STPS1H100-Y Automotive high voltage power Schottky rectifier Features ■ Negligible switching losses ■ High junction temperature capability ■ Low leakage current ■ Good trade-off between leakage current and forward voltage drop ■ Avalanche capability specified ■ ECOPACK®2 compliant component ■ AEC-Q101 qualified K K SMA (JEDEC DO-214AC) STPS1H100AY Table 1. Description Schottky rectifiers packaged in SMA or SMB, and designed for high frequency miniature switched mode power supplies as DC/DC converters for automotive applications. December 2010 A A Doc ID 17935 Rev 1 SMB (JEDEC DO-214AA) STPS1H100UY Device summary Symbol Value IF(AV) 1A VRRM 100 V Tj (max) 175 °C VF(max) 0.62 V 1/9 www.st.com 9 Characteristics 1 STPS1H100-Y Characteristics Table 2. Absolute ratings (limiting values) Symbol Unit Repetitive peak reverse voltage 100 V IF(RMS) Forward rms voltage 10 A IF(AV) Average forward current TL = 160 °C δ = 0.5 1 A IFSM Surge non repetitive forward current tp =10 ms sinusoidal 50 A IRRM Repetitive peak reverse current tp = 2 µs F = 1 kHz square 1 A IRSM Non repetitive peak reverse current tp = 100 µs square 1 A PARM Repetitive peak avalanche power tp = 1 µs Tj = 25 °C 1500 W - 65 to + 175 °C - 40 to + 175 °C 10000 V/µs Value Unit Tj dV/dt Storage temperature range Operating junction temperature (1) Critical rate of rise of reverse voltage 1 dPtot < condition to avoid thermal runaway for a diode on its own heatsink Rth(j-a) dTj Table 3. Thermal resistance Symbol Rth(j-l) Table 4. Parameter 30 SMB 25 °C/W Static electrical characteristics Symbol Parameter IR(1) Reverse leakage current VF(2) SMA Junction to lead Test conditions Tj = 25 °C Tj = 125 °C Tj = 25 °C Tj = 125 °C Forward voltage drop Tj = 25 °C Tj = 125 °C Min. VR = VRRM Typ. 0.2 Max. Unit 4 µA 0.5 mA 0.77 IF = 1 A 0.58 0.62 V 0.86 IF = 2 A 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.54 x IF(AV) + 0.08 IF2(RMS) 2/9 Value VRRM Tstg 1. Parameter Doc ID 17935 Rev 1 0.65 0.7 STPS1H100-Y Figure 1. Characteristics Average forward power dissipation Figure 2. versus average forward current Average forward current versus ambient temperature (δ = 0.5) IF(AV)(A) PF(AV)(W) 1.2 0.8 0.7 δ = 0.1 δ = 0.05 δ = 0.5 δ = 0.2 Rth(j-a)=Rth(j-l) 1.0 Rth(j-a)=120°C/W 0.6 δ=1 SMB Rth(j-a)=100°C/W 0.8 0.5 SMA 0.3 0.4 T 0.2 T 0.2 0.1 IF(AV)(A) δ=tp/T 0.0 0.0 0.1 0.2 Figure 3. 1 Rth(j-a)=200°C/W 0.6 0.4 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 tp 1.1 δ=tp/T Normalized avalanche power derating versus pulse duration 0 25 Figure 4. PARM(tp) PARM(1µs) Tamb(°C) tp 0.0 1.2 1.2 50 75 100 125 150 175 Normalized avalanche power derating versus junction temperature PARM(Tj) PARM(25 °C) 1 0.1 0.8 0.6 0.4 0.01 0.2 tp(µs) 0.001 0.01 0.1 Figure 5. 