STMICROELECTRONICS STPS2L30A

STPS2L30
Low drop power Schottky rectifier
Features
A
■
Low cost device with low drop forward voltage
for less power dissipation
■
Optimized conduction/reverse losses trade-off
which lead to the highest yield in the
applications
■
Surface mount miniature packages
■
Avalanche capability specified
K
SMA
STPS2L30A
Description
A
Single Schottky rectifier suited to switched mode
power supplies and high frequency DC to DC
converters, freewheel diode and integrated circuit
latch up protection.
Packaged in SMA and low profile SMA and SMB,
this device is especially intended for use in
parallel with MOSFETs in synchronous
rectification.
April 2008
A
K
K
SMB flat
STPS2L30UF
Table 1.
Rev 6
SMA flat
STPS2L30AF
Device summary
IF(AV)
2A
VRRM
30 V
Tj (max)
150 °C
VF(max)
0.375 V
1/10
www.st.com
10
Characteristics
STPS2L30
1
Characteristics
Table 2.
Absolute ratings (limiting values)
Symbol
VRRM
Parameter
V
2
A
TL = 130 °C δ = 0.5
Average forward current
SMA
TL = 120 °C δ = 0.5
SMB flat
TL = 135 °C δ = 0.5
Surge non repetitive forward current
tp =10 ms sinusoidal
75
A
PARM
Repetitive peak avalanche power
tp = 1 µs Tj = 25 °C
1500
W
-65 to + 150
°C
150
°C
Value
Unit
Storage temperature range
Operating junction temperature (1)
Tj
dPtot
--------------dTj
<
Table 3.
1
-------------------------Rth ( j – a )
condition to avoid thermal runaway for a diode on its own heatsink
Thermal resistance
Symbol
Rth(j-l)
Table 4.
Symbol
IR(1)
Parameter
Junction to lead
VF(1)
SMA flat
20
SMA
30
SMB flat
15
°C/W
Static electrical characteristics
Parameter
Reverse leakage current
Test Conditions
Tj = 25 °C
Tj = 100 °C
Tj = 25 °C
Forward voltage drop
Tj = 125 °C
Tj = 25 °C
Tj = 125 °C
VR = VRRM
Min.
Typ.
6
Max.
Unit
200
µA
15
mA
0.45
IF = 2 A
0.325
0.375
V
0.53
IF = 4 A
1. Pulse test: tp = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation:
P = 0.24 x IF(AV) + 0.068 IF2(RMS)
2/10
30
IFSM
Tstg
1.
Unit
Repetitive peak reverse voltage
SMA flat
IF(AV)
Value
0.43
0.51
STPS2L30
Characteristics
Figure 1.
Average forward power dissipation Figure 2.
versus average forward current
Average forward current versus
ambient temperature (δ = 0.5) SMA
IF(AV)(A)
PF(AV)(W)
2.2
1.2
1.1
δ = 0.05
1.0
δ = 0.1
Rth(j-a)=Rth(j-l)
δ = 0.2
δ = 0.5
SMA
2.0
1.8
0.9
1.6
0.8
δ=1
Rth(j-a)=120°C/W
1.4
0.7
1.2
0.6
1.0
0.5
0.8
0.4
0.6
0.3
T
T
0.4
0.2
IF(AV)(A)
0.1
0.0
0.2
0.4
Figure 3.
0.6
0.8
1.0
1.2
1.4
0.2
δ=tp/T
0.0
1.6
1.8
2.0
0.0
2.2
2.4
2.6
Average forward current
versus ambient temperature
(δ = 0.5) SMB flat
0
2.2
Rth(j-a)=Rth(j-l)
2.0
2.0
1.8
1.8
SMB flat
1.6
Tamb(°C)
tp
25
Figure 4.
