VN820
High-side driver
Datasheet − production data
Features
Type
RDS(on)
IOUT
VCC
VN820
VN820SP
VN820-B5
VN820PT
40 mΩ
9A
36 V
1
■
Very low standby current
■
CMOS compatible input
■
On-state open-load detection
■
Off-state open-load detection
■
Thermal shutdown protection and diagnosis
■
Undervoltage shutdown
■
Overvoltage clamp
■
Output stuck to VCC detection
■
Load current limitation
■
Reverse battery protection
■
Electrostatic discharge protection
Table 1.
10
PowerSO-10
PPAK
P2PAK
PENTAWATT
Description
The VN820 is a monolithic device designed in
STMicroelectronic's VIPower® M0-3 technology.
The VN820 is intended for driving any type of load
with one side connected to ground. The active
VCC pin voltage clamp protects the device against
low energy spikes.
Active current limitation combined with thermal
shutdown and automatic restart protects the
device against over-load. The device detects the
open-load condition in both the on-state and offstate. In the off-state the device detects if the
output is shorted to VCC. The device automatically
turns off in the case where the ground pin
becomes disconnected.
Device summary
Order codes
Package
Tube
Tape and reel
PENTAWATT
VN820
—
PowerSO-10
VN820SP
VN820SP13TR
P2PAK
VN820-B5
VN820-B513TR
PPAK
VN820PT
VN820PT13TR
June 2012
This is information on a product in full production.
Doc ID 7370 Rev. 5
1/43
www.st.com
1
Contents
VN820
Contents
1
Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2
Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3
2.1
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.2
Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.3
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.4
Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.1
4
5
2/43
GND protection network against reverse battery . . . . . . . . . . . . . . . . . . . 18
3.1.1
Solution 1: resistor in the ground line (RGND only) . . . . . . . . . . . . . . . . 18
3.1.2
Solution 2: diode (DGND) in the ground line . . . . . . . . . . . . . . . . . . . . . 19
3.2
Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.3
MCU I/Os protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.4
Open load detection in off-state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.5
PowerSO-10, P2PAK, PPAK, PENTAWATT maximum demagnetization
energy (VCC = 13.5V) 21
Package and PCB thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
4.1
P2PAK thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
4.2
PPAK thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
4.3
PowerSO-10 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
5.1
ECOPACK® . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
5.2
PENTAWATT mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
5.3
P2PAK mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
5.4
PPAK mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
5.5
PowerSO-10 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
5.6
PENTAWATT packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
5.7
P2PAK packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
5.8
PPAK packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Doc ID 7370 Rev. 5
VN820
Contents
5.9
6
PowerSO-10 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Doc ID 7370 Rev. 5
3/43
List of tables
VN820
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Table 18.
Table 19.
Table 20.
Table 21.
4/43
Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 7
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Switching (VCC=13V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Input pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
VCC output diode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Status pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Open-load detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Electrical transient requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Thermal parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
PENTAWATT mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
P2PAK mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
PPAK mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
PowerSO-10 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Doc ID 7370 Rev. 5
VN820
List of figures
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
Figure 16.
Figure 17.
Figure 18.
Figure 19.
Figure 20.
Figure 21.
Figure 22.
Figure 23.
Figure 24.
Figure 25.
Figure 26.
Figure 27.
Figure 28.
Figure 29.
Figure 30.
Figure 31.
Figure 32.
Figure 33.
Figure 34.
Figure 35.
Figure 36.
Figure 37.
Figure 38.
Figure 39.
Figure 40.
Figure 41.
Figure 42.
Figure 43.
Figure 44.
Figure 45.
Figure 46.
Figure 47.
Figure 48.
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Status timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Switching time waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Off-state output current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
High level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Status leakage current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Status low output voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Status clamp voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
On-state resistance Vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
On-state resistance Vs VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Open load on-state detection threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Input high level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Input low level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Over-voltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Open load off-state voltage detection threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Turn-on voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Ilim Vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Open load detection in off-state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
PowerSO-10, P2PAK, PPAK, PENTAWATT maximum turn-off current versus inductance 21
PC board. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Rthj-amb vs PCB copper area in open box free air condition . . . . . . . . . . . . . . . . . . . . . . . 22
P2PAK thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . 23
Thermal fitting model of a single channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
PC board. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Rthj-amb vs PCB copper area in open box free air condition . . . . . . . . . . . . . . . . . . . . . . . 25
PPAK thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Thermal fitting model of a single channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
PowerSO-10 PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Rthj-amb vs PCB copper area in open box free air condition . . . . . . . . . . . . . . . . . . . . . . . 27
Thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Thermal fitting model of a single channel HSD in PowerSO-10 . . . . . . . . . . . . . . . . . . . . . 28
PENTAWATT package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
P2PAK package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
PPAK package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
PowerSO-10 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
PENTAWATT tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
P2PAK tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
P2PAK tape and reel (suffix “13TR”). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
PPAK suggested pad layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
PPAK tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
PPAK tape and reel (suffix “13TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Doc ID 7370 Rev. 5
5/43
List of figures
Figure 49.
Figure 50.
