BB OPA2369AIDGKT

OPA369
OPA2369
SBOS414A – AUGUST 2007 – REVISED SEPTEMBER 2007
1.8V, 1μA max, Zerø-Crossover
RAIL-TO-RAIL I/O OPERATIONAL AMPLIFIER
FEATURES
DESCRIPTION
1
•
•
•
•
•
•
2
ZERØ-CROSSOVER
LOW POWER: 1μA (max)
LOW OFFSET VOLTAGE: 750μV (max)
LOW VOLTAGE SUPPLY: +1.8V to +5.5V
LOW OFFSET DRIFT: 1.75μV/°C (max)
microSIZE PACKAGES:
– SC70-5, SOT23-8, MSOP-8
The OPA369 and OPA2369 are new low-power,
low-voltage operational amplifiers from Texas
Instruments designed especially for battery-powered
applications.
The OPAx369 operates on a supply voltage as low as
1.8V and has true rail-to-rail operation that makes it
useful for a wide range of applications. The
zero-crossover feature resolves the problem of input
crossover distortion that becomes very prominent in
low voltage (< 3V), rail-to-rail input applications.
APPLICATIONS
•
•
•
•
BATTERY-POWERED INSTRUMENTS
PORTABLE DEVICES
MEDICAL INSTRUMENTS
TEST EQUIPMENT
In addition to microsize packages and very low
quiescent current (1μA, max) the OPAx369 features
12kHz bandwidth, low offset drift (1.75μV/°C, max),
and low 0.1Hz to 10Hz noise (3.6μVPP).
The OPA369 (single version, available Q4 2007) is
offered in an SC70-5 package. The OPA2369 (dual
version) comes in both MSOP-8 and SOT23-8
packages.
hi laurie
OFFSET VOLTAGE
vs COMMON-MODE VOLTAGE
(VS = 1.8V)
200
Offset Voltage (mV)
150
100
OPA369
50
0
-50
Competition
-100
-150
-200
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
Common-Mode Voltage (V)
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007, Texas Instruments Incorporated
OPA369
OPA2369
www.ti.com
SBOS414A – AUGUST 2007 – REVISED SEPTEMBER 2007
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ABSOLUTE MAXIMUM RATINGS (1)
Over operating free-air temperature range (unless otherwise noted).
Supply Voltage, VS = (V+) – (V–)
Single Input
Terminals
VALUE
UNIT
+7V
V
Voltage (2)
–0.5 to (V+) + 0.5
V
Current (2)
±10
mA
Output Short-Circuit (3)
Continuous
Operating Temperature, TA
–55 to +125
°C
Storage Temperature, TA
–65 to +150
°C
Junction Temperature, TJ
+150
°C
Human Body Model (HBM)
4000
V
Charged Device Model (CDM)
1000
V
Machine Model (MM)
200
V
ESD Ratings
(1)
(2)
(3)
Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not supported.
Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails should
be current limited to 10mA or less.
Short-circuit to VS/2, one amplifier per package.
PACKAGE/ORDERING INFORMATION (1)
PRODUCT
PACKAGE-LEAD
PACKAGE DESIGNATOR
OPA369
SC70-5 (2)
DCK
CJS
MSOP-8
DGK
OCCQ
SOT23-8
DCN
OCBQ
OPA2369
(1)
(2)
PACKAGE MARKING
For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Available Q4, 2007.
PIN CONFIGURATIONS
OPA369(1)
SC70-5
(TOP VIEW)
(1)
2
+IN
1
V-
2
-IN
3
OPA2369
MSOP-8, SOT23-8
(TOP VIEW)
5
V+
4
OUT
Out A
1
8
V+
-In A
2
7
Out B
+In A
3
6
-In B
V-
4
5
+In B
Available Q4, 2007.
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SBOS414A – AUGUST 2007 – REVISED SEPTEMBER 2007
ELECTRICAL CHARACTERISTICS: VS = +1.8V to +5.5V
BOLDFACE limits apply over the specified temperature range, TA = –40°C to +85°C.
At TA = +25°C, RL = 100kΩ connected to VS/2, unless otherwise noted.