IF(AV)(A)
2.2
δ=tp/T
tp
50
75
100
125
150
Average forward current
versus ambient temperature
(δ = 0.5) SMA flat
IF(AV)(A)
SMA-Flat
Rth(j-a)=Rth(j-l)
1.6
Rth(j-a)=120°C/W
1.4
1.4
1.2
1.2
1.0
1.0
0.8
0.8
0.6
0.6
T
Rth(j-a)=200 °C/W
T
0.4
0.4
0.2
δ=tp/T
0.0
0
δ=tp/T
0.2
Tamb(°C)
tp
Tamb(°C)
tp
0.0
25
Figure 5.
50
75
100
125
0
150
Non repetitive surge peak forward
current versus overload duration
(maximum values) SMA
25
Figure 6.
IM(A)
50
75
100
125
150
Non repetitive surge peak forward
current versus overload duration
(maximum values) SMB flat
IM(A)
10
30
SMB flat
(non exposed pad)
SMA
9
25
8
7
20
Ta=25°C
6
5
TL=25°C
15
Ta=75°C
4
TL=75°C
10
3
Ta=125°C
2
1
IM
t(s)
δ=0.5
IM
t
t(s)
δ=0.5
0
1.E-03
TL=125°C
5
t
0
1.E-02
1.E-01
1.E+00
1.E-03
1.E-02
1.E-01
1.E+00
3/10
Characteristics
Figure 7.
STPS2L30
Non repetitive surge peak forward
current versus overload duration
(maximum values) SMA flat
Figure 8.
IM(A)
Normalized avalanche power
derating versus pulse duration
PARM(tp)
PARM(1µs)
8
SMA-Flat
1
7
6
5
0.1
Ta=25 °C
4
Ta=75 °C
3
0.01
2
Ta=125 °C
IM
1
t(s)
t
δ =0.5
0
1.E-03
1.E-02
Figure 9.
tp(µs)
0.001
1.E-01
0.01
1.E+00
Normalized avalanche power
derating versus junction
temperature
0.1
1
10
100
1000
Figure 10. Relative variation of thermal
impedance, junction to ambient,
versus pulse duration - SMA
Zth(j-a)/Rth(j-a)
PARM(Tj)
PARM(25°C)
1.0
SMA
0.9
1.2
0.8
1
0.7
0.8
0.6
0.5
0.6
0.4
0.4
0.3
T
0.2
0.2
Tj(°C)
0.1
0
25
50
75
100
125
150
Single pulse
1.E-02
Figure 11. Relative variation of thermal
impedance junction to lead
versus pulse duration - SMB flat
1.E+00
1.E+01
1.E+02
1.E+03
Zth(j-a)/Rth(j-a)
SMA-Flat
SMB flat
0.9
0.8
0.7
0.7
0.6
0.6
0.5
0.5
0.4
0.4
0.3
0.3
0.2
0.2
Single pulse
0.1
tp(s)
1.E-04
Single pulse
tp(s)
0.0
0.0
4/10
1.E-01
tp
1.0
0.8
0.1
δ=tp/T
Figure 12. Relative variation of thermal
impedance junction to ambient
versus pulse duration - SMA flat
Zth(j-l)/Rth(j-l)
1.0
0.9
tp(s)
0.0
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
STPS2L30
Characteristics
Figure 13. Reverse leakage current versus
reverse voltage applied (typical
values)
Figure 14. Junction capacitance versus
reverse voltage applied (typical
values)
IR(mA)
C(pF)
1.E+02
1000
F=1MHz
VOSC=30mVRMS
Tj=25°C
Tj=150°C
Tj=125°C
1.E+01
Tj=100°C
1.E+00
100
1.E-01
Tj=25°C
1.E-02
VR(V)
VR(V)
10
1.E-03
0
5
10
15
20
25
Figure 15. Forward voltage drop versus
forward current (high level)
10.0
1
30
10
100
Figure 16. Forward voltage drop versus
forward current ( low level)
IFM(A)
IFM(A)
3.0
2.5
Tj=125 °C
(maximum values)
Tj=125 °C
(maximum values)
2.0
1.5
1.0
Tj=125 °C
(typical values)
Tj=125 °C
(typical values)
1.0
Tj=25 °C
(maximum values)
Tj=25 °C
(maximum values)
0.5
VFM(V)
VFM(V)
0.0
0.1
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.0
0.1
Figure 18.
