STMICROELECTRONICS VNQ830PEP-E

VNQ830PEP-E
Quad channel high side driver
Features
Type
RDS(on)
IOUT
VCC
VNQ830PEP-E
60mΩ(1)
14A(1)
36V
1. Per each channel.
PowerSSO-24
■
CMOS compatible inputs
■
Open drain status outputs
■
On-state open load detection
■
Off-state open load detection
■
Shorted load protection
■
Undervoltage and overvoltage shutdown
■
Loss of ground protection
■
Very low standby current
■
Reverse battery protection(a)
■
In compliance with the 2002/95/EC european
directive
Description
The VNQ830PEP-E is a monolithic device made
using| STMicroelectronics VIPower™ M0-3
Technology. The VNQ830PEP-E is intended for
driving any type of multiple load with one side
connected to ground.
The Active VCC pin voltage clamp protects the
device against low energy spikes (see ISO7637
transient compatibility table).
Active current limitation combined with thermal
shutdown and automatic restart protects the
device against overload. The device detects the
open load condition in both the on and off-state.
In the off-state the device detects if the output is
shorted to VCC. The device automatically turns off
in the case where the ground pin becomes
disconnected.
a. See Application schematic on page 16
Table 1.
Device summary
Package
PowerSSO-24
July 2009
Order codes
Tube
Tape and reel
VNQ830PEP-E
VNQ830PEPTR-E
Doc ID 10871 Rev 7
1/27
www.st.com
1
Contents
VNQ830PEP-E
Contents
1
Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2
Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3
2.1
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.2
Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.3
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.4
Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.1
4
6
2/27
3.1.1
Solution 1: a resistor in the ground line (RGND only) . . . . . . . . . . . . . . 16
3.1.2
Solution 2: a diode (DGND) in the ground line . . . . . . . . . . . . . . . . . . . . 17
3.2
Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.3
MCU I/O protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.4
Open-load detection in off-state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.5
Maximum demagnetization energy (VCC = 13.5V) . . . . . . . . . . . . . . . . . . 19
Package and PC board thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.1
5
GND protection network against reverse battery . . . . . . . . . . . . . . . . . . . 16
PowerSSO-24 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.1
ECOPACK® packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.2
PowerSSO-24 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.3
Packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Doc ID 10871 Rev 7
VNQ830PEP-E
List of tables
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Table 18.
Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 5
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Thermal data (per island) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Power output. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
VCC - output diode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Switching (VCC = 13V; Tj = 25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Logic inputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Status pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Open-load detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Electrical transient requirements (part 1/3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Electrical transient requirements (part 2/3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Electrical transient requirements (part 3/3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Thermal parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
PowerSSO-24 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Doc ID 10871 Rev 7
3/27
List of figures
VNQ830PEP-E
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
Figure 16.
Figure 17.
Figure 18.
Figure 19.
Figure 20.
Figure 21.
Figure 22.
Figure 23.
Figure 24.
Figure 25.
Figure 26.
Figure 27.
Figure 28.
Figure 29.
Figure 30.
Figure 31.
Figure 32.
Figure 33.
4/27
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Status timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Switching characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Off-state output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
High level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Turn-on voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Overvoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
ILIM vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
On-state resistance vs VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Input high level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
On-state resistance vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Input low level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Status leakage current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Status low output voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Status clamp voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Open-load on-state detection threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Open-load off-state voltage detection threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Open-load detection in off-state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Maximum turn-off current versus load inductance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
PowerSSO-24 PC board. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Rthj-amb vs PCB copper area in open box free air condition (one channel ON) . . . . . . . . 20
PowerSSO-24 thermal impedance junction ambient single pulse (one channel ON). . . . . 21
Thermal fitting model of a double channel HSD in PowerSSO-24 . . . . . . . . . . . . . . . . . . . 21
PowerSSO-24 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
PowerSSO-24 tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
PowerSSO-24 tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Doc ID 10871 Rev 7
VNQ830PEP-E
1
Block diagram and pin description
Block diagram and pin description
Figure 1.
