TPS3779 TPS3780 www.ti.com SBVS216B – SEPTEMBER 2012 – REVISED MAY 2013 Low-Power, Dual-Voltage Detector in Small µSON Package Check for Samples: TPS3779, TPS3780 FEATURES DESCRIPTION • • • The TPS3779 and TPS3780 are a family of twochannel voltage detectors with low-power and highaccuracy comparators, and are available in a very small µSON package. The SENSE1 and SENSE2 inputs include a built-in hysteresis for filtering to reject brief glitches, thereby ensuring stable output operation without false triggering. This family offers different factory-set hysteresis options of 0.5%, 1%, 5%, or 10%. 1 2 • • • • Very Small Package: 1.45-mm × 1-mm µSON Low Quiescent Current: 1.8 µA (typ) High Threshold and Hysteresis Accuracy: 1.0% Adjustable Thresholds Different Hysteresis Options: – 0.5%, 1%, 5%, and 10% Temperature Range: –40°C to +125°C Push-Pull (TPS3779) and Open-Drain (TPS3780) Output Options The TPS3779 and TPS3780 have adjustable SENSE inputs that can be configured by an external resistor divider. When the voltage at the SENSE1 or SENSE2 input goes below the falling threshold, OUT1 or OUT2 is driven low, respectively. When SENSE1 or SENSE2 rises above the rising threshold, OUT1 or OUT2 goes high, respectively. APPLICATIONS • • • • • DSPs, Microcontrollers, or Microprocessors Applications Portable and Battery-Powered Products Cell Phones and PDAs Notebook and Desktop Computers Set-Top Boxes The devices have a very low quiescent current of 1.8 µA (typical) and provide a precise, spaceconscious solution for voltage detection suitable for low-power system-monitoring and portable applications. The TPS3779 and TPS3780 operate from 1.5 V to 6.5 V, over the –40°C to +125°C temperature range. IN DRY PACKAGE 1.45-mm ´ 1-mm SON (TOP VIEW) SENSE1 SENSE1 1 6 VCC GND 2 5 OUT1 SENSE2 3 4 OUT2 VCC1 VCC OUT1 RST OUT2 INT TPS3779 V2 SENSE2 GND DSP CPU FPGA GND 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2012–2013, Texas Instruments Incorporated TPS3779 TPS3780 SBVS216B – SEPTEMBER 2012 – REVISED MAY 2013 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. DEVICE INFORMATION PRODUCT HYSTERESIS (%) OUTPUT TPS3779A 0.5 Push-pull TPS3779B 5 Push-pull TPS3779C 10 Push-pull TPS3779D 1 Push-pull TPS3780A 0.5 Open-drain TPS3780B 5 Open-drain TPS3780C 10 Open-drain TPS3780D 1 Open-drain ABSOLUTE MAXIMUM RATINGS (1) Over operating free-air temperature range, unless otherwise noted. Voltage (2) Current Electrostatic discharge (ESD) ratings (2) (3) UNIT –0.3 to +7 V OUT1, OUT2 –0.3 to +7 V SENSE1, SENSE2 –0.3 to +7 V ±20 mA Operating junction, TJ –40 to +125 °C Storage, Tstg –65 to +150 °C 2 kV 500 V OUT pin Temperature (3) (1) VALUE VCC Human body model (HBM) Charge device model (CDM) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to absolute maximum- rated conditions for extended periods my affect device reliability. All voltages are with respect to the network ground terminal. As a result of the low dissipated power in this device, it is assumed that TJ = TA. THERMAL INFORMATION THERMAL METRIC (1) TPS3779 TPS3780 DRY (µSON) UNITS 6 PINS θJA Junction-to-ambient thermal resistance 306.7 θJCtop Junction-to-case (top) thermal resistance 174.1 θJB Junction-to-board thermal resistance 173.4 ψJT Junction-to-top characterization parameter 30.9 ψJB Junction-to-board characterization parameter 171.6 θJCbot Junction-to-case (bottom) thermal resistance 65.2 (1) 2 °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: TPS3779 TPS3780 TPS3779 TPS3780 www.ti.com SBVS216B – SEPTEMBER 2012 – REVISED MAY 2013 ELECTRICAL CHARACTERISTICS All specifications are over the operating temperature