REMOTE 16-BIT I2C PCF8575C AND SMBus LOW-POWER I/O EXPANDER WITH INTERRUPT OUTPUT www.ti.com SCPS123C – MARCH 2005 – REVISED JULY 2006 FEATURES 22 4 21 5 20 6 19 7 18 8 17 9 16 10 15 11 14 12 13 A1 A2 P00 P01 P02 P03 P04 P05 P06 P07 1 24 3 4 23 SDA 22 SCL 21 A0 5 6 20 P17 19 P16 7 8 18 P15 17 P14 9 10 16 P13 15 P12 2 24 23 22 21 20 19 12 13 1 18 A0 P01 P03 2 3 17 P17 16 P16 P03 P04 4 5 15 P15 14 P14 P05 6 13 P13 7 8 9 10 11 12 14 P11 11 P00 P12 3 VCC SDA SCL A0 P17 P16 P15 P14 P13 P12 P11 P10 A2 A1 INT VCC 23 RGE PACKAGE (TOP VIEW) P06 P07 GND P10 P11 24 2 RHL PACKAGE (TOP VIEW) VCC 1 • P10 INT A1 A2 P00 P01 P02 P03 P04 P05 P06 P07 GND • Latched Outputs With High-Current Drive Capability for Directly Driving LEDs Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) – 1000-V Charged-Device Model (C101) SDA SCL DB, DBQ, DGV, DW, OR PW PACKAGE (TOP VIEW) • INT • • • • • Low Standby-Current Consumption of 10 µA Max I2C to Parallel-Port Expander Open-Drain Interrupt Output Compatible With Most Microcontrollers 400-kHz Fast I2C Bus Address by Three Hardware Address Pins for Use of up to Eight Devices GND • DESCRIPTION/ORDERING INFORMATION This 16-bit I/O expander for the two-line bidirectional bus (I2C) is designed for 4.5-V to 5.5-V VCC operation. ORDERING INFORMATION PACKAGE (1) TA PCF8575CDBQR PCF8575C TVSOP – DGV Reel of 2000 PCF8575CDGVR PF575C Tube of 25 PCF8575CDW Reel of 2000 PCF8575CDWR Tube of 60 PCF8575CDB Reel of 2000 PCF8575CDBR Tube of 60 PCF8575CPW Reel of 1200 PCF8575CPWR Reel of 250 PCF8575CPWT QFN – RGE Reel of 3000 PCF8575CRGER PF575C QFN – RHL Reel of 1000 PCF8575CRHLR PREVIEW SSOP – DB TSSOP – PW (1) TOP-SIDE MARKING Reel of 2500 SOIC – DW –40°C to 85°C ORDERABLE PART NUMBER QSOP – DBQ PCF8575C PF575C PF575C Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2005–2006, Texas Instruments Incorporated PCF8575C REMOTE 16-BIT I2C AND SMBus LOW-POWER I/O EXPANDER WITH INTERRUPT OUTPUT www.ti.com SCPS123C – MARCH 2005 – REVISED JULY 2006 DESCRIPTION/ORDERING INFORMATION (CONTINUED) The PCF8575C provides general-purpose remote I/O expansion for most microcontroller families via the I2C interface serial clock (SCL) and serial data (SDA). The device features a 16-bit quasi-bidirectional input/output (I/O) port (P07–P00, P17–P10), including latched outputs with high-current drive capability for directly driving LEDs. Each quasi-bidirectional I/O can be used as an input or output without the use of a data-direction control signal. At power on, the I/Os are in 3-state mode. The strong pullup to VCC allows fast-rising edges into heavily loaded outputs. This device turns on when an output is written high and is switched off by the negative edge of SCL. The I/Os should be high before being used as inputs. After power on, as all the I/Os are set to 3-state, all of them can be used as inputs. Any change in setting of the I/Os as either inputs or outputs can be done with the write mode. If a high is applied externally to an I/O that has been written earlier to low, a large current (IOL) flows to GND. The PCF8575C provides an open-drain interrupt (INT) output, which can be connected to the interrupt input of a microcontroller. An interrupt is generated by any rising or falling edge of the port inputs in the input mode. After time (tiv), the signal INT is valid. Resetting and reactivating the interrupt circuit is achieved when data on the port is changed to the original setting, or data is read from or written to the port that generated the interrupt. Resetting occurs in the read mode at the acknowledge (ACK) bit after the rising edge of the SCL signal or in the write mode at the ACK bit after the falling edge of the SCL signal. Interrupts that occur during the ACK clock pulse can be lost (or be very short), due to the resetting of the interrupt during this pulse. Each change of the I/Os after resetting is detected and is transmitted as INT. Reading from or writing to another device does not affect the interrupt circuit. By sending an interrupt signal on this line, the remote I/O can inform the microcontroller if there is incoming data on its ports, without having to communicate via the I2C bus. Thus, the PCF8575C can remain a simple slave device. Every data transmission to or from the PCF8575C must consist of an even number of bytes. The first data byte in every pair refers to port 0 (P07–P00), and the second data byte in every pair refers to port 1 (P17–P10). To write to the ports (output mode), the master first addresses the slave device, setting the last bit of the byte containing the slave address to logic 0. The PCF8575C acknowledges and the master sends the first data byte for P07–P00. After the first data byte is acknowledged by the PCF8575C, the second data byte (P17–P10) is sent by the master. Once again, the PCF8575C acknowledges the receipt of the data, after which this 16-bit data is presented on the port lines. The number of data bytes that can be sent successively is not limited. After every two bytes, the previous data is overwritten. When the PCF8575C receives the pairs of data bytes, the first byte is referred to as P07–P00 and the second byte as P17–P10. The third byte is referred to as P07–P00, the fourth byte as P17–P10, and so on. Before reading from the PCF8575C, all ports desired as input should be set to logic 1. To read from the ports (input mode), the master first addresses the slave device, setting the last bit of the byte containing the slave address to logic 1. The data bytes that follow on the SDA are the values on the ports. If the data on the input port changes faster than the master can read, this data may be lost. When power is applied to VCC, an internal power-on reset holds the PCF8575C in a reset state until VCC has reached VPOR. At that time, the reset condition is released, and the device I2C-bus state machine initializes the bus to its default state. The hardware pins (A0, A1, and A2) are used to program and vary the fixed I2C address, and allow up to eight devices to share the same I2C bus or SMBus. The fixed I2C address of the PCF8575C is the same as the PCF8575, PCF8574, PCA9535, and PCA9555, allowing up to eight of these devices, in any combination, to share the same I2C bus or SMBus. 2 Submit Documentation Feedback REMOTE 16-BIT www.ti.com I2C PCF8575C AND SMBus LOW-POWER I/O EXPANDER WITH INTERRUPT OUTPUT SCPS123C – MARCH 2005 – REVISED JULY 2006 TERMINAL FUNCTIONS NO. DB, DBQ, DGV, DW, PW, AND RHL RGE 1 22 INT Interrupt output. Connect to VCC through a pullup resistor. 2 23 A1 Address input 1. Connect directly to VCC or ground. Pullup resistors are not needed. 3 24 A2 Address input 2. Connect directly to VCC or ground. Pullup resistors are not needed. 4 1 P00 P-port input/output. Open-drain design structure. Connect to VCC through a pullup resistor. 5 2 P01 P-port input/output. Open-drain design structure. Connect to VCC through a pullup resistor. 6 3 P02 P-port input/output. Open-drain design structure. Connect to VCC through a pullup resistor. 7 4 P03 P-port input/output. Open-drain design structure. Connect to VCC through a pullup resistor. 