Block diagram
VCC
VCC
CLAMP
OUTPUT1
OVERVOLTAGE
VCC
INPUT2 CONTROL & PROTECTION
STATUS2 EQUIVALENT TO
CHANNEL1
UNDERVOLTAGE
CLAMP 1
GND
INPUT1
OUTPUT2
DRIVER 1
LOGIC
VCC
STATUS1
INPUT3 CONTROL & PROTECTION
STATUS3 EQUIVALENT TO
CHANNEL1
CURRENT LIMITER 1
OVERTEMP. 1
INPUT2
OUTPUT3
OPENLOAD ON 1
STATUS2
VCC
INPUT3
INPUT4 CONTROL & PROTECTION
STATUS4 EQUIVALENT TO
CHANNEL1
OPENLOAD OFF 1
STATUS3
INPUT4
OUTPUT4
STATUS4
Figure 2.
Configuration diagram (top view)
OUTPUT1
OUTPUT1
OUTPUT1
OUTPUT2
OUTPUT2
OUTPUT2
OUTPUT3
OUTPUT3
OUTPUT3
OUTPUT4
OUTPUT4
OUTPUT4
VCC
GND
INPUT1
STATUS1
INPUT2
STATUS2
INPUT3
STATUS3
INPUT4
STATUS4
N.C.
VCC
TAB = VCC
Table 2.
Suggested connections for unused and not connected pins
Connection / pin
Status
N.C.
Output
Input
Floating
X
X
X
X
To ground
X
Doc ID 10871 Rev 7
Through 10KΩ
resistor
5/27
Electrical specifications
VNQ830PEP-E
2
Electrical specifications
2.1
Absolute maximum ratings
Stressing the device above the rating listed in the “Absolute maximum ratings” table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the Operating sections of
this specification is not implied. Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics SURE
Program and other relevant quality document.
Table 3.
Absolute maximum ratings
Symbol
VCC
Value
Unit
41
V
DC supply voltage
- VCC
Reverse DC supply voltage
- 0.3
V
- IGND
DC reverse ground pin current
- 200
mA
Internally limited
A
- 12
A
DC input current
+/- 10
mA
ISTAT
DC Status current
+/- 10
mA
VESD
Electrostatic discharge (human body model: R=1.5KΩ;
C = 100pF)
– Input
– Status
– Output
– VCC
4000
4000
5000
5000
V
V
V
V
83
W
Internally limited
°C
IOUT
- IOUT
IIN
Ptot
DC output current
Reverse DC output current
Power dissipation (per island) at Tlead = 25°C
Tj
Junction operating temperature
Tc
Case operating temperature
- 40 to 150
°C
Storage temperature
- 55 to 150
°C
Tstg
2.2
Parameter
Thermal data
Table 4.
Symbol
Thermal data (per island)
Parameter
Rthj-case
Thermal resistance junction-case
Rthj-amb
Thermal resistance junction-ambient
(one chip ON)
56(1)
Value
Unit
1.5
°C/W
41.7(2)
°C/W
1. When mounted on a standard single-sided FR-4 board with 0.5cm2 of Cu (at least 35 µm thick). Horizontal
mounting and no artificial air flow.
2. When mounted on a standard single-sided FR-4 board with 8cm2 of Cu (at least 35 µm thick). Horizontal
mounting and no artificial air flow.
6/27
Doc ID 10871 Rev 7
VNQ830PEP-E
2.3
Electrical specifications
Electrical characteristics
Values specified in this section are for 8V < VCC < 36V; -40°C < Tj < 150°C, unless
otherwise stated.
Figure 3.
Current and voltage conventions
IS
VF1 (*)
IINn
VINn
VCC
VCC
INPUTn
IOUTn
ISTATn
OUTPUTn
STATUSn
VOUTn
VSTATn
GND
IGND
Note:
VFn = VCCn - VOUTn during reverse battery condition.
