•
SOIC−16
D SUFFIX
CASE 751B
HCT4
85xA
ALYWG
G
1
X
A
WL, L
YY, Y
WW, W
G or G
= 1 or 2
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 11 of this data sheet.
© Semiconductor Components Industries, LLC, 2013
April, 2013 − Rev. 6
1
Publication Order Number:
MC74HCT4851A/D
MC74HCT4851A, MC74HCT4852A
FUNCTION TABLE − MC74HCT4851A
Control Inputs
13
X0
14
X1
15
X2
ANALOG
12
MULTIPLEXER/
INPUTS/ X3
DEMULTIPLEXER
OUTPUTS X4 1
5
X5
2
X6
4
X7
11
A
CHANNEL
10
B
SELECT
9
INPUTS
C
6
ENABLE
PIN 16 = VCC
PIN 8 = GND
3
X
Select
B
A
Enable
C
L
L
L
L
L
L
L
L
H
L
L
L
L
H
H
H
H
X
L
L
H
H
L
L
H
H
X
COMMON
OUTPUT/
INPUT
ON Channels
L
H
L
H
L
H
L
H
X
X0
X1
X2
X3
X4
X5
X6
X7
NONE
VCC
X2
X1
X0
X3
A
B
C
16
15
14
13
12
11
10
9
6
7
8
GND
Figure 1. MC74HCT4851A Logic Diagram
Single−Pole, 8−Position Plus Common Off
1
2
3
4
5
X4
X6
X
X7
X5
Enable NC
Figure 2. MC74HCT4851A 16−Lead Pinout (Top View)
FUNCTION TABLE − MC74HCT4852A
Control Inputs
12
ANALOG
INPUTS/OUTPUTS
CHANNEL‐SELECT
INPUTS
X0
14
X1
15
X2
11
X3
Y0
Y1
Y2
Y3
A
B
ENABLE
X SWITCH
13
X
COMMON
OUTPUTS/INPUTS
1
5
2
Y SWITCH
3
B
Select
A
L
L
L
L
H
L
L
H
H
X
L
H
L
H
X
ON Channels
Y0
Y1
Y2
Y3
X0
X1
X2
X3
NONE
X = Don’t Care
Y
4
10
9
Enable
PIN 16 = VCC
PIN 8 = GND
VCC
X2
X1
X
X0
X3
A
B
16
15
14
13
12
11
10
9
6
7
8
GND
6
Figure 3. MC74HCT4852A Logic Diagram
Double−Pole, 4−Position Plus Common Off
1
2
3
4
5
Y0
Y2
Y
Y3
Y1
Enable NC
Figure 4. MC74HCT4852A 16−Lead Pinout (Top View)
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2
MC74HCT4851A, MC74HCT4852A
MAXIMUM RATINGS
Symbol
Value
Unit
VCC
Positive DC Supply Voltage
(Referenced to GND)
–0.5 to + 7.0
V
Vin
DC Input Voltage (Any Pin)
(Referenced to GND)
–0.5 to VCC +
0.5
V
$25
mA
500
450
mW
I
Parameter
DC Current, Into or Out of Any Pin
PD
Power Dissipation in Still Air,
SOIC Package†
TSSOP Package†
Tstg
Storage Temperature Range
TL
Lead Temperature, 1 mm from Case for 10 Seconds
SOIC or TSSOP Package
–65 to + 150
°C
°C
260
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress
ratings only. Functional operation above the Recommended Operating Conditions is not implied.
Extended exposure to stresses above the Recommended Operating Conditions may affect device
reliability.
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high−impedance circuit. For proper operation, Vin and
Vout should be constrained to the
range GND v (Vin or Vout) v VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
VCC
Positive DC Supply Voltage
(Referenced to GND)
4.5
5.5
V
Vin
DC Input Voltage (Any Pin)
(Referenced to GND)
GND
VCC
V
Static or Dynamic Voltage Across Switch
0.0
1.2
V
TA
Operating Temperature Range, All Package Types
– 55
+ 125
°C
tr, tf
Input Rise/Fall Time
(Channel Select or Enable Inputs)
1000
500
400
ns
VIO*
VCC = 2.0 V
VCC = 4.5 V
VCC = 6.0 V
0
0
0
*For voltage drops across switch greater than 1.2 V (switch on), excessive VCC current may be
drawn; i.e., the current out of the switch may contain both VCC and switch input components. The
reliability of the device will be unaffected unless the Maximum Ratings are exceeded.