OPA369 (1), OPA2369
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNIT
VOS
250
750
μV
1
mV
dVOS/dT
0.4
1.75
μV/°C
VS = 1.8V to 5.5V
5
20
μV/V
dc
0.1
μV/V
f = 1kHz
120
dB
OFFSET VOLTAGE
Input Offset Voltage
over Temperature
Drift
vs Power Supply
PSRR
Channel Separation
INPUT VOLTAGE RANGE
Common-Mode Voltage Range
VCM
Common-Mode Rejection Ratio
CMRR
over Temperature
(V–)
(V–) ≤ VCM ≤ (V+)
100
(V–) ≤ VCM ≤ (V+)
90
(V+)
V
114
dB
dB
INPUT BIAS CURRENT
Input Bias Current
Input Offset Current
IB
10
50
pA
IOS
10
50
pA
INPUT IMPEDANCE
Differential
Common-Mode
1013|| 3
Ω || pF
13
Ω || pF
10 || 6
NOISE
Input Voltage Noise
f = 0.1Hz to 10Hz
3.6
μVPP
f = 100Hz
160
nV/√Hz
f = 1kHz
120
nV/√Hz
f = 1kHz
1
fA/√Hz
134
dB
Input Voltage Noise Density
Current Noise Density
OPEN-LOOP GAIN
Open-Loop Voltage Gain
AOL
Over Temperature
Over Temperature
100mV ≤ VO ≤ (V+)–100mV, RL =
100kΩ
114
100mV ≤ VO ≤ (V+)–100mV, RL =
100kΩ
100
500mV ≤ VO ≤ (V+)–500mV, RL =
10kΩ
114
500mV ≤ VO ≤ (V+)–500mV, RL =
10kΩ
90
dB
134
dB
dB
OUTPUT
Voltage Output Swing from Rail
Short-Circuit Current
Capacitive Load Drive
RL = 100kΩ
10
mV
RL = 10kΩ
25
mV
ISC
CLOAD
10
mA
See Typical Characteristics
pF
FREQUENCY RESPONSE
Gain-Bandwidth Product
Slew Rate
GBW
SR
Overload Recovery Time
12
kHz
G = +1
0.005
V/μs
VIN × Gain > VS
250
μs
POWER SUPPLY
Specified Voltage
Quiescent Current
(per channel amplifier)
VS
1.8
IQ
IOUT = 0A
Over Temperature
(1)
0.7
5.5
V
1
μA
1.25
μA
OPA369 specifications are preview. Available Q4, 2007.
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SBOS414A – AUGUST 2007 – REVISED SEPTEMBER 2007
ELECTRICAL CHARACTERISTICS: VS = +1.8V to +5.5V (continued)
BOLDFACE limits apply over the specified temperature range, TA = –40°C to +85°C.
At TA = +25°C, RL = 100kΩ connected to VS/2, unless otherwise noted.
OPA369 (1), OPA2369
PARAMETER
CONDITIONS
MIN
Specified Range
TA
Operating Range
TA
TYP
MAX
UNIT
–40
+85
°C
–55
+125
°C
TEMPERATURE RANGE
Thermal Resistance
4
θ JA
SC70
250
°C/W
SOT23
223
°C/W
MSOP
252
°C/W
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SBOS414A – AUGUST 2007 – REVISED SEPTEMBER 2007
TYPICAL CHARACTERISTICS
At TA = +25°C, VS = 5V, RL = 100kΩ connected to VS/2, unless otherwise noted.
OFFSET VOLTAGE DRIFT
PRODUCTION DISTRIBUTION
-1.2
-1.1
-1.0
-0.9
-0.8
-0.7
-0.6
-0.5
-0.4
-0.3
-0.2
-0.1
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
750
600
675
450
525
300
375
150
225
0
75
-75
-150
-225
-300
-450
-375
-525
-600
-675
-750
Population
Population
OFFSET VOLTAGE
PRODUCTION DISTRIBUTION
Offset Voltage (mV)
Offset Voltage Drift (mV/°C)
Figure 1.
