STMICROELECTRONICS STPS30M100DJF

STPS30M100DJF
Power Schottky rectifier
Features
A
■
Very low conduction losses
■
Low forward voltage drop
■
Low thermal resistance
■
High specified avalanche capability
■
High integration
■
ECOPACK®2 compliant component
K
A
K
K
Description
The STPS30M100DJF is a power Schottky
rectifier suited for switch mode power supply and
high frequency DC to DC converters.
Packaged in PowerFLAT™, this device is
intended to be used in adaptors requiring good
efficiency at both low and high load. Its low profile
was especially designed to be used in
applications with space-saving constraints.
Table 1.
Device summary
PowerFLAT 5x6
STPS30M100DJF
Electrical characteristics (a)
Figure 1.
Symbol
Value
IF(AV)
30 A
VRRM
100 V
Tj(max)
150 °C
VF(typ)
0.58 V
A
A
I
V
"Forward"
I
2 x IO
X
IF
VRRM
VR
VAR
IO
X
V
IR
VTo VF(Io) VF VF(2xIo)
"Reverse"
IAR
TM: PowerFLAT is a trademark of STMicroelectronics
May 2011
a. VARM and IARM must respect the reverse safe
operating area defined in Figure 12. VAR and IAR are
pulse measurements (tp < 1 µs). VR, IR, VRRM and VF,
are static characteristics
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Characteristics
1
STPS30M100DJF
Characteristics
Table 2.
Absolute ratings (limiting values, anode terminals short circuited)
Symbol
Parameter
Value
Unit
VRRM
Repetitive peak reverse voltage
100
V
IF(RMS)
Forward rms current
45
A
IF(AV)
Average forward current δ = 0.5
Tc = 90 °C
30
A
IFSM
Surge non repetitive forward current
tp = 10 ms sinusoidal
200
A
PARM
Repetitive peak avalanche power
tp = 1 µs, Tj = 25 °C
15000
W
VARM (1)
Maximum repetitive peak avalanche
voltage
tp < 1 µs, Tj < 150 °C
IAR < 37.5 A
120
V
VASM (1)
Maximum single pulse peak avalanche
voltage
tp < 1 µs, Tj < 150 °C
IAR < 37.5 A
120
V
-65 to +175
°C
150
°C
Value
Unit
2.5
°C/W
Tstg
Tj
Storage temperature range
Maximum operating junction temperature
(2)
1. Refer to Figure 12.
2.
1
dPtot <
condition to avoid thermal runaway for a diode on its own heatsink
Rth(j-a)
dTj
Table 3.
Thermal resistance
Symbol
Rth(j-c)
Table 4.
Symbol
IR(1)
Parameter
Junction to case
Static electrical characteristics (anode terminals short circuited)
Parameter
Reverse leakage
current
Test conditions
Tj = 25 °C
Tj = 125 °C
Tj = 25 °C
VF(1)
Forward voltage drop
Tj = 125 °C
Tj = 25 °C
Tj = 125 °C
VR = VRRM
IF = 15 A
Min.
Typ.
Max.
Unit
-
-
100
µA
-
10
40
mA
-
-
0.82
-
0.58
0.66
-
-
0.96
-
0.66
0.73
V
IF = 30 A
1. Pulse test: tp = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation:
P = 0.65 x IF(AV) + 0.00267 x IF2(RMS)
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STPS30M100DJF
Figure 2.
30.0
Characteristics
Average forward power dissipation Figure 3.
versus average forward current
PF(AV)(W)
35
IF(AV)(A)
Rth(j-a) = Rth(j-c)
δ=1
δ = 0.5
25.0
Average forward current versus
ambient temperature (δ = 0.5)
30
25
20.0
δ = 0.2
20
δ = 0.1
15.0
T
15
δ = 0.05
δ = tp / T
10.0
tp
10
T
5.0
5
IF(AV)(A)
0.0
0
5
Figure 4.
10
15
20
25
30
δ = tp / T
0
35
Normalized avalanche power
derating versus pulse duration
tp
Tamb(°C)
0
25
50
Figure 5.
PARM(tp)
PARM(1 µs)
75
100
125
150
Normalized avalanche power
derating versus junction
temperature
PARM(Tj)
PARM(25 °C)
1
1.2
1
0.1
0.8
0.6
0.4
0.01
0.2
0.001
0.01
0.1
Figure 6.