Figure 51.
6/43
VN820
PowerSO-10 suggested pad layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
PowerSO-10 tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
PowerSO-10 tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Doc ID 7370 Rev. 5
VN820
1
Block diagram and pin description
Block diagram and pin description
Figure 1.
Block diagram
VCC
OVER-VOLTAGE
DETECTION
VCC
CLAMP
UNDER-VOLTAGE
DETECTION
GND
Power CLAMP
DRIVER
INPUT
OUTPUT
LOGIC
CURRENT LIMITER
ON-STATE OPEN LOAD
DETECTION
STATUS
OVER-TEMPERATURE
DETECTION
Figure 2.
OFF-STATE OPEN LOAD
AND OUTPUT SHORTED TO VCC
DETECTION
Configuration diagram (top view)
GROUND
INPUT
6
5
OUTPUT
5
7
4
STATUS
N.C.
N.C.
3
OUTPUT
OUTPUT
4
8
9
2
OUTPUT
2
10
1
OUTPUT
1
3
OUTPUT
STATUS
VCC
INPUT
GND
11
VCC
PPAK / P2PAK / PENTAWATT
PowerSO-10
Table 2.
Suggested connections for unused and not connected pins
Connection / pin
Status
N.C.
Output
Input
Floating
X
X
X
X
To ground
X
Doc ID 7370 Rev. 5
Through 10 KΩ resistor
7/43
Electrical specifications
2
VN820
Electrical specifications
Figure 3.
Current and voltage conventions
IS
VF
IIN
VCC
INPUT
ISTAT
IOUT
STATUS
VCC
OUTPUT
GND
VIN
VSTAT
2.1
VOUT
IGND
Absolute maximum ratings
Stressing the device above the rating listed in theTable 3 may cause permanent damage to
the device. These are stress ratings only and operation of the device at these or any other
conditions above those indicated in the operating sections of this specification is not implied.
Exposure to Absolute maximum rating conditions for extended periods may affect device
reliability.
Table 3.
Absolute maximum ratings
Value
Symbol
Parameter
PowerSO-10
VCC
DC supply voltage
-VCC
PENTAWATT
P2PAK
Unit
PPAK
41
V
Reverse DC supply voltage
- 0.3
V
-Ignd
DC reverse ground pin current
- 200
mA
IOUT
DC output current
Internally limited
A
-IOUT
Reverse DC output current
-9
A
DC input current
+/- 10
mA
ISTAT
DC Status current
+/- 10
mA
VESD
Electrostatic discharge (human body
model: R = 1.5 KΩ; C = 100 pF)
– INPUT
– STATUS
– OUTPUT
– VCC
4000
4000
5000
5000
V
V
V
V
IIN
8/43
Doc ID 7370 Rev. 5
VN820
Table 3.
Electrical specifications
Absolute maximum ratings (continued)
Value
Symbol
Parameter
PowerSO-10
EMAX
Ptot
Unit
PPAK
Maximum switching energy
(L = 1.4 mH; RL = 0 Ω; Vbat = 13.5 V;
Tjstart = 150°C; IL = 13 A)
156
mJ
Power dissipation TC = 25°C
65.8
W
Internally limited
°C
Tj
Junction operating temperature
Tc
Case operating temperature
-40 to 150
°C
Storage temperature
-55 to 150
°C
Tstg
2.2
P2PAK
PENTAWATT
Thermal data
Table 4.
Thermal data
Max. value
Symbol
Parameter
Rthj-case
Thermal resistance
junction-case
Rthj-amb
Thermal resistance
junction-ambient
Unit
PowerSO-10
PENTAWATT
P2PAK
PPAK
1.9
1.9
1.9
1.9
°C/W
51.9(1)
61.9(2)
51.9(2)
76.9(2)
°C/W
-
37(4)
45(4)
°C/W
37
(2)
1. When mounted on a standard single-sided FR-4 board with 0.5 cm2 of Cu (at least 35 µm thick).
2. When mounted on a standard single-sided FR-4 board with 6 cm2 of Cu (at least 35 µm thick).
Doc ID 7370 Rev. 5
9/43
Electrical specifications
2.3
VN820
Electrical characteristics
Values specified in this section are for 8 V < VCC < 36 V; -40°C < Tj < 150°C, unless
otherwise stated.
Table 5.
Symbol
Parameter
Min.
Typ.
VCC
Operating supply voltage
5.5
13
36
V
VUSD
Under-voltage shutdown
3
4
5.5
V
VUSDhyst
Under-voltage shutdown
hysteresis
VOV
Over-voltage shutdown
RON
On-state resistance
IS
Test conditions
Supply current
Max. Unit
0.5
V
36
V
IOUT = 3 A; Tj = 25°C; VCC > 8 V
40
mΩ
IOUT = 3 A; VCC > 8 V
80
mΩ
Off-state; VCC = 13 V;
VIN = VOUT = 0 V
10
25
µA
Off-state; VCC = 13 V;
VIN = VOUT = 0 V; Tj = 25°C
10
20
µA
On-state; VCC = 13 V; VIN = 5 V;
IOUT = 0 A
2
3.5
mA
0
50
µA
-75
0
µA
IL(off1)
Off-state output current
VIN = VOUT = 0 V
IL(off2)
Off-state output current
VIN = 0V; VOUT = 3.5 V
IL(off3)
Off-state output current
VIN = VOUT = 0 V; VCC = 13 V;
Tj = 125°C
5
µA
IL(off4)
Off-state output current
VIN = VOUT = 0 V; VCC = 13 V;
Tj = 25°C
3
µA
Table 6.