Table 5.
Symbol
Power output
Parameter
VCC
Operating supply
voltage
VUSD
Test conditions
Min.
Typ. Max. Unit
5.5
13
36
V
Undervoltage shutdown
3
4
5.5
V
VOV
Overvoltage shutdown
36
RON
On-state resistance
IS
Supply current
V
IOUT = 2A; Tj = 25°C
IOUT = 2A; VCC > 8V
65
120
mΩ
mΩ
Off-state; VCC = 13V;
VIN = VOUT = 0V
20
60
µA
Off-state; VCC = 13V;
VIN = VOUT = 0V;
Tj = 25°C
20
40
µA
On-state; VCC = 13V; VIN = 5V;
IOUT = 0A
8.5
13.5
mA
0
50
µA
-75
0
µA
IL(off1)
Off-state output current VIN = VOUT = 0V
IL(off2)
Off-state output current VIN = 0V; VOUT = 3.5V
Doc ID 10871 Rev 7
7/27
Electrical specifications
Table 5.
Parameter
IL(off3)
Off-state output current
VIN = VOUT = 0V; VCC = 13V;
Tj = 125°C
5
µA
IL(off4)
Off-state output current
VIN = VOUT = 0V; VCC = 13V;
Tj = 25°C
3
µA
Symbol
Test conditions
Min.
Typ. Max. Unit
Protections
Min.
Typ.
Max.
Unit
Shutdown temperature
150
175
200
°C
TR
Reset temperature
135
Thyst
Thermal hysteresis
7
tSDL
Status delay in overload
conditions
Tj > TTSD
Ilim
Current limitation
VCC = 13V
5.5V < VCC < 36V
Turn-off output clamp
voltage
IOUT = 2A; L = 6mH
TTSD
Vdemag
Parameter
Test conditions
°C
15
14
18
°C
20
µs
23
23
A
A
VCC - VCC - VCC 41
48
55
V
To ensure long term reliability under heavy overload or short circuit conditions, protection
and related diagnostic signals must be used together with a proper software strategy. If the
device is subjected to abnormal conditions, this software must limit the duration and number
of activation cycles.
Table 7.
VCC - output diode
Symbol
Parameter
VF
Forward on voltage
Table 8.
Symbol
8/27
Power output (continued)
Symbol
Table 6.
Note:
VNQ830PEP-E
Test conditions
Min.
Typ.
Max.
Unit
-
-
0.6
V
- IOUT = 1.3A; Tj = 150°C
Switching (VCC = 13V; Tj = 25°C)
Parameter
Test conditions
Min.
Typ.
Max. Unit
td(on)
Turn-on delay time
RL = 6.5Ω from VIN rising edge
to VOUT = 1.3V (see Figure 5)
-
30
-
µs
td(off)
Turn-off delay time
RL = 6.5Ω from VIN falling edge
to VOUT = 11.7V (see Figure 5)
-
30
-
µs
dVOUT/dt(on) Turn-on voltage slope
RL = 6.5Ω from VOUT = 1.3V to
VOUT = 10.4V (see Figure 5)
-
See
Figure 10
-
V/µs
dVOUT/dt(off) Turn-off voltage slope
RL = 6.5Ω from VOUT = 11.7V
to VOUT = 1.3V (see Figure 5)
-
See
Figure 12
-
V/µs
Doc ID 10871 Rev 7
VNQ830PEP-E
Electrical specifications
Table 9.
Logic inputs
Symbol
Parameter
Test conditions
VIL
Input low level
IIL
Low level input current
VIH
Input high level
IIH
High level input current
VI(hyst)
Input hysteresis voltage
VICL
Table 10.
Min.
VIN = 1.25V
Typ.
Max.
