STMICROELECTRONICS STPS2150RL

STPS2150
Power Schottky rectifier
Main product characteristics
IF(AV)
2A
VRRM
150 V
Tj (max)
175° C
VF(max)
0.67 V
Description
150 V Power Schottky rectifier are suited for
switch mode power supplies on up to 24 V rails
and high frequency converters.
Packaged in SMA and Axial, this device is
intended for use in consumer and computer
applications like TV, STB, PC and DVD where low
drop forward voltage is required to reduce power
dissipation.
STPS2150
Features and benefits
Order Codes
■
Negligible switching losses
■
Low forward voltage drop for higher efficiency
and extented battery life
Part Number
Marking
■
Low thermal resistance
STPS2150A
2150
■
Surface mount miniature package
STPS2150
STPS2150
■
Avalanche capability specified
STPS2150RL
STPS2150
Table 1.
Absolute Ratings (limiting values)
Symbol
Parameter
Value
Unit
VRRM
Repetitive peak reverse voltage
150
V
IF(RMS)
RMS forward voltage
15
A
2
A
IF(AV)
Average forward current
IFSM
Surge non repetitive forward
current
PARM
Repetitive peak avalanche power
Tstg
Tj
1.
DO-15
SMA
(JEDEC DO-214AC)
STPS2150A
TL = 145° C δ = 0.5
TL = 130° C δ = 0.5
SMA
DO-15
tp = 10 ms sinusoidal
tp = 1 µs Tj = 25° C
Storage temperature range
Maximum operating junction temperature(1)
dPtot
1
--------------- > -------------------------dTj
Rth ( j – a )
May 2006
SMA
DO-15
75
150
A
2400
W
-65 to + 175
°C
175
°C
thermal runaway condition for a diode on its own heatsink
Rev 5
1/7
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7
Characteristics
STPS2150
1
Characteristics
Table 2.
Thermal resistance
Symbol
Rth(j-l)
Parameter
Value
SMA
20
DO-15
30
Unit
Junction to lead
° C/W
Lead length = 10 mm
Table 3.
Static electrical characteristics
Symbol
IR (1)
Parameter
Tests conditions
Tj = 25° C
Reverse leakage current
Tj = 125° C
Tj = 25° C
VF (2)
Tj = 125° C
Forward voltage drop
Tj = 25° C
Tj = 125° C
Min.
VR = VRRM
IF = 2 A
Typ
Max.
Unit
0.5
1.5
µA
0.5
1.5
mA
0.78
0.82
0.62
0.67
0.86
0.89
0.70
0.75
V
IF = 4 A
1. tp = 5 ms, δ < 2%
2. tp = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation: P = 0.59 x IF(AV) + 0.04 IF2(RMS)
Figure 1.
Average forward power
dissipation versus average
forward current
Figure 2.
PF(AV)(W)
Average forward current versus
ambient temperature (δ = 0.5)
IF(AV)(A)
1.6
δ = 0.1
δ = 0.2
2.2
δ = 0.5
Rth(j-a)=Rth(j-I)
2.0
δ = 0.05
1.4
SMA
1.8
DO-15
1.2
1.6
δ=1
1.4
1.0
Rth(j-a)=100°C/W
1.2
0.8
1.0
0.6
0.8
0.4
0.6
T
T
0.4
0.2
IF(AV)(A)
δ=tp/T
0.0
0.0
2/7
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
0.2
tp
δ=tp/T
0.0
2.0
2.2
0
25
Tamb(°C)
tp
50
75
100
125
150
175
STPS2150
Characteristics
Figure 3.
Normalized avalanche power
derating versus pulse duration
Figure 4.
PARM(tp)
PARM(1µs)
Normalized avalanche power
derating versus junction
temperature
PARM(tp)
PARM(25°C)
1
1.2
1
0.1
0.8
0.6
0.4
0.01
0.2
Tj(°C)
tp(µs)
0.001
0.01
0.1
Figure 5.
1
0
10
100
25
1000
Non repetitive surge peak
forward current versus overload
duration - maximum values (SMA)
50
Figure 6.
IM(A)
75
100
125
150
Non repetitive surge peak forward
current versus overload duration
- maximum values (DO-15)
IM(A)
10
10
9
9
8
8
7
7
6
6
5
Ta=25°C
4
Ta=25°C
5
Ta=75°C
4
Ta=75°C
3
2
3
2
IM
Ta=125°C
IM
Ta=125°C
1
t
t(s)
δ=0.5
0
t(s)
δ=0.5
0
1.E-03
Figure 7.
