TI LMT86-Q1

LMT86, LMT86-Q1
www.ti.com
SNIS169A – MARCH 2013 – REVISED JUNE 2013
LMT86/LMT86-Q1 SC70, Analog Temperature Sensors with Class-AB Output
Check for Samples: LMT86, LMT86-Q1
FEATURES
DESCRIPTION
•
The LMT86/LMT86-Q1 are precision analog output
CMOS integrated-circuit temperature sensors that
operates at a supply voltage as low as 2.2 Volts. A
class-AB output structure gives the LMT86/LMT86Q1 strong output source and sink current capability
for driving heavy loads. This means it is well suited to
source the input of a sample-and-hold analog-todigital converter with its transient load requirements.
While operating over the wide temperature range of
−50°C to 150°C, the device delivers an output voltage
that is inversely proportional to measured
temperature. The LMT86/LMT86-Q1 low supply
current makes it ideal for battery-powered systems as
well as general temperature sensing applications.
1
•
•
•
•
•
•
LMT86-Q1 is AEC-Q100 Grade 0 qualified and
is Manufactured on an Automotive Grade Flow
Push-Pull Output with 50 µA Source Current
Capability
Very Accurate Over Wide Temperature Range
of −50°C to 150°C
Low Quiescent Current
Output is Short-Circuit Protected
Extremely Small SC70 Package
Cost-effective Alternative to Thermistors
APPLICATIONS
•
•
•
•
•
•
•
•
•
The LMT86/LMT86-Q1 can operate with a 2.2 V
supply while measuring temperature over the full
−50°C to 150°C operating range.
Automotive
Industrial
White Goods
Battery Management
Disk Drives
Appliances
Games
Wireless Transceivers
Cell phones
The
LMT86/LMT86-Q1
alternative to thermistors.
CONNECTION DIAGRAM
1
GND
2
3
OUT
cost-competitive
Output Voltage vs Temperature
VDD
GND
are
TYPICAL TRANSFER CHARACTERISTIC
5
3.0
LMT86
4
2.5
VDD
Figure 1. SOT Top View
See Package Number DCK0005A
OUTPUT VOLTAGE (V)
2
2.0
1.5
1.0
0.5
0.0
±50
0
50
100
150
TEMPERATURE (ƒC)
C001
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2013, Texas Instruments Incorporated
LMT86, LMT86-Q1
SNIS169A – MARCH 2013 – REVISED JUNE 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
TYPICAL APPLICATION
Full-Range Celsius Temperature Sensor (−50°C to 150°C)
VDD (+2.2V to +5.5V)
VDD
VDD
LMT86
CBP
OUT
GND
2
GND
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PIN DESCRIPTIONS
LABEL
PIN
NUMBER
TYPE
VDD
5
Power
GND
1
Ground
EQUIVALENT CIRCUIT
FUNCTION
Positive Supply Voltage
Power Supply Ground
VDD
OUT
3
Outputs a voltage which is inversely proportional to
temperature
Analog Output
GND
VDD
4
Power
Positive Supply Voltage
GND
2
Ground
Power Supply Ground
ABSOLUTE MAXIMUM RATINGS
(1)
VALUE
MIN
MAX
UNIT
Supply Voltage
−0.3
6
Voltage at Output Pin
−0.3
(VDD + 0.5)
V
±7
mA
Output Current
Input Current at any pin
(2)
5
mA
150
°C
150
°C
Human Body Model
2500
V
Machine Model
250
V
−65
Storage Temperature
Maximum Junction Temperature (TJMAX)
ESD Susceptibility
(3)
V
Soldering process must comply with TI's Reflow Temperature Profile specifications. Refer to www.ti.com/packaging. (4)
(1)
(2)
(3)
(4)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not specific performance limits. For specifications and test conditions, see the Electrical
Characteristics. The specifications apply only for the test conditions listed. Some performance characteristics may degrade when the
device is not operated under the listed test conditions.
When the input voltage (VI) at any pin exceeds power supplies (VI < GND or VI > V), the current at that pin should be limited to 5 mA.
The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. The machine model is a 200 pF
capacitor discharged directly into each pin.