Symbol
Switching (VCC=13V)
Parameter
Test conditions
Min.
Typ.
Max. Unit
td(on)
Turn-on delay time
RL = 4.3 Ω from VIN rising edge to
VOUT = 1.3 V
30
µs
td(off)
Turn-off delay time
RL = 4.3 Ω from VIN falling edge to
VOUT = 11.7 V
30
µs
dVOUT/dt(on) Turn-on voltage slope
RL = 4.3 Ω from VOUT = 1.3 V to
VOUT=10.4 V
See Figure 21
V/µs
dVOUT/dt(off) Turn-off voltage slope
RL = 4.3 Ω from VOUT = 11.7 V to
VOUT = 1.3 V
See Figure 22
V/µs
Table 7.
Symbol
10/43
Power
Input pin
Parameter
Test conditions
VIL
Input low level
IIL
Low level input current
VIN = 1.25 V
Doc ID 7370 Rev. 5
Min.
1
Typ.
Max.
Unit
1.25
V
µA
VN820
Electrical specifications
Table 7.
Symbol
Input pin (continued)
Parameter
Test conditions
VIH
Input high level
IIH
High level input current
Vhyst
Input hysteresis voltage
VICL
Input clamp voltage
Table 8.
Max.
3.25
V
VIN = 3.25 V
10
0.5
IIN = 1 mA
Unit
µA
V
6
6.8
8
-0.7
V
V
VCC output diode
Parameter
VF
Forward on voltage
Symbol
Typ.
IIN = -1 mA
Symbol
Table 9.
Min.
Test conditions
-IOUT = 2 A; Tj = 150°C
Min.
Typ.
Max.
Unit
—
—
0.6
V
Min.
Typ.
Max.
Unit
Status pin
Parameter
Test conditions
VSTAT
Status low output voltage
ISTAT = 1.6 mA
0.5
V
ILSTAT
Status leakage current
Normal operation; VSTAT = 5 V
10
µA
CSTAT
Status pin input capacitance Normal operation; VSTAT = 5 V
100
pF
8
V
VSCL
Status clamp voltage
Table 10.
Protections(1)
Symbol
Parameter
ISTAT = 1 mA
6
6.8
ISTAT = - 1 mA
V
Min.
Typ.
Max.
Unit
Shutdown temperature
150
175
200
°C
TR
Reset temperature
135
Thyst
Thermal hysteresis
7
tSDL
Status delay in over-load
Tj > Tjsh
condition
Ilim
Current limitation
TTSD
Vdemag
Test conditions
-0.7
9 V < VCC < 36 V
5.5 V < VCC < 36 V
Turn-off output clamp
voltage
IOUT = 3 A; VIN = 0 V;
L = 6 mH
9
°C
15
13
°C
20
ms
20
A
20
A
VCC - 41 VCC - 48 VCC - 55
V
1. To ensure long term reliability under heavy over-load or short circuit conditions, protection and related
diagnostic signals must be used together with a proper software strategy. If the device operates under
abnormal conditions this software must limit the duration and number of activation cycles.
Doc ID 7370 Rev. 5
11/43
Electrical specifications
Table 11.
VN820
Open-load detection
Symbol
Parameter
Test conditions
IOL
Open-load on-state detection
VIN = 5 V
threshold
tDOL(on)
Open-load on-state detection
IOUT = 0A
delay
VOL
Open-load off-state voltage
detection threshold
tDOL(off)
Open-load detection delay at
turn-off
Figure 4.
VIN = 0V
Typ.
Max.
Unit
70
150
300
mA
200
µs
3.5
V
1000
µs
1.5
2.5
Status timings
OPEN LOAD STATUS TIMING (with external pull-up)
IOUT< IOL
VOUT > VOL
OVER-TEMP STATUS TIMING
Tj > Tjsh
VIN
VIN
VSTAT
VSTAT
tDOL(off)
Figure 5.
Min.
tDOL(on)
tSDL
tSDL
Switching time waveforms
VOUT
90%
80%
dVOUT/dt(off)
dVOUT/dt(on)
10%
t
VIN
td(on)
td(off)
t
12/43
Doc ID 7370 Rev. 5
VN820
Electrical specifications
Table 12.
Truth table
Conditions
Input
Output
Status
Normal operation
L
H
L
H
H
H
Current limitation
L
H
H
L
X
X
H
(Tj < TTSD) H
(Tj > TTSD) L
Over-temperature
L
H
L
L
H
L
Under-voltage
L
H
L
L
X
X
Over-voltage
L
H
L
L
H
H
Output voltage > VOL
L
H
H
H
L
H
Output current < IOL
L
H
L
H
H
L
Table 13.