Figure 2.
OFFSET VOLTAGE vs TEMPERATURE
NORMALIZED OFFSET VOLTAGE
vs COMMON-MODE VOLTAGE
100
800
80
Offset Voltage (mV)
600
400
200
0
-200
-400
-600
60
40
20
0
-20
-40
-60
-800
-80
-1000
-100
-75
-50
-25
0
25
50
75
100
VS = 5V
10 Typical Units Shown
125
-0.2
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
2.6
2.8
3.0
3.2
3.4
3.6
3.8
4.0
4.2
4.4
4.6
4.8
5.0
5.2
Normalized Offset Voltage (mV)
1000
Common-Mode Voltage (V)
Temperature (°C)
Figure 3.
Figure 4.
0.1Hz to 10Hz NOISE
INPUT-REFERRED VOLTAGE NOISE
vs FREQUENCY
1mV/div
Voltage Noise, RTI (nV/ÖHz)
10000
1000
100
10
Time (500ms/div)
0.1
1
10
100
1k
Frequency (Hz)
Figure 5.
Figure 6.
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SBOS414A – AUGUST 2007 – REVISED SEPTEMBER 2007
TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, VS = 5V, RL = 100kΩ connected to VS/2, unless otherwise noted.
OPEN-LOOP GAIN AND PHASE
vs FREQUENCY
POWER-SUPPLY REJECTION RATIO
vs FREQUENCY
140
180
110
100
120
GAIN
90
135
60
90
40
PSRR (dB)
80
PHASE
20
+PSRR
80
Phase (°)
Gain (dB)
100
70
60
50
40
-PSRR
30
45
20
0
10
-20
0.001
0.01
0.1
1
10
100
0
0
10k 20k
1k
1
10
100
Figure 7.
10k 20k
Figure 8.
COMMON-MODE REJECTION RATIO
vs FREQUENCY
CHANNEL SEPARATION vs FREQUENCY
120
160
140
Channel Separation (dB)
100
CMRR (dB)
1k
Frequency (Hz)
Frequency (Hz)
80
60
40
20
120
100
80
60
40
20
0
0
10
100
1k
10k 20k
100
1k
10k
100k
Frequency (Hz)
Frequency (Hz)
Figure 9.
Figure 10.
COMMON-MODE REJECTION RATIO
vs TEMPERATURE
POWER-SUPPLY REJECTION RATIO
vs TEMPERATURE
20
10
10 Typical Units Shown
15
10
PSRR (mV/V)
CMRR (mV/V)
8
6
4
5
0
-5
-10
2
-15
0
-20
-75
6
-50
-25
0
25
50
75
100
125
-75
-50
-25
0
25
50
Temperature (°C)
Temperature (°C)
Figure 11.
Figure 12.
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75
100
125
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OPA2369
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SBOS414A – AUGUST 2007 – REVISED SEPTEMBER 2007
TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, VS = 5V, RL = 100kΩ connected to VS/2, unless otherwise noted.
OUTPUT VOLTAGE SWING-FROM-RAIL
vs TEMPERATURE
OPEN-LOOP GAIN vs TEMPERATURE
3.0
25
2.5
Output Voltage Swing-from-Rail (mV)
RL = 10kW
RL = 100kW
AOL (mV/V)
2.0
1.5
1.0
0.5
RL = 10kW
RL = 100kW
20
15
10
5
0
-5
-10
-15
-20
0
-25
-75
-50
0
-25
25
50
75
100
125
-75
-50
-25
Temperature (°C)
0
25
50
75
Figure 13.
Figure 14.
INPUT BIAS CURRENT
vs TEMPERATURE
OUTPUT VOLTAGE
vs OUTPUT CURRENT
2.75
10k
125
VS = ±2.75V
2.25
1k
1.75
Output Voltage (V)
Input Bias Current (pA)
100
Temperature (°C)
100
10
1
1.25
+25°C
+85°C
0.75
-40°C
+115°C
0.25
-0.25
-0.75
-1.25
-1.75
0.1
-2.25
0.01
-2.75
-50
-25
0
25
50
75
100
0
125
5
10
15
20
25
30
35
Temperature (°C)
Output Current (mA)
Figure 15.