Reflow temperature profiles are different for lead-free and non-lead-free packages.
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OPERATING RATINGS
VALUE
Specified Temperature Range:
°C
−50 ≤ TA ≤ 150
°C
2.2 to 5.5
V
415
°C/W
Supply Voltage Range (VDD)
Thermal Resistance (θJA)
(1)
(2)
(1) (2)
UNIT
TMIN ≤ TA ≤ TMAX
(SOT)
The junction to ambient thermal resistance (θJA) is specified without a heat sink in still air.
Changes in output due to self heating can be computed by multiplying the internal dissipation by the thermal resistance.
ACCURACY CHARACTERISTICS
These limits do not include DC load regulation. These stated accuracy limits are with reference to the values in Table 1.
PARAMETER
Temperature Error
(1)
(2)
CONDITIONS
(2)
TYPICAL
LIMITS
(1)
UNIT
40°C to 150°C; VDD = 2.4 V to 5.5 V
0.4
2.7
°C
0°C to 40°C; VDD = 2.4 V to 5.5 V
0.7
2.7
°C
0°C to 70°C; VDD = 3.0 V to 5.5 V
0.3
–50°C to 0°C; VDD = 3.0 V to 5.5 V
0.7
–50°C to 0°C; VDD = 3.6 V to 5.5 V
0.25
2.7
2.7
°C
°C
Limits are specified to TI's AOQL (Average Outgoing Quality Level).
Accuracy is defined as the error between the measured and reference output voltages, tabulated in the Transfer Table at the specified
conditions of supply gain setting, voltage, and temperature (expressed in °C). Accuracy limits include line regulation within the specified
conditions. Accuracy limits do not include load regulation; they assume no DC load.
ELECTRICAL CHARACTERISTICS
Unless otherwise noted, these specifications apply for +VDD = 2.2 V to 5.5 V. Boldface limits apply for TA = TJ = TMIN to
TMAX ; all other limits TA = TJ = 25°C.
PARAMETER
CONDITIONS
Sensor Gain
(3)
Supply Current (5)
CL
Output Load Capacitance
–1
Sink ≤ 50 μA, VOUT ≥ 200 mV
0.26
1
(6)
TA = -50°C to 150°C, (VDD - VOUT) ≥ 100 mV
(5)
(6)
4
mV
mV
5.4
8.1
μA
5.4
9
μA
1.9
ms
±50
µA
1100
CL= 0 pF to 1100 pF
UNITS
μV/V
200
TA = 30°C to 150°C, (VDD - VOUT) ≥ 100 mV
(2)
mV/°C
–0.22
Output drive
(1)
(2)
(3)
(4)
MAX
Source ≤ 50 μA, (VDD - VOUT) ≥ 200 mV
(4)
IS
Power-on Time
(1)
–10.9
Load Regulation
Line Regulation
TYPICAL
0.7
pF
Typicals are at TJ = TA = 25°C and represent most likely parametric norm.
Limits are specific to TI's AOQL (Average Outgoing Quality Level).
Source currents are flowing out of the LMT86/LMT86-Q1. Sink currents are flowing into the LMT86/LMT86-Q1.
Line regulation (DC) is calculated by subtracting the output voltage at the highest supply voltage from the output voltage at the lowest
supply voltage. The typical DC line regulation specification does not include the output voltage shift discussed in OUTPUT VOLTAGE
SHIFT.
The input current is leakage only and is highest at high temperature. It is typically only 0.001 µA. The 1 µA limit is solely based on a
testing limitation and does not reflect the actual performance of the part.
Specified by design and characterization.
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TYPICAL PERFORMANCE CHARACTERISTICS
spacer for second page
Temperature Error vs
Temperature
Minimum Operating Temperature vs
Supply Voltage
4
TEMPERATURE ERROR (ºC)
3
2
1
0
-1
-2
-3
-4
-50
-25
0
25
50
75
100 125 150
TEMPERATURE (ºC)
Figure 2.
Figure 3.
Supply Current vs
Temperature
Supply Current vs
Supply Voltage
Figure 4.
Figure 5.
Load Regulation, Sourcing Current
Load Regulation, Sinking Current
Figure 6.