Electrical transient requirements
ISO T/R
Test level
7637/1
Test pulse
I
II
III
IV
Delays and impedance
1
- 25V(1)
- 50V(1)
- 75V(1)
- 100V(1)
2ms, 10Ω
2
(1)
+
50V(1)
75V(1)
+
100V(1)
0.2ms, 10Ω
-
50V(1)
-
150V(1)
0.1µs, 50Ω
+
50V(1)
+
100V(1)
0.1µs, 50Ω
3a
3b
+ 25V
-
25V(1)
+
25V(1)
+
-
100V(1)
+
75V(1)
4
- 4V(1)
- 5V(1)
- 6V(1)
- 7V(1)
5
26.5V(1)
46.5V(2)
66.5V(2)
86.5V(2)
+
+
+
+
100ms, 0.01Ω
400ms, 2Ω
1. All functions of the device are performed as designed after exposure to disturbance.
2. One or more functions of the device is not performed as designed after exposure and cannot be returned to
proper operation without replacing the device.
Doc ID 7370 Rev. 5
13/43
Electrical specifications
Figure 6.
VN820
Waveforms
NORMAL OPERATION
INPUT
LOAD VOLTAGE
STATUS
UNDER-VOLTAGE
VUSDhyst
VCC
VUSD
INPUT
LOAD VOLTAGE
STATUS
undefined
OVER-VOLTAGE
VCC<VOV
VCC > VOV
VCC
INPUT
LOAD VOLTAGE
STATUS
OPEN LOAD with external pull-up
INPUT
VOUT > VOL
LOAD VOLTAGE
VOL
STATUS
OPEN LOAD without external pull-up
INPUT
LOAD VOLTAGE
STATUS
Tj
TTSD
TR
OVER-TEMPERATURE
INPUT
LOAD CURRENT
STATUS
14/43
Doc ID 7370 Rev. 5
VN820
2.4
Electrical specifications
Electrical characteristics curves
Figure 7.
Off-state output current
Figure 8.
IL(off1) (µA)
Iih (uA)
5
5
4.5
4.5
Off state
Vcc=36V
Vin=Vout=0V
4
3.5
High level input current
Vin=3.25V
4
3.5
3
3
2.5
2.5
2
2
1.5
1.5
1
1
0.5
0.5
0
0
-50
-25
0
25
50
75
100
125
150
175
-50
-25
0
25
50
Tc (ºC)
Figure 9.
75
100
125
150
175
Tc (°C)
Input clamp voltage
Figure 10. Status leakage current
Ilstat (uA)
Vicl (V)
8
0.05
7.8
Iin=1mA
0.04
7.6
Vstat=5V
7.4
0.03
7.2
7
0.02
6.8
6.6
0.01
6.4
6.2
0
6
-50
-25
0
25
50
75
100
125
150
-50
175
-25
0
25
Figure 11.
50
75
100
125
150
175
Tc (°C)
Tc (°C)
Status low output voltage
Figure 12. Status clamp voltage
Vscl (V)
Vstat (V)
8
0.8
7.8
0.7
Istat=1mA
Istat=1.6mA
7.6
0.6
7.4
0.5
7.2
7
0.4
6.8
0.3
6.6
0.2
6.4
0.1
6.2
0
6
-50
-25
0
25
50
75
100
125
150
175
Tc (°C)
-50
-25
0
25
50
75
100
125
150
175
Tc (°C)
Doc ID 7370 Rev. 5
15/43
Electrical specifications
VN820
Figure 13. On-state resistance Vs Tcase
Figure 14. On-state resistance Vs VCC
Ron (mOhm)
Ron (mOhm)
100
100
90
90
Iout=3A
Vcc=8V; 13V; 36V
80
80
Tc= 150ºC
70
70
60
60
50
50
40
40
30
30
20
20
10
10
0
Tc= 25ºC
Tc= - 40ºC
0
-50
-25
0
25
50
75
100
125
150
175
5
10
15
20
Tc (ºC)
25
30
35
40
Vcc (V)
Figure 15. Open load on-state detection Figure 16. Input high level
threshold
Iol (mA)
Vih (V)
150
3.6
140
3.4
Vcc=13V
Vin=5V
130
3.2
120
3
110
2.8
100
90
2.6
80
2.4
70
2.2
60
2
50
-50
-25
0
25
50
75
100
125
150
-50
175
-25
0
25
50
75
100
125
150
175
Tc (°C)
Tc (°C)
Figure 17. Input low level
Figure 18. Input hysteresis voltage
Vil (V)
Vhyst (V)
2.6
1.5
1.4
2.4
1.3
2.2
1.2
2
1.1
1.8
1
0.9
1.6
0.8
1.4
0.7
1.2
0.6
1
0.5
-50
-25
0
25
50
75
100
125
150
175
Tc (°C)
16/43
-50
-25
0
25
50
75
Tc (°C)
Doc ID 7370 Rev. 5
100
125
150
175
VN820
Electrical specifications
Figure 19. Over-voltage shutdown
Figure 20. Open load off-state voltage
detection threshold
Vov (V)
Vol (V)
50
5
48
4.5
46
4
44
3.5
Vin=0V
42
3
40
2.5
38
2
36
1.5
34
1
32
0.5
0
30
-50
-25
0
25
50
75
100
125
150
-50
175
-25
0
25
50
75
100
125
150
175
Tc (°C)
Tc (°C)
Figure 21. Turn-on voltage slope
Figure 22. Turn-off voltage slope
dVout/dt/(on) (V/ms)
dVout/dt(off) (V/ms)
1000
1000
900
900
Vcc=13V
Rl=6.5Ohm
800
Vcc=13V
Rl=4.3Ohm
800
700
700
600
600
500
500
400
400
300
300
200
200
100
100
0
0
-50
-25
0
25
50
75
100
125
150
175
-50
-25
0
25
50
75
100
125
150
175
Tc (ºC)
Tc (ºC)
Figure 23. Ilim Vs Tcase
Ilim (A)
20
18
Vcc=13V
16
14
12
10
8
6
4
2
0
-50
-25
0
25
50
75
100
125
150
175
Tc (°C)
Doc ID 7370 Rev. 5
17/43
Application information
3
VN820
Application information
Figure 24. Application schematic
+5V
+5V
VCC
Rprot
STATUS
Dld
μC
Rprot
INPUT
OUTPUT
GND
VGND
RGND
DGND
3.1
GND protection network against reverse battery
3.1.1
Solution 1: resistor in the ground line (RGND only)
This can be used with any type of load.