DC CHARACTERISTICS — Digital Section (Voltages Referenced to GND) VEE = GND, Except Where Noted
Symbol
Parameter
Condition
VCC
V
Guaranteed Limit
−55 to 25°C
≤85°C
≤125°C
Unit
VIH
Minimum High−Level Input Voltage,
Channel−Select or Enable Inputs
Ron = Per Spec
4.5
to
5.5
2.0
2.0
2.0
V
VIL
Maximum Low−Level Input Voltage,
Channel−Select or Enable Inputs
Ron = Per Spec
4.5
to
5.5
0.8
0.8
0.8
V
Iin
Maximum Input Leakage Current on Digital Pins
(Enable/A/B/C)
Vin = VCC or GND
5.5
± 0.1
± 1.0
± 1.0
mA
ICC
Maximum Quiescent Supply Current
(per Package)
Vin(digital) = VCC or GND
Vin(analog) = GND
5.5
2.0
20
40
mA
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3
MC74HCT4851A, MC74HCT4852A
DC CHARACTERISTICS — Analog Section
Guaranteed Limit
Symbol
Ron
Parameter
Condition
VCC
−55 to 25°C
≤85°C
≤125°C
Unit
Maximum “ON” Resistance
Vin = VIL or VIH;VIS = VCC to
GND; IS ≤ 2.0 mA
4.5
5.5
550
400
650
500
750
600
W
Delta “ON” Resistance
Vin = VIL or VIH; VIS = VCC/2
IS ≤ 2.0 mA
4.5
5.5
80
60
100
80
120
100
W
Ioff
Maximum Off−Channel Leakage Current,
Any One Channel
Common Channel
Vin = VCC or GND
5.5
±0.1
±0.1
±0.1
±0.1
±0.1
±0.1
Ion
Maximum On−Channel Leakage
Vin = VCC or GND
Channel−to−Channel
5.5
±0.1
±0.1
±0.1
VCC
−55 to 25°C
≤85°C
≤125°C
Unit
Maximum Propagation Delay, Analog Input to Analog Output
5.0
40
45
50
ns
Maximum Propagation Delay, Enable or Channel−Select to Analog Output
5.0
80
90
100
ns
10
35
40
10
35
40
10
35
40
pF
DRon
mA
mA
AC CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6 ns, VCC = 5.0 V ± 10%)
Symbol
tPHL,
tPLH
tPHL,
tPHZ,PZH
tPLH,
tPLZ,PZL
Parameter
Cin
Maximum Input Capacitance
(All Switches Off)
(All Switches Off)
CPD
Power Dissipation Capacitance
Digital Pins
Any Single Analog Pin
Common Analog Pin
Typical
5.0
20
pF
INJECTION CURRENT COUPLING SPECIFICATIONS (VCC = 5V, TA = −55°C to +125°C)
Symbol
VDout
Parameter
Condition
Maximum Shift of Output Voltage of Enabled Analog Channel
Iin* ≤ 1 mA, RS ≤ 3,9 kW
Iin* ≤ 10 mA, RS ≤ 3,9 kW
Iin* ≤ 1 mA, RS ≤ 20 kW
Iin* ≤ 10 mA, RS ≤ 20 kW
* Iin = Total current injected into all disabled channels.
Figure 5. Typical On Resistance VCC = 4.5V
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4
Typ
Max
Unit
0.1
1.0
0.5
5.0
1.0
5.0
2.0
20
mV
MC74HCT4851A, MC74HCT4852A
External DC P.S.
VCC = 5 V
Vin2 / Iin2 meas. here.
Current Source
HP4155C
Smu #2
Vin1 = 4.9 V (Smu3)
Iin1 meas. Here
Vm1 connected here.
X7
RS
X0
4
16
13
3
X
Vout
Vm2 connected here.
6
NOTES: Rs = 3.9 KW or 20 KW.
NOTES: Vm1 & Vm2 are internal
NOTES:
HP4155C Voltmeters.