Figure 17. Thermal resistance junction to
ambient versus copper surface
under each lead (epoxy printed
board FR4, copper
thickness = 35 µm) (SMA, SMB flat)
Rth(j-a)(°C/W)
0.2
0.3
0.4
0.5
0.6
Thermal resistance junction to
ambient versus copper surface
under each lead (epoxy printed
board FR4, copper
thickness = 35 µm) (SMA flat)
Rth(j-a)(°C/W)
130
200
120
SMA-Flat
180
110
160
100
140
90
SMA
80
120
70
100
60
80
SMB flat)
50
40
60
30
40
20
10
20
SCU(Cm²)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
SCU(Cm²)
0
0
3.5
4.0
4.5
5.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5/10
Package Information
2
STPS2L30
Package Information
●
Epoxy meets UL94, V0
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at www.st.com.
Table 5.
SMA dimensions
Dimensions
Ref.
Millimeters
Inches
E1
D
E
A1
A2
C
L
Min.
Max.
Min.
Max.
A1
1.90
2.45
0.075
0.094
A2
0.05
0.20
0.002
0.008
b
1.25
1.65
0.049
0.065
c
0.15
0.40
0.006
0.016
D
2.25
2.90
0.089
0.114
E
4.80
5.35
0.189
0.211
E1
3.95
4.60
0.156
0.181
L
0.75
1.50
0.030
0.059
b
Figure 19. SMA footprint (dimensions in mm)
1.4
2.63
1.4
1.64
5.43
6/10
STPS2L30
Package Information
Table 6.
SMA flat (non exposed pad) dimensions
Dimensions
Ref.
Millimeters
Inches
Min. Typ. Max.
Min.
Typ.
Max.
A
0.90
1.10
0.035
0.043
b
1.25
1.65
0.049
0.065
c
0.15
0.40
0.006
0.016
D
2.25
2.95
0.088
0.116
E
4.80
5.60
0.189
0.220
E1
3.95
4.60
0.156
0.181
L
0.75
1.50
0.030
0.059
A
c
D
L 2x
L1 2x
E E1
L
L2 2x
b
L1
0.50
0.019
L2
0.50
0.019
Figure 20. SMA flat (non exposed pad) footprint dimensions
5.52
(0.217)
1.52
(0.060)
1.20
(0.047)
3.12
(0.123)
1.20
(0.047)
millimeters
(inches)
7/10
Package Information
Table 7.
STPS2L30
SMB flat dimensions
Dimensions
Ref.
D
L
L2
E E1
L
L1
b
Min.
A
0.90
1.10
0.035
0.043
b(1)
1.95
2.20
0.077
0.087
(1)
0.15
0.40
0.006
0.016
D
3.30
3.95
0.130
0.156
E
5.10
5.60
0.200
0.220
E1
4.05
4.60
0.189
0.181
L
0.75
1.50
0.029
0.059
c
0.40
0.016
L2
0.60
0.024
Figure 21. SMB flat footprint (dimensions in mm)
5.84
2.07
8/10
3.44
Typ.
L1
1. Applies to plated leads
1.20
Inches
Min. Typ. Max.
A
c
Millimeters
1.20
Max.
STPS2L30
3
Ordering information
Ordering information
Table 8.
4
Ordering information
Order code
Marking
Package
Weight
Base qty
Delivery mode
STPS2L30A
G30
SMA
0.068 g
5000
Tape and reel
STPS2L30UF
FG30
SMB flat
0.050 g
5000
Tape and reel
STPS2L30AF
F30
SMA flat
0.035 g
10000
Tape and reel
Revision history
Table 9.
Document revision history
Date
Revision
Changes
Jul-2003
3A
Aug-2004
4
SMA package dimensions update. Reference A1 max.
changed from 2.70mm (0.106inc.) to 2.03mm (0.080).
31-Jan-2007
5
Reformatted to current standard. Added ECOPACK
statement. Added SMB flat package.
23-Apr-2008
6
Reformatted to current standards. Added SMA flat package.
Last update.
9/10
STPS2L30
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