The following is an indication on how to size the RGND resistor.
1.
RGND ≤ 600 mV / (IS(on)max)
2.
RGND ≥ (- VCC) / (- IGND)
where - IGND is the DC reverse ground pin current and can be found in the absolute
maximum rating section of the device datasheet.
Power Dissipation in RGND (when VCC < 0: during reverse battery situations) is:
PD= (- VCC)2/ RGND
This resistor can be shared amongst several different HSDs. Please note that the value of
this resistor should be calculated with formula (1) where IS(on)max becomes the sum of the
maximum on-state currents of the different devices.
Please note that if the microprocessor ground is not shared by the device ground then the
RGND will produce a shift (IS(on)max * RGND) in the input thresholds and the status output
values. This shift will vary depending on how many devices are ON in the case of several
high-side drivers sharing the same RGND.
If the calculated power dissipation leads to a large resistor or several devices have to share
the same resistor then ST suggests to utilize Solution 2 (see below).
18/43
Doc ID 7370 Rev. 5
VN820
3.1.2
Application information
Solution 2: diode (DGND) in the ground line
A resistor (RGND = 1 kΩ) should be inserted in parallel to DGND if the device drives an
inductive load.
This small signal diode can be safely shared amongst several different HSDs. Also in this
case, the presence of the ground network produces a shift (≈ 600 mV) in the input threshold
and in the status output values if the microprocessor ground is not common to the device
ground. This shift does not vary if more than one HSD shares the same diode/resistor
network.
Series resistor in INPUT and STATUS lines are also required to prevent that, during battery
voltage transient, the current exceeds the absolute maximum rating.
Safest configuration for unused INPUT and STATUS pin is to leave them unconnected.
3.2
Load dump protection
Dld is necessary (Voltage Transient Suppressor) if the load dump peak voltage exceeds the
VCC max DC rating. The same applies if the device is subject to transients on the VCC line
that are greater than the ones shown in the ISO 7637-2: 2004(E) table.
3.3
MCU I/Os protection
If a ground protection network is used and negative transient are present on the VCC line,
the control pins are pulled negative. ST suggests to insert a resistor (Rprot) in line to prevent
the microcontroller I/O pins from latching-up.
The value of these resistors is a compromise between the leakage current of microcontroller
and the current required by the HSD I/Os (Input levels compatibility) with the latch-up limit of
microcontroller I/Os.
-VCCpeak/Ilatchup ≤ Rprot ≤ (VOHµC-VIH-VGND) / IIHmax
Calculation example:
For VCCpeak= - 100V and Ilatchup ≥ 20mA; VOHµC ≥ 4.5V
5kΩ ≤ Rprot ≤ 65kΩ.
Recommended values: Rprot =10kΩ .
3.4
Open load detection in off-state
Off-state open load detection requires an external pull-up resistor (RPU) connected between
OUTPUT pin and a positive supply voltage (VPU) like the +5V line used to supply the
microprocessor.
The external resistor has to be selected according to the following requirements:
1.
no false open load indication when load is connected: in this case we have to avoid
VOUT to be higher than VOlmin; this results in the following condition
VOUT= (VPU / (RL+RPU)) RL < VOlmin.
2.
no misdetection when load is disconnected: in this case the VOUT has to be higher than
VOLmax; this results in the following condition RPU < (VPU – VOLmax) / IL(off2).
Doc ID 7370 Rev. 5
19/43
Application information
VN820
Because Is(OFF) may significantly increase if Vout is pulled high (up to several mA), the pullup resistor RPU should be connected to a supply that is switched off when the module is in
standby.
The values of VOLmin, VOLmax and IL(off2) are available in the electrical characteristics
section.
