STMICROELECTRONICS STPS3L60U

STPS3L60
Power Schottky rectifier
Features
■
Negligible switching losses
■
Low forward voltage drop
■
Avalanche capability specified
K
K
DO-201AD
STPS3L60
Description
Axial and surface mount power Schottky rectifier
suited for switch mode power supplies and high
frequency dc to dc converters. Packaged in
DO-201AD, DO-15, SMB and SMBflat, this device
is intended for use in low voltage, high frequency
inverters and small battery chargers and for
applications where there are space constraints,
for example telecom battery charger.
DO-15
STPS3L60Q
A
A
K
K
SMB
STPS3L60U
Table 1.
June 2009
A
A
Doc ID 7505 Rev 6
SMBflat
STPS3L60UF
Device summary
IF(AV)
3A
VRRM
60 V
Tj (max)
150 °C
VF (max)
0.61 V
1/11
www.st.com
11
Characteristics
1
STPS3L60
Characteristics
Table 2.
Absolute ratings(1)
Symbol
Parameter
Value
Unit
VRRM
Repetitive peak reverse voltage
60
V
IF(RMS)
RMS forward current
10
A
3
A
TL = 105 °C δ = 0.5
(DO-201AD, SMB)
TL = 72 °C δ = 0.5
(DO-15)
Average forward current
IF(AV)
TL = 127 °C δ = 0.5
(SMBflat)
IFSM
Surge non repetitive forward current
tp = 10 ms Sinusoidal
100
A
PARM
Repetitive peak avalanche power
tp = 1 µs Tj = 25 °C
2000
W
-65 to + 150
°C
150
°C
10000
V/µs
Value
Unit
Tstg
Storage temperature range
Maximum operating junction
Tj
dV/dt
temperature(2)
Critical rate of rise reverse voltage
1. limiting values, per diode
2.
dPtot
--------------dTj
1
- condition to avoid thermal runaway for a diode on its own heatsink
< ------------------------Rth ( j – a )
Table 3.
Thermal resistance
Symbol
Rth (j-l)
Parameter
SMBflat
10
SMB
20
DO-201AD
20
DO-15
35
Junction to leads
Lead length = 10 mm
2/11
Doc ID 7505 Rev 6
°C/W
STPS3L60
Characteristics
Table 4.
Static electrical characteristics
Symbol
Parameter
Tests Conditions
Min.
Typ.
Max.
Unit
-
-
150
µA
-
4
15
mA
Tj = 125 °C
-
14
30
Tj = 25 °C
-
-
0.62
-
0.53
0.61
Tj = 125 °C
-
0.51
0.59
Tj = 25 °C
-
-
0.79
-
0.62
0.71
-
0.6
0.69
Tj = 25 °C
IR (1)
Reverse leakage current
VR = VRRM
Tj = 100 °C
IF = 3 A
Tj = 100 °C
VF (1)
Forward voltage drop
V
IF = 6 A
Tj = 100 °C
Tj = 125 °C
1. Pulse test :tp = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation :
P = 0.44 x IF(AV) + 0.05 x IF2(RMS)
Figure 1.
Average forward power dissipation Figure 2.
versus average forward current
PF(AV)(W)
2.50
δ = 0.05
2.25
δ = 0.1
δ = 0.2
3.5
Average forward current versus
ambient temperature (δ = 0.5)
(DO-201AD, SMB)
IF(AV)(A)
δ = 0.5
Rth(j-a)=Rth(j-I)
3.0
2.00
δ=1
1.75
2.5
1.50
2.0
Rth(j-a)=80°C/W
1.25
1.5
1.00
1.0
0.75
T
0.50
0.5
0.25
IF(AV)(A)
δ=tp/T
0.00
0.0
0.5
1.0
1.5
2.0
2.5
3.0
Tamb(°C)
tp
3.5
0.0
4.0
0
Doc ID 7505 Rev 6
25
50
75
100
125
150
3/11
Characteristics
Figure 3.
STPS3L60
Average forward current versus
ambient temperature (δ = 0.5)
(DO-15)
Figure 4.
IF(AV)(A)
Average forward current versus
ambient temperature (δ = 0.5)
(SMBflat)
IF(AV)(A)
3.5
3.5
Rth(j-a)=Rth(j-l)
Rth(j-a)=Rth(j-l)
3.0
3.0
2.5
2.5
2.0
2.0
1.5
1.5
Rth(j-a)=100°C/W
Rth(j-a)=100°C/W
1.0
1.0
0.5
0.5
Tamb(°C)
Tamb(°C)
0.0
0.0
0
25
Figure 5.