Unit
1.25
V
1
µA
3.25
V
VIN = 3.25V
10
0.5
IIN = 1mA
IIN = -1mA
Input clamp voltage
µA
V
6
6.8
- 0.7
8
V
V
Status pin
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
VSTAT
Status low output voltage
ISTAT = 1.6mA
0.5
V
ILSTAT
Status leakage current
Normal operation; VSTAT = 5V
10
µA
CSTAT
Status pin input capacitance
Normal operation; VSTAT = 5V
100
pF
VSCL
Status clamp voltage
ISTAT = 1mA
ISTAT = - 1mA
8
V
V
Table 11.
6
Open-load detection
Symbol
Parameter
IOL
Open-load on-state detection threshold
VIN = 5V
Open-load on-state detection delay
IOUT = 0A
VOL
Open-load off-state voltage detection
threshold
VIN = 0V
tDOL(off)
Open-load detection delay at turn-off
tDOL(on)
Figure 4.
6.8
- 0.7
Test conditions
Min.
35
1.5
Typ. Max.
70
2.5
Unit
140
mA
200
µs
3.5
V
1000
µs
Status timings
OPEN LOAD STATUS TIMING (with external pull-up)
IOUT < IOL
VOUT > VOL
VINn
OVER TEMP STATUS TIMING
Tj > TTSD
VINn
VSTATn
VSTATn
tSDL
tDOL(off)
tSDL
tDOL(on)
Doc ID 10871 Rev 7
9/27
Electrical specifications
Figure 5.
VNQ830PEP-E
Switching characteristics
VOUTn
90%
80%
dVOUT/dt(off)
dVOUT/dt(on)
10%
t
VINn
td(on)
td(off)
t
Table 12.
10/27
Truth table
Conditions
Input
Output
Status
Normal operation
L
H
L
H
H
H
Current limitation
L
H
H
L
X
X
H
(Tj < TTSD) H
(Tj > TTSD) L
Overtemperature
L
H
L
L
H
L
Undervoltage
L
H
L
L
X
X
Overvoltage
L
H
L
L
H
H
Output voltage > VOL
L
H
H
H
L
H
Output current < IOL
L
H
L
H
H
L
Doc ID 10871 Rev 7
VNQ830PEP-E
Electrical specifications
Table 13.
Electrical transient requirements (part 1/3)
ISO T/R
Test level
7637/1
Test pulse
I
II
III
IV
Delays and impedance
1
- 25V
- 50V
- 75V
- 100V
2ms, 10Ω
2
+ 25V
+ 50V
+ 75V
+ 100V
0.2ms, 10Ω
3a
- 25V
- 50V
- 100V
- 150V
0.1µs, 50Ω
3b
+ 25V
+ 50V
+ 75V
+ 100V
0.1µs, 50Ω
4
- 4V
- 5V
- 6V
- 7V
100ms, 0.01Ω
5
+ 26.5V
+ 46.5V
+ 66.5V
+ 86.5V
400ms, 2Ω
Table 14.
Electrical transient requirements (part 2/3)
ISO T/R
Test level
7637/1
Test pulse
I
II
III
IV
1
C
C
C
C
2
C
C
C
C
3a
C
C
C
C
3b
C
C
C
C
4
C
C
C
C
5
C
E
E
E
Table 15.
Electrical transient requirements (part 3/3)
Class
Contents
C
All functions of the device are performed as designed after exposure to
disturbance.
E
One or more functions of the device is not performed as designed after exposure
and cannot be returned to proper operation without replacing the device.
Doc ID 10871 Rev 7
11/27
Electrical specifications
Figure 6.
VNQ830PEP-E
Waveforms
NORMAL OPERATION
INPUTn
OUTPUT VOLTAGEn
STATUSn
UNDERVOLTAGE
VUSDhyst
VCC
VUSD
INPUTn
OUTPUT VOLTAGEn
STATUSn
undefined
OVERVOLTAGE
VCC<VOV
VCC>VOV
VCC
INPUTn
OUTPUT VOLTAGEn
STATUSn
OPEN LOAD with external pull-up
INPUTn
VOUT>VOL
OUTPUT VOLTAGEn
VOL
STATUSn
OPEN LOAD without external pull-up
INPUTn
OUTPUT VOLTAGEn
STATUSn
Tj
TTSD
TR
OVERTEMPERATURE
INPUTn
OUTPUT CURRENTn
STATUSn
12/27
Doc ID 10871 Rev 7
VNQ830PEP-E
Electrical specifications
2.4
Electrical characteristics curves
Figure 7.