Figure 25. Open load detection in off-state
6BATT
60 5
6##
20 5
).0 54
$2)6%2
,/')#
),OFF
/54
2
3 4!453 6/,
2,
'2/5.$
("1($'5
20/43
Doc ID 7370 Rev. 5
VN820
3.5
Application information
PowerSO-10, P2PAK, PPAK, PENTAWATT maximum
demagnetization energy (VCC = 13.5V)
Figure 26. PowerSO-10, P2PAK, PPAK, PENTAWATT maximum turn-off current
versus inductance
)MAX!
!
#
"
,M(
'!0'#&4
A: Tjstart = 150°C single pulse
B: Tjstart = 100°C repetitive pulse
C: Tjstart = 125°C repetitive pulse
VIN, IL
Demagnetization
Demagnetization
Demagnetization
t
Note:
Values are generated with RL = 0 Ω.In case of repetitive pulses, Tjstart (at the beginning of
each demagnetization) of every pulse must not exceed the temperature specified above for
curves A and B.
Doc ID 7370 Rev. 5
21/43
Package and PCB thermal data
VN820
4
Package and PCB thermal data
4.1
P2PAK thermal data
Figure 27. PC board
("1($'5
Note:
Layout condition of Rth and Zth measurements (PCB FR4 area = 60 mm x 60 mm, PCB
thickness = 2 mm, Cu thickness = 35 µm , Copper areas: 0.97 cm2, 8 cm2).
Figure 28. Rthj-amb vs PCB copper area in open box free air condition
24(J?AMB #7
4J4AMB #
0#"#UHEATSINKAREACM>
22/43
Doc ID 7370 Rev. 5
("1($'5
VN820
Package and PCB thermal data
Figure 29. P2PAK thermal impedance junction ambient single pulse
:4 ( #7
CM
CM
4 IMES
'!0'#&4
Equation 1: pulse calculation formula
Z
THδ
= R
TH
⋅δ+Z
THtp
(1 – δ)
where δ = tP/T
Figure 30. Thermal fitting model of a single channel
Doc ID 7370 Rev. 5
23/43
Package and PCB thermal data
Table 14.
4.2
VN820
Thermal parameter
Area/island (cm2)
0.97
R1 (°C/W)
0.04
R2 (°C/W)
0.25
R3 (°C/W)
0.3
R4 (°C/W)
4
R5 (°C/W)
9
R6 (°C/W)
37
C1 (W·s/°C)
0.0008
C2 (W·s/°C)
0.007
C3 (W·s/°C)
0.015
C4 (W·s/°C)
0.4
C5 (W·s/°C)
2
C6 (W·s/°C)
3
6
22
5
PPAK thermal data
Figure 31. PC board
("1($'5
Note:
24/43
Layout condition of Rth and Zth measurements (PCB FR4 area = 60 mm x 60 mm, PCB
thickness = 2 mm, Cu thickness=35 µm , Copper areas: 0.44 cm2, 8 cm2).
Doc ID 7370 Rev. 5
VN820
Package and PCB thermal data
Figure 32. Rthj-amb vs PCB copper area in open box free air condition
24(J?AMB #7
0#"#UHEATSINKAREACM>
'!0'#&4
Figure 33. PPAK thermal impedance junction ambient single pulse
:4( #7
CM
CM
4IMES
'!0'#&4
Doc ID 7370 Rev. 5
25/43
Package and PCB thermal data
VN820
Equation 2: pulse calculation formula
Z
THδ
= R
TH
⋅δ+Z
THtp
(1 – δ)
where δ = tP/T
Figure 34. Thermal fitting model of a single channel
Table 15.
26/43
Thermal parameter
Area/island (cm2)
0.44
R1 (°C/W)
0.04
R2 (°C/W)
0.25
R3 (°C/W)
0.3
R4 (°C/W)
2
R5 (°C/W)
15
R6 (°C/W)
61
C1 (W·s/°C)
0.0008
C2 (W·s/°C)
0.007
C3 (W·s/°C)
0.02
C4 (W·s/°C)
0.3
C5 (W·s/°C)
0.45
C6 (W·s/°C)
0.8
Doc ID 7370 Rev. 5
6
24
5
VN820
4.3
Package and PCB thermal data
PowerSO-10 thermal data
Figure 35. PowerSO-10 PC board
Note:
Layout condition of Rth and Zth measurements (PCB FR4 area = 58 mm x 58 mm, PCB
thickness = 2 mm, Cu thickness = 35 µm, Copper areas: from minimum pad lay-out to
8 cm2).
Figure 36. Rthj-amb vs PCB copper area in open box free air condition
24(J?AMB #7
4J4AMB #
0#"#UHEATSINKAREACM>
Doc ID 7370 Rev. 5
("1($'5
27/43
Package and PCB thermal data
VN820
Figure 37. Thermal impedance junction ambient single pulse
:4( #7 CM
CM
4IMES
("1($'5
Equation 3: pulse calculation formula
Z
THδ
= R
TH
⋅δ+Z
THtp
(1 – δ)
where δ = tP/T
Figure 38. Thermal fitting model of a single channel HSD in PowerSO-10
Tj
C1
C2
C3
C4
C5
C6
R1
R2
R3
R4
R5
R6
Pd
T_amb
28/43
Doc ID 7370 Rev. 5
VN820
Package and PCB thermal data
Table 16.