1.E-02
1.E-01
1.E+00
Relative variation of thermal
impedance junction to ambient
versus pulse duration - epoxy
printed circuit board, eCu = 35 µm,
recommended pad layout (SMA)
1.E-03
Figure 8.
Zth(j-a)/Rth(j-a)
1.E-02
1.E-01
1.E+00
Relative variation of thermal
impedance junction to ambient
versus pulse duration (DO-15)
Zth(j-a)/Rth(j-a)
1.0
1.0
0.9
0.9
0.8
0.8
0.7
0.7
0.6
t
1
0.6
δ = 0.5
0.5
δ = 0.5
0.5
0.4
0.4
0.3
δ = 0.2
0.2
δ = 0.1
T
0.1
δ=tp/T
tp(s)
Single pulse
tp
0.0
1.E-02
0.3
δ = 0.2
0.2
δ = 0.1
T
0.1
Single pulse
tp(s)
δ=tp/T
tp
0.0
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
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Characteristics
Figure 9.
STPS2150
Reverse leakage current versus
reverse voltage applied (typical
values)
Figure 10. Junction capacitance versus
reverse voltage applied (typical
values)
IR(µA)
C(pF)
1.E+04
1000
F=1MHz
VOSC=30mVRMS
Tj=25°C
Tj=150°C
1.E+03
Tj=125°C
1.E+02
Tj=100°C
1.E+01
100
Tj=75°C
Tj=50°C
1.E+00
Tj=25°C
1.E-01
VR(V)
VR(V)
10
1.E-02
0
25
50
75
100
125
1
150
10
100
1000
Figure 11. Forward voltage drop versus
Figure 12. Forward voltage drop versus
forward current - maximum values,
forward current - maximum values,
high level
low level
IFM(A)
IFM(A)
2.0
100
Tj=125°C
(maximum values)
1.8
Tj=125°C
(maximum values)
1.6
1.4
Tj=125°C
(typical values)
Tj=125°C
(typical values)
1.2
Tj=25°C
(maximum values)
1.0
10
Tj=25°C
(maximum values)
0.8
0.6
0.4
0.2
VFM(V)
0.0
VFM(V)
1
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
Figure 14. Thermal resistance versus lead
length (DO-15)
Figure 13. Thermal resistance junction to
ambient versus copper surface
under each lead - Epoxy printed
circuit board FR4, eCu = 35 µm
(SMA)
Rth(j-a)(°C/W)
Rth(°C/W)
140
120
Rth(j-a)
120
100
100
80
80
60
60
Rth(j-I)
40
40
20
20
Lleads(mm)
SCu(cm²)
0
0
0
4/7
1
2
3
4
5
5
10
15
20
25
STPS2150
2
Package information
Package information
Band shows cathode. Epoxy meets UL94, V0.
Table 4.
SMA Package dimensions
DIMENSIONS
E1
REF.
D
Millimeters
Inches
Min.
Max.
Min.
Max.
A1
1.90
2.03
0.075
0.080
A2
0.05
0.20
0.002
0.008
b
1.25
1.65
0.049
0.065
c
0.15
0.41
0.006
0.016
E
4.80
5.60
0.189
0.220
E1
3.95
4.60
0.156
0.181
D
2.25
2.95
0.089
0.116
L
0.75
1.60
0.030
0.063
E
A1
A2
C
L
b
Figure 15. SMA Foot Print Dimensions (in mm)
1.87
1.75
1.87
1.67
5.49
Table 5.
DO-15 Package dimensions
DIMENSIONS
C
A
D
B
C
REF.
Millimeters
Inches
Min.
Max.
Min.
Max.
A
6.05
6.75
0.238 0.266
B
2.95
3.53
0.116 0.139
C
26
31
1.024 1.220
D
0.71
0.88
0.028 0.035
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
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Ordering information
3
4
6/7
STPS2150
Ordering information
Ordering type
Marking
Package
Weight
Base qty
Delivery mode
STPS2150A
2150
SMA
0.068 g
5000
Tape and reel
STPS2150
STPS2150
DO-15
0.4 g
2000
Ammopack
STPS2150RL
STPS2150
DO-15
0.4 g
5000
Tape and reel
Revision history
Date
Revision
Description of Changes
Jul-2003
3A
Aug-2004
4
SMA package dimensions update. Reference A1 max. changed
from 2.70mm (0.106inc.) to 2.03mm (0.080).
31-May-2006
5
Reformatted to current standard. Added ECOPACK statement.
Updated SMA footprint in Figure 15. Changed nF to pF in Figure 10.
Last update.
STPS2150
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