Off-state output current
Figure 8.
High level input current
IL (off1) (µA)
Iih (µA)
2.8
8
2.45
7
Vcc=13V
Vin=3.25V
Vcc=36
2.1
6
1.75
5
1.4
4
1.05
3
0.7
2
0.35
1
0
0
-50
-25
0
25
50
75
100
125
150
175
-50
-25
0
25
Tc (°C)
Figure 9.
50
75
100
125
150
175
150
175
150
175
Tc (°C)
Input clamp voltage
Figure 10. Turn-on voltage slope
Vicl (V)
dVout/dt (on) (V/ms)
8
0.9
7.8
0.8
Iin=1mA
7.6
Vcc=13V
Rl=6.5Ohm
0.7
7.4
0.6
7.2
0.5
7
0.4
6.8
0.3
6.6
0.2
6.4
0.1
6.2
6
0
-50
-25
0
25
50
75
100
125
150
175
-50
-25
0
25
Tc (°C)
Figure 11.
50
75
100
125
Tc (°C)
Overvoltage shutdown
Figure 12. Turn-off voltage slope
Vov (V)
dVout/dt (off) (V/ms)
50
0.5
0.45
47.5
Vcc=13V
Rl=6.5Ohm
0.4
45
0.35
42.5
0.3
40
0.25
0.2
37.5
0.15
35
0.1
32.5
0.05
30
0
-50
-25
0
25
50
75
100
125
150
175
Tc (°C)
-50
-25
0
25
50
75
100
125
Tc (°C)
Doc ID 10871 Rev 7
13/27
Electrical specifications
VNQ830PEP-E
Figure 13. ILIM vs Tcase
Figure 14. On-state resistance vs VCC
Ilim (A)
Ron (mOhm)
26
180
160
24
Iout=2A
Vcc=13V
140
22
Tc=150°C
120
20
100
18
80
Tc=25°C
16
60
14
40
12
Tc=-40°C
20
10
0
-50
-25
0
25
50
75
100
125
150
175
0
5
10
15
Tc (°C)
20
25
30
35
40
Vcc (V)
Figure 15. Input high level
Figure 16. Input hysteresis voltage
Vih(V)
Vhyst (V)
4
1.6
3.8
1.4
3.6
1.2
3.4
1
3.2
3
0.8
2.8
0.6
2.6
0.4
2.4
0.2
2.2
0
2
-50
-25
0
25
50
75
100
125
150
-50
175
-25
0
25
50
75
100
125
150
175
100
125
150
175
Tc (°C)
Tc (°C)
Figure 17. On-state resistance vs Tcase
Ron (mOhm)
Figure 18. Input low level
Vil (V)
160
4
3.6
140
Iout=2A
Vcc=8v; 13V; 36V
120
3.2
2.8
100
2.4
2
80
1.6
60
1.2
40
0.8
20
0.4
0
0
-50
-25
0
25
50
75
100
125
150
175
Tc (°C)
14/27
-50
-25
0
25
50
75
Tc (°C)
Doc ID 10871 Rev 7
VNQ830PEP-E
Electrical specifications
Figure 19. Status leakage current
Figure 20. Status low output voltage
Vstat (V)
Istat (nA)
300
0.8
270
0.7
Vstat=5V
Istat=1.6mA
240
0.6
210
0.5
180
0.4
150
120
0.3
90
0.2
60
0.1
30
0
0
-50
-25
0
25
50
75
100
125
150
-50
175
-25
0
25
50
75
100
125
150
175
Tc (°C)
Tc (°C)
Figure 21. Status clamp voltage
Figure 22. Open-load on-state detection
threshold
Vscl (V)
Iol (mA)
8
0.13
7.8
0.12
Iin=1mA
7.6
Vcc=13V
0.11
7.4
0.1
7.2
0.09
7
0.08
6.8
0.07
6.6
0.06
6.4
0.05
6.2
6
0.04
-50
-25
0
25
50
75
100
125
150
175
Tc (°C)
-50
-25
0
25
50
75
100
125
150
175
Tc (°C)
Figure 23. Open-load off-state voltage
detection threshold
Vol (V)
3.8
3.6
Vin=0V
3.4
3.2
3
2.8
2.6
2.4
2.2
2
1.8
-50
-25
0
25
50
75
100
125
150
175
Tc (°C)
Doc ID 10871 Rev 7
15/27
Application information
3
VNQ830PEP-E
Application information
Figure 24. Application schematic
+5V
+5V
VCC
Rprot
STATUSn
Dld
μC
Rprot
INPUTn
OUTPUTn
GND
VGND
3.1
RGND
DGND
GND protection network against reverse battery
This section provides two solutions for implementing a ground protection network against
reverse battery.
3.1.1
Solution 1: a resistor in the ground line (RGND only)