Figure 7.
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)
spacer for second page
Change in Vout vs
Overhead Voltage
Supply-Noise Gain vs
Frequency
Figure 8.
Figure 9.
Output Voltage vs
Supply Voltage
Figure 10.
6
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LMT86/LMT86-Q1 TRANSFER FUNCTION
The output voltage of the LMT86/LMT86-Q1, across the complete operating temperature range is shown in
Table 1. This table is the reference from which the LMT86/LMT86-Q1 accuracy specifications (listed in the
ELECTRICAL CHARACTERISTICS section) are determined. This table can be used, for example, in a host
processor look-up table. A file containing this data is available for download at www.ti.com/appinfo/tempsensors.
Table 1. LMT86/LMT86-Q1 Transfer Table
TEMP
(°C)
VOUT
(mV)
TEMP
(°C)
VOUT
(mV)
TEMP
(°C)
VOUT
(mV)
TEMP
(°C)
VOUT
(mV)
TEMP
(°C)
VOUT
(mV)
-50
2616
-10
2207
30
1777
70
1335
110
883
-49
2607
-9
2197
31
1766
71
1324
111
872
-48
2598
-8
2186
32
1756
72
1313
112
860
-47
2589
-7
2175
33
1745
73
1301
113
849
-46
2580
-6
2164
34
1734
74
1290
114
837
-45
2571
-5
2154
35
1723
75
1279
115
826
-44
2562
-4
2143
36
1712
76
1268
116
814
-43
2553
-3
2132
37
1701
77
1257
117
803
-42
2543
-2
2122
38
1690
78
1245
118
791
-41
2533
-1
2111
39
1679
79
1234
119
780
-40
2522
0
2100
40
1668
80
1223
120
769
-39
2512
1
2089
41
1657
81
1212
121
757
-38
2501
2
2079
42
1646
82
1201
122
745
-37
2491
3
2068
43
1635
83
1189
123
734
-36
2481
4
2057
44
1624
84
1178
124
722
-35
2470
5
2047
45
1613
85
1167
125
711
-34
2460
6
2036
46
1602
86
1155
126
699
-33
2449
7
2025
47
1591
87
1144
127
688
-32
2439
8
2014
48
1580
88
1133
128
676
-31
2429
9
2004
49
1569
89
1122
129
665
-30
2418
10
1993
50
1558
90
1110
130
653
-29
2408
11
1982
51
1547
91
1099
131
642
-28
2397
12
1971
52
1536
92
1088
132
630
-27
2387
13
1961
53
1525
93
1076
133
618
-26
2376
14
1950
54
1514
94
1065
134
607
-25
2366
15
1939
55
1503
95
1054
135
595
-24
2355
16
1928
56
1492
96
1042
136
584
-23
2345
17
1918
57
1481
97
1031
137
572
-22
2334
18
1907
58
1470
98
1020
138
560
-21
2324
19
1896
59
1459
99
1008
139
549
-20
2313
20
1885
60
1448
100
997
140
537
-19
2302
21
1874
61
1436
101
986
141
525
-18
2292
22
1864
62
1425
102
974
142
514
-17
2281
23
1853
63
1414
103
963
143
502
-16
2271
24
1842
64
1403
104
951
144
490
-15
2260
25
1831
65
1391
105
940
145
479
-14
2250
26
1820
66
1380
106
929
146
467
-13
2239
27
1810
67
1369
107
917
147
455
-12
2228
28
1799
68
1358
108
906
148
443
-11
2218
29
1788
69
1346
109
895
149
432
150
420
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Although the LMT86/LMT86-Q1 is very linear, its response does have a slight umbrella parabolic shape. This
shape is very accurately reflected in . The Transfer Table can be calculated by using the parabolic equation.
mV
mV
ª
º ª
2º
VTEMP mV = 1777.3mV - «10.888
T - 30°C » - «0.00347 2 T - 30°C »
°C
¬
¼ ¬
°C
¼
(1)
For a linear approximation, a line can easily be calculated over the desired temperature range from the Table
using the two-point equation:
·
¹
V - V1 =
V2 - V1
T2 - T1
· u (T - T1)
¹
(2)
Where V is in mV, T is in °C, T1 and V1 are the coordinates of the lowest temperature, T2 and V2 are the
coordinates of the highest temperature.
