TMP300 SBOS335A – JUNE 2005 – REVISED SEPTEMBER 2007 1.8V, Resistor-Programmable TEMPERATURE SWITCH and ANALOG OUT TEMPERATURE SENSOR in SC70 FEATURES 1 • • • • • • • • • 2 DESCRIPTION ACCURACY: ±1°C (typical at +25°C) PROGRAMMABLE TRIP POINT PROGRAMMABLE HYSTERESIS: 5°C/10°C OPEN-DRAIN OUTPUTS LOW-POWER: 110μA (max) WIDE VOLTAGE RANGE: +1.8V to +18V OPERATION: –40°C to +150°C ANALOG OUT: 10mV/°C SC70-6 AND SOT23-6 PACKAGES The TMP300 is a low-power, resistor-programmable, digital output temperature switch. It allows a threshold point to be set by adding an external resistor. Two levels of hysteresis are available. The TMP300 has a VTEMP analog output that can be used as a testing point or in temperature-compensation loops. The TMP300 detects temperature with ±4°C accuracy (max) over –40°C to +125°C. With a supply voltage as low as 1.8V and low current consumption, the TMP300 is ideal for power-sensitive systems. APPLICATIONS • • • • POWER-SUPPLY SYSTEMS DC-DC MODULES THERMAL MONITORING ELECTRONIC PROTECTION SYSTEMS Available in two micropackages that have proven thermal characteristics, this part gives a complete and simple solution for users who need simple and reliable thermal management. V+ 3mA TMP300 TSET 1 6 V+ GND 2 5 VTEMP OUT 3 4 HYSTSET Proportional to TA RPULL-UP VTEMP OUT TSET RSET 210kW (1) SC70-6, SOT23-6 TMP300 HYSTSET NOTE: (1) Thinfilm resistor with approximately 10% accuracy; however, this accuracy error is trimmed out at the factory. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2005–2007, Texas Instruments Incorporated TMP300 www.ti.com SBOS335A – JUNE 2005 – REVISED SEPTEMBER 2007 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION (1) (1) (2) PRODUCT PACKAGE-LEAD PACKAGE DESIGNATOR TMP300 SC70-6 DCK PACKAGE MARKING BPN TMP300 SOT23-6 (2) DBV T300 For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Available 4Q, 2007. ABSOLUTE MAXIMUM RATINGS (1) Supply Voltage (V+) Signal Input Terminals, Voltage (2) Signal Input Terminals, Current (2) VALUE UNIT +18 V –0.5 to (V+) + 0.5 V ±10 mA Output Short-Circuit (ISC) (3) Continuous Open-Drain Output (V+) + 0.5 V Operating Temperature –40 to +150 °C Storage Temperature –55 to +150 °C +150 °C Human Body Model (HBM) 4000 V Charged Device Model (CDM) 1000 V Junction Temperature (TJ) ESD Rating (1) (2) (3) 2 Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not supported. Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails should be current limited to 10mA or less. Short-circuit to ground. Submit Documentation Feedback Copyright © 2005–2007, Texas Instruments Incorporated Product Folder Link(s): TMP300 TMP300 www.ti.com SBOS335A – JUNE 2005 – REVISED SEPTEMBER 2007 ELECTRICAL CHARACTERISTICS At VS = 3.3V and TA = –40°C to +125°C, unless otherwise noted. TMP300 PARAMETER TEST CONDITIONS MIN (1) VS = 2.35V to 18V VS = 1.8V to 2.35V TYP (1) MAX (1) UNIT –40 +125 °C –40 100(VS – 0.95) °C TEMPERATURE MEASUREMENT Measurement Range TRIP POINT Total Accuracy TA = –40°C to +125°C ±2 RSET Equation TC is in °C RSET = 10 (50 + TC)/3 ±4 °C kΩ HYSTERESIS SET INPUT LOW Threshold 0.4 HIGH Threshold VS – 0.4 Threshold Hysteresis V V HYSTSET = GND 5 °C HYSTSET = VS 10 °C DIGITAL OUTPUT Logic Family CMOS OUT = VS 10 μA VS = 1.8V to 18V, ISINK = 5mA 0.3 V Open-Drain Leakage Current Logic Levels VOL ANALOG OUTPUT Accuracy ±2 Temperature Sensitivity 10 Output Voltage TA = +25°C 720 VTEMP Pin Output Resistance 750 ±3 °C mV/°C 780 210 mV kΩ POWER SUPPLY Quiescent Current (2) IQ VS = 1.8V to 18V, TA = –40°C to +125°C 110 μA TEMPERATURE RANGE Specified Range Operating Range Thermal Resistance, VS = 2.35V to 