ESDA-1K EOS and ESD Transil™ protection for charger and battery port Features ■ Breakdown voltage: 12 V, 18 V ■ Unidirectional device ■ High peak power dissipation: 450 W (8/20 µs waveform) ■ ESD protection level better than IEC 61000-4-2 level 4: 30 kV contact discharge. ■ Low leakage current < 0.5 µA at 5 V ■ PCB area: 1.3 mm2 SOD-523 Figure 1. Functional diagram Pin 1 Benefits ■ High EOS and ESD protection level ■ High integration ■ Suitable for high density board ■ Small package Complies with the following standards ■ ■ IEC 61000-4-2 level 4 – 15 kV (air discharge) – 8 kV (contact discharge) Pin 2 Description MIL STD 883G - Method 3015-7 Class 3B – HBM (Human Body Model): ≥ 8 kV Applications The ESDA-1K is a single line Transil diode designed specifically for the protection of integrated circuits in portable equipment and miniaturized electronics devices subject to ESD and EOS transient overvoltages. Where transient overvoltage protection in ESD sensitive equipment is required, such as: ■ Computers ■ Printers ■ Communication systems ■ Cellular phone handsets and accessories ■ Video equipment TM: Transil is a trademark of STMicroelectronics. September 2010 Doc ID 17883 Rev 1 1/10 www.st.com 10 Characteristics 1 ESDA-1K Characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol Value Unit 30 30 kV Operating Junction temperature rage -40 to +150 °C Tstg Storage temperature range -65 to +150 °C TL Maximum lead temperature for soldering during 10 s 260 °C VPP Tj Parameter IEC 61000-4-2 air discharge IEC 61000-4-2 contact discharge Peak pulse voltage 0 Table 2. Absolute maximum ratings (tamb = 25 °C) - product specific parameters Order code IPP (A) peak pulse current (8/20 µs) PPP (W) peak pulse power (8/20 µs) ESDA12-1K 16 450 ESDA18-1K 12 400 Figure 2. Electrical characteristics (definitions) Symbol Table 3. Parameter Electrical characteristics (values, Tamb = 25 °C) VBR @ IR Order code IRM @ VRM Max. Typ. V V mA µA V V A V A pF ESDA12-1K 12 13 1 0.5 10 16.5 1 28 16 150 ESDA18-1K 18 19 1 0.5 15 24 1 34 12 105 Doc ID 17883 Rev 1 Max. Max. Cline(1) Min. 1. VR = 0 V, Fosc = 1 MHz, Vosc = 30 mV 2/10 VCL@ IPP (8/20 µs) Max. ESDA-1K Characteristics Figure 3. Peak pulse power dissipation versus exponential pulse duration (typical values) PPP (W) Figure 4. PPP(W) 1000 1000 Peak pulse power dissipation versus initial junction temperature (typical values) 8/20 µs ESDA12-1K 900 Tj=25 °C 800 ESDA18-1K 700 ESDA12-1K 100 600 500 ESDA18-1K 400 10 300 200 100 tP (µs) 1 Figure 5. 100.0 Tj (°C) 0 10 100 1000 Clamping voltage versus peak pulse current (typical values) IPP (A) 25 Figure 6. 100.00 50 75 125 150 175 Leakage current versus junction temperature (typical values) IR (nA) 8/20 µs Tjinitial = 25 °C VR = VRM = 10 V for ESDA12-1K VR = VRM =1 5V for ESDA18-1K ESDA12-1K 10.0 100 ESDA12-1K 1.00 1.0 ESDA18-1K ESDA18-1K VCL (V) 0.1 0 Figure 7. 10 20 25 30 ESD response to IEC 61000-4-2 (+15 kV air discharge) ESDA12-1K Tj (°C) 0.01 Figure 8. 5 V / div 35 45 55 65 75 85 ESD response to IEC 61000-4-2 (-15 kV air discharge) ESDA12-1K 5 V / div C2 C2 100 ns / div Doc ID 17883 Rev 1 100 ns / div 3/10 Ordering information scheme 2 ESDA-1K Ordering information scheme Figure 9. Ordering information scheme ESDA ESD array Breakdown voltage XX = 12: 12 V min. XX = 18: 18 V min. Package 1 = 1 line K = SOD-523 4/10 Doc ID 17883 Rev 1 XX - 1K ESDA-1K 3 Package information Package information ● Epoxy meets UL94,V0 ● Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 4. SOD-523 dimensions Dimensions E Ref. 0.15 M C A B E1 B D 2xb 0.20 M C A B Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 0.50 0.60 0.70 0.020 0.024 0.028 E 1.50 1.60 1.70 0.059 0.063 0.067 E1 1.10 1.20 1.30 0.043 0.047 0.051 D 0.70 0.80 0.90 0.028 0.031 0.035 b 0.25 0.35 0.010 0.014 c 0.07 0.20 0.003 0.008 L 0.15 0.25 0.006 0.008 0.010 L1 0.05 0.20 0.002 A 8° R0.1 A c SEATING PLANE 7° L C L1 Figure 10. Footprint (dimensions in mm) 0.20 0.008 Figure 11. Marking 0.7 0.3 Pin 1 1X Pin 2 2 Note: Product marking may be rotated by multiples of 90° for assembly plant differentiation. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose. Doc ID 17883 Rev 1 5/10 Package information ESDA-1K Figure 12. Tape and reel specification Ø 1.50 4.10 2.0 8.0 3.5 1.35 1.75 0.22 0.50 0.90 4.0 0.73 All dimensions are typical values in mm 6/10 User direction of unreeling Doc ID 17883 Rev 1 ESDA-1K Recommendation on PCB assembly 4 Recommendation on PCB assembly 4.1 Solder paste 4.2 4.3 1. Use halide-free flux, qualification ROL0 according to ANSI/J-STD-004. 2. “No clean” solder paste recommended. 3. Offers a high tack force to resist component displacement during PCB movement. 4. Use solder paste with fine particles: powder particle size 20-45 µm. Placement 1. Manual positioning is not recommended. 2. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering. 3. Standard tolerance of ± 0.05 mm is recommended. 4. 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. PCB design preference 1. To control the solder paste amount, the closed via is recommended instead of open vias. 2. The position of tracks and open vias in the solder area should be well balanced. The symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. Doc ID 17883 Rev 1 7/10 Recommendation on PCB assembly 4.4 ESDA-1K Reflow profile Figure 13. ST ECOPACK® recommended soldering reflow profile for PCB mounting Temperature (°C) 260°C max 255°C 220°C 180°C 125 °C 2°C/s recommended 2°C/s recommended 6°C/s max 6°C/s max 3°C/s max 3°C/s max 0 0 1 2 3 4 5 10-30 sec 90 to 150 sec Note: 8/10 6 7 Time (min) 90 sec max Minimize air convection currents in the reflow oven to avoid component movement. Doc ID 17883 Rev 1 ESDA-1K 5 Ordering information Ordering information Table 5. Ordering information Order code Marking ESDA12-1K 12 ESDA18-1K 18 Package Weight Base qty Delivery mode SOD-523 1.46 3000 Tape and reel Note: The marking can be rotated by multiples of 90° to differentiate assembly location. 6 Revision history Table 6. Document revision history Date Revision 02-Sep-2010 1 Changes First issue. 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