Thermal parameters
Area / island (cm2)
Footprint
R1 (°C/W)
0.04
R2 (°C/W)
0.25
R3 (°C/W)
0.25
R4 (°C/W)
0.8
R5 (°C/W)
12
R6 (°C/W)
37
C1 (W.s/°C)
0.0008
C2 (W.s/°C)
7E-03
C3 (W.s/°C)
0.015
C4 (W.s/°C)
0.3
C5 (W.s/°C)
0.75
C6 (W.s/°C)
3
Doc ID 7370 Rev. 5
6
22
5
29/43
Package and packing information
VN820
5
Package and packing information
5.1
ECOPACK®
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
5.2
PENTAWATT mechanical data
Figure 39. PENTAWATT package dimensions
30/43
Doc ID 7370 Rev. 5
VN820
Package and packing information
Table 17.
PENTAWATT mechanical data
mm
Dim.
Min.
Typ.
Max.
A
4.8
C
1.37
D
2.4
2.8
D1
1.2
1.35
E
0.35
0.55
F
0.8
1.05
F1
1
1.4
G
3.2
3.4
3.6
G1
6.6
6.8
7
H2
H3
10.4
10.05
10.4
L
17.85
L1
15.75
L2
21.4
L3
22.5
L5
2.6
3
L6
15.1
15.8
L7
6
6.6
M
4.5
M1
4
Diam.
3.65
Doc ID 7370 Rev. 5
3.85
31/43
Package and packing information
5.3
VN820
P2PAK mechanical data
Figure 40. P2PAK package dimensions
("1($'5
32/43
Doc ID 7370 Rev. 5
VN820
Package and packing information
P2PAK mechanical data
Table 18.
mm
Dim.
Min.
Typ.
Max.
A
4.30
4.80
A1
2.40
2.80
A2
0.03
0.23
b
0.80
1.05
c
0.45
0.60
c2
1.17
1.37
D
8.95
9.35
D2
E
8.00
10.00
E1
10.40
8.50
e
3.20
3.60
e1
6.60
7.00
L
13.70
14.50
L2
1.25
1.40
L3
0.90
1.70
L5
1.55
2.40
R
V2
0.40
0º
Package weight
8º
1.40 Gr (typ)
Doc ID 7370 Rev. 5
33/43
Package and packing information
5.4
VN820
PPAK mechanical data
Figure 41. PPAK package dimensions
("1($'5
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Package and packing information
Table 19.
PPAK mechanical data
mm
Dim.
Min.
Typ.
Max.
A
2.20
2.40
A1
0.90
1.10
A2
0.03
0.23
B
0.40
0.60
B2
5.20
5.40
C
0.45
0.60
C2
0.48
0.60
D
6.00
6.20
D1
E
5.1
6.40
6.60
E1
4.7
e
1.27
G
4.90
5.25
G1
2.38
2.70
H
9.35
10.10
L2
0.8
1.00
L4
0.60
1.00
L5
1
—
L6
2.80
R
0.2
V2
0°
Package weight
8°
Gr. 0.3
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Package and packing information
5.5
VN820
PowerSO-10 mechanical data
Figure 42. PowerSO-10 package dimensions
B
0.10 A B
10
H
E
E
E2
1
SEATING
PLANE
e
B
DETAIL "A"
A
C
0.25
h
E4
D
= D1 =
=
=
SEATING
PLANE
A
F
A1
A1
L
DETAIL "A"
α
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Doc ID 7370 Rev. 5
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Package and packing information
Table 20.
PowerSO-10 mechanical data
mm
Dim.
Min.
Typ.
Max.
A
3.35
3.65
A(1)
3.4
3.6
A1
0
0.10
B
0.40
0.60
B(1)
0.37
0.53
C
0.35
0.55
C(1)
0.23
0.32
D
9.40
9.60
D1
7.40
7.60
E
9.30
9.50
E2
7.20
7.60
E2(1)
7.30
7.50
E4
5.90
6.10
E4(1)
5.90
6.30
e
1.27
F
1.25
1.35
F(1)
1.20
1.40
H
13.80
14.40
H(1)
13.85
14.35
h
0.50
L
1.20
1.80
L(1)
0.80
1.10
α
0°
8°
α(1)
2°
8°
1. Muar only POA P013P.
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Package and packing information
5.6
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PENTAWATT packing information
Figure 43. PENTAWATT tube shipment (no suffix)
"
#
Base Q.ty
Bulk Q.ty
Tube length (± 0.5)
A
B
C (± 0.1)
All dimensions are in mm.
!
("1($'5
5.7
P2PAK packing information
Figure 44. P2PAK tube shipment (no suffix)
"
#
Base Q.ty
Bulk Q.ty
Tube length (± 0.5)
A
B
C (± 0.1)
All dimensions are in mm.
!