8
GND or VSS
Figure 6. Injection Current Coupling Specification
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5
MC74HCT4851A, MC74HCT4852A
5V
6V
5V
VCC
VCC
HCT4051A
Channel 1
Channel 2
Channel 3
Channel 4
Channel 5
Channel 6
Channel 7
Channel 8
Sensor
(8x Identical Circuitry)
Microcontroller
Common Out
A/D - Input
Figure 7. Actual Technology
Requires 32 passive components and one extra 6V regulator
to suppress injection current into a standard HCT4051 multiplexer
5V
VCC
VCC
HCT4851A
Channel 1
Channel 2
Channel 3
Channel 4
Channel 5
Channel 6
Channel 7
Channel 8
Sensor
(8x Identical Circuitry)
Common Out
Microcontroller
A/D - Input
Figure 8. MC74HCT4851A Solution
Solution by applying the HCT4851A multiplexer
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6
MC74HCT4851A, MC74HCT4852A
PLOTTER
VCC
PROGRAMMABLE
POWER
SUPPLY
MINI COMPUTER
DC ANALYZER
16
VEE
VCC
OFF
-
+
VCC
VCC
A
COMMON O/I
OFF
NC
DEVICE
UNDER TEST
ANALOG IN
VIH
COMMON OUT
6
8
GND
Figure 10. Maximum Off Channel Leakage Current,
Any One Channel, Test Set−Up
Figure 9. On Resistance Test Set−Up
VCC
16
VEE
ANALOG I/O
16
A
OFF
VCC
OFF
VIH
VCC
VCC
VCC
ON
VEE
COMMON O/I
VCC
N/C
ANALOG I/O
VIL
6
COMMON O/I
OFF
6
8
8
Figure 11. Maximum Off Channel Leakage Current,
Common Channel, Test Set−Up
Figure 12. Maximum On Channel Leakage Current,
Channel to Channel, Test Set−Up
VCC
VCC
CHANNEL
SELECT
(VI)
VCC
ON/OFF
VM
COMMON O/I
ANALOG I/O
OFF/ON
GND
tPLH
ANALOG
OUT
16
TEST
POINT
CL*
tPHL
6
50%
8
CHANNEL SELECT
VI = GND to 3.0 V
VM = 1.3 V
*Includes all probe and jig capacitance
Figure 13. Propagation Delays, Channel Select
to Analog Out
Figure 14. Propagation Delay, Test Set−Up Channel
Select to Analog Out
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7
MC74HCT4851A, MC74HCT4852A
VCC
16
VCC
ANALOG
IN
(VI)
COMMON O/I
ANALOG I/O
ON
50%
TEST
POINT
CL*
GND
tPLH
tPHL
ANALOG
OUT
6
8
50%
VI = GND to 3.0 V
VM = 1.3 V
*Includes all probe and jig capacitance
Figure 15. Propagation Delays, Analog In
to Analog Out
tf
Figure 16. Propagation Delay, Test Set−Up
Analog In to Analog Out
tr
90%
VM
10%
ENABLE
(VI)
tPZL
ANALOG
OUT
2
GND
tPLZ
16
HIGH
IMPEDANCE
10%
1
10kW
ANALOG I/O
TEST
POINT
ON/OFF
2
CL*
VOL
tPHZ
ENABLE
VOH
90%
ANALOG
OUT
VCC
VCC
50%
tPZH
POSITION 1 WHEN TESTING tPHZ AND tPZH
POSITION 2 WHEN TESTING tPLZ AND tPZL
1
VCC
50%
6
8
HIGH
IMPEDANCE
VI = GND to 3.0 V
VM = 1.3 V
Figure 17. Propagation Delays, Enable to
Analog Out
Figure 18. Propagation Delay, Test Set−Up
Enable to Analog Out
VCC
A
VCC
16
ON/OFF
COMMON O/I
NC
ANALOG I/O
OFF/ON
VCC
6
8
11
CHANNEL SELECT
Figure 19. Power Dissipation Capacitance,
Test Set−Up
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8
MC74HCT4851A, MC74HCT4852A
Gate = VCC
(Disabled)
Disabled Analog Mux Input
Vin > VCC + 0.7V
P+
Common Analog Output
Vout > VCC
P+
+
+
+
N - Substrate (on VCC potential)
Figure 20. Diagram of Bipolar Coupling Mechanism
Appears if Vin exceeds VCC, driving injection current into the substrate
A
B
C
ENABLE
11
10
9
6
Figure 21. Function Diagram, HCT4851A
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9
INJECTION
CURRENT
CONTROL
13
INJECTION
CURRENT
CONTROL
14
INJECTION
CURRENT
CONTROL
15
INJECTION
CURRENT
CONTROL
12
INJECTION
CURRENT
CONTROL
1
INJECTION
CURRENT
CONTROL
5
INJECTION
CURRENT
CONTROL
2
INJECTION
CURRENT
CONTROL
4
INJECTION
CURRENT
CONTROL
3
X0
X1
X2
X3
X4
X5
X6
X7
X
MC74HCT4851A, MC74HCT4852A
A
B
ENABLE
10
9
6