220
Tj(°C)
tp(µs)
1
0
10
100
1000
Non repetitive surge peak forward
current versus overload duration
(maximum values)
IM(A)
25
Figure 7.
1.0
200
0.9
180
0.8
160
75
100
125
150
Relative variation of thermal
impedance junction to case versus
pulse duration
Zth(j-c)/Rth(j-c)
0.7
140
0.6
Tc = 25 °C
120
100
Tc = 75 °C
80
0.5
0.4
0.3
60
40
50
IM
20
0
1.E-03
Tc = 125 °C
0.2
0.1
t
δ = 0.5
t(s)
1.E-02
1.E-01
1.E+00
Single pulse
0.0
1.E-05
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tp(s)
1.E-04
1.E-03
1.E-02
1.E-01
1.E+00
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Characteristics
Figure 8.
1.E+02
STPS30M100DJF
Reverse leakage current versus
reverse voltage applied
(typical values)
Figure 9.
IR(mA)
10000
Junction capacitance versus
reverse voltage applied
(typical values)
C(pF)
F = 1 MHz
Vosc = 30 mVRMS
T = 25 °C
Tj = 150 °C
1.E+01
j
Tj = 125 °C
Tj = 100 °C
1.E+00
1000
Tj = 75 °C
1.E-01
Tj = 50 °C
1.E-02
Tj = 25 °C
VR(V)
1.E-03
0
10
20
30
40
50
60
70
80
90
Figure 10. Forward voltage drop versus
forward current
60
VR(V)
100
1
100
10
100
Figure 11. Thermal resistance junction to
ambient versus copper surface
under tab
IFM(A)
250
Rth(j-a)(°C/W)
Epoxy printed circuit board FR4,
copper thickness = 35 µm
55
50
Tj = 125 °C
(Maximum values)
45
200
40
35
150
Tj = 125 °C
(Typical values)
30
25
100
20
Tj = 25 °C
(Maximum values)
15
10
5
50
VFM(V)
0
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
Scu(cm²)
0
1.2
0
1
2
3
4
5
Figure 12. Reverse safe operating area (tp < 1 µs and Tj < 150 °C)
50
Iarm (A)
Iarm (Varm) 150 °C, 1µs
45
40
Forbidden area
Operating area
35
30
100
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Varm (V)
110
120
130
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140
150
6
7
8
9
10
STPS30M100DJF
Package information
●
Epoxy meets UL94,V0
●
Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Table 5.
PowerFLAT 5x6 dimensions
Dimensions
Ref.
Millimeters
Min.
D2
E2
K
Typ.
e
L
Max.
Min.
Typ.
Max.
A
0.80
1.00
0.031
0.039
A1
0.02
0.05
0.001
0.002
A2
b
Inches
b
0.25
0.30
0.010
0.50
0.012
0.020
A
A1
D
A2
D
D2
E
5.20
4.11
0.205
4.31
0.162
0.170
e
1.27
0.050
E
6.15
0.242
E2
3.50
3.70
0.138
0.146
L
0.50
0.80
0.020
0.031
K
1.275
1.575
0.050
0.062
Figure 13. Footprint (dimensions in mm)
5.35
4.41
3.86
4.33
6.29
2
Package information
0.98
0.95
0.62
1.27
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Package information
STPS30M100DJF
Figure 14. Tape and reel specifications
Dot identifying Pin A1 location
2.0
Ø 1.55
1.75
4.0
0.30
Ø 1.5
5.30
12.0
5.5
0.20
R 0.50
6.30
8.0
1.20
All dimensions are typical values in mm
6/8
User direction of unreeling
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STPS30M100DJF
3
Ordering information
Table 6.
4
Ordering information
Ordering information
Order code
Marking
Package
STPS30M100DJF-TR
PS30 M100
PowerFLAT 5x6
Weight Base qty Delivery mode
95 mg
3000
Tape and reel
Revision history
Table 7.
Document revision history
Date
Revision
Changes
06-Nov-2009
1
First issue.
30-Jul-2010
2
Replace Power QFN with PowerFLAT.
15-Jan-2011
3
Add reference E in Table 5.
20-May-2011
4
Update all package illustrations. Updated base quantity and
marking in Table 6. Updated terminal identification in captions of
Table 2 and Table 4. Added Figure 14.
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STPS30M100DJF
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