TPIC9201 MICROCONTROLLER POWER SUPPLY AND MULTIPLE LOW-SIDE DRIVER www.ti.com SLIS115B – APRIL 2005 – REVISED JUNE 2006 FEATURES APPLICATIONS • • • • • • • • • • • Eight Low-Side Drivers With Internal Clamp for Inductive Loads and Current Limiting for Self Protection – Seven Outputs Rated at 150 mA and Controlled Through Serial Interface – One Output Rated at 150 mA and Controlled Through Serial Interface and Dedicated Enable Pin 5-V ±5% Regulated Power Supply With 200-mA Load Capability at VIN Max of 18 V Internal Voltage Supervisory for Regulated Output Serial Communications for Control of Eight Low-Side Drivers Enable/Disable Input for OUT1 5-V or 3.3-V I/O Tolerant for Interface to Microcontroller Programmable Power-On Reset Delay Before RST Asserted High, Once 5 V Is Within Specified Range (6 ms Typ) Programmable Deglitch Timer Before RST Is Asserted Low (40 µs Typ) Zero-Voltage Detection Signal With Built-In Filter of 20 µs Thermal Shutdown for Self Protection • Electrical Appliances – Air Conditioning Units – Ranges – Dishwashers – Refrigerators – Microwaves – Washing Machines General-Purpose Interface Circuits, Allowing Microcontroller Interface to Relays, Electric Motors, LEDs, and Buzzers N OR PWP PACKAGE (TOP VIEW) ZVS OUT1 OUT2 OUT3 OUT4 OUT5 OUT6 OUT7 OUT8 GND 1 20 2 19 3 4 18 17 5 16 6 15 7 14 8 9 13 12 10 11 SYN VIN 5VOUT SCLK NCS MOSI RST RDELAY EN1 GND DESCRIPTION/ORDERING INFORMATION The power supply provides regulated 5-V output to power the system microcontroller and drive eight low-side switches. The AC zero-detect circuitry is monitoring the crossover voltage of the mains AC supply. The resultant signal is a low-frequency clock output on the ZVS terminal, based on the AC-line cycle. This information allows the microcontroller to reduce in-rush current by powering loads on the AC-line peak voltage. A serial communications interface controls the eight low-side outputs; each output has an internal snubber circuit to absorb the energy in the inductor at turn OFF. Alternatively, the system can use a fly-back diode to VIN to help recirculate the energy in an inductive load at turn OFF. ORDERING INFORMATION TA PACKAGE PDIP – N –40°C to 125°C PowerPAD™ – PWP ORDERABLE PART NUMBER Tube of 20 TPIC9201N Reel of 2000 TPIC9201PWPR Tube of 70 TPIC9201PWP TOP-SIDE MARKING TPIC9201 IC9201 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPAD is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2005–2006, Texas Instruments Incorporated TPIC9201 MICROCONTROLLER POWER SUPPLY AND MULTIPLE LOW-SIDE DRIVER www.ti.com SLIS115B – APRIL 2005 – REVISED JUNE 2006 PINOUT CONFIGURATION (1) (2) 2 NO. NAME I/O 1 ZVS O Zero-voltage synchronization DESCRIPTION 2 OUT1 O Low-side output 1 3 OUT2 O Low-side output 2 4 OUT3 O Low-side output 3 5 OUT4 O Low-side output 4 6 OUT5 O Low-side output 5 7 OUT6 O Low-side output 6 8 OUT7 O Low-side output 7 9 OUT8 O Low-side output 8 10 (1) GND I Ground 11 (1) GND I Ground 12 EN1 I Enable/disable for OUT1 13 RDELAY O Power-up reset delay 14 (2) RST I/O Power-on reset output (open drain, active low) 15 MOSI I Serial data input 16 NCS I Chip select 17 SCLK I Serial clock for data synchronization 18 5VOUT O Regulated output 19 VIN I Unregulated input voltage source 20 SYN I AC zero detect input Terminals 10 and 11 are fused internally