STPS3150 Power Schottky rectifier Features A A ■ Negligible switching losses ■ Low forward voltage drop for higher efficiency and extented battery life ■ Low thermal resistance ■ ECOPACK®2 compliant component K K DO-201AD STPS3150 SMB STPS3150U A Description K 150 V Power Schottky rectifier are suited for switch mode power supplies on up to 24 V rails and high frequency converters. Packaged in Axial, SMB, and low-profile SMB, this device is intended for use in consumer and computer applications like TV, STB, PC and DVD where low drop forward voltage is required to reduce power dissipation. July 2011 SMB flat STPS3150UF Table 1. Doc ID 9474 Rev 5 Device summary Symbol Value IF(AV) 3A VRRM 150 V Tj (max) 175 °C VF (max) 0.67 V 1/10 www.st.com 10 Characteristics 1 STPS3150 Characteristics Table 2. Absolute Ratings (limiting values) Symbol Parameter VRRM Repetitive peak reverse voltage IF(AV) Average forward current SMB TL = 130 °C δ = 0.5 DO-201AD TL = 140 °C δ = 0.5 SMB flat TL = 150 °C δ = 0.5 IFSM DO-201AD tp = 10 ms sinusoidal Operating junction 1. < Table 3. 1 -------------------------Rth ( j – a ) Symbol IR (1) °C 175 °C Value Unit Parameter Junction to lead SMB flat 10 SMB 20 DO-201AD 15 °C/W Static electrical characteristics Parameter Reverse leakage current Tests conditions Tj = 25 °C Tj = 125 °C Forward voltage drop Tj = 125 °C Tj = 25 °C Tj = 125 °C Min. VR = VRRM IF = 3 A Typ. Max. Unit 0.4 2.0 µA 0.6 2.0 mA 0.78 0.82 0.63 0.67 0.85 0.89 0.70 0.75 V IF = 6 A 1. tp = 5 ms, δ < 2% 2. tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.59 x IF(AV) + 0.023 IF2(RMS) 2/10 A Thermal resistance Tj = 25 °C VF (2) A condition to avoid thermal runaway for a diode on its own heatsink Lead length = 10 mm Table 4. 3 -65 to + 175 temperature(1) Symbol Rth(j-l) V 80 Storage temperature range Tj dPtot --------------dTj 150 100 SMB flat Tstg Unit 80 SMB Surge non repetitive forward current Value Doc ID 9474 Rev 5 STPS3150 Characteristics Figure 1. Average forward power dissipation versus average forward current Figure 2. PF(AV)(W) Average forward current versus ambient temperature (δ = 0.5) (DO-201AD / SMB) IF(AV)(A) 2.4 δ = 0.2 δ = 0.1 2.2 3.5 δ = 0.5 Rth(j-a)=Rth(j-I) DO-201AD 3.0 δ = 0.05 2.0 1.8 2.5 δ=1 1.6 1.4 SMB 2.0 1.2 1.5 1.0 Rth(j-a)=75°C/W 0.8 1.0 0.6 T T 0.4 0.5 IF(AV)(A) 0.2 δ=tp/T 0.0 0.0 0.5 Figure 3. 1.0 1.5 2.0 2.5 δ=tp/T tp 0.0 3.0 0 3.5 Average forward current versus ambient temperature (δ = 0.5) (SMB flat) 25 Figure 4. IF(AV)(A) Tamb(°C) tp 50 75 100 125 150 175 Non repetitive surge peak forward current versus overload duration (maximum values) IM(A) 3.5 12 Rth(j-a)=Rth(j-l) 11 3.0 SMB 10 9 2.5 8 Ta=25°C 7 2.0 6 SMB flat 1.5 Ta=75°C 5 4 Rth(j-a)=40°C/W . SCU=2.5 cm2 1.0 Ta=125°C 3 T IM 2 0.5 δ=tp/T 0.0 0 25 Figure 5. t 1 Tamb(°C) tp t(s) δ=0.5 0 50 75 100 125 150 175 Non repetitive surge peak forward current versus overload duration (maximum values) 1.E-03 1.E-02 Figure 6. 1.E-01 1.E+00 Non repetitive surge peak forward current versus overload duration (maximum values) IM(A) IM(A) 50 14 SMB flat DO-201AD 45 12 40 Ta=25°C 10 35 30 8 Ta=75°C TL=25°C 25 TL=75°C 6 20 Ta=125°C 4 15 10 IM TL=125°C IM 2 t 5 t(s) δ=0.5 0 1.E-03 t t(s) δ=0.5 0 1.E-02 1.E-01 1.E+00 1.E-03 Doc ID 9474 Rev 5 1.E-02 1.E-01 1.E+00 3/10 Characteristics Figure 7. 1 STPS3150 Normalized avalanche power derating versus pulse duration Figure 8. PARM(tp) PARM(1µs) 1.2 Normalized avalanche power derating versus junction temperature PARM(Tj) PARM(25 °C) 1 0.1 0.8 0.6 0.4 0.01 0.2 tp(µs) 0.001 0.01 0.1 Figure 9. 