("1($'5
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Doc ID 7370 Rev. 5
50
1000
532
18
33.1
1
50
1000
532
18
33.1
1
VN820
Package and packing information
Figure 45. P2PAK tape and reel (suffix “13TR”)
REEL DIMENSIONS
All dimensions are in mm.
Base Q.ty
Bulk Q.ty
A (max)
B (min)
C (± 0.2)
F
G (+ 2 / -0)
N (min)
T (max)
1000
1000
330
1.5
13
20.2
24.4
60
30.4
TAPE DIMENSIONS
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb 1986
Tape width
Tape Hole Spacing
Component Spacing
Hole Diameter
Hole Diameter
Hole Position
Compartment Depth
Hole Spacing
W
P0 (± 0.1)
P
D (± 0.1/-0)
D1 (min)
F (± 0.05)
K (max)
P1 (± 0.1)
24
4
12
1.5
1.5
11.5
6.5
2
All dimensions are in mm.
End
Start
Top
cover
tape
No components
Components
No components
500mm min
Empty components pockets
saled with cover tape.
500mm min
User direction of feed
5.8
PPAK packing information
Figure 46. PPAK suggested pad layout
3
1.8
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6.7
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Package and packing information
VN820
Figure 47. PPAK tube shipment (no suffix)
A
Base Q.ty
Bulk Q.ty
Tube length (± 0.5)
A
B
C (± 0.1)
C
75
3000
532
6
21.3
0.6
All dimensions are in mm.
B
Figure 48. PPAK tape and reel (suffix “13TR”)
REEL DIMENSIONS
All dimensions are in mm.
Base Q.ty
Bulk Q.ty
A (max)
B (min)
C (± 0.2)
F
G (+ 2 / -0)
N (min)
T (max)
2500
2500
330
1.5
13
20.2
16.4
60
22.4
TAPE DIMENSIONS
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb 1986
Tape width
Tape Hole Spacing
Component Spacing
Hole Diameter
Hole Diameter
Hole Position
Compartment Depth
Hole Spacing
W
P0 (± 0.1)
P
D (± 0.1/-0)
D1 (min)
F (± 0.05)
K (max)
P1 (± 0.1)
All dimensions are in mm.
16
4
8
1.5
1.5
7.5
2.75
2
End
Start
Top
cover
tape
No components
Components
500mm min
Empty components pockets
saled with cover tape.
User direction of feed
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Doc ID 7370 Rev. 5
No components
500mm min
VN820
5.9
Package and packing information
PowerSO-10 packing information
Figure 49. PowerSO-10 suggested Figure 50. PowerSO-10 tube shipment
pad layout
(no suffix)
CASABLANCA
B
MUAR
C
C
A
A
All dimensions are in mm.
B
Casablanca
Muar
Base Q.ty Bulk Q.ty Tube length (± 0.5) A
B C (± 0.1)
50
1000
532
10.4 16.4
0.8
50
1000
532
4.9 17.2
0.8
("1($'5
Figure 51. PowerSO-10 tape and reel shipment (suffix “TR”)
Reel dimensions
Base Q.ty
Bulk Q.ty
A (max)
B (min)
C (± 0.2)
F
G (+ 2 / -0)
N (min)
T (max)
600
600
330
1.5
13
20.2
24.4
60
30.4
Tape dimensions
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb. 1986
Tape width
Tape Hole Spacing
Component Spacing
Hole Diameter
Hole Diameter
Hole Position
Compartment Depth
Hole Spacing
W
P0 (± 0.1)
P
D (± 0.1/-0)
D1 (min)
F (± 0.05)
K (max)
P1 (± 0.1)
All dimensions are in mm.
24
4
24
1.5
1.5
11.5
6.5
2
End
Start
Top
No components
Components
No components
cover
tape
500mm min
Empty components pockets
saled with cover tape.
500mm min
User direction of feed
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Revision history
6
VN820
Revision history
Table 21.
Document revision history
Date
Revision
07-Jul-2004
1
Initial release.
2
Minor changes
Current and voltage convention update (page 2).
Configuration diagram (top view) and suggested connections for
unused and n.c. pins insertion (page 2).
6 cm2 Cu condition insertion in thermal data table (page 3).
VCC - output diode section update (page 4).
Revision history table insertion (page 34).
Disclaimers update (page 35).
3
Document reformatted and restructured.
Added content, list of figures and tables.
Added ECOPACK® packages information.
Updated Figure 45.: P2PAK tape and reel (suffix “13TR”):
– changed component spacing (P) in tape dimensions table from 16
mm to 12 mm.
31-Mar-2010
4
Updated document template.
Updated features list.
Removed SO-16L package into the document:
– Updated Table 1: Device summary
– Updated Table 3: Absolute maximum ratings
– Updated Table 4: Thermal data
– Updated Section 3.5: PowerSO-10, P2PAK, PPAK, PENTAWATT
maximum demagnetization energy (VCC = 13.5V)
– Updated Section 4: Package and PCB thermal data
– Updated Section 5: Package and packing information
06-Jun-2012
5
Updated Section 5.8: PPAK packing information
03-May-2006
17-Dec-2008
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Changes
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