in the lead frame for the 20-pin PDIP package. Terminal 14 can be used as an input or an output. Submit Documentation Feedback TPIC9201 MICROCONTROLLER POWER SUPPLY AND MULTIPLE LOW-SIDE DRIVER www.ti.com SLIS115B – APRIL 2005 – REVISED JUNE 2006 FUNCTIONAL BLOCK DIAGRAM OUT1 EN1 OUT1 Enables OUT1 Enable 100 kW OUT1 at 150 mA 6V Gate Control for Outputs 1 Through 8 100 kW OUT2 OUT2 OUT2 at 150 mA OUT3 OUT3 at 150 mA NCS OUT3 OUT4 NCS OUT4 at 150 mA Parallel Register OUT4 OUT5 OUT5 at 150 mA OUT5 OUT6 OUT6 at 150 mA SCLK SCLK MOSI 100 kW MOSI 20 W (2 W) VIN 10 V OUT6 OUT7 Serial Register OUT7 at 150 mA OUT7 OUT8 OUT8 at 150 mA OUT8 100 kW 7–18 V PMOS Optional, dependent on heat-management implementation (see Note A) GND 5VOUT Gate Drive and Control Bandgap Ref Comp GND 5V – + Vref 5 kΩ Vref Voltage Supervisor RST RST Iconst 6V RDELAY RDELAY 20-μs Filter SYN SYN 10 kΩ A. 25 kΩ S 500 kΩ Q 100 kΩ ZVS ZVS R The resistor and Zener diode are required if there is insufficient thermal-management allocation. Submit Documentation Feedback 3 TPIC9201 MICROCONTROLLER POWER SUPPLY AND MULTIPLE LOW-SIDE DRIVER www.ti.com SLIS115B – APRIL 2005 – REVISED JUNE 2006 DETAILED DESCRIPTION The 5-V regulator is powered from VIN, and the regulated output is within 5 V ±5% over the operating conditions. The open-drain power-on reset (RST) pin remains low until the regulator exceeds the set threshold, and the timer value set by the capacitor on the reset delay (RDELAY) pin expires. If both of these conditions are satisfied, RST is asserted high. This signifies to the microcontroller that serial communications can be initiated to the TPIC9201. The serial communications is an 8-bit format, with data transfer synchronized using a serial clock from the microcontroller. A single register controls all the outputs (one bit per output). The default value is zero (OFF). If an output requires pulse width modulation (PWM) function, the register must be updated at a rate faster than the desired PWM frequency. OUT1 can be controlled by serial input from the microcontroller or with the dedicated enable (EN1) pin. If EN1 is pulled low or left open, the serial input through the shift register controls OUT1. If EN1 is pulled high, OUT1 always is turned on, and the serial input for OUT1 is ignored. The SYN input translates the image of the mains voltage through the secondary of the transformer. The SYN input has a resistor to protect from high currents into the IC. The zero-voltage synchronization output translates the AC-line cycle frequency into a low-frequency clock, which can be used for a timing reference and to help power loads on the AC-line peak voltage (to reduce in-rush currents). If RST is asserted, all outputs are turned OFF internally, and the input register is reset to all zeroes. The microcontroller must write to the register to turn the outputs ON again. 