Figure 16.
QUIESCENT CURRENT vs TEMPERATURE
MAXIMUM OUTPUT VOLTAGE
vs FREQUENCY
2.0
40
45
3.0
Maximum VOUT (V)
Quiescent Current (mA)
2.5
1.5
1.0
0.5
2.0
1.5
1.0
0.5
0
0
-75
-50
-25
0
25
50
75
100
125
100
1k
Temperature (°C)
Frequency (Hz)
Figure 17.
Figure 18.
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SBOS414A – AUGUST 2007 – REVISED SEPTEMBER 2007
TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, VS = 5V, RL = 100kΩ connected to VS/2, unless otherwise noted.
SMALL-SIGNAL OVERSHOOT
vs CAPACITIVE LOAD
SMALL-SIGNAL STEP RESPONSE
50
CL = 20pF
G = +1
20mV/div
Overshoot (%)
40
30
20
10
0
10
100
Time (100ms/div)
200
Capacitive Load (pF)
Figure 19.
Figure 20.
LARGE-SIGNAL STEP RESPONSE
OVERLOAD RECOVERY
8
1V/div
500mV/div
CL = 200pF
Time (250ms/div)
Time (500ms/div)
Figure 21.
Figure 22.
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SBOS414A – AUGUST 2007 – REVISED SEPTEMBER 2007
APPLICATION INFORMATION
The OPA369 family of operational amplifiers
minimizes power consumption and operates on
supply voltages as low as 1.8V. Power-supply
rejection ratio (PSRR), common-mode rejection ratio
(CMRR), and open-loop gain (AOL) typical values are
in the range of 100dB or better.
When designing for ultralow power, choose system
components
carefully.
To
minimize
current
consumption, select large-value resistors. However,
note that large resistors will react with stray
capacitance in the circuit and the input capacitance of
the operational amplifier. These parasitic RC
combinations can affect the stability of the overall
system. A feedback capacitor may be required to
assure stability and limit overshoot or gain peaking.
Good layout practice and use of a 0.1μF bypass
capacitor placed closely across the supply pins are
mandatory.
OPERATING VOLTAGE
OPA369 series op amps are fully specified and tested
from +1.8V to +5.5V. Parameters that vary
significantly with supply voltage are shown in the
Typical Characteristic curves.
INPUT COMMON-MODE VOLTAGE RANGE
The OPA369 family is designed to eliminate the input
offset transition region typically present in most
rail-to-rail
complementary
stage
operational
amplifiers, which allows the OPA369 family of
amplifiers to provide superior common-mode
performance over the entire input range.
The input common-mode voltage range of the
OPA369 family typically extends to each supply rail.
CMRR is specified from the negative rail to the
positive rail. See Figure 4 the Normalized Offset
Voltage vs Common-Mode Voltage.
Current-limiting resistor
required if input voltage
exceeds supply rails by
³ 0.5V.
+5V
IOVERLOAD
10mA max
VOUT
OPA369
VIN
5kW
Figure 23. Input Current Protection for Voltages
Exceeding the Supply Voltage
NOISE
Although micropower amplifiers frequently have high
wideband noise, the OPA369 series offers excellent
noise performance. The OPA369 has only 2.8μVPP of
0.1Hz to 10Hz noise, and 80nV/Hz of wideband
noise. Resistors should be chosen carefully, because
they can become the dominant source of noise.
CAPACITIVE LOAD AND STABILITY
Follower configurations with load capacitance in
excess of approximately 50pF can produce extra
overshoot and ringing in the output signal (see
Figure 19). Increasing the gain enhances the ability of
the amplifier to drive greater capacitive loads. In
unity-gain configurations, capacitive load drive can be
improved by inserting a small (10Ω to 20Ω) resistor,
RS, in series with the output, as shown in Figure 24.
This resistor significantly reduces ringing while
maintaining dc performance for purely capacitive
loads. However, if there is a resistive load in parallel
with the capacitive load, a voltage divider is created,
introducing a dc error at the output and slightly
reducing the output swing. The error introduced is
proportional to the ratio RS/RL, and is generally
negligible.