range of –40°C < TJ < +125°C and 1.5 V ≤ VCC ≤ 6.5 V, unless otherwise noted. Typical values are at TJ = +25°C and VCC = 3.3 V. PARAMETER VCC TEST CONDITIONS Input supply range V(POR) Power-on reset voltage MIN (1) Supply current (into VCC pin) 1.8 VCC = 3.3 V, no load, –40°C < TJ < +125°C VCC = 6.5 V, no load, –40°C < TJ < +85°C MAX UNIT 6.5 VOL (max) = 0.2 V, IOL = 15 µA VCC = 3.3 V, no load, –40°C < TJ < +85°C ICC TYP 1.5 2 VCC = 6.5 V, no load, –40°C < TJ < +125°C V 0.8 V 3.3 µA 4.5 µA 3.5 µA 5 µA 1.20 Positive-going input threshold voltage VIT+ V(SENSE) rising 0°C < TJ < +85°C –1% –40°C < TJ < +125°C –1% TPS37xxA (0.5% hysteresis) Negative-going input threshold voltage I(SENSE) VOL Input current (2) Low-level output voltage V(SENSE) falling +1.3% 1.194 V 1.14 V TPS37xxC (10% hysteresis) 1.08 V TPS37xxD (1% hysteresis) 1.188 V TPS37xxB (5% hysteresis) VIT– TPS37xxA, TPS37xxD, 0°C < TJ < +85°C –1% +1% TPS37xxA, TPS37xxD, –40°C < TJ < +125°C –1% +1.3% TPS37xxB, TPS37xxC, –40°C < TJ < +125°C –1.3% +1.3% V(SENSE) = 0 V or VCC 5 nA VCC ≥ 1.2 V, ISINK = 0.4 mA –5 0.25 V VCC ≥ 2.7 V, ISINK = 2 mA 0.25 V 0.3 V VCC ≥ 4.5 V, ISINK = 3.2 mA High-level output voltage (push-pull) VOH Ilkg(OD) Open-drain output leakage current V +1% VCC ≥ 1.7 V, ISINK = 0.4 mA 0.8 VCC V VCC ≥ 2.7 V, ISINK = 1 mA 0.8 VCC V VCC ≥ 4.5 V, ISINK = 2.5 mA 0.8 VCC V High impedance, V(SENSE_OUT) = 6.5 V, –40°C < TJ < +85°C –50 50 nA High impedance, V(SENSE_OUT) = 6.5 V, –40°C < TJ < +125°C –250 250 nA tPD(r) SENSE (rising) to OUT propagation delay 4 µs tPD(f) SENSE (falling) to OUT propagation delay 6 µs 350 µs Startup delay (1) (2) (3) (3) (2) The lowest supply voltage (VCC) at which the output is active (trise(VCC) > 15 µs/V). Below V(POR), the output cannot be determined. Specified by design. During power-up, VCC must exceed 1.5 V for the start-up delay time before the output is in the correct state. Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: TPS3779 TPS3780 3 TPS3779 TPS3780 SBVS216B – SEPTEMBER 2012 – REVISED MAY 2013 www.ti.com PIN CONFIGURATION DRY PACKAGE 1.45-mm × 1-mm USON (TOP VIEW) SENSE1 1 6 VCC GND 2 5 OUT1 SENSE2 3 4 OUT2 PIN DESCRIPTIONS PIN DESCRIPTION NAME NO. GND 2 Ground OUT2 4 OUT2 is the output for SENSE2. OUT2 is asserted (driven low) when the voltage at SENSE2 falls below VIT–. OUT2 is deasserted (goes high) after SENSE2 rises higher than VIT+. OUT2 is a push-pull output for the TPS3779 and an open-drain output for the TPS3780. The open-drain device (TPS3780) can be pulled up to 6.5 V independent of VCC; a pull-up resistor is required for this device. OUT1 5 OUT1 is the output for SENSE1. OUT1 is asserted (driven low) when the voltage at SENSE1 falls below VIT–. OUT1 is deasserted (goes high) after SENSE1 rises higher than VIT+. OUT1 is a push-pull output for the TPS3779 and an open-drain output for the TPS3780. The open-drain device (TPS3780) can be pulled up to 6.5 V independent of VCC; a pull-up resistor is required for this device. SENSE1 1 This pin is connected to the voltage to be monitored with the use of an external resistor divider. When the voltage at this terminal drops below the threshold voltage (VIT–), OUT1 is asserted. SENSE2 3 This pin is connected to the voltage to be monitored with the use of an external resistor divider. When the voltage at this terminal drops below the threshold voltage (VIT–), OUT2 is asserted. VCC 6 Supply voltage input. Connect a 1.5-V to 6.5-V supply to VCC in order to power the device. It is good analog design practice to place a 0.1-µF ceramic capacitor close to this pin. FUNCTIONAL BLOCK DIAGRAM VCC SENSE1 OUT1 SENSE2 OUT2 