STMICROELECTRONICS X0202NUF

X02
1.25 A sensitive gate SCR
Features
A
■
on-state rms current: 1.25 A
■
repetitive peak off-state voltage: 600 V and
800 V
■
G
K
gate triggering current: 50 and 200 µA
A
Applications
ground fault circuit interrupters
■
overvoltage crowbar protection in power
supplies
■
A
G
■
A
K
K
TO-92
X02xxA
SOT-223
X02xxN
capacitive ignition circuits
Description
A
The X02 SCR can be used as the on/off function
in applications where topology does not offer high
current for gate triggering.
K
G
This device is optimized in forward voltage drop
and inrush current capabilities for reduced power
losses and high reliability in harsh environments.
Table 1.
G
SMBflat-3L
X0202NUF
Device summary
Voltage
Order code
600 V
Sensitivity µA
Package
800 V
X0202MA
Y
200
TO-92
X0202MN
Y
200
SOT-223
X0202NA
Y
200
TO-92
X0202NN
Y
200
SOT-223
50
TO-92
X0205MA
Y
X0205NA
Y
50
TO-92
X0202NUF
Y
200
SMBflat-3L
January 2011
Doc ID 7480 Rev 4
1/11
www.st.com
11
Characteristics
X02
1
Characteristics
Table 2.
Absolute ratings (limiting values, TJ = 25 °C unless otherwise specified)
Symbol
IT(RMS)
Parameter
On-state rms current (180 °Conduction angle)
TO-92
TL = 63 °C
SOT-223
Ttab = 99 °C
Value
Unit
1.25
A
0.8
A
SMBflat-3L Ttab = 111 °C
IT(AV)
Average on-state current (180 °Conduction angle)
TO-92
TL = 63 °C
SOT-223
Ttab = 99 °C
SMBflat-3L Ttab = 111 °C
ITSM
I²t
tp = 8.3 ms
Non repetitive surge peak on-state current
tp = 10 ms
25
Tj = 25 °C
A
22.5
I²t Value for fusing
tp = 10 ms
Tj = 25 °C
2.5
A2s
di/dt
Critical rate of rise of on-state current
IG = 2 x IGT , tr ≤ 100 ns
F = 60 Hz
Tj = 125 °C
50
A/µs
IGM
Peak gate current
tp = 20 µs
Tj = 125 °C
1.2
A
Tj = 125 °C
0.2
W
- 40 to + 150
- 40 to + 125
°C
PG(AV)
Tstg
Tj
Average gate power dissipation
Storage junction temperature range
Operating junction temperature range
Table 3.
Electrical characteristics (TJ = 25 °C unless otherwise specified)
Symbol
Test conditions
X0202
X0205
Min.
IGT
Unit
20
µA
VD = 12 V, RL = 140 Ω
Max.
VGT
50
Max.
0.8
V
Min.
0.1
V
VGD
VD = VDRM, RL = 3.3 kΩ , RGK = 1 kΩ
VRG
IRG = 10 µA
Min.
8
V
IH
IT = 50 mA, RGK = 1 kΩ
Max.
5
mA
IL
IG = 1 mA, RGK = 1 kΩ
Max.
6
mA
dV/dt
Table 4.
VD = 67% VDRM, RGK = 1 kΩ
2/11
Tj = 110 °C
Min.
10
15
V/µs
X0202
X0205
Unit
Static electrical characteristics
Symbol
Test conditions
VTM
ITM = 2.5 A, tp = 380 µs
VTO
Threshold voltage
Rd
Dynamic resistance
IDRM IRRM
Tj = 125 °C
200
VDRM = VRRM, RGK = 1 kΩ
Tj = 25 °C
1.45
V
0.9
V
200
mΩ
Tj = 25 °C
5
µA
Tj = 125 °C
500
µA
Tj = 125 °C
Doc ID 7480 Rev 4
Max.
X02
Characteristics
Table 5.
Thermal resistances
Symbol
Parameter
Value
Rth(j-l)
Junction to leads (DC)
TO-92
60
Rth(j-t)
Junction to tab (DC)
SOT-223
25
Rth(j-t)
Junction to tab (DC)
SMBflat-3L
Junction to ambient (DC)
Figure 1.
1.2
14
Max.
Rth(j-a)
S = 5 cm2
Maximum average power
dissipation versus average
on-state current (full cycle)
Figure 2.