8 5 P04 P-port input/output. Open-drain design structure. Connect to VCC through a pullup resistor. NAME FUNCTION 9 6 P05 P-port input/output. Open-drain design structure. Connect to VCC through a pullup resistor. 10 7 P06 P-port input/output. Open-drain design structure. Connect to VCC through a pullup resistor. 11 8 P07 P-port input/output. Open-drain design structure. Connect to VCC through a pullup resistor. 12 9 GND Ground 13 10 P10 P-port input/output. Open-drain design structure. Connect to VCC through a pullup resistor. 14 11 P11 P-port input/output. Open-drain design structure. Connect to VCC through a pullup resistor. 15 12 P12 P-port input/output. Open-drain design structure. Connect to VCC through a pullup resistor. 16 13 P13 P-port input/output. Open-drain design structure. Connect to VCC through a pullup resistor. 17 14 P14 P-port input/output. Open-drain design structure. Connect to VCC through a pullup resistor. 18 15 P15 P-port input/output. Open-drain design structure. Connect to VCC through a pullup resistor. 19 16 P16 P-port input/output. Open-drain design structure. Connect to VCC through a pullup resistor. 20 17 P17 P-port input/output. Open-drain design structure. Connect to VCC through a pullup resistor. 21 18 A0 Address input 0. Connect directly to VCC or ground. Pullup resistors are not needed. 22 19 SCL Serial clock line. Connect to VCC through a pullup resistor 23 20 SDA Serial data line. Connect to VCC through a pullup resistor. 24 21 VCC Supply voltage Submit Documentation Feedback 3 PCF8575C REMOTE 16-BIT I2C AND SMBus LOW-POWER I/O EXPANDER WITH INTERRUPT OUTPUT www.ti.com SCPS123C – MARCH 2005 – REVISED JULY 2006 LOGIC DIAGRAM (POSITIVE LOGIC) INT A0 A1 A2 SCL SDA PCF8575C 1 Interrupt Logic LP Filter 21 2 P07−P00 3 22 23 I2C Bus Control Input Filter Shift Register I/O Port 16 Bits P17−P10 Write Pulse VCC GND Read Pulse 24 12 Power-On Reset SIMPLIFIED SCHEMATIC DIAGRAM OF EACH P-PORT INPUT/OUTPUT VCC Write Pulse IOHT Data From Shift Register D Q FF P07−P00 CI IOL S Power-On Reset D P17−P10 Q GND FF Read Pulse CI S To Interrupt Logic Data To Shift Register 4 Submit Documentation Feedback REMOTE 16-BIT www.ti.com I2C PCF8575C AND SMBus LOW-POWER I/O EXPANDER WITH INTERRUPT OUTPUT SCPS123C – MARCH 2005 – REVISED JULY 2006 I2C Interface The bidirectional I2C bus consists of the serial clock (SCL) and serial data (SDA) lines. Both lines must be connected to a positive supply via a pullup resistor when connected to the output stages of a device. Data transfer may be initiated only when the bus is not busy. I2C communication with this device is initiated by a master sending a start condition, a high-to-low transition on the SDA input/output while the SCL input is high (see Figure 1). After the start condition, the device address byte is sent, MSB first, including the data direction bit (R/W). This device does not respond to the general call address. After receiving the valid address byte, this device responds with an ACK, a low on the SDA input/output during the high of the ACK-related clock pulse. The address inputs (A2–A0) of the slave device must not be changed between the start and the stop conditions. The data byte follows the address ACK. If the R/W bit is high, the data from this device are the values read from the P port. If the R/W bit is low, the data are from the master, to be output to the P port. The data byte is followed by an ACK sent from this device. If other data bytes are sent from the master, following the ACK, they are ignored by this device. Data are