PROTECTING INPUTS FROM
OVER-VOLTAGE
V+
Input currents are typically 10pA. However, large
inputs (greater than 500mV beyond the supply rails)
can cause excessive current to flow in or out of the
input pins. Therefore, in addition to keeping the input
voltage between the supply rails, it is also important
to limit the input current to less than 10mA. This
limiting is easily accomplished with an input resistor,
as shown in Figure 23.
RS
VOUT
OPA369
VIN
10W to
20W
RL
CL
Figure 24. Series Resistor in Unity-Gain Buffer
Configuration Improves Capacitive Load Drive
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In unity-gain inverter configuration, phase margin can
be reduced by the reaction between the capacitance
at the op amp input and the gain setting resistors.
Best performance is achieved by using smaller
valued resistors. However, when larger valued
resistors cannot be avoided, a small (4pF to 6pF)
capacitor, CFB, can be inserted in the feedback, as
shown in Figure 25. This configuration significantly
reduces overshoot by compensating the effect of
capacitance, CIN, which includes the amplifier input
capacitance and printed circuit board (PCB) parasitic
capacitance.
CFB
RF
1. Selecting RF: Select RF such that the current
through RF is approximately 1000x larger than
the maximum bias current over temperature:
VREF
RF =
1000(IBMAX)
1.2V
1000(50pA)
= 24MW » 20MW
(1)
2. Choose the hysteresis voltage, VHYST. For
battery-monitoring
applications,
50mV
is
adequate.
3. Calculate R1 as follows:
VHYST
R 1 = RF
= 20MW 50mV = 420kW
VBATT
2.4V
=
(2)
RI
VIN
OPA369
VOUT
CIN
Figure 25. Improving Stability for Large RF and RIN
4. Select a threshold voltage for VIN rising (VTHRS) =
2.0V
5. Calculate R2 as follows:
1
R2 =
VTHRS
- 1 - 1
VBATT
R1 R 1
( )
1
=
BATTERY MONITORING
The low operating voltage and quiescent current of
the OPA369 series make it an excellent choice for
battery monitoring applications, as shown in
Figure 26. In this circuit, VSTATUS is high as long as
the battery voltage remains above 2V. A low-power
reference is used to set the trip point. Resistor values
are selected as follows:
2V
- 1 - 1
420kW 20MW
1.2V ´ 420kW
(
)
= 650kW
(3)
6. Calculate RBIAS: The minimum supply voltage for
this circuit is 1.8V. The REF1112 has a current
requirement of 1.2μA (max). Providing the
REF1112 with 2μA of supply current assures
proper operation. Therefore:
V
RBIAS = BATTMIN = 1.8V = 0.9MW
2m A
IBIAS
(4)
RF
R1
+IN
+
IBIAS
VBATT
OPA369
RBIAS
OUT
-IN
VSTATUS
VREF
R2
REF1112
Figure 26. Battery Monitor
10
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SBOS414A – AUGUST 2007 – REVISED SEPTEMBER 2007
WINDOW COMPARATOR
If VIN falls below VL, the output of A2 is high, current
flows through D2, and VOUT is low. Likewise, if VIN
rises above VH, the output of A1 is high, current flows
through D1, and VOUT is low. The window comparator
threshold voltages are set as follows:
R2
VH =
R1 + R2
(5)
Figure 27 shows the OPA2369 used as a window
comparator. The threshold limits are set by VH and
VL, with VH > VL. When VIN < VH, the output of A1 is
low. When VIN >VL, the output of A2 is low.
Therefore, both op amp outputs are at 0V as long as
VIN is between VH and VL. This configuration results
in no current flowing through either diode, Q1 in
cutoff, with the base voltage at 0V, and VOUT forced
high.
