STPS160 Power Schottky rectifier Features ■ Very small conduction losses ■ Negligible switching losses ■ Low forward voltage drop ■ Surface mount miniature packages ■ Avalanche capability specified A A K K SMA (JEDEC DO-214AC) STPS160A SMB (JEDEC DO-214AA) STPS160U Description Single chip Schottky rectifiers suited to switched mode power supplies and high frequency DC to DC converters. Table 1. Packaged in SMA and SMB, this device is especially intended for surface mounting and used in low voltage, high frequency inverters, free wheeling and polarity protection applications. March 2010 Doc ID 4608 Rev 9 Device summary Symbol Value IF(AV) 1A VRRM 60 V Tj (max) 150 °C VF (max) 0.57 V 1/9 www.st.com 9 Characteristics 1 STPS160 Characteristics Table 2. Absolute ratings (limiting values) Symbol Unit 60 V 1 A Repetitive peak reverse voltage IF(AV) Average forward current TL = 130 °C IFSM Surge non repetitive forward current tp =10 ms sinusoidal 75 A IRRM Repetitive peak reverse current tp = 2 µs F = 1 kHz square 1 A IRSM Non repetitive peak reverse current tp = 100 µs square 1 A PARM Repetitive peak avalanche power tp = 1 µs Tj = 25 °C 2400 W - 65 to + 150 °C 150 °C 10000 V/µs Value Unit Tj dV/dt δ = 0.5 Storage temperature range Maximum operating junction temperature (1) Critical rate of rise of reverse voltage 1 dPtot < condition to avoid thermal runaway for a diode on its own heatsink Rth(j-a) dTj Table 3. Thermal resistance Symbol Rth(j-l) Table 4. Parameter 30 SMB 23 °C/W Static electrical characteristics Symbol Parameter IR(1) Reverse leakage current VF(2) SMA Junction to lead Test conditions Tj = 25 °C Tj = 125 °C Tj = 25 °C Tj = 125 °C Forward voltage drop Tj = 25 °C Tj = 125 °C Min. VR = VRRM Typ. 1.1 Max. Unit 4 µA 4 mA 0.67 IF = 1 A 0.49 0.57 V 0.8 IF = 2 A 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.49 x IF(AV) + 0.08 IF2(RMS) 2/9 Value VRRM Tstg 1. Parameter Doc ID 4608 Rev 9 0.58 0.65 STPS160 Characteristics Figure 1. Average forward power dissipation Figure 2. versus average forward current Average forward current versus ambient temperature (δ = 0.5) IF(AV)(A) PF(AV)(W) 0.7 δ = 0.1 δ = 0.05 0.6 1.2 δ = 0.5 δ = 0.2 Rth(j-a)=Rth(j-I) 1.0 δ=1 0.5 SMA Rth(j-a)=100°C/W S(CU)=1.5cm2 0.8 0.4 SMB Rth(j-a)=80°C/W S(CU)=1.5cm2 0.6 0.3 0.4 0.2 T T 0.2 0.1 IF(AV)(A) δ=tp/T 0.0 tp δ=tp/T 0.0 0.0 0.2 Figure 3. 0.4 0.6 0.8 1.0 1.2 Normalized avalanche power derating versus pulse duration 0 25 Figure 4. PARM(tp) PARM(1µs) Tamb(°C) tp 50 75 100 125 150 Normalized avalanche power derating versus junction temperature PARM(tp) PARM(25°C) 1 1.2 0.1 0.8 1 0.6 0.4 0.01 0.2 Tj(°C) tp(µs) 0.001 0.01 0.1 Figure 5. 1 0 10 100 25 1000 Non repetitive surge peak forward current versus overload duration (maximum values) (SMA) 50 Figure 6. 