50
75
100
125
0
150
Normalized avalanche power
derating versus pulse duration
25
Figure 6.
PARM(tp)
PARM(1 µs)
50
75
100
125
150
Normalized avalanche power
derating versus junction
temperature
PARM(Tj)
PARM(25 °C)
1
1.2
1
0.1
0.8
0.6
0.4
0.01
0.2
Tj(°C)
tp(µs)
0.001
0.01
0.1
Figure 7.
1
0
10
100
25
1000
Non repetitive surge peak forward
current versus overload duration
(maximum values) (DO-201AD)
50
Figure 8.
75
100
125
150
Non repetitive surge peak forward
current versus overload duration
(maximum values) (DO-15)
IM(A)
IM(A)
11
12
10
10
9
8
8
Ta=25 °C
7
Ta=25 °C
6
6
Ta=50 °C
5
Ta=50 °C
4
4
Ta=100 °C
3
Ta=100 °C
2
2
IM
t(s)
t
δ =0.5
1
0
1.E-03
4/11
1.E-02
IM
1.E-01
1.E+00
0
1.E-03
Doc ID 7505 Rev 6
t(s)
t
δ =0.5
1.E-02
1.E-01
1.E+00
STPS3L60
Characteristics
Figure 9.
Non repetitive surge peak forward
current versus overload duration
(maximum values) (SMB)
Figure 10. Non repetitive surge peak forward
current versus overload duration
(maximum values) (SMBflat)
IM(A)
IM(A)
11
40
10
35
9
30
8
7
Ta=25 °C
25
6
20
TL=25°C
4
15
TL=50°C
3
10
5
Ta=50 °C
2
IM
5
t(s)
t
δ =0.5
1
0
1.E-03
1.E-02
1.E-01
1.E+00
Figure 11. Relative variation of thermal
impedance junction to ambient
versus pulse duration (DO-201AD)
1.E-02
1.E-01
1.E+00
Figure 12. Relative variation of thermal
impedance junction to ambient
versus pulse duration (DO-15)
Zth(j-a)/Rth(j-a)
Zth(j-a)/Rth(j-a)
1.0
0.9
0.9
0.8
0.8
0.7
0.7
0.6
0.6
0.5
0.5
0.4
0.4
0.3
0.3
0.2
0.2
Single pulse
0.1
tp(s)
0.0
Single pulse
tp(s)
0.0
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
Figure 13. Relative variation of thermal
impedance junction to ambient
versus pulse duration (SMB)
Zth(j-a)/Rth(j-a)
1.E-01
1.0
0.9
0.9
0.8
0.8
0.7
0.7
0.6
0.6
0.5
0.5
0.4
0.4
0.3
1.E+00
1.E+01
1.E+02
1.E+03
Figure 14. Relative variation of thermal
impedance junction to lead
versus pulse duration (SMBflat)
1.0
0.2
t(s)
t
δ =0.5
0
1.E-03
1.0
0.1
TL=100°C
Ta=100 °C
IM
Zth(j-l)/Rth(j-l)
0.3
0.2
Single pulse
0.1
0.0
1.E-01
Single pulse
0.1
tp(s)
tp(s)
0.0
1.E+00
1.E+01
1.E+02
1.E+03
1.E-03
Doc ID 7505 Rev 6
1.E-02
1.E-01
1.E+00
5/11
Characteristics
STPS3L60
Figure 15. Reverse leakage current versus
reverse voltage applied
(typical values)
1.E+02
Figure 16. Junction capacitance versus
reverse voltage applied
(typical values)
IR(mA)
1000
C(pF)
F=1MHz
Vosc=30mV
Tj=25°C
Tj=125°C
1.E+01
Tj=100°C
1.E+00
100
1.E-01
Tj=25°C
1.E-02
VR(V)
VR(V)
10
1.E-03
0
5
10
15
20
25
30
35
40
45
50
55
1
60
Figure 17. Forward voltage drop versus
forward current (high level)
10
100
Figure 18. Forward voltage drop versus
forward current (low level)
IFM(A)
IFM(A)
5
30
Tj=100°C
(Typical values)
25
4
Tj=100°C
(Typical values)
20
Tj=100°C
(Maximum values)
3
Tj=25°C
(Maximum values)
15
Tj=100°C
(Maximum values)
2
10
Tj=25°C
(Maximum values)
1
5
VFM(V)
VFM(V)
0
0
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
Figure 19. Thermal resistance junction to
ambient versus copper surface
under each lead (SMB)
0.0
0.1
0.2
0.3
0.5
0.6
0.7
0.8
0.9
1.0
Figure 20. Thermal resistance junction to
ambient versus copper surface
under each lead (SMBflat)
Rth(j-a)(°C/W)
Rth(j-a)(°C/W)
120
120
Expoxy printed circuit FR4,
copper thickness = 35 µm
Expoxy printed circuit FR4,
copper thickness = 35 µm
SMB
100
100
80
80
60
60
40
40
SMB-Flat
20
20
S(Cu)(cm²)
S(Cu)(cm²)
0
0
0.0
6/11
0.4
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0.0
Doc ID 7505 Rev 6
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
STPS3L60
2
Package information
Package information
●
Epoxy meets UL94,V0
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 21. DO-15 plastic dimensions
Dimensions
C
C
A
D
B
Ref.