output only if complete bytes are received and acknowledged. The output data is valid at time (tpv) after the low-to-high transition of SCL, during the clock cycle for the ACK. On the I2C bus, only one data bit is transferred during each clock pulse. The data on the SDA line must remain stable during the high pulse of the clock period, as changes in the data line at this time are interpreted as control commands (start or stop) (see Figure 2). A stop condition, a low-to-high transition on the SDA input/output while the SCL input is high, is sent by the master (see Figure 1). The number of data bytes transferred between the start and the stop conditions from transmitter to receiver is not limited. Each byte of eight bits is followed by one ACK bit. The transmitter must release the SDA line before the receiver can send an ACK bit. A slave receiver that is addressed must generate an ACK after the reception of each byte. Also, a master must generate an ACK after the reception of each byte that has been clocked out of the slave transmitter. The device that acknowledges has to pull down the SDA line during the ACK clock pulse so that the SDA line is stable low during the high pulse of the ACK-related clock period (see Figure 3). Setup and hold times must be taken into account. A master receiver must signal an end of data to the transmitter by not generating an acknowledge (NACK) after the last byte that has been clocked out of the slave. This is done by the master receiver by holding the SDA line high. In this event, the transmitter must release the data line to enable the master to generate a stop condition. SDA SCL S P Start Condition Stop Condition Figure 1. Definition of Start and Stop Conditions Submit Documentation Feedback 5 PCF8575C REMOTE 16-BIT I2C AND SMBus LOW-POWER I/O EXPANDER WITH INTERRUPT OUTPUT www.ti.com SCPS123C – MARCH 2005 – REVISED JULY 2006 SDA SCL Data Line Stable; Data Valid Change of Data Allowed Figure 2. Bit Transfer Data Output by Transmitter NACK Data Output by Receiver ACK SCL from Master 1 2 8 9 S Clock Pulse for Acknowledgment Start Condition Figure 3. Acknowledgment on I2C Bus Interface Definition BYTE 6 BIT 7 (MSB) 6 5 4 3 2 1 0 (LSB) I2C slave address L H L L A2 A1 A0 R/W P0x I/O data bus P07 P06 P05 P04 P03 P02 P01 P00 P1x I/O data bus P17 P16 P15 P14 P13 P12 P11 P10 Submit Documentation Feedback REMOTE 16-BIT I2C www.ti.com PCF8575C AND SMBus LOW-POWER I/O EXPANDER WITH INTERRUPT OUTPUT SCPS123C – MARCH 2005 – REVISED JULY 2006 Figure 4 and Figure 5 show the address and timing diagrams for the write and read modes, respectively. Integral Multiples of Two Bytes SCL 1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 ACK From Slave Start Condition R/W S 0 1 0 0 1 2 Data to Port 0 A2 A1 A0 0 A 3 4 5 6 7 8 ACK From Slave ACK From Slave Slave Address (PCF8575C) SDA 8 P07 P06 Data to Port 1 1 P00 A P17 P10 A P05 Write to Port Data A0 and B0 Valid Data Output Voltage tpv P05 Output Voltage IOH P05 Pullup Output Current IOHT INT tir Figure 4. Write Mode (Output) SCL 1 2 3 4 5 6 7 8 R/W SDA S 0 1 0 0 A2 A1 A0 1 1 2 3 4 5 6 7 1 2 3 4 5 6 7 8 ACK From Master ACK From Slave A 8 P07 P06 P05 P04 P03 P02 P01 P00 A ACK From Master P17 P16 P15 P14 P13 P12 P11 P10 A P07 P06 Read From Port Data Into Port P07 to P00 P17 to P10 P07 to P00 th P17 to P10 tsu INT tiv tir tir A low-to-high transition of SDA while SCL is high is defined as the stop condition (P). The transfer of data can be stopped at any moment by a stop condition. When this occurs, data present at the latest ACK phase is