This can be used with any type of load.
The following show how to dimension the RGND resistor:
1.
RGND ≤ 600mV / 2 (IS(on)max)
2.
RGND ≥ ( - VCC) / (- IGND)
where - IGND is the DC reverse ground pin current and can be found in the absolute
maximum rating section of the device datasheet.
Power dissipation in RGND (when VCC < 0 during reverse battery situations) is:
PD = (- VCC)2/ RGND
This resistor can be shared amongst several different HSDs. Please note that the value of
this resistor should be calculated with formula (1) where IS(on)max becomes the sum of the
maximum on-state currents of the different devices.
16/27
Doc ID 10871 Rev 7
VNQ830PEP-E
Application information
Please note that, if the microprocessor ground is not shared by the device ground, then the
RGND will produce a shift (IS(on)max * RGND) in the input thresholds and the status output
values. This shift will vary depending on how many devices are ON in the case of several
high side drivers sharing the same RGND.
If the calculated power dissipation requires the use of a large resistor, or several devices
have to share the same resistor, then ST suggests using solution 2 below.
3.1.2
Solution 2: a diode (DGND) in the ground line
A resistor (RGND = 1kΩ) should be inserted in parallel to DGND if the device will be driving an
inductive load. This small signal diode can be safely shared amongst several different HSD.
Also in this case, the presence of the ground network will produce a shift (j600mV) in the
input threshold and the status output values if the microprocessor ground is not common
with the device ground. This shift will not vary if more than one HSD shares the same
diode/resistor network. Series resistor in INPUT and STATUS lines are also required to
prevent that, during battery voltage transient, the current exceeds the Absolute Maximum
Rating. Safest configuration for unused INPUT and STATUS pin is to leave them
unconnected.
3.2
Load dump protection
Dld is necessary (voltage transient suppressor) if the load dump peak voltage exceeds the
VCC maximum DC rating. The same applies if the device is subject to transients on the VCC
line that are greater than those shown in the ISO T/R 7637/1 table.
3.3
MCU I/O protection
If a ground protection network is used and negative transients are present on the VCC line,
the control pins will be pulled negative. ST suggests to insert a resistor (Rprot) in line to
prevent the µC I/O pins from latching up.
The value of these resistors is a compromise between the leakage current of µC and the
current required by the HSD I/Os (Input levels compatibility) with the latch-up limit of µC
I/Os:
- VCCpeak / Ilatchup ≤ Rprot ≤ (VOHμC - VIH - VGND) / IIHmax
Example
For the following conditions:
VCCpeak = - 100V
Ilatchup ≥ 20mA
VOHμC ≥ 4.5V
5kΩ ≤ Rprot ≤ 65kΩ.