P(W)
1.4
°C/W
TO-92
150
SOT-223
60
SMBflat-3L
75
Average and DC on-state current
versus tab (SOT-223, SMBflat-3L) or
lead (TO-92) temperature
IT(AV)(A)
D.C. (SMBflat-3L)
360°
α = 180°
1.2
D.C. (TO-92)
1.0
D.C. (SOT-223)
1.0
α
0.8
Unit
0.8
α = 180° (TO-92)
0.6
0.6
0.4
IT(AV)(A)
0.0
0.2
α = 180° (SMBflat-3L)
Tlead or Ttab (°C)
0.0
0
0.1
Figure 3.
1.4
α = 180° (SOT-223)
0.4
0.2
0.2
0.3
0.4
0.5
0.6
0.7
0.8
Average and DC on-state current
versus ambient temperature
0
Figure 4.
25
50
75
100
125
Relative variation of thermal
impedance junction to ambient
versus pulse duration
K=[Zth(j-a)/Rth(j-a)]
IT(AV)(A)
1.00
1.2
TO-92
D.C. (SOT-223)
SMBflat-3L
D.C. (SMBflat-3L)
1.0
0.8
D.C. (TO-92)
0.10
0.6
SOT-223
α = 180° (TO-92)
0.4
α = 180° (SOT-223)
0.2
α = 180° (SMBflat-3L)
Tamb(°C)
tp(s)
0.0
0
25
50
75
100
125
0.01
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 1.E+04 1.E+05
Doc ID 7480 Rev 4
3/11
Characteristics
Figure 5.
X02
Relative variation of triggering,
Figure 6.
holding and latching current versus
junction temperature
Relative variation of holding
current versus gate-cathode
resistance (typical values)
IGT,IH,IL[Tj] / IGT,IH,IL[Tj=25°C]
1.50
IH[RGK] / IH[RGK=1kΩ]
Typical values
4.0
1.25
Tj=25
3.5
3.0
1.00
2.5
0.75
IH & IL
RGK = 1kΩ
2.0
1.5
0.50
1.0
IGT
0.5
0.25
0.00
-40
-20
Figure 7.
0
20
40
RGK(kΩ)
0.0
1.E-02
Tj(°C)
60
80
100
120
1.E-01
1.E+00
1.E+01
140
Relative variation of dV/dt immunity Figure 8.
versus gate-cathode resistance
(typical values)
Relative variation of dV/dt immunity
versus gate-cathode capacitance
(typical values)
dV/dt[CGK] / dV/dt[RGK=1kΩ]
dV/dt[RGK] / dV/dt[RGK=1kΩ]
20
10.0
VD = 0.67 x VDRM
Tj = 125°C
RGK = 1kΩ
18
Tj = 125°C
VD = 0.67 x VDRM
16
14
12
10
1.0
8
6
4
2
RGK(kΩ)
CGK(nF)
0
0.1
0.0
0.2
Figure 9.
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
Surge peak on-state current
versus number of cycles
0
2
4
6
8
10
12
14
16
18
20
22
Figure 10. Non repetitive surge peak on state
current for a sinusoidal pulse and
corresponding value of I2T
ITSM(A), I2t (A2s)
ITSM(A)
25
300
20
100
Tj initial = 25°C
tp=10ms
dI/dt limitation
ITSM
One cycle
15
Non repetitive
Tj initial=25°C
10
10
Repetitive
Tamb=25°C
5
I2t
Number of cycles
1
4/11
tp(ms)
1
0
10
100
1000
0.01
Doc ID 7480 Rev 4
0.10
1.00
10.00
X02
Ordering information scheme
Figure 11. On-state characteristics (maximum Figure 12. Thermal resistance junction to
values)
ambient versus copper surface
under tab (SOT-223, SMBflat-3L)
ITM(A)
170
160
150
140
130
120
110
100
90
80
70
60
50
3E+1
Tj max.:
Vt0=0.9V
Rd=200mΩ
1E+1
Tj=max
1E+0
Tj=25°C
VTM(V)
1E-1
0.5
2
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
Rth(j-a)(°C/W)
Epoxy printed circuit board FR4,
copper thickness 35 µm
SMBF3L (typical)
SOT-223
(maximum)
S(cm²)
0
1
2
3
4
5
Ordering information scheme
Figure 13. Ordering information scheme
X 02 02 M ZBlank 1BA2
Sensitive SCR series
Current
02 = 1.25 A
Sensitivity
02 = 200 µA
05 = 50 µA
Voltage
M = 600 V
N = 800 V
Package
A = TO-92 (A"Blank")
N = SOT-223 (N"No Blank”)
UF = SMBF3L
Packing mode
1BA2 = Bulk
2BL2 = Ammopack
5BA4 = Tape and reel 7” (SOT-223)
Blank = Tape and reel 13” (SMBflat-3L)
Doc ID 7480 Rev 4
5/11
Package information
3
X02
Package information
●
Epoxy meets UL94, V0
●
Lead-free packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Table 6.