valid (output mode). Input data is lost. Figure 5. Read Mode (Input) Submit Documentation Feedback 7 PCF8575C REMOTE 16-BIT I2C AND SMBus LOW-POWER I/O EXPANDER WITH INTERRUPT OUTPUT www.ti.com SCPS123C – MARCH 2005 – REVISED JULY 2006 Address Reference INPUTS I2C BUS SLAVE ADDRESS A2 A1 A0 L L L 32 (decimal), 20 (hexadecimal) L L H 33 (decimal), 21 (hexadecimal) L H L 34 (decimal), 22 (hexadecimal) L H H 35 (decimal), 23 (hexadecimal) H L L 36 (decimal), 24 (hexadecimal) H L H 37 (decimal), 25 (hexadecimal) H H L 38 (decimal), 26 (hexadecimal) H H H 39 (decimal), 27 (hexadecimal) Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VCC Supply voltage range –0.5 6.5 V VI Input voltage range (2) –0.5 VCC + 0.5 V VO Output voltage range (2) –0.5 VCC + 0.5 IIK Input clamp current VI < 0 IOK Output clamp current VO < 0 IOK Input/output clamp current VO < 0 or VO > VCC IOL Continuous output low current VO = 0 to VCC IOH Continuous output high current VO = 0 to VCC Continuous current through VCC or GND θJA Package thermal impedance (3) Tstg (1) (2) (3) mA –20 mA ±400 µA 50 mA –4 mA ±100 mA DB package 63 DBQ package 61 DGV package 86 DW package 46 PW package 88 RGE package 53 RHL package Storage temperature range V –20 °C/W 43 –65 150 °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. The package thermal impedance is calculated in accordance with JESD 51-7. Recommended Operating Conditions 8 MIN MAX 4.5 5.5 A0, A1, A2, SDA, and SCL 0.7 × VCC VCC + 0.5 P07–P00 and P17–P10 0.8 × VCC VCC + 0.5 A0, A1, A2, SDA, and SCL –0.5 0.3 × VCC P07–P00 and P17–P10 –0.5 0.6 × VCC UNIT VCC Supply voltage VIH High-level input voltage VIL Low-level input voltage IOHT P-port transient pullup current –10 mA IOL P-port low-level output current 25 mA TA Operating free-air temperature 85 °C –40 Submit Documentation Feedback V V V REMOTE 16-BIT I2C www.ti.com PCF8575C AND SMBus LOW-POWER I/O EXPANDER WITH INTERRUPT OUTPUT SCPS123C – MARCH 2005 – REVISED JULY 2006 Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VIK Input diode clamp voltage TEST CONDITIONS II = –18 mA VPOR Power-on reset voltage (2) VI = VCC or GND, IOHT P-port transient pullup current High during ACK VOH = GND SDA VOL = 0.4 V IO = 0 VCC MIN 4.5 V to 5.5 V –1.2 VPOR 4.5 V VOL = 0.4 V 4.5 V to 5.5 V VOL = 0.4 V 4.5 V to 5.5 V VI = VCC or GND 4.5 V to 5.5 V P port VI ≥ VCC or VI ≤ GND 4.5 V to 5.5 V Operating mode VI = VCC or GND, IO = 0, fSCL = 400 kHz Standby mode VI = VCC or GND, IO = 0, fSCL = 0 kHz ∆ICC Supply current increase One input at VCC – 0.6 V, Other inputs at VCC or GND 4.5 V to 5.5 V Ci SCL VI = VCC or GND 4.5 V to 5.5 V VIO = VCC or GND 4.5 V to 5.5 V P port INT SCL, SDA II A0, A1, A2 IIHL ICC Cio (1) (2) SDA P port MAX UNIT V 1.2 –0.5 4.5 V to 5.5 V VOL = 1 V IOL TYP (1) 1.8 –1 V mA 3 5 15 10 25 mA 1.6 ±2 ±1 ±400 5.5 V 100 200 2.5 10 3 µA µA µA 200 µA 7 pF 3 7 4 10 pF All typical values are at VCC = 5 V, TA = 25°C. The power-on reset circuit resets the I2C bus logic with VCC < VPOR and sets all I/Os to logic high (with current source to VCC). I2C Interface Timing Requirements over recommended operating free-air temperature range (unless otherwise noted) (see Figure 6) MIN MAX UNIT 400 kHz fscl I2C clock frequency tsch I2C clock high time 0.6 µs tscl I2C clock low time 1.3 µs tsp I2C tsds I2C serial-data setup time tsdh I2C serial-data hold time ticr I2C ticf I2C input fall time tocf I2C output fall time (10-pF to 400-pF bus) tbuf I2C 1.3 µs tsts I2C start or repeated start condition setup 0.6 µs tsth I2C start or repeated start condition