18V –40 +125 °C VS = 1.8V to 2.35V –40 100(VS – 0.95) °C VS = 2.35V to 18V –40 +150 °C VS = 1.8V to 2.35V –50 100(VS – 0.95) °C θJA SC70 SOT23-6 (1) (2) (3) (3) 250 °C/W 180 °C/W 100% of production is tested at TA = +85°C. Specifications over temperature range are ensured by design. See Figure 1 for typical quiescent current. Available Q4, 2007. Submit Documentation Feedback Copyright © 2005–2007, Texas Instruments Incorporated Product Folder Link(s): TMP300 3 TMP300 www.ti.com SBOS335A – JUNE 2005 – REVISED SEPTEMBER 2007 TYPICAL CHARACTERISTICS At VS = 5V, unless otherwise noted. QUIESCENT CURRENT OVER TEMPERATURE AND SUPPLY RSET SHIFT DUE TO RSET TOLERANCE 95 2.0 TERROR + 1% 1.5 85 1.0 75 Error (°C) IQ (mA) VS = 18V VS = 3.3V 65 VS = 1.8V 0.5 TERROR + 0.1% 0 TERROR - 0.1% -0.5 -1.0 55 -1.5 45 -40 -25 0 25 50 75 100 TERROR - 1% -2.0 -40 -25 125 Figure 1. Figure 2. 4.0 600 3.0 100 125 100 125 2.0 Error (°C) RSET (kW) 75 TYPICAL TRIP ERROR 700 500 400 300 200 1.0 0 -1.0 -2.0 100 -3.0 0 -40 -25 0 25 50 75 100 -4.0 -40 -25 125 25 50 Temperature (°C) Figure 3. Figure 4. 75 ANALOG PSR OVER TEMPERATURE 3.0 0.10 2.5 0.08 2.0 1.5 0.06 0.04 Error (°C/V) 1.0 0.5 0 -0.5 -1.0 -1.5 -2.0 -2.5 -3.0 -40 -25 0 Temperature (°C) TYPICAL ANALOG OUTPUT ERROR Error (°C) 50 Temperature (°C) RSET vs TEMPERATURE TMAX is +85°C for VS = 1.8V to 3.3V 0.02 0 3.3V to 18V -0.02 -0.04 -0.06 -0.08 0 25 50 75 100 125 -0.10 -40 -25 Temperature (°C) 0 25 50 75 100 125 Temperature (°C) Figure 5. 4 25 0 Temperature (°C) Figure 6. Submit Documentation Feedback Copyright © 2005–2007, Texas Instruments Incorporated Product Folder Link(s): TMP300 TMP300 www.ti.com SBOS335A – JUNE 2005 – REVISED SEPTEMBER 2007 TYPICAL CHARACTERISTICS (continued) At VS = 5V, unless otherwise noted. TRIP PSR OVER TEMPERATURE 0.10 0.08 0.06 Error (°C/V) 0.04 0.02 3.3V to 18V 0 -0.02 -0.04 -0.06 TMAX is +85°C for VS = 1.8V to 3.3V -0.08 -0.10 -40 -25 0 25 50 75 100 125 Temperature (°C) Figure 7. Submit Documentation Feedback Copyright © 2005–2007, Texas Instruments Incorporated Product Folder Link(s): TMP300 5 TMP300 www.ti.com SBOS335A – JUNE 2005 – REVISED SEPTEMBER 2007 APPLICATIONS INFORMATION To set the TMP300 to trip at a preset value, calculate the RSET resistor value according to Equation 1 or Equation 2: (TSET ´ 0.01 + 0.5) RSET = 3e-6 (1) The TMP300 is a thermal sensor designed for over-temperature protection circuits in electronic systems. The TMP300 uses a set resistor to program the trip temperature of the digital output. An additional high-impedance (210kΩ) analog voltage output provides the temperature reading. Where TSET is in °C; or 10(50 + TSET) RSET in kW = 3 CALCULATING RSET The set resistor (RSET) provides a threshold voltage for the comparator input. The TMP300 trips when the VTEMP pin exceeds the TSET voltage. The value of the set resistor is determined by the analog output function and the 3μA internal bias current. (2) Where TSET is in °C. USING VTEMP TO TRIP THE DIGITAL OUTPUT The analog voltage output can also serve as a voltage input that forces a trip of the digital output to simulate a thermal event. This simulation facilitates easy system design and test of thermal safety circuits, as shown in Figure 8. V+ 3m A Voltage source to test trip point. Proportional to TA VTEMP OUT Open-Drain Control TSET RINT 210kW RSET TMP300 HYSTSET Figure 8. Applying Voltage to Trip Digital Output 6 Submit Documentation Feedback Copyright © 2005–2007, Texas Instruments Incorporated Product Folder Link(s): TMP300 TMP300 www.ti.com SBOS335A – JUNE 2005 – REVISED SEPTEMBER 2007 ANALOG TEMPERATURE OUTPUT USING A