75 100 125 150 Non repetitive surge peak forward current versus overload duration (maximum values) (SMB) IM(A) IM(A) 8 8 7 7 6 6 Ta=25°C 5 Ta=25°C 5 4 4 Ta=50°C Ta=50°C 3 2 Ta=100°C IM 1 3 Ta=100°C 2 IM 1 t t(s) δ=0.5 t t(s) δ=0.5 0 0 1E-3 1E-2 1E-1 1E+0 1E-3 Doc ID 4608 Rev 9 1E-2 1E-1 1E+0 3/9 Characteristics Figure 7. STPS160 Relative variation of thermal impedance junction to ambient versus pulse duration (SMA) Figure 8. Zth(j-c)/Rth(j-c) Zth(j-c)/Rth(j-c) 1.0 1.0 epoxy printed circuit board, e(Cu) = 35 µm recommended pad layout 0.9 epoxy printed circuit board, e(Cu) = 35 µm recommended pad layout 0.9 0.8 0.8 0.7 0.7 0.6 Relative variation of thermal impedance junction to ambient versus pulse duration (SMB) 0.6 δ = 0.5 δ = 0.5 0.5 0.5 0.4 0.4 0.3 δ = 0.2 0.2 δ = 0.1 0.1 Single pulse T 1E-1 Figure 9. δ=tp/T tp(s) 0.0 1E-2 1E+0 tp 0.3 δ = 0.2 0.2 δ = 0.1 0.1 Single pulse T δ=tp/T tp(s) 0.0 1E+1 1E+2 Reverse leakage current versus reverse voltage applied (typical values) 1E-2 1E-1 1E+0 1E+1 tp 1E+2 1E+3 Figure 10. Junction capacitance versus reverse voltage applied (typical values) IR(µA) C(pF) 1E+3 200 F=1MHz Tj=25°C Tj=105°C 100 1E+2 Tj=75°C 50 1E+1 1E+0 20 Tj=25°C VR(V) VR(V) 1E-1 0 5 10 15 20 25 30 10 35 40 45 50 55 1 60 Figure 11. Forward voltage drop versus forward current (maximum values) 2 5 10 20 50 100 Figure 12. Thermal resistance junction to ambient versus copper surface under each lead (SMA) Rth(j-a)(°C/W) IFM(A) 140 1E+1 Epoxy printed circuit board Fr4 copper thickness: 35 µm 120 Tj=125°C 100 1E+0 Tj=25°C 80 60 1E-1 40 20 S(Cu)(cm²) VFM(V) 0 1E-2 0 4/9 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 0 Doc ID 4608 Rev 9 1 2 3 4 5 STPS160 Characteristics Figure 13. Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, copper thickness: 35 µm) (SMB) Rth(j-a)(°C/W) 100 80 60 40 20 S(Cu)(cm²) 0 0 1 2 Doc ID 4608 Rev 9 3 4 5 5/9 Package information 2 STPS160 Package information ● Epoxy meets UL94, V0 ● Band indicates cathode In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 5. SMA dimensions Dimensions Ref. Millimeters Inches E1 D E A1 A2 C L Min. Max. Min. Max. A1 1.90 2.45 0.075 0.094 A2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.006 0.016 D 2.25 2.90 0.089 0.114 E 4.80 5.35 0.189 0.211 E1 3.95 4.60 0.156 0.181 L 0.75 1.50 0.030 0.059 b Figure 14. Footprint, dimensions in mm (inches) 1.4 2.63 1.4 (0.055) (0.103) (0.055) 1.64 (0.064) 5.43 (0.214) 6/9 Doc ID 4608 Rev 9 STPS160 Package information Table 6. SMB dimensions Dimensions Ref. Millimeters Inches E1 D E A1 A2 C L b Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 D 3.30 3.95 0.130 0.156 E 5.10 5.60 0.201 0.220 E1 4.05 4.60 0.159 0.181 L 0.75 1.50 0.030 0.059 Figure 15. Footprint, dimensions in mm (inches) 1.62 2.60 (0.064) (0.102) 1.62 (0.064) 2.18 (0.086) 5.84 (0.300) Doc ID 4608 Rev 9 7/9 Ordering information 3 Ordering information Table 7. 4 Ordering information Order code Marking Package Weight Base qty Delivery mode STPS160A GA6 SMA 0.068 g 5000 Tape and reel STPS160U E16 SMB 0.107 g 2500 Tape and reel Revision history Table 8. 8/9 STPS160 Document revision history Date Revision Changes Jul-2003 6A Aug-2004 7 SMA package dimensions update. Reference A1 max changed from 2.70 mm (0.106 inc.) to 2.03 mm (0.080 inc). 16-Feb-2007 8 Reformatted to current standards. IF(RMS) removed from Table 2. Package dimensions and footprints updated. Ecopack statement added. 18-Mar-2010 9 Updated package illustration on page 1. Last update. Doc ID 4608 Rev 9 STPS160 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2010 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com Doc ID 4608 Rev 9 9/9