For example, if we want to resolve this equation, over a temperature range of 20°C to 50°C, we would proceed
as follows:
1558 mV - 1885 mV·
u (T - 20oC)
50oC - 20oC
¹
·
¹
V - 1885 mV =
(3)
o
o
V - 1885 mV = (-10.9 mV / C) u (T - 20 C)
(4)
o
V = (-10.9 mV / C) u T + 2103 mV
(5)
Using this method of linear approximation, the transfer function can be approximated for one or more
temperature ranges of interest.
MOUNTING AND THERMAL CONDUCTIVITY
The LMT86/LMT86-Q1 can be applied easily in the same way as other integrated-circuit temperature sensors. It
can be glued or cemented to a surface.
To ensure good thermal conductivity, the backside of the LMT86/LMT86-Q1 die is directly attached to the GND
pin (Pin 2). The temperatures of the lands and traces to the other leads of the LMT86/LMT86-Q1 will also affect
the temperature reading.
Alternatively, the LMT86/LMT86-Q1 can be mounted inside a sealed-end metal tube, and can then be dipped
into a bath or screwed into a threaded hole in a tank. As with any IC, the LMT86/LMT86-Q1 and accompanying
wiring and circuits must be kept insulated and dry, to avoid leakage and corrosion. This is especially true if the
circuit may operate at cold temperatures where condensation can occur. If moisture creates a short circuit from
the output to ground or VDD, the output from the LMT86/LMT86-Q1 will not be correct. Printed-circuit coatings are
often used to ensure that moisture cannot corrode the leads or circuit traces.
The thermal resistance junction to ambient (θJA) is the parameter used to calculate the rise of a device junction
temperature due to its power dissipation. The equation used to calculate the rise in the LMT86/LMT86-Q1 die
temperature is:
TJ = TA + TJA ¬ª(VDDIS ) + (VDD - VO ) IL ¼º
(6)
where TA is the ambient temperature, IS is the supply current, IL is the load current on the output, and VO is the
output voltage. For example, in an application where TA = 30°C, VDD = 5V, IS = 5.4 µA, VO = 1777 mV junction
temp 30.014°C self-heating error of 0.014°C. Since the LMT86/LMT86-Q1's junction temperature is the actual
temperature being measured, care should be taken to minimize the load current that the LMT86/LMT86-Q1 is
required to drive. Table 2 shows the thermal resistance of the LMT86/LMT86-Q1.
Table 2. LMT86/LMT86-Q1 Thermal Resistance
8
DEVICE NUMBER
TI PACKAGE NUMBER
THERMAL RESISTANCE (θJA)
LMT86DCK
DCK0005A
415°C/W
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OUTPUT AND NOISE CONSIDERATIONS
A push-pull output gives the LMT86/LMT86-Q1 the ability to sink and source significant current. This is beneficial
when, for example, driving dynamic loads like an input stage on an analog-to-digital converter (ADC). In these
applications the source current is required to quickly charge the input capacitor of the ADC. See the
APPLICATION CIRCUITS section for more discussion of this topic. The LMT86/LMT86-Q1 is ideal for this and
other applications which require strong source or sink current.
The LMT86/LMT86-Q1's supply-noise gain (the ratio of the AC signal on VOUT to the AC signal on VDD) was
measured during bench tests. Its typical attenuation is shown in the TYPICAL PERFORMANCE
CHARACTERISTICS section. A load capacitor on the output can help to filter noise.
For operation in very noisy environments, some bypass capacitance should be present on the supply within
approximately 5 centimeters of the LMT86/LMT86-Q1.
CAPACITIVE LOADS
The LMT86/LMT86-Q1 handles capacitive loading well. In an extremely noisy environment, or when driving a
switched sampling input on an ADC, it may be necessary to add some filtering to minimize noise coupling.
Without any precautions, the LMT86/LMT86-Q1 can drive a capacitive load less than or equal to 1100 pF as
shown in Figure 11. For capacitive loads greater than 1100 pF, a series resistor may be required on the output,
as shown in Figure 12.