4 Submit Documentation Feedback TPIC9201 MICROCONTROLLER POWER SUPPLY AND MULTIPLE LOW-SIDE DRIVER www.ti.com SLIS115B – APRIL 2005 – REVISED JUNE 2006 Absolute Maximum Ratings (1) MIN MAX VIN 24 SYN 24 UNIT VI(unreg) Unregulated input voltage (2) (3) VI(logic) Logic input voltage (2) (3) VO Low-side output voltage OUT1–OUT8 16.5 V ILIMIT Output current limit (4) OUTn = ON and shorted to VIN with low impedance 350 mA θJA Thermal impedance, junction to ambient (5) θJC Thermal impedance, junction to case (5) θJP Thermal impedance, junction to thermal pad (5) PD Continuous power dissipation (6) ESD Electrostatic discharge (7) TA Operating ambient temperature range Tstg Storage temperature range Tlead Lead temperature (1) (2) (3) (4) (5) (6) (7) EN1, MOSI, SCLK, and NCS 7 RST and RDELAY 7 N package 69 PWP package 33 N package 54 PWP package 20 PWP package 1.4 N package 1.8 PWP package 3.7 V V °C/W °C/W °C/W W 2 kV –40 125 °C –65 125 °C 260 °C Soldering, 10 s Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to GND. Absolute negative voltage on these pins must not go below –0.5 V. Not more than one output should be shorted at a time, and duration of the short circuit should not exceed 1 ms. The thermal data is based on using 1-oz copper trace with JEDEC 51-5 test board for PWP and JEDEC 51-7 test board for N. The data is based on ambient temperature of 25°C max. The Human-Body Model is a 100-pF capacitor discharged through a 1.5-kΩ resistor into each pin. Dissipation Ratings PACKAGE TA ≤ 25°C POWER RATING DERATING FACTOR ABOVE TA = 25°C TA = 125°C POWER RATING N 1812 mW 14.5 mW/°C 362 mW PWP 3787 mW 30.3 mW/°C 757 mW Recommended Operating Conditions VI(unreg) Unregulated input voltage VI(logic) Logic input voltage TA Operating ambient temperature MIN MAX VIN 7 18 SYN 0 18 0 5.25 V –40 125 °C EN1, MOSI, SCLK, NCS, RST, and RDELAY Submit Documentation Feedback UNIT V 5 TPIC9201 MICROCONTROLLER POWER SUPPLY AND MULTIPLE LOW-SIDE DRIVER www.ti.com SLIS115B – APRIL 2005 – REVISED JUNE 2006 Electrical Characteristics TA = –40°C to 125°C, VIN = 7 V to 18 V (unless otherwise stated) PARAMETER TEST CONDITIONS MIN TYP (1) MAX UNIT Supply Voltage and Current VIN (2) Input voltage IVIN Input supply current 7 18 Enable = ON, OUT1–OUT8 = OFF 3 Enable = ON, OUT1–OUT8 = ON 5 V mA Logic Inputs (MOSI, NCS, SCLK, and EN1) VIL Logic input low level IIL = 100 µA VIH Logic input high level IIL = 100 µA VOL Logic level output IOL = 1.6 mA VOH (3) Logic level output 5-kΩ pullup to VCC VH Disabling reset threshold 5-V regulator ramps up VL Enabling reset threshold 5-V regulator ramps down VHYS Threshold hysteresis 0.8 2.4 V Reset (RST) 0.4 VCC – 0.8 V V 4.25 4.5 V 3.3 3.75 V 0.12 0.5 V 18 28 Reset Delay (RDELAY) Output current TDW Reset delay timer C = 47 nF 6 ms TUP Reset capacitor to low level C = 47 nF 45 µs 0.4 3 48 µA IOUT Output (OUT1–OUT8) VOL Output ON IOUTn = 150 mA IOH Output leakage VOH = Max of 16.5 V 0.7 V 2 µA 5.25 V Regulator Output (5VOUT) 5VOUT Output supply I5VOUT = 5 mA to 200 mA, VIN = 7 V to 18 V, C5VOUT = 1 µF 4.75 I5VOUT limit Output short-circuit current 5VOUT = 0 V 200 5 mA Thermal Shutdown TSD Thermal shutdown THYS Hysteresis 150 °C 20 °C Zero Voltage Synchronization (ZVS) VSYNTH Transition threshold ISYN Input activating current RZV = 10 kΩ, VSYN = 24 V tD Transition filtering time Rising and falling (1) (2) (3) 6 All typical values are at TA = 25°C. There are external high-frequency noise-suppression capacitors and filter capacitors on VIN. VCC is the pullup resistor voltage. Submit Documentation Feedback 0.4 0.75 1.1 V 2 mA 10 30 70 µs TPIC9201 MICROCONTROLLER POWER SUPPLY AND MULTIPLE LOW-SIDE DRIVER www.ti.com SLIS115B – APRIL 2005 – REVISED JUNE 2006 Output Control Register MSB LSB IN8 