1 10 1000 100 Relative variation of thermal impedance junction to ambient versus pulse duration Tj(°C) 0 25 50 75 100 Figure 10. Relative variation of thermal impedance junction to ambient versus pulse duration Zth(j-a)/Rth(j-a) Zth(j-a)/Rth(j-a) 1.0 1.0 SMB DO-201AD 0.9 0.9 0.8 0.8 0.7 0.7 0.6 0.6 0.5 0.5 0.4 0.4 0.3 0.3 T 0.2 150 125 T 0.2 Single pulse 0.1 δ=tp/T tp(s) tp 0.0 Single pulse 0.1 δ=tp/T tp(s) tp 0.0 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Figure 11. Relative variation of thermal impedance junction to lead versus pulse duration 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Figure 12. Reverse leakage current versus reverse voltage applied (typical values) Zth(j-l)/Rth(j-l) IR(µA) 1.0 1.E+04 SMB flat 0.9 Tj=150°C 1.E+03 0.8 Tj=125°C 0.7 1.E+02 Tj=100°C 0.6 1.E+01 0.5 Tj=75°C 0.4 0.2 tp(s) VR(V) 1.E-02 0.0 1.E-04 Tj=25°C 1.E-01 Single pulse 0.1 4/10 Tj=50°C 1.E+00 0.3 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 0 Doc ID 9474 Rev 5 25 50 75 100 125 150 STPS3150 Characteristics Figure 13. Junction capacitance versus reverse voltage applied (typical values) Figure 14. Forward voltage drop versus forward current IFM(A) C(pF) 100 1000 Tj=125°C (maximum values) F=1MHz VOSC=30mVRMS Tj=25°C Tj=125°C (typical values) Tj=25°C (maximum values) 10 100 VFM(V) VR(V) 10 1 1 10 100 1000 Figure 15. Thermal resistance junction to ambient versus copper surface under each lead 0.0 100 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 Figure 16. Thermal resistance junction to ambient versus copper surface under each lead Rth(j-a)(°C/W) 110 0.2 Rth(°C/W) 90 epoxy printed board copper thickness = 35 µm DO-201AD 80 90 Rth(j-a) 70 SMB 80 60 70 60 50 50 40 40 epoxy printed board copper thickness = 35 µm Rth(j-I) 30 30 20 20 10 10 SCu(cm²) Lleads(mm) 0 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5 5.0 10 15 20 25 Figure 17. Thermal resistance junction to ambient versus copper surface under each lead (epoxy printed board copper thickness = 35 µm) Rth(j-a)(°C/W) 110 100 90 80 70 60 SMB flat 50 40 30 20 10 SCU(cm²) 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 Doc ID 9474 Rev 5 3.5 4.0 4.5 5.0 5/10 Package information 2 STPS3150 Package information ● Epoxy meets UL94, V0 ● Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 5. SMB dimensions Dimensions Ref. Millimeters Inches E1 D E A1 A2 C L b Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 E 5.10 5.60 0.201 0.220 E1 4.05 4.60 0.159 0.181 D 3.30 3.95 0.130 0.156 L 0.75 1.50 0.030 0.059 Figure 18. SMB footprint (dimensions in mm) 1.62 2.60 1.62 2.18 5.84 6/10 Doc ID 9474 Rev 5 STPS3150 Package information Table 6. SMB Flat dimensions Dimensions Ref. Min. A 0.90 1.10 0.035 0.043 b(1) 1.95 2.20 0.077 0.087 c(1) 0.15 0.40 0.006 0.016 D 3.30 3.95 0.130 0.156 E 5.10 5.60 0.200 0.220 E1 4.05 4.60 0.189 0.181 L 0.75 1.50 0.029 0.059 c D L2 Inches Min. Typ. Max. A L Millimeters E E1 L L1 b Typ. L1 0.40 0.016 L2 0.60 0.024 Max. 1. Applies to plated leads Figure 19. SMB Flat footprint (dimensions in mm) 5.84 2.07 1.20 3.44 Doc ID 9474 Rev 5 1.20 7/10 Package information Table 7. STPS3150 DO-201AD dimensions Dimensions B B A E Note 1 E REF. Note 1 Millimeters Min. A ØD Max. Inches Min. 9.50 Max. 0.374 Note 2 B ØC 25.40 1.000 C 5.30 0.209 (1) 1.30 0.051 E 1.25 0.049 D Note 2(2) 15 0.59 1. The lead diameter D is not controlled over zone E 2. The minimum length, which must stay straight between the right angles after bending, is 15 mm (0.59”) 8/10 Doc ID 9474 Rev 5 STPS3150 3 Ordering information Ordering information Table 8. 4 Ordering information Order code Marking Package Weight Base qty Delivery mode STPS3150U G315 SMB 0.107 g 2500 Tape and reel STPS3150UF FG315 SMB flat 0.50 g 5000 Tape and reel STPS3150 STPS3150 DO-201AD 1.12 g 600 Ammopack STPS3150RL STPS3150 DO-201AD 1.12 g 1900 Tape and reel Revision history Table 9. Document revision history Date Revision Changes May-2003 2A 31-May-2006 3 Reformatted to current standard. Added ECOPACK statement. Updated SMB footprint in Figure 12. Changed nF to pF in Figure 8. 08-Feb-2007 4 Added SMB flat and SMB flat e package. 20-Jul-2011 5 Updated Table 2. Last update. Doc ID 9474 Rev 5 9/10 STPS3150 Please Read Carefully: Information in this document is provided solely in connection with ST products. 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