1 10 1000 100 Non repetitive surge peak forward current versus overload duration (maximum values) (SMB) Tj(°C) 0 25 50 Figure 6. IM(A) 100 150 125 Non repetitive surge peak forward current versus overload duration (maximum values) (SMA) IM(A) 8 10 9 75 SMA SMB 7 8 6 7 Ta=25 °C 5 Ta=110 °C 2 IM IM 1 t δ =0.5 t(s) t(s) t δ =0.5 0 0 1.E-03 Ta=75 °C 3 Ta=110 °C 3 1 4 Ta=75 °C 4 2 Ta=25 °C 5 6 1.E-02 1.E-01 1.E+00 1.E-03 Doc ID 17935 Rev 1 1.E-02 1.E-01 1.E+00 3/9 Characteristics Figure 7. STPS1H100-Y Relative variation of thermal impedance junction to ambient versus pulse duration (SMB) Figure 8. Zth(j-c)/Rth(j-c) Relative variation of thermal impedance junction to ambient versus pulse duration (SMA) Zth(j-c)/Rth(j-c) 1.00 1.00 SMB SMA 0.10 0.10 Single pulse Single pulse tp(s) tp(s) 0.01 0.01 1.E-03 1.E-02 Figure 9. 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Reverse leakage current versus reverse voltage applied (typical values) 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Figure 10. Junction capacitance versus reverse voltage applied (typical values) IR(µA) C(pF) 1.E+03 100 1.E+02 F=1 MHz VOSC=30 mVRMS Tj=25 °C Tj=125 °C 1.E+01 1.E+00 1.E-01 Tj=25 °C 1.E-02 VR(V) VR(V) 10 1.E-03 0 10 20 30 40 50 60 70 80 90 1 100 Figure 11. Forward voltage drop versus forward current (maximum values) 10 100 Figure 12. Thermal resistance junction to ambient versus copper surface under each lead (SMB) Rth(j-a)(°C/W) IFM(A) 120 100.00 Epoxy printed circuit board FR4, copper thickness: 35 µm 110 SMB 100 10.00 90 80 Tj=125 °C Tj=25 °C 1.00 70 60 50 0.10 40 0.01 20 0.0 4/9 S(Cu)(cm²) 30 VFM(V) 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0.0 Doc ID 17935 Rev 1 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 STPS1H100-Y Characteristics Figure 13. Thermal resistance junction to ambient versus copper surface under each lead (SMA) Rth(j-a)(°C/W) 140 130 Epoxy printed circuit board FR4, copper thickness: 35 µm SMA 120 110 100 90 80 70 60 50 40 S(Cu)(cm²) 30 20 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 Doc ID 17935 Rev 1 4.0 4.5 5.0 5/9 Package information 2 STPS1H100-Y Package information ● Epoxy meets UL94, V0 ● Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 14. SMA package dimensions Dimensions Ref Millimeters Inches E1 D Min. Max. Min. Max. A1 1.90 2.45 0.075 0.094 A2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.006 0.016 D 2.25 2.90 0.089 0.114 E 4.80 5.35 0.189 0.211 E1 3.95 4.60 0.156 0.181 L 0.75 1.50 0.030 0.059 E A1 A2 C L b Figure 15. SMA footprint dimensions in millimeters (inches) 1.4 2.63 1.4 (0.055) (0.103) (0.055) 1.64 (0.064) 5.43 (0.214) 6/9 Doc ID 17935 Rev 1 STPS1H100-Y Package information Figure 16. SMB package dimensions Dimensions Ref Millimeters Inches E1 D Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 D 3.30 3.95 0.130 0.156 E 5.10 5.60 0.201 0.220 E1 4.05 4.60 0.159 0.181 L 0.75 1.50 0.030 0.059 E A1 A2 C L b Figure 17. SMB footprint dimensions in millimeters (inches) 1.62 2.60 (0.064) (0.102) 1.62 (0.064) 2.18 (0.086) 5.84 (0.300) Doc ID 17935 Rev 1 7/9 Ordering information 3 Ordering information Table 5. 4 Ordering information Order code Marking Package Weight Base qty Delivery mode STPS1H100AY S11Y SMA 0.068 g 5000 Tape and reel STPS1H100UY G11Y SMB 0.107 g 2500 Tape and reel Revision history Table 6. 8/9 STPS1H100-Y Document revision history Date Revision 03-Dec-2010 1 Changes First issue. Doc ID 17935 Rev 1 STPS1H100-Y Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. 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