Recommended values are:
Rprot = 10kΩ
Doc ID 10871 Rev 7
17/27
Application information
3.4
VNQ830PEP-E
Open-load detection in off-state
Off-state open load detection requires an external pull-up resistor (RPU) connected between
OUTPUT pin and a positive supply voltage (VPU) like the +5V line used to supply the
microprocessor.
The external resistor has to be selected according to the following requirements:
1) no false open load indication when load is connected: in this case we have to avoid VOUT
to be higher than VOlmin; this results in the following condition
VOUT = (VPU / (RL + RPU))RL < VOlmin.
2) no misdetection when load is disconnected: in this case the VOUT has to be higher than
VOLmax; this results in the following condition RPU < (VPU - VOLmax) / IL(off2).
Because Is(OFF) may significantly increase if Vout is pulled high (up to several mA), the pullup resistor RPU should be connected to a supply that is switched OFF when the module is in
standby.
Figure 25. Open-load detection in off-state
V batt.
VPU
VCC
RPU
INPUT
DRIVER
+
LOGIC
IL(off2)
OUT
+
STATUS
R
VOL
GROUND
18/27
Doc ID 10871 Rev 7
RL
VNQ830PEP-E
3.5
Application information
Maximum demagnetization energy (VCC = 13.5V)
Figure 26. Maximum turn-off current versus load inductance
ILMAX (A)
100
10
A
B
C
1
0.01
0.1
1
10
100
L(mH)
A = single pulse at TJstart = 150ºC
B= repetitive pulse at TJstart = 100ºC
C= repetitive pulse at TJstart = 125ºC
VIN, IL
Demagnetization
Demagnetization
Demagnetization
t
Note:
Values are generated with RL = 0Ω.
In case of repetitive pulses, Tjstart (at beginning of each demagnetization) of every pulse
must not exceed the temperature specified above for curves B and C.
Doc ID 10871 Rev 7
19/27
Package and PC board thermal data
VNQ830PEP-E
4
Package and PC board thermal data
4.1
PowerSSO-24 thermal data
Figure 27. PowerSSO-24 PC board
Note:
Layout condition of Rth and Zth measurements (PCB FR4 area= 78 mm x 78 mm, PCB
thickness=2 mm, Cu thickness=70 mm (front and back side), Copper areas: from minimum
pad lay-out to 8 cm2).
Figure 28. Rthj-amb vs PCB copper area in open box free air condition (one channel ON)
RTHj_amb(°C/W)
60
55
50
45
40
35
30
0
2
4
6
PCB Cu heatsink area (cm^2)
20/27
Doc ID 10871 Rev 7
8
10
VNQ830PEP-E
Package and PC board thermal data
Figure 29. PowerSSO-24 thermal impedance junction ambient single pulse (one
channel ON)
ZTH (°C/W)
100
Footprint
8 cm2
10
1
0.1
0.0001
0.001
0.01
0.1
1
10
100
1000
Time (s)
Figure 30. Thermal fitting model of a double channel HSD in PowerSSO-24 (b)
b. The fitting model is a simplified thermal tool and is valid for transient evolutions where the embedded
protections (power limitation or thermal cycling during thermal shutdown) are not triggered.
Doc ID 10871 Rev 7
21/27
Package and PC board thermal data
VNQ830PEP-E
Equation 1: pulse calculation formula:
Z
THδ
= R
TH
⋅δ+Z
THtp
(1 – δ)
where δ = tP/T
Table 16.