VDD
LMT86
OPTIONAL
BYPASS
CAPACITANCE
OUT
GND
CLOAD ” 1100 pF
Figure 11. LMT86 No Decoupling Required for Capacitive Loads Less than 1100 pF
VDD
RS
LMT86
OPTIONAL
BYPASS
CAPACITANCE
OUT
GND
CLOAD > 1100 pF
Figure 12. LMT86 with Series Resistor for Capacitive Loading Greater than 1100 pF
CLOAD
MINIMUM RS
1.1 nF to 99 nF
3 kΩ
100 nF to 999 nF
1.5 kΩ
1 μF
800 Ω
OUTPUT VOLTAGE SHIFT
The LMT86/LMT86-Q1 are very linear over temperature and supply voltage range. Due to the intrinsic behavior
of an NMOS/PMOS rail-to-rail buffer, a slight shift in the output can occur when the supply voltage is ramped
over the operating range of the device. The location of the shift is determined by the relative levels of VDD and
VOUT. The shift typically occurs when VDD- VOUT = 1 V.
This slight shift (a few millivolts) takes place over a wide change (approximately 200 mV) in VDD or VOUT. Since
the shift takes place over a wide temperature change of 5°C to 20°C, VOUT is always monotonic. The accuracy
specifications in the ELECTRICAL CHARACTERISTICS table already include this possible shift.
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APPLICATION CIRCUITS
V+
VTEMP
R3
VT1
R4
VT2
LM4040
VDD
VT
R1
4.1V
U3
0.1 PF
LMT86
R2
(High = overtemp alarm)
+
U1
-
VOUT
VOUT
VTemp
U2
VT1 =
(4.1)R2
R1 + R2||R3
VT2 =
(4.1)R2
R2 + R1||R3
Figure 13. Celsius Thermostat
VDD
SHUTDOWN
VOUT
LMT86
Any logic
device output
Figure 14. Conserving Power Dissipation with Shutdown
Simplified Input Circuit of
SAR Analog-to-Digital Converter
Reset
+2.7V to +5.5V
Input
Pin
LMT86
VDD
CBP
RMUX
RSS
Sample
OUT
GND
CFILTER
CMUX
CSAMPLE
Most CMOS ADCs found in microcontrollers and ASICs have a sampled data comparator input structure. When the
ADC charges the sampling cap, it requires instantaneous charge from the output of the analog source such as the
LMT86/LMT86-Q1 temperature sensor and many op amps. This requirement is easily accommodated by the addition
of a capacitor (CFILTER). The size of CFILTER depends on the size of the sampling capacitor and the sampling
frequency. Since not all ADCs have identical input stages, the charge requirements will vary. This general ADC
application is shown as an example only.
Figure 15. Suggested Connection to a Sampling Analog-to-Digital Converter Input Stage
10
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PACKAGE OPTION ADDENDUM
www.ti.com
30-Jun-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
LMT86DCKR
ACTIVE
SC70
DCK
5
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-50 to 150
BSA
LMT86DCKT
ACTIVE
SC70
DCK
5
250
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-50 to 150
BSA
LMT86QDCKRQ1
ACTIVE
SC70
DCK
5
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-50 to 150
BTA
LMT86QDCKTQ1
ACTIVE
SC70
DCK
5
250
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-50 to 150
BTA
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
30-Jun-2013
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LMT86, LMT86-Q1 :
• Catalog: LMT86
• Automotive: LMT86-Q1
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Jul-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
LMT86DCKR
SC70
DCK
5
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
3000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
LMT86DCKT
SC70
DCK
5
250
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
LMT86QDCKRQ1
SC70
DCK
5
3000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
LMT86QDCKTQ1
SC70
DCK
5
250
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Jul-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LMT86DCKR
SC70
DCK
5
3000
210.0
185.0
35.0
LMT86DCKT
SC70
DCK
5
250
210.0
185.0
35.0
LMT86QDCKRQ1
SC70
DCK
5
3000
210.0
185.0
35.0
LMT86QDCKTQ1
SC70
DCK
5
250
210.0
185.0
35.0
Pack Materials-Page 2
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