STPS2H100 Power Schottky rectifier Features ■ Negligible switching losses ■ High junction temperature capability ■ Low leakage current ■ Good trade-off between leakage current and forward voltage drop ■ Avalanche capability specified A A K K SMA STPS2H100A SMB STPS2H100U A Description K Schottky rectifiers designed for high frequency miniature switched mode power supplies such as adaptators and on board DC/DC converters. Available in SMA, SMB, low-profile SMB. SMB flat STPS2H100UF Table 1. February 2010 Doc ID 6115 Rev 7 Device summary Symbol Value IF(AV) 2A VRRM 100 V Tj (max) 175 °C VF (max) 0.65 V 1/10 www.st.com 10 Characteristics STPS2H100 1 Characteristics Table 2. Absolute ratings (limiting values) Symbol Value Unit 100 V 2 A VRRM Repetitive peak reverse voltage IF(AV) Average forward current IFSM Surge non repetitive forward current tp =10 ms sinusoidal 75 A PARM Repetitive peak avalanche power tp = 1 µs Tj = 25 °C 2400 W -65 to + 175 °C 175 °C Value Unit SMA 30 °C/W SMB 25 SMB flat 15 Tstg Tj 1. Parameter SMA / SMB TL = 130 °C δ = 0.5 SMB flat TL = 150 °C δ = 0.5 Storage temperature range Operating junction temperature (1) 1 dPtot < condition to avoid thermal runaway for a diode on its own heatsink Rth(j-a) dTj Table 3. Thermal resistance Symbol Rth(j-l) Table 4. Symbol IR(1) Parameter Junction to lead Static electrical characteristics Parameter Reverse leakage current Test conditions Tj = 25 °C Tj = 125 °C Tj = 25 °C VF(2) Forward voltage drop Tj = 125 °C Tj = 25 °C Tj = 125 °C VR = VRRM Min. Typ. 0.4 Max. Unit 1 µA 1 mA 0.79 IF = 2 A 0.6 0.65 V 0.88 IF = 4 A 0.69 0.74 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.56 x IF(AV) + 0.045 IF2(RMS) 2/10 Doc ID 6115 Rev 7 STPS2H100 Characteristics Figure 1. Average forward power dissipation Figure 2. versus average forward current PF(AV)(W) Average forward current versus ambient temperature (δ = 0.5) (SMA / SMB) IF(AV)(A) 1.7 1.6 1.5 1.4 1.3 1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 δ = 0.2 δ = 0.1 δ = 0.05 2.2 δ = 0.5 Rth(j-a)=Rth(j-I) 2.0 SMB 1.8 SMA 1.6 δ=1 SMA Rth(j-a)=100°C/W S(CU)=1.5cm2 1.4 1.2 SMB Rth(j-a)=80°C/W S(CU)=1.5cm2 1.0 0.8 0.6 T T 0.4 IF(AV)(A) 0.0 0.2 0.4 Figure 3. 0.6 0.8 1.0 0.2 δ=tp/T 1.2 1.4 1.6 1.8 δ=tp/T tp 0.0 2.0 2.2 Average forward current versus ambient temperature (δ = 0.5) (SMB flat) 0 Figure 4. IF(AV)(A) Tamb(°C) tp 25 50 75 100 125 150 175 Normalized avalanche power derating versus pulse duration PARM(tp) PARM(1 µs) 2.2 Rth(j-a)=Rth(j-l) 1 2.0 1.8 1.6 1.4 0.1 SMB flat 1.2 1.0 0.8 Rth(j-a)=40°C/W . SCU=2.5 cm2 0.6 0.01 T 0.4 0.2 δ=tp/T 0.0 0 Figure 5. Tamb(°C) tp 25 50 75 tp(µs) 0.001 100 125 150 175 Normalized avalanche power derating versus junction temperature 0.01 0.1 Figure 6. 1 10 100 1000 Non repetitive surge peak forward current versus overload duration (maximum values) (SMA) IM(A) PARM(Tj) PARM(25 °C) 10 1.2 SMA 9 8 1 7 0.8 6 Ta=25°C 5 0.6 Ta=75°C 4 0.4 3 2 0.2 Tj(°C) Ta=125°C IM 1 0 t t(s) δ=0.5 0 25 50 75 100 125 150 1.E-03 Doc ID 6115 Rev 7 1.E-02 1.E-01 1.E+00 3/10 Characteristics Figure 7. STPS2H100 Non repetitive surge peak forward current versus overload duration (maximum values) (SMB) Figure 8. IM(A) Non repetitive surge peak forward current versus overload duration (maximum values) (SMB flat) IM(A) 10 30 SMB flat SMB 9 25 8 7 Ta=25°C 20 Ta=75°C 15 6 TL=25°C 5 TL=75°C 4 10 Ta=125°C 3 2 TL=125°C IM IM 5 t 1 t t(s) δ=0.5 t(s) δ=0.5 0 0 1.E-03 1.E-02 Figure 9. 