Millimeters
Inches
Min.
Max.
Min.
Max.
A
6.05
6.75
0.238
0.266
B
2.95
3.53
0.116
0.139
C
26
31
1.024
1.220
D
0.71
0.88
0.028
0.035
Figure 22. DO-201AD plastic dimensions
Dimensions
B
B
A
E
Note 1
E
Ref.
Millimeters
Inches
Note 1
Min.
ØD
A
Note 2
B
ØC
Max.
Min.
9.50
25.40
Max.
0.374
1.000
∅C
5.30
0.209
∅D
1.30
0.051
E
1.25
0.049
Notes:
1.
The lead diameter ∅D is not controlled over zone E
2.
The minimum axial length within which the device may be placed with its leads bent at
right angles is 0.59”(15 mm)
Doc ID 7505 Rev 6
7/11
Package information
Table 5.
STPS3L60
SMB dimensions
Dimensions
Ref.
E1
D
E
A1
C
A2
L
b
Millimeters
Min.
Max.
Min.
Max.
A1
1.90
2.45
0.075
0.096
A2
0.05
0.20
0.002
0.008
b
1.95
2.20
0.077
0.087
c
0.15
0.40
0.006
0.016
D
3.30
3.95
0.130
0.156
E
5.10
5.60
0.201
0.220
E1
4.05
4.60
0.159
0.181
L
0.75
1.50
0.030
0.059
Figure 23. SMB footprint, dimensions in mm (inches)
1.62
2.60
(0.064) (0.102)
1.62
(0.064)
2.18
(0.086)
5.84
(0.300)
8/11
Doc ID 7505 Rev 6
Inches
STPS3L60
Package information
Table 6.
SMBflat dimensions
Dimensions
Ref.
A
c
D
L 2x
L1 2x
E E1
Millimeters
Inches
Min. Typ. Max.
Min.
Typ.
Max.
A
0.90
1.10
0.035
0.043
b
1.95
2.20
0.077
0.087
c
0.15
0.40
0.006
0.016
D
3.30
3.95
0.130
0.156
E
5.10
5.60
0.200
0.220
E1
4.05
4.60
0.189
0.181
L
0.75
1.50
0.029
0.059
L
L2 2x
b
L1
0.40
0.016
L2
0.60
0.024
Figure 24. SMBflat footprint dimensions(a)
5.84
(0.230)
2.07
(0.082)
1.20
(0.047)
3.44
(0.136)
1.20
(0.047)
millimeters
(inches)
a. SMB footprint may also be used.
Doc ID 7505 Rev 6
9/11
Ordering information
3
Ordering information
Table 7.
4
Ordering information
Order codes
Marking
Package
Weight
Base qty
Delivery mode
STPS3L60
STPS3L60
DO-201AD
1.12 g
600
Ammopack
STPS3L60RL
STPS3L60
DO-201AD
1.12 g
1900
Tape and reel
STPS3L60Q
STPS3L60
DO-15
0.4 g
1000
Ammopack
STPS3L60QRL
STPS3L60
DO-15
0.4 g
6000
Tape and reel
STPS3L60U
G36
SMB
0.107 g
2500
Tape and reel
STPS3L60UF
FG36
SMBflat
0.136 g
5000
Tape and reel
Revision history
Table 8.
10/11
STPS3L60
Document revision history
Date
Revision
July-2003
5A
12-Jun-2009
6
Changes
Previous issue
Reformatted to current standards. Added SMBflat package.
Added ECOPACK statement. Added cathode band graphics.
Doc ID 7505 Rev 6
STPS3L60
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Doc ID 7505 Rev 6
11/11