hold 0.6 µs tsps I2C stop condition setup 0.6 µs tvd Valid-data time Cb I2C bus capacitive load (1) spike time 50 input rise time ns 0 ns (1) 300 ns 20 + 0.1Cb (1) 300 ns 300 ns 20 + 0.1Cb bus free time between stop and start SCL low to SDA output valid ns 100 1.2 µs 400 pF Cb = total bus capacitance of one bus line in pF Submit Documentation Feedback 9 PCF8575C REMOTE 16-BIT I2C AND SMBus LOW-POWER I/O EXPANDER WITH INTERRUPT OUTPUT www.ti.com SCPS123C – MARCH 2005 – REVISED JULY 2006 Switching Characteristics over recommended operating free-air temperature range, CL ≤ 100 pF (unless otherwise noted) (see Figure 7 and Figure 8) PARAMETER FROM (INPUT) TO (OUTPUT) P port INT 4 µs MIN MAX UNIT tiv Interrupt valid time tir Interrupt reset delay time SCL INT 4 µs tpv Output data valid SCL P port 4 µs tsu Input data setup time P port SCL 0 µs th Input data hold time P port SCL 4 µs 10 Submit Documentation Feedback REMOTE 16-BIT I2C www.ti.com PCF8575C AND SMBus LOW-POWER I/O EXPANDER WITH INTERRUPT OUTPUT SCPS123C – MARCH 2005 – REVISED JULY 2006 TYPICAL OPERATING CHARACTERISTICS TA = 25°C (unless otherwise noted) 100 SCL = VCC All I/Os unloaded 8 Supply Current (µA) 60 50 40 30 6 VCC = 5 V 5 4 3 60 50 40 30 2 20 10 1 10 0 0 −25 0 25 50 75 Temperature (°C) 100 125 0 −50 −25 0 25 50 75 Temperature (°C) 2.0 100 125 2.5 3.5 4.0 4.5 5.0 5.5 I/O High Voltage vs Temperature 400 50 3.0 Supply Voltage (V) I/O Output Low Voltage vs Temperature I/O Sink Current vs Output Low Voltage 500 VCC = 5 V 350 TA = −40_C VCC = 5 V, ISINK = 10 mA 40 VCC − VOH (V) 45 300 35 TA = 25_C VOL (mV) ISINK (mA) 70 20 −50 fSCL = 400 kHz All I/Os unloaded 80 7 VCC = 5 V 70 90 Supply Current (µA) 80 Supply Current (µA) 100 9 fSCL = 400 kHz All I/Os unloaded 90 Supply Current vs Supply Voltage Standby Supply Current vs Temperature Supply Current vs Temperature 30 25 20 TA = 125_C 15 250 200 150 400 300 200 100 100 VCC = 5 V, ISINK = 1 mA 10 VCC = 5 V, ISOURCE = 10 mA 50 5 0 0 0.1 0.2 0.3 VOL (V) 0.4 0.5 0 −50 0 −25 0 25 50 75 100 125 Temperature (°C) Submit Documentation Feedback −50 −25 0 25 50 75 Temperature (°C) 100 125 11 PCF8575C REMOTE 16-BIT I2C AND SMBus LOW-POWER I/O EXPANDER WITH INTERRUPT OUTPUT www.ti.com SCPS123C – MARCH 2005 – REVISED JULY 2006 PARAMETER MEASUREMENT INFORMATION VCC RL = 1 kΩ DUT SDA CL = 50 pF SDA LOAD CONFIGURATION 3 Bytes for Complete Device Programming Stop Condition (P) Start Address Address Condition Bit 7 Bit 6 (S) (MSB) Address Bit 1 tscl R/W Bit 0 (LSB) ACK (A) Data Bit 07 (MSB) Data Bit 10 (LSB) Stop Condition (P) tsch 0.7 × VCC SCL 0.3 × VCC ticr tPHL ticf tbuf tsts tPLH tsp 0.7 × VCC SDA 0.3 × VCC ticr ticf tsth tsdh tsds tsps Repeat Start Condition Start or Repeat Start Condition VOLTAGE WAVEFORMS BYTE DESCRIPTION 1 I2C address 2, 3 P-port data Figure 6. I2C Interface Load Circuit and Voltage Waveforms 12 Submit Documentation Feedback Stop Condition REMOTE 16-BIT I2C www.ti.com PCF8575C AND SMBus LOW-POWER I/O EXPANDER WITH INTERRUPT OUTPUT SCPS123C – MARCH 2005 – REVISED JULY 2006 PARAMETER MEASUREMENT INFORMATION (continued) VCC RL = 4.7 kΩ INT DUT CL = 100 pF INTERRUPT LOAD CONFIGURATION ACK From Slave Start Condition 16 Bits (2 Data Bytes) From Port R/W Slave Address (PCF8575) S 0 1 0 0 A2 A1 A0 1 A 1 2 3 4 A 5 6 7 8 Data 1 ACK From Slave Data 2 Data From Port A Data 3 1 P A tir tir B B INT A tiv tsps A Data Into Port Address Data 1 0.7 × VCC INT 0.3 × VCC SCL Data 2 Data 3 0.7 × VCC R/W tiv A 0.3 × VCC tir 0.7 × VCC Pn 0.7 × VCC INT 0.3 × VCC 0.3 × VCC View A−A View B−B Figure 7. Interrupt