1.E-01 1.E+00 1.E-03 1.E-02 1.E-01 1.E+00 Relative variation of thermal Figure 10. Relative variation of thermal impedance junction to ambient impedance junction to lead versus pulse duration (SMA / SMB) versus pulse duration (SMB flat) Zth(j-l)/Rth(j-l) Zth(j-a)/Rth(j-a) 1.0 1.0 0.9 0.8 SMB flat (non exposed pad) 0.9 SMA 0.8 SMB 0.7 0.7 0.6 0.6 0.5 0.5 0.4 0.4 0.3 0.3 T 0.2 0.1 0.2 Single pulse δ=tp/T tp(s) 0.0 tp(s) 0.0 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Figure 11. Reverse leakage current versus reverse voltage applied (typical values) 1.E+04 Single pulse 0.1 tp 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 Figure 12. Junction capacitance versus reverse voltage applied (typical values) IR(µA) C(pF) 100 1.E+03 F=1MHz VOSC=30mVRMS Tj=25°C Tj=150°C Tj=125°C 1.E+02 Tj=100°C 1.E+01 Tj=75°C Tj=50°C 1.E+00 Tj=25°C 1.E-01 VR(V) VR(V) 1.E-02 10 0 4/10 20 40 60 80 100 1 Doc ID 6115 Rev 7 10 100 STPS2H100 Characteristics Figure 13. Forward voltage drop versus forward current (low level) Figure 14. Forward voltage drop versus forward current (high level) IFM(A) 2.0 100 IFM(A) 1.8 Tj=125°C (Maximum values) 1.6 Tj=125°C (Maximum values) 1.4 1.2 Tj=125°C (Typical values) Tj=125°C (Typical values) 1.0 10 0.8 Tj=25°C (Maximum values) 0.6 Tj=25°C (Maximum values) 0.4 0.2 VFM(V) VFM(V) 1 0.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 0.4 1.2 Figure 15. Thermal resistance junction to ambient versus copper surface under each lead (SMA) 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 Figure 16. Thermal resistance junction to ambient versus copper surface under each lead (SMB) Rth(j-a)(°C/W) Rth(j-a)(°C/W) 110 130 Epoxy printed circuit board FR4, Copper thickness = 35 µm 120 SMA Epoxy printed circuit board FR4, Copper thickness = 35 µm 100 110 SMB 90 100 80 90 80 70 70 60 60 50 50 40 40 30 30 20 20 10 10 SCU(cm²) SCU(cm²) 0 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 0.0 5.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Figure 17. Thermal resistance junction to ambient versus copper surface under each lead (SMB flat) Rth(j-a)(°C/W) 110 Epoxy printed circuit board FR4, Copper thickness = 35 µm 100 90 80 70 60 50 SMB flat 40 30 20 10 SCU(cm²) 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 Doc ID 6115 Rev 7 3.5 4.0 4.5 5.0 5/10 Package information 2 STPS2H100 Package information ● Epoxy meets UL94, V0 ● Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 5. SMA dimensions Dimensions Ref. Millimeters Inches E1 D E A1 A2 C L Min. Max. Min. Max. A1 1.90 2.45 0.075 0.094 A2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.006 0.016 D 2.25 2.90 0.089 0.114 E 4.80 5.35 0.189 0.211 E1 3.95 4.60 0.156 0.181 L 0.75 1.50 0.030 0.059 b Figure 18. SMA footprint (dimensions in mm) 1.4 2.63 1.4 1.64 5.43 6/10 Doc ID 6115 Rev 7 STPS2H100 Package information Table 6. SMB dimensions Dimensions Ref. Millimeters Inches E1 D E A1 A2 C L b Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 E 5.10 5.60 0.201 0.220 E1 4.05 4.60 0.159 0.181 D 3.30 3.95 0.130 0.156 L 0.75 1.50 0.030 0.059 Figure 19. SMB footprint (dimensions in mm) 1.62 2.60 1.62 2.18 5.84 Doc ID 6115 Rev 7 7/10 Package information Table 7. STPS2H100 SMB flat dimensions Dimensions Ref. Min. A 0.90 1.10 0.035 0.043 b(1) 1.95 2.20 0.077 0.087 (1) 0.15 0.40 0.006 0.016 D 3.30 3.95 0.130 0.156 E 5.10 5.60 0.200 0.220 E1 4.05 4.60 0.189 0.181 L 0.75 1.50 0.029 0.059 c D L2 c E E1 L L1 b 0.40 0.016 L2 0.60 0.024 Figure 20. SMB flat footprint (dimensions in mm) 5.84 2.07 8/10 3.44 Doc ID 6115 Rev 7 Typ. L1 1. Applies to plated leads 1.20 Inches Min. Typ. Max. A L Millimeters 1.20 Max. STPS2H100 3 Ordering information Ordering information Table 8. 4 Ordering information Order code Marking Package Weight Base qty Delivery mode STPS2H100A S21 SMA 0.068 g 5000 Tape and reel STPS2H100U G21 SMB 0.107 g 2500 Tape and reel STPS2H100UF FG21 SMB flat 0.050 g 5000 Tape and reel Revision history Table 9. Document revision history Date Revision Changes Jul-2003 4A Aug-2004 5 SMA package dimensions update. Reference A1 max. changed from 2.70 (0.106 inches) to 2.03 mm (0.080 inches). 08-Feb-2007 6 Reformatted to current standards. Added ECOPACK statement. Added SMB flat package. 15-Feb-2010 7 Updated weight for SMB flat in Table 8. Last update. Doc ID 6115 Rev 7 9/10 STPS2H100 Please Read Carefully: Information in this document is provided solely in connection with ST products. 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