Figure 22. Function Diagram, HCT4852A
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10
INJECTION
CURRENT
CONTROL
13
INJECTION
CURRENT
CONTROL
14
INJECTION
CURRENT
CONTROL
15
INJECTION
CURRENT
CONTROL
12
INJECTION
CURRENT
CONTROL
13
INJECTION
CURRENT
CONTROL
1
INJECTION
CURRENT
CONTROL
5
INJECTION
CURRENT
CONTROL
2
INJECTION
CURRENT
CONTROL
4
INJECTION
CURRENT
CONTROL
3
X0
X1
X2
X3
X
Y0
Y1
Y2
Y3
Y
MC74HCT4851A, MC74HCT4852A
ORDERING INFORMATION
Package
Shipping†
MC74HCT4851ADG
SOIC−16
(Pb−Free)
48 Units / Rail
MC74HCT4851ADR2G
SOIC−16
(Pb−Free)
2500 Units / Tape & Reel
NLV74HCT4851ADR2G*
SOIC−16
(Pb−Free)
2500 Units / Tape & Reel
MC74HCT4851ADTG
TSSOP−16
(Pb−Free)
48 Units / Rail
M74HCT4851ADTR2G
TSSOP−16
(Pb−Free)
2500 Units / Tape & Reel
NLVHCT4851ADTR2G*
TSSOP−16
(Pb−Free)
2500 Units / Tape & Reel
M74HCT4851ADWR2G
SOIC−16 WIDE
(Pb−Free)
1000 Units / Tape & Reel
MC74HCT4852ADG
SOIC−16
(Pb−Free)
48 Units / Rail
MC74HCT4852ADR2G
SOIC−16
(Pb−Free)
2500 Units / Tape & Reel
MC74HCT4852ADTG
TSSOP−16
(Pb−Free)
48 Units / Rail
M74HCT4852ADTR2G
TSSOP−16
(Pb−Free)
2500 Units / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
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11
MC74HCT4851A, MC74HCT4852A
PACKAGE DIMENSIONS
SOIC−16
D SUFFIX
CASE 751B−05
ISSUE K
−A−
16
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
9
−B−
1
P
8 PL
0.25 (0.010)
8
M
B
S
G
R
K
F
X 45 _
C
−T−
SEATING
PLANE
J
M
D
16 PL
0.25 (0.010)
M
T B
S
A
S
SOLDERING FOOTPRINT
8X
6.40
16X
1
1.12
16
16X
0.58
1.27
PITCH
8
9
DIMENSIONS: MILLIMETERS
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12
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
9.80
10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.386
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.229
0.244
0.010
0.019
MC74HCT4851A, MC74HCT4852A
PACKAGE DIMENSIONS
SOIC−16 WIDE
DW SUFFIX
CASE 751G−03
ISSUE C
A
D
9
h X 45 _
E
0.25
1
16X
M
14X
e
T A
S
B
S
L
A
0.25
B
B
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INLCUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 TOTAL IN
EXCESS OF THE B DIMENSION AT MAXIMUM
MATERIAL CONDITION.
MILLIMETERS
DIM MIN
MAX
A
2.35
2.65
A1 0.10
0.25
B
0.35
0.49
C
0.23
0.32
D 10.15 10.45
E
7.40
7.60
e
1.27 BSC
H 10.05 10.55
h
0.25
0.75
L
0.50
0.90
q
0_
7_
8
A1
H
8X
M
B
M
16
q
SEATING
PLANE
T
C
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13
MC74HCT4851A, MC74HCT4852A
PACKAGE DIMENSIONS
TSSOP−16
CASE 948F
ISSUE B
16X K REF
0.10 (0.004)
0.15 (0.006) T U
M
T U
S
V
S
K
S
ÉÉÉ
ÇÇÇ
ÇÇÇ
ÉÉÉ
K1
2X
L/2
16
9
J1
B
−U−
L
SECTION N−N
J
PIN 1
IDENT.
N
8
1
0.25 (0.010)
M
0.15 (0.006) T U
S
A
−V−
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH OR
GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER
SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER
SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED AT
DATUM PLANE -W-.
N
F
DETAIL E
−W−
C
0.10 (0.004)
−T− SEATING
PLANE
D
H
G
DETAIL E
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
MIN
MAX
4.90
5.10
4.30
4.50
−−−
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.18
0.28
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
INCHES
MIN
MAX
0.193 0.200
0.169 0.177
−−− 0.047
0.002 0.006
0.020 0.030
0.026 BSC
0.007
0.011
0.004 0.008
0.004 0.006
0.007 0.012
0.007 0.010
0.252 BSC
0_
8_
SOLDERING FOOTPRINT
7.06
1
0.65
PITCH
16X
0.36
16X
1.26
DIMENSIONS: MILLIMETERS
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