Hysteresis Logic and Control GND 1.22 V Figure 1. Block Diagram 4 Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: TPS3779 TPS3780 TPS3779 TPS3780 www.ti.com SBVS216B – SEPTEMBER 2012 – REVISED MAY 2013 TYPICAL CHARACTERISTICS At TJ = +25°C and VCC = 3.3 V, unless otherwise noted 4 0ƒC 25ƒC 85ƒC 105ƒC 125ƒC 1.214 SENSE1, Vcc = 1.5 V 1.21 SENSE1, Vcc = 6.5 V 3 SENSE2, Vcc = 1.5 V 1.206 2.5 VIT+ (V) Supply Current (µA) 3.5 ±40ƒC 2 1.5 SENSE2, Vcc = 6.5 V 1.202 1.198 1 1.194 0.5 0 1.19 0 1 2 3 4 5 6 Supply Voltage (V) -50 7 -25 50 75 100 125 C002 Figure 3. SENSE THRESHOLD (VIT+) vs TEMPERATURE 0.35 0.4 ±40ƒC SENSE1, Vcc = 1.5 V 0.3 0ƒC 0.3 SENSE1, Vcc = 6.5 V 25ƒC 0.2 0.1 SENSE2, Vcc = 1.5 V 0.25 SENSE2, Vcc = 6.5 V 0.2 VOL (V) Change in VIT± (%) 25 Temperature (ƒC) Figure 2. SUPPLY CURRENT vs SUPPLY VOLTAGE 0 85ƒC 105ƒC 125ƒC 0.15 -0.1 0.1 -0.2 0.05 -0.3 -0.4 0 -50 -25 0 25 50 75 100 Temperature (ƒC) 0 125 0.5 1 1.5 2 Output Sink Current (mA) C003 C004 Figure 4. SENSE THRESHOLD (VIT–) vs TEMPERATURE Figure 5. OUTPUT VOLTAGE LOW vs OUTPUT CURRENT (VCC = 1.5 V) 0.35 0.35 ±40ƒC 0ƒC 0.3 0ƒC 25ƒC 0.25 85ƒC 85ƒC VOL (V) 105ƒC 0.2 ±40ƒC 0.3 25ƒC 0.25 VOL (V) 0 C001 125ƒC 0.15 0.2 125ƒC 0.15 0.1 0.1 0.05 0.05 0 105ƒC 0 0 0.5 1 1.5 2 2.5 Output Sink Current (mA) 3 0 0.5 Figure 6. OUTPUT VOLTAGE LOW vs OUTPUT CURRENT (VCC = 3.3 V) 1 1.5 2 2.5 3 3.5 Output Sink Current (mA) C005 4 C006 Figure 7. OUTPUT VOLTAGE LOW vs OUTPUT CURRENT (VCC = 6.5 V) Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: TPS3779 TPS3780 5 TPS3779 TPS3780 SBVS216B – SEPTEMBER 2012 – REVISED MAY 2013 www.ti.com TYPICAL CHARACTERISTICS (continued) At TJ = +25°C and VCC = 3.3 V, unless otherwise noted 1.6 3.4 3.3 3.2 1.2 VOH (V) VOH (V) 1.4 ±40ƒC 3.1 1 ±40ƒC 3 0ƒC 0ƒC 25ƒC 2.9 25ƒC 85ƒC 2.8 85ƒC 125ƒC 125ƒC 0.8 2.7 0.1 0.2 0.3 0.4 0.5 Output Source Current (mA) 0 1.2 1.6 2 C008 Figure 9. OUTPUT VOLTAGE HIGH vs OUTPUT CURRENT (VCC = 3.3 V) 6.5 5 6.4 4 6.3 3 tPD(r) (µs) VOH (V) 0.8 Output Source Current (mA) Figure 8. OUTPUT VOLTAGE HIGH vs OUTPUT CURRENT (VCC = 1.5 V) ±40ƒC 6.2 0.4 C007 0ƒC 2 25ƒC 6.1 1 85ƒC Vcc = 1.5 V Vcc = 6.5 V 125ƒC 6 0 0 0.5 1 1.5 2 2.5 3 Output Source Current (mA) -50 -25 0 25 50 75 100 Temperature (ƒC) C009 Figure 10. OUTPUT VOLTAGE HIGH vs OUTPUT CURRENT (VCC = 6.5 V) 125 C010 Figure 11. PROPAGATION DELAY FROM SENSE HIGH TO OUTPUT HIGH (SENSE1 and SENSE2 = 0 V to 1.3 V) 10 tPD(f) (µs) 8 6 4 Vcc = 1.5 V 2 Vcc = 6.5 V 0 -50 -25 0 25 50 75 Temperature (ƒC) 100 125 C011 Figure 12. PROPAGATION DELAY FROM SENSE LOW TO OUTPUT LOW (SENSE1 and SENSE2 = 1.3 V to 0 V) 6 Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: TPS3779 TPS3780 TPS3779 TPS3780 www.ti.com SBVS216B – SEPTEMBER 2012 – REVISED MAY 2013 DETAILED DESCRIPTION OVERVIEW The TPS3779 and TPS3780 belong to a family of ultrasmall, low quiescent current (ICC), dual-channel voltage detectors. These devices have high-accuracy, rising and falling input thresholds, and assert the output as shown in Table 1. The output (OUTx pin) goes low when the SENSEx pin is less than VIT– and goes high when the pin is greater than VIT+. The TPS3779 and TPS3780 offer multiple hysteresis options from 0.5% to 10% for use in wide variety of applications. These devices have two independent voltage detection channels that can be used in systems where multiple voltage rails are required to be monitored, or where one channel can be used as an early warning signal and the other channel used as the system reset signal. Table 1. TPS33779, TPS3780 Truth Table CONDITIONS OUTPUT SENSE1 < VIT– OUT1 = low SENSE2 < VIT– OUT2 = low SENSE1 > VIT+ OUT1 = high