IN7 IN6 IN5 IN4 IN3 IN2 IN1 0 0 0 0 0 0 0 0 INn = 0: Output OFF INn = 1: Output ON To operate the output in PWM mode, the output control register must be updated at a rate twice the desired PWM frequency of the output. Maximum PWM frequency is 5 kHz. The register is updated every 100 µs. ENABLE TRUTH TABLE EN1 SERIAL INPUT FOR OUT1 OUT1 Open H On Open L Off L H On L L Off H H On H L On Submit Documentation Feedback 7 TPIC9201 MICROCONTROLLER POWER SUPPLY AND MULTIPLE LOW-SIDE DRIVER www.ti.com SLIS115B – APRIL 2005 – REVISED JUNE 2006 Serial Communications Interface The serial communications is an 8-bit format, with data transfer synchronized using a serial clock from the microcontroller (see Figure 1). A single register controls all the outputs. The signal gives the instruction to control the output of TPIC9201. The NCS signal enables the SCLK and MOSI data when it is low. After NCS is set low for T1, synchronization clock and data begin to transmit and, after the 8-bit data has been transmitted, NCS is set high again to disable SCLK and MOSI and transfer the serial data to the control register. SCLK must be held low when NCS is in the high state. T2 T3 T8 T1 T4 T5 NCS SCLK 1 2 3 4 5 6 7 LSB MSB MOSI XXX IN8 IN7 IN6 IN5 IN4 IN3 IN2 T6 T7 Figure 1. Serial Communications 8 8 Submit Documentation Feedback IN1 T1 TPIC9201 MICROCONTROLLER POWER SUPPLY AND MULTIPLE LOW-SIDE DRIVER www.ti.com SLIS115B – APRIL 2005 – REVISED JUNE 2006 Timing Requirements TA = –40°C to 125°C, VIN = 7 V to 18 V (unless otherwise stated) PARAMETER MIN TYP 4 MAX UNIT fSPI SPI frequency T1 Delay time, NCS falling edge to SCLK rising edge 10 kHz ns T2 Delay time, NCS falling edge to SCLK falling edge 80 ns T3 Pulse duration, SCLK high 60 ns T4 Pulse duration, SCLK low 60 ns T5 Delay time, last SCLK falling edge to NCS rising edge 80 ns T6 Setup time, MOSI valid before SCLK edge 10 ns T7 Hold time, MOSI valid after SCLK edge 10 ns T8 Time between two words for transmitting 170 ns Reset Delay (RDELAY) The RDELAY output provides a constant current source to charge an external capacitor to approximately 6.5 V. The external capacitor is selected to provide a delay time, based on the current equation for a capacitor, I = C(∆v/∆t) and a 28-µA typical output current. Therefore, the user should select a 47-nF capacitor to provide a 6-ms delay at 3.55 V. I = C(∆v/∆t) 28 µA = C × (3.55 V/6 ms) C = 47 nF Submit Documentation Feedback 9 TPIC9201 MICROCONTROLLER POWER SUPPLY AND MULTIPLE LOW-SIDE DRIVER www.ti.com SLIS115B – APRIL 2005 – REVISED JUNE 2006 APPLICATION INFORMATION Buzzer Driver Relay Driver Relay Driver Relay Driver Relay Driver Fan Driver Fan Driver Fan Driver MOSI SCLK MCU/DSP NCS 8 Outputs ZVS TPIC9201 RST 5VOUT ±5% at 200 mA SYN (AC Zero-Cross Detect Input) EN1 Reset Delay DC Input 7 V to 18 V GND (´2) Figure 2. Typical Application Display (LED/LCD/VFD) AC Keypad LED LED Water Supply Valve Filters Water Outlet Softener Supply Volume Sensor M Power Switch Controller Water-Level Sensor Driver Optical Sensor SYN VIN + ~ ZVS Zero-Cross Detection 5VOUT Regulator ~ POR/SYS RST - Cover Switch TPIC9201 Figure 3. Washing-Machine Application 10 Temperature Sensor (Optional) Submit Documentation Feedback TPIC9201 MICROCONTROLLER POWER SUPPLY AND MULTIPLE LOW-SIDE DRIVER www.ti.com SLIS115B – APRIL 