Load Circuit and Voltage Waveforms Submit Documentation Feedback 13 PCF8575C REMOTE 16-BIT I2C AND SMBus LOW-POWER I/O EXPANDER WITH INTERRUPT OUTPUT www.ti.com SCPS123C – MARCH 2005 – REVISED JULY 2006 PARAMETER MEASUREMENT INFORMATION (continued) VCC VCC RL = 1 kΩ DUT RL = 4.7 kΩ SDA DUT INT DUT CL = 50 pF CL = 100 pF GND CL = 100 pF GND SDA LOAD CONFIGURATION SCL GND INTERRUPT LOAD CONFIGURATION P-PORT LOAD CONFIGURATION 0.7 × VCC P00 A P17 0.3 × VCC Slave ACK ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ SDA Pn Unstable Data tpv Last Stable Bit Write-Mode Timing (R/W = 0) SCL 0.7 × VCC P00 A tsu P17 0.3 × VCC th 0.7 × VCC Pn 0.3 × VCC Read-Mode Timing (R/W = 1) Figure 8. P-Port Load Circuits and Voltage Waveforms 14 Pn Submit Documentation Feedback REMOTE 16-BIT www.ti.com I2C PCF8575C AND SMBus LOW-POWER I/O EXPANDER WITH INTERRUPT OUTPUT SCPS123C – MARCH 2005 – REVISED JULY 2006 THERMAL PAD MECHANICAL DATA RGE (S-PQFP-N24) Submit Documentation Feedback 15 PCF8575C REMOTE 16-BIT I2C AND SMBus LOW-POWER I/O EXPANDER WITH INTERRUPT OUTPUT SCPS123C – MARCH 2005 – REVISED JULY 2006 THERMAL PAD MECHANICAL DATA RHL (S-PQFP-N24) 16 Submit Documentation Feedback www.ti.com PACKAGE OPTION ADDENDUM www.ti.com 18-Jul-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty PCF8575CDB ACTIVE SSOP DB 24 60 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PCF8575CDBE4 ACTIVE SSOP DB 24 60 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PCF8575CDBQR ACTIVE SSOP/ QSOP DBQ 24 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1YEAR PCF8575CDBQRE4 ACTIVE SSOP/ QSOP DBQ 24 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1YEAR PCF8575CDBQRG4 ACTIVE SSOP/ QSOP DBQ 24 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1YEAR PCF8575CDBR ACTIVE SSOP DB 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PCF8575CDBRE4 ACTIVE SSOP DB 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PCF8575CDGVR ACTIVE TVSOP DGV 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PCF8575CDGVRE4 ACTIVE TVSOP DGV 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PCF8575CDW ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PCF8575CDWE4 ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PCF8575CDWR ACTIVE SOIC DW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PCF8575CDWRE4 ACTIVE SOIC DW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PCF8575CPW ACTIVE TSSOP PW 24 60 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PCF8575CPWE4 ACTIVE TSSOP PW 24 60 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PCF8575CPWR ACTIVE TSSOP PW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PCF8575CPWRE4 ACTIVE TSSOP PW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PCF8575CRGER ACTIVE QFN RGE 24 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1YEAR Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 18-Jul-2006 package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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Addendum-Page 2 MECHANICAL DATA MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,40 0,23 0,13 24 13 0,07 M 0,16 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 0°–8° 1 0,75 0,50 12 A Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,08 14 16 20 24 38 48 56 A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 DIM 4073251/E 08/00 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. Falls within JEDEC: 24/48 Pins – MO-153 14/16/20/56 Pins – MO-194 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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