SENSE2 > VIT+ OUT2 = high INPUTS (SENSE1, SENSE2) The TPS3779 and TPS3780 have two comparators for voltage detection. Each comparator has one external input; the other input is connected to the internal reference. The comparator rising threshold is designed and trimmed to be equal to VIT+ and the falling threshold is trimmed to be equal to VIT–. The built-in falling hysteresis options make the devices immune to supply rail noise and ensures stable operation. The comparator inputs can swing from ground to 6.5 V, regardless of the device supply voltage used. Although not required in most cases, it is good analog design practice to place a 1-nF to 10-nF bypass capacitor at the comparator input for extremely noisy applications in order to reduce sensitivity to transients and layout parasitic. For each SENSE input, the corresponding output (OUTx) is driven to logic low when the input voltage drops below VIT–. When the voltage exceeds VIT+, the output (OUTx) goes to a high-impedance state, as shown in Figure 13. VCC V(POR) VIT+ SENSEx OUTx Hysteresis tpd(r) VIT- tpd(f) Figure 13. Timing Diagram Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: TPS3779 TPS3780 7 TPS3779 TPS3780 SBVS216B – SEPTEMBER 2012 – REVISED MAY 2013 www.ti.com The TPS3779 and TPS3780 also have adjustable sense inputs that can be configured to monitor voltages using external resistor divider, as shown in Figure 14. VCC V1 VCC R1_V1 OUT1 SENSE1 TPS3780 R1_V2 OUT2 SENSE2 V2 R2_V1 To System Reset R2_V2 GND Figure 14. Application Diagram The resistor divider values and target threshold voltage can be calculated by using Equation 1 and Equation 2 to determine VMON(no UV) and VMON(UV), respectively. R1 · § VMON(UV) = ¨ 1 + × VIT R2 ¸¹ © (1) R1 · § VMON(no UV) = ¨ 1 + ¸ × VIT+ R2 © ¹ (2) Where: • • • R1 and R2 are the resistor values for the resistor divider on the SENSEx pins. VMON(UV) is the target voltage at which an undervoltage condition is detected. VMON(no UV) is the target voltage at which an undervoltage condition is removed when VMON rises. Choose RTOTAL ( = R1 + R2) so that the current through the divider is approximately 100 times higher than the input current at the SENSEx pins. The resistors can have high values to minimize current consumption as a result of low input bias current without adding significant error to the resistive divider. For details on sizing input resistors, refer to Application Report SLVA450, Optimizing Resistor Dividers at a Comparator Input, available for download from www.ti.com. 8 Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: TPS3779 TPS3780 TPS3779 TPS3780 www.ti.com SBVS216B – SEPTEMBER 2012 – REVISED MAY 2013 OUTPUTS (OUT1, OUT2) In a typical device application, the outputs are connected to a reset or enable input of the processor, such as a digital signal processor (DSP), central processing unit (CPU), field-programmable gate array (FPGA), or application-specific integrated circuit (ASIC); or the outputs are connected to the enable input of a voltage regulator, such as a dc-dc or low-dropout (LDO) regulator. The TPS3779 provides two push-pull outputs. The logic high level of the outputs is determined by the VCC pin voltage. With this configuration, pull-up resistors are not required and some board area can be saved. However, all interface logic levels should be examined. All OUT connections must be compatible with the VCC pin logic level. The TPS3780 provides two open-drain outputs (OUT1 and OUT2); pull-up resistors must be used to hold these lines high when the output goes to a high impedance condition (not asserted). By connecting pull-up resistors to