STPS2L60-Y Automotive power Schottky rectifier Features ■ AEC-Q101 qualified ■ Negligible switching losses ■ Low forward voltage drop ■ Surface mount miniature package ■ Avalanche capability specified ■ ECOPACK®2 compliant component A K SMA STPS2L60AY Description Table 1. This power Schottky rectifier is suited to switched mode power supplies and high frequency DC to DC converters for automative applications. Packaged in SMA, this device is especially intended for use in low voltage, high frequency inverters and small battery chargers. November 2011 Doc ID 018927 Rev 1 Device summary Symbol Value IF(AV) 2A VRRM 60 V Tj (max) 150 °C VF(max) 0.55 V 1/7 www.st.com 7 Characteristics 1 STPS2L60-Y Characteristics Table 2. Absolute ratings (limiting values) Symbol Unit Repetitive peak reverse voltage 60 V IF(RMS) Forward rms voltage 10 A IF(AV) Average forward current TL = 115 °C δ = 0.5 2 A IFSM Surge non repetitive forward current tp =10 ms sinusoidal 75 A PARM Repetitive peak avalanche power tp = 1 µs Tj = 25 °C 1600 W -65 to +150 °C -40 to +150 °C 10000 V/µs Value Unit 25 °C/W Storage temperature range Tj Operating junction temperature range dV/dt Critical rate of rise of reverse voltage (1) 1 dPtot < condition to avoid thermal runaway for a diode on its own heatsink Rth(j-a) dTj Table 3. Thermal resistance Symbol Rth(j-l) Table 4. Symbol IR(1) Test conditions Junction-lead Static electrical characteristics Parameter Reverse leakage current Test conditions Tj = 25 °C Tj = 100 °C Tj = 25 °C VF(1) Forward voltage drop Tj = 125 °C Tj = 25 °C Tj = 125 °C Min. VR = VRRM Typ. 2 Max. Unit 100 µA 10 mA 0.60 IF = 2 A 0.51 0.55 V 0.77 IF = 4 A 1. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.43 x IF(AV) + 0.06 IF2(RMS) 2/7 Value VRRM Tstg 1. Parameter Doc ID 018927 Rev 1 0.62 0.67 STPS2L60-Y Figure 1. Characteristics Average forward power dissipation Figure 2. versus average forward current Average forward current versus ambient temperature (δ = 0.5) IF(AV)(A) PF(AV)(W) 2.2 1.4 δ = 0.1 1.3 δ = 0.2 Rth(j-a)=Rth(j-I) δ = 0.5 2.0 δ = 0.05 1.2 1.8 1.1 1.6 δ=1 1.0 0.9 1.4 0.8 1.2 Rth(j-a)=100°C/W 0.7 1.0 0.6 0.8 0.5 0.4 0.6 T 0.3 T 0.4 0.2 δ=tp/T IF(AV)(A) 0.1 δ=tp/T 0.2 tp 0.0 tp Tamb(°C) 0.0 0.0 0.2 0.4 Figure 3. 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 Normalized avalanche power derating versus pulse duration 0 25 Figure 4. PARM(tp) PARM(1µs) 50 75 100 125 150 Normalized avalanche power derating versus junction temperature PARM(Tj) PARM(25°C) 1 1.2 1 0.1 0.8 0.6 0.4 0.01 0.2 Tj(°C) tp(µs) 0.001 0.01 0.1 Figure 5. 1 0 10 100 25 1000 Non repetitive surge peak forward current versus overload duration (maximum values) 50 Figure 6. 75 100 125 150 Relative variation of thermal impedance junction to ambient versus pulse duration Zth(j-l)/Rth(j-l) IM(A) 10 1.0 9 0.9 8 0.8 7 0.7 Epoxy printed circuit board FR4, copper thickness: 35 µm 0.6 6 Ta=25°C 0.5 5 4 Ta=75°C 2 1 IM Ta=125°C t 0.2 0.1 t(s) δ=0.5 0 1.E-03 0.4 0.3 3 Single pulse tp(s) 0.0 1.E-02 1.E-01 1.E+00 1.E-04 Doc ID 018927 Rev 1 1.E-03 1.E-02 1.E-01 1.E+00 3/7 Characteristics Figure 7. STPS2L60-Y Reverse leakage current versus reverse voltage applied (typical values) Figure 8. IR(µA) Junction capacitance versus reverse voltage applied (typical values) C(pF) 1.E+05 1000 F=1MHz VOSC=30mV Tj=25°C Tj=150°C 1.E+04 Tj=125°C Tj=100°C 1.E+03 100 Tj=75°C 1.E+02 Tj=50°C Tj=25°C 1.E+01 VR(V) VR(V) 10 1.E+00 0 10 Figure 9. 20 30 40 50 1 60 Forward voltage drop versus forward current (maximum values, low level) 10 100 Figure 10. Thermal resistance junction to ambient versus copper surface under each lead Rth(j-a)(°C/W) IFM(A) 130 10 Epoxy printed circuit board FR4, copper thickness: 35 µm 120 Tj=125°C (maximum values) 9 110 8 100 90 7 80 Tj=125°C (typical values) 6 70 5 60 Tj=25°C (maximum values) 4 50 40 3 30 2 20 1 VFM(V) 0 0.0 4/7 S(Cu)(cm²) 10 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0.0 0.5 Doc ID 018927 Rev 1 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 STPS2L60-Y 2 Package information Package information ● Epoxy meets UL94, V0 ● Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 5. SMA dimensions Dimensions Ref. Millimeters Inches E1 D Min. Max. Min. Max. A1 1.90 2.45 0.075 0.094 A2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.006 0.016 D 2.25 2.90 0.089 0.114 E 4.80 5.35 0.189 0.211 E1 3.95 4.60 0.156 0.181 L 0.75 1.50 0.030 0.059 E A1 A2 C L b Figure 11. Footprint, dimensions in mm (inches) 1.4 2.63 1.4 (0.055) (0.103) (0.055) 1.64 (0.064) 5.43 (0.214) Doc ID 018927 Rev 1 5/7 Ordering information 3 Ordering information Table 6. 4 Ordering information Order code Marking Package Weight STPS2L60AY S26Y SMA 0.068 g Base qty Delivery mode Revision history Table 7. 6/7 STPS2L60-Y Document revision history Date Revision 02-Nov-2011 1 Changes Initial release. Doc ID 018927 Rev 1 5000 Tape and reel STPS2L60-Y Please Read Carefully: Information in this document is provided solely in connection with ST products. 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