DAC TO SET THE TRIP POINT The analog out or VTEMP pin is high-impedance (210kΩ). Avoid loading this pin to prevent degrading the analog out value or trip point. Buffer the output of this pin when using it for direct thermal measurement. Figure 9 shows buffering of the analog output signal. The trip point is easily converted by changing the digital-to-analog converter (DAC) code. This technique can be useful for control loops where a large thermal mass is being brought up to the set temperature and the OUT pin is used to control the heating element. The analog output can be monitored in a control algorithm that adjusts the set temperature to prevent overshoot. Trip set voltage error versus temperature is shown in Figure 10, which shows error in °C of the comparator input over temperature. An alternative method of setting the trip point by using a DAC is shown in Figure 11. Analog Out OPA335 V+ 1.00 Proportional to TA 0.75 VTEMP Trip Set Voltage Error (°C) 3mA OUT TSET 210kW TMP300 0.50 0.25 0 -0.25 -0.50 -0.75 HYSTSET -1.00 -50 0 -25 Figure 9. Buffering the Analog Output Signal 25 50 75 100 125 Temperature (°C) Figure 10. Trip Set Voltage Error vs Temperature V+ 3m A Voltage source to test trip point. Proportional to TA VTEMP OUT Open-Drain Control TSET 210kW DAC8560 TMP300 HYSTSET Figure 11. DAC Generates the Voltage-Driving TSET Pin Submit Documentation Feedback Copyright © 2005–2007, Texas Instruments Incorporated Product Folder Link(s): TMP300 7 TMP300 www.ti.com SBOS335A – JUNE 2005 – REVISED SEPTEMBER 2007 HYSTERESIS The hysteresis pin has two settings. Grounding HYSTSET results in 5°C of hysteresis. Connecting it to VS results in 10°C of hysteresis. Hysteresis error variation over temperature is shown in Figure 12 and Figure 13. Bypass capacitors should be used on the supplies as well as on the RSET and analog out (VTEMP) pins when in noisy environments, as shown in Figure 14. These capacitors reduce premature triggering of the comparator. 5 4 5 3 4 2 Error (°C) 2 Error (°C) 3 Maximum 1 0 Maximum 1 0 -1 Average -2 -1 Average -2 Minimum Minimum -3 -4 -3 -5 -50 -4 -5 -50 -25 25 0 50 75 100 25 0 50 75 100 125 Temperature (°C) 125 Temperature (°C) -25 Figure 13. 10°C Hysteresis Error vs Temperature Figure 12. 5°C Hysteresis Error vs Temperature V+ 3m A Proportional to TA VTEMP OUT Open-Drain Control TSET CBYPASS CBYPASS 210kW RSET TMP300 HYSTSET Figure 14. Bypass Capacitors Prevent Early Comparator Toggling Due to Circuit Board Noise 8 Submit Documentation Feedback Copyright © 2005–2007, Texas Instruments Incorporated Product Folder Link(s): TMP300 PACKAGE OPTION ADDENDUM www.ti.com 8-Jul-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TBD Lead/Ball Finish Call TI MSL Peak Temp (3) TMP300AIDBVR PREVIEW SOT-23 DBV 6 3000 TMP300AIDCKR ACTIVE SC70 DCK 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Call TI Level-1-260C-UNLIM TMP300AIDCKRG4 ACTIVE SC70 DCK 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TMP300AIDCKT ACTIVE SC70 DCK 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TMP300AIDCKTG4 ACTIVE SC70 DCK 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 5-Jun-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TMP300AIDCKR SC70 DCK 6 3000 179.0 8.4 2.2 2.5 1.2 4.0 8.0 Q3 TMP300AIDCKT SC70 DCK 6 250 179.0 8.4 2.2 2.5 1.2 4.0 8.0 Q3 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 5-Jun-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TMP300AIDCKR SC70 DCK 6 3000 195.0 200.0 45.0 TMP300AIDCKT SC70 DCK 6 250 220.0 205.0 50.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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