the proper voltage rails, the outputs can be connected to other devices at correct interface voltage levels. The outputs can be pulled up to 6.5 V, independent of the device supply voltage. To ensure proper voltage levels, make sure to choose the correct pull-up resistor values. The pull-up resistor value is determined by VOL, the sink current capability, and the output leakage current (Ilkg(OD)). These values are specified in the Electrical Characteristics table. By using wired-AND logic, OUT1 and OUT2 can be merged into one logic signal. The Inputs (SENSE1, SENSE2) section describes how the outputs are asserted or deasserted. Refer to Figure 13 for a description of the relationship between threshold voltages and the respective output. Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: TPS3779 TPS3780 9 TPS3779 TPS3780 SBVS216B – SEPTEMBER 2012 – REVISED MAY 2013 www.ti.com REVISION HISTORY NOTE: Page numbers for previous revisions may differ from the page numbers in the current version. Changes from Revision A (March 2013) to Revision B • Changed VIT– parameter in Electrical Characteristics table .................................................................................................. 3 Changes from Original (September 2012) to Revision A • 10 Page Page Changed data sheet from product preview to production data ............................................................................................. 1 Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: TPS3779 TPS3780 PACKAGE OPTION ADDENDUM www.ti.com 9-May-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) TPS3779ADRYR PREVIEW SON DRY 6 5000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 ZQ TPS3779ADRYT PREVIEW SON DRY 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 ZQ TPS3779BDRYR PREVIEW SON DRY 6 5000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 ZR TPS3779BDRYT PREVIEW SON DRY 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 ZR TPS3779CDRYR PREVIEW SON DRY 6 5000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 ZT TPS3779CDRYT PREVIEW SON DRY 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 ZT TPS3779DDRYR PREVIEW SON DRY 6 5000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 ZS TPS3779DDRYT PREVIEW SON DRY 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 ZS TPS3780ADRYR ACTIVE SON DRY 6 5000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 ZU TPS3780ADRYT ACTIVE SON DRY 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 ZU TPS3780BDRYR PREVIEW SON DRY 6 5000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 ZV TPS3780BDRYT PREVIEW SON DRY 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 ZV TPS3780CDRYR PREVIEW SON DRY 6 5000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 ZW TPS3780CDRYT PREVIEW SON DRY 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 ZW TPS3780DDRYR PREVIEW SON DRY 6 5000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 ZX TPS3780DDRYT PREVIEW SON DRY 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 ZX (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 9-May-2013 LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 22-Jun-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TPS3780ADRYR SON DRY 6 5000 179.0 8.4 1.2 1.65 0.7 4.0 8.0 Q1 TPS3780ADRYT SON DRY 6 250 179.0 8.4 1.2 1.65 0.7 4.0 8.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 22-Jun-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPS3780ADRYR SON DRY 6 5000 203.0 203.0 35.0 TPS3780ADRYT SON DRY 6 250 203.0 203.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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