VL =
R4
R 3 + R4
(6)
3V
3V
R1
VH
A1
1/2
OPA2369
R2
D1
(2)
3V
R7
5.1kW
RIN
(1)
2kW
VOUT
R5
10kW
VIN
Q1
R6
5.1kW
3V
3V
A2
R3
VL
(3)
1/2
OPA2369
D2
(2)
R4
NOTES: (1) RIN protects A1 and A2 from possible excess current flow.
(2) IN4446 or equivalent diodes.
(3) 2N2222 or equivalent NPN transistor.
Figure 27. OPA2369 as a Window Comparator
ADDITIONAL APPLICATION EXAMPLES
Figure 28 through Figure 32 illustrate additional application examples.
VEX
R1
+5V
R R
R R
VOUT
OPA369
R1
VREF
Figure 28. Single Op Amp Bridge Amplifier
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+2.7V
R3
R2
VCC
+2.7V
MSP430x20x3PW
R1
66.5W
A0+
OPA369
16-Bit
ADC
C1
1.5nF
VIN
VREF
REF3312
VSS
C2
1m F
Figure 29. Unipolar Signal Chain Configuration
RG
RSHUNT
zener
(1)
V+
(2)
R1
MOSFET rated to
stand-off supply voltage
such as BSS84 for
up to 50V.
OPA369
10kW
+5V
V+
Two zener
biasing methods
(3)
are shown.
Output
Load
RBIAS
RL
NOTES: (1) Zener rated for op amp supply capability (that is, 5.1V for OPA369).
(2) Current-limiting resistor.
(3) Choose zener biasing resistor or dual NMOSFETs (FDG6301N, NTJD4001N, or Si1034)
Figure 30. High-Side Current Monitor
+5V
REF3130
3V
Load
R1
4.99kW
R2
49.9kW
R6
71.5kW
V
ILOAD
RSHUNT
1W
RN
56W
OPA369
R3
4.99kW
Stray Ground-Loop Resistance
R4
48.7kW
ADS1100
R7
1.18kW
RN
56W
2
IC
(PGA Gain = 4)
FS = 3.0V
NOTE: 1% resistors provide adequate common-mode rejection at small ground-loop errors.
Figure 31. Low-Side Current Monitor
12
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): OPA369 OPA2369
OPA369
OPA2369
www.ti.com
SBOS414A – AUGUST 2007 – REVISED SEPTEMBER 2007
RG
VREF
R1
V2
R2
R2
1/2
OPA2369
R1
VOUT
1/2
OPA2369
V1
VOUT = (V1 - V2) 1 +
R1 2R1
+
+ VREF
R2
RG
Figure 32. Two Op Amp Instrumentation Amplifier
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): OPA369 OPA2369
13
PACKAGE OPTION ADDENDUM
www.ti.com
1-Oct-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
OPA2369AIDCNR
ACTIVE
SOT-23
DCN
8
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
OPA2369AIDCNRG4
ACTIVE
SOT-23
DCN
8
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
OPA2369AIDCNT
ACTIVE
SOT-23
DCN
8
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
OPA2369AIDCNTG4
ACTIVE
SOT-23
DCN
8
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
OPA2369AIDGKR
ACTIVE
MSOP
DGK
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
OPA2369AIDGKRG4
ACTIVE
MSOP
DGK
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
OPA2369AIDGKT
ACTIVE
MSOP
DGK
8
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
OPA2369AIDGKTG4
ACTIVE
MSOP
DGK
8
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
OPA369AIDCKR
PREVIEW
SC70
DCK
5
3000
TBD
Call TI
Call TI
OPA369AIDCKT
PREVIEW
SC70
DCK
5
250
TBD
Call TI
Call TI
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Oct-2007
TAPE AND REEL BOX INFORMATION
Device
Package Pins
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
OPA2369AIDCNR
DCN
8
SITE 48
179
8
3.2
3.2
1.4
4
8
Q3
OPA2369AIDCNT
DCN
8
SITE 48
179
8
3.2
3.2
1.4
4
8
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Oct-2007
Device
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
OPA2369AIDCNR
DCN
8
SITE 48
195.0
200.0
45.0
OPA2369AIDCNT
DCN
8
SITE 48
195.0
200.0
45.0
Pack Materials-Page 2
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