TO-92 dimensions
Dimensions
Ref
Millimeters
Min.
Typ.
Max.
Inches
Min.
Typ.
Max.
A
a
B
A
1.35
B
C
4.70
C
F
6/11
D
E
Doc ID 7480 Rev 4
0.053
0.185
2.54
0.100
D
4.40
0.173
E
12.70
0.500
F
3.70
0.146
a
0.50
0.019
X02
Package information
Table 7.
SOT-223 dimensions
Dimensions
Ref.
V
A
A1
Millimeters
Min.
c
Typ.
A
B
A1
e1
Inches
Max.
Min.
Typ.
Max.
1.80
0.071
0.02
0.10
0.001 0.004
B
0.60
0.70
0.85
0.024 0.027 0.033
B1
2.90
3.00
3.15
0.114 0.118 0.124
c
0.24
0.26
0.35
0.009 0.010 0.014
(1)
6.30
6.50
6.70
0.248 0.256 0.264
D
B1
D
4
H
E
1
2
e
3
2.3
e1
0.090
4.6
0.181
E(1)
3.30
3.50
3.70
0.130 0.138 0.146
H
6.70
7.00
7.30
0.264 0.276 0.287
e
V
10° max
1. Do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15mm (0.006inches)
Figure 14. SOT-223 footprint
3.25
1.32
5.16
7.80
1.32
2.30
Doc ID 7480 Rev 4
0.95
7/11
Package information
Table 8.
X02
SMBflat-3L dimensions
Dimensions
Ref.
A
c
e
D
b 2x
L2 2x
L 2x
L1
E E1
Millimeters
Inches
Min. Typ. Max.
Min.
Typ.
Max.
A
0.90
1.10
0.035
0.043
b
0.35
0.65
0.014
0.026
b4
1.95
2.20
0.07
0.087
c
0.15
0.40
0.006
0.016
D
3.30
3.95
0.130
0.156
E
5.10
5.60
0.201
0.220
E1
4.05
4.60
0.156
0.181
L
0.75
1.50
0.030
0.059
L1
L
L2
b4
L1
0.40
0.016
L2
0.60
0.024
e
1.60
0.063
Figure 15. SMBflat-3L footprint dimensions
5.84
(0.230)
0.51
(0.020)
2.07
(0.082)
2.07
(0.082)
0.51
(0.020)
1.20
(0.047)
3.44
(0.136)
millimeters
(inches)
8/11
Doc ID 7480 Rev 4
1.20
(0.047)
X02
Package information
Figure 16. Footprint and connectors for SOT-223 or SMBflat-3L (dimensions in mm)
5.84
3.42
3.25
1.19
1.32
1.50
2.92
SOT-223
Solder resist
1.35
1.20
1.08
Solder lands
SMBF3L
7.80
2.07
2.22
SMBF3L
1.95
SMBF3L
2.07
0.61
0.51
0.46
1.30
1.20
1.08
Solder paste
1.47
1.32
1.19
Connector line
SOT-223
SOT-223
SOT-223
0.85
0.95
1.10
2.30
Doc ID 7480 Rev 4
9/11
Ordering information
4
Ordering information
Table 9.
5
Ordering information
Order code
Marking
Package
Weight
Base qty
Delivery mode
X0202MA 1BA2
X0202 MA
TO-92
0.2 g
2500
Bulk
X0202MA 2BL2
X0202 MA
TO-92
0.2 g
2000
Ammopack
X0202MN5BA4
X2M
SOT-223
0.12 g
1000
Tape and reel
X0202NA 1BA2
X0202 NA
TO-92
0.2 g
2500
Bulk
X0202NA 2BL2
X0202 NA
TO-92
0.2 g
2000
Ammopack
X0202NN5BA4
X2N
SOT-223
0.12 g
1000
Tape and reel
X0205MA 1BA2
X0205 MA
TO-92
0.2 g
2500
Bulk
X0205MA 2BL2
X0205 MA
TO-92
0.2 g
2000
Ammopack
X0205NA 1BA2
X0205 NA
TO-92
0.2 g
2500
Bulk
X0202NUF
X2N
SMBflat-3L
46.914 mg
5000
Tape and reel
Revision history
Table 10.
10/11
X02
Document revision history
Date
Revision
Changes
Sep-2000
3
Previous issue
14-Jan-2011
4
Added SMBflat-3L package and ECOPACK statement.
Doc ID 7480 Rev 4
X02
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Doc ID 7480 Rev 4
11/11