22/27
Thermal parameters
Area/island (cm2)
Footprint
R1 = R7 = R9 = R11 (°C/W)
0.1
R2 = R8 = R10 = R12 (°C/W)
0.9
R3 (°C/W)
1
R4 (°C/W)
4
R5 (°C/W)
13.5
R6 (°C/W)
37
C1 = C7 = C9 = C11 (W.s/°C)
0.0006
C2 = C8 = C10 = C12 (W.s/°C)
0.0025
C3 (W.s/°C)
0.025
C4 (W.s/°C)
0.08
C5 (W.s/°C)
0.7
C6 (W.s/°C)
3
Doc ID 10871 Rev 7
8
22
5
VNQ830PEP-E
Package and packing information
5
Package and packing information
5.1
ECOPACK® packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
5.2
PowerSSO-24 mechanical data
Figure 31. PowerSSO-24 package dimensions
Doc ID 10871 Rev 7
23/27
Package and packing information
VNQ830PEP-E
PowerSSO-24 mechanical data(1) (2)
Table 17.
Millimeters
Symbol
Min.
Typ.
A
2.45
A2
2.15
2.35
a1
0
0.10
b
0.33
0.51
c
0.23
0.32
D
10.10
10.50
E(3)
7.40
7.60
(3)
e
0.8
e3
8.8
F
2.3
G
0.1
G1
0.06
H
10.1
10.5
h
0.4
k
0°
8°
L
0.55
0.85
O
1.2
Q
0.8
S
2.9
T
3.65
U
1
N
10º
X
4.1
4.7
Y
6.5
4.9(4)
7.1
5.5(4)
1. No intrusion allowed inwards the leads.
2. Flash or bleeds on exposed die pad shall not exceed 0.4 mm per side
3. “D and E” do not include mold flash or protusions.
Mold flash or protusions shall not exceed 0.15 mm.
4. Variations for small window lead frame option.
24/27
Max.
Doc ID 10871 Rev 7
VNQ830PEP-E
5.3
Package and packing information
Packing information
Figure 32. PowerSSO-24 tube shipment (no suffix)
C
Base Q.ty
Bulk Q.ty
Tube length (± 0.5)
A
B
C (± 0.1)
B
49
1225
532
3.5
13.8
0.6
All dimensions are in mm.
A
Figure 33. PowerSSO-24 tape and reel shipment (suffix “TR”)
Reel dimensions
Base Q.ty
Bulk Q.ty
A (max)
B (min)
C (± 0.2)
F
G (+ 2 / -0)
N (min)
T (max)
1000
1000
330
1.5
13
20.2
24.4
100
30.4
Tape dimensions
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb 1986
Tape width
Tape Hole Spacing
Component Spacing
Hole Diameter
Hole Diameter
Hole Position
Compartment Depth
Hole Spacing
W
P0 (± 0.1)
P
D (± 0.05)
D1 (min)
F (± 0.1)
K (max)
P1 (± 0.1)
24
4
12
1.55
1.5
11.5
2.85
2
End
All dimensions are in mm.
Start
Top
cover
tape
No components Components
500mm min
No components
500mm min
Empty components pockets
saled with cover tape.
User direction of feed
Doc ID 10871 Rev 7
25/27
Revision history
6
VNQ830PEP-E
Revision history
Table 18.
Document revision history
Date
Revision
10-Nov-2004
1
Initial release.
22-Nov-2006
2
Pdf changed.
07-Dec-2004
3
Mechanical data updating.
PowerSSO-24 thermal characterization insertion
PCB copper area correction.
04-May-2005
4
Changed document status from preliminary to definitive.
03-May-2006
5
Configuration diagram modification
Shipment data insertion
6
Document reformatted and restructured.
Added list of contents, tables and figures.
Added ECOPACK® packages information.
Update PowerSSO-24 mechanical data.
7
Table 17: PowerSSO-24 mechanical data:
– Deleted A (min) value
– Changed A (max) value from 2.50 to 2.45
– Changed A2 (max) value from 2.40 to 2.35
– Updated k values
– Changed L (min) value from 0.6 to 0.55
– Changed L (max) value from 1 to 0.85
26-Nov-2008
01-Jul-2009
26/27
Changes
Doc ID 10871 Rev 7
VNQ830PEP-E
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Doc ID 10871 Rev 7
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