2005 – REVISED JUNE 2006 APPLICATION INFORMATION (continued) PCB Layout To maximize the efficiency of this package for application on a single-layer or multi-layer PCB, certain guidelines must be followed when laying out this part on the PCB. The following information is to be used as a guideline only. For further information, see the PowerPAD concept implementation document. Application Using a Multilayer PCB In a multilayer board application, the thermal vias are the primary method of heat transfer from the package thermal pad to the internal ground plane (see Figure 4 and Figure 5). The efficiency of this method depends on several factors: die area, number of thermal vias, thickness of copper, etc. (see the PowerPAD™ Thermally Enhanced Package Technical Brief, literature number SLMA002). Solder Pad (Land Pattern) Package Thermal Pad Thermal Vias Package Outline Figure 4. Package and PCB Land Configuration for a Multilayer PCB Power Pad Package Solder Pad Component Traces 1.5038–1.5748-mm Component Trace (2-oz Cu) 2 Plane 4 Plane 1.5748 mm Thermal Via Thermal Isolation Power Plane Only 1.0142–1.0502-mm Ground Plane (1-oz Cu) 0.5246–0.5606-mm Power Plane (1-oz Cu) 0.0–0.071-mm Board Base and Bottom Pad Package Solder Pad (Bottom Trace) Figure 5. Multilayer Board (Side View) Submit Documentation Feedback 11 TPIC9201 MICROCONTROLLER POWER SUPPLY AND MULTIPLE LOW-SIDE DRIVER www.ti.com SLIS115B – APRIL 2005 – REVISED JUNE 2006 APPLICATION INFORMATION (continued) Application Using a Single-Layer PCB In a single-layer board application, the thermal pad is attached to a heat spreader (copper area) by using the low thermal-impedance attachment method (solder paste or thermal-conductive epoxy). With either method, it is advisable to use as much copper trace area as possible to dissipate the heat. CAUTION: If the attachment method is not implemented correctly, the functionality of the product cannot be assured. Power-dissipation capability is adversely affected if the device is incorrectly mounted onto the circuit board. Use as Much Copper Area as Possible for Heat Spread Package Thermal Pad Package Outline Figure 6. Layout Recommendations for a Single-Layer PCB 12 Submit Documentation Feedback TPIC9201 MICROCONTROLLER POWER SUPPLY AND MULTIPLE LOW-SIDE DRIVER www.ti.com SLIS115B – APRIL 2005 – REVISED JUNE 2006 APPLICATION INFORMATION (continued) Recommended Board Layout 6,5 SMOC 5,85 SMOC = Solder Mask Over Copper SMO = Solder Mask Opening 8) 3 (´ 1 1,2 (´20) 1 2,4 SMO 3,4 SMOC 4,52 6,92 0,3 0,65 0,27 (´20) 3,7 SMO Figure 7. Recommended Board Layout for PWP Submit Documentation Feedback 13 PACKAGE OPTION ADDENDUM www.ti.com 12-Sep-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TPIC9201N ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TPIC9201NE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TPIC9201PWP ACTIVE HTSSOP PWP 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1YEAR TPIC9201PWPG4 ACTIVE HTSSOP PWP 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1YEAR TPIC9201PWPR ACTIVE HTSSOP PWP 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1YEAR TPIC9201PWPRG4 ACTIVE HTSSOP PWP 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1YEAR Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. 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