ESDA6V1M6, ESDA6V1-5M6 4- and 5-line Transil™ arrays for ESD protection Features ■ High ESD protection level ■ High integration ■ Suitable for high density boards ■ 4 unidirectional Transil diodes (ESDA6V1M6) ■ 5 unidirectional Transil diodes (ESDA6V1-5M6) ■ Breakdown Voltage VBR = 6.1 V min ■ High peak power dissipation: 100 Watts 8/20 µs ■ Low leakage current < 500 nA ■ Low diode capacitance (70 pF typ at 0 V) ■ Very small PCB area: 1.45 mm² ■ 500 microns pitch ■ Lead-free package Micro QFN package Figure 1. ESDA6V1M6 ■ I/O1 1 6 I/O5 GND 2 5 GND I/O2 4 I/O3 3 ESDA6V1-5M6 Complies with the following standards: ■ Functional diagram IEC 61000-4-2 – 15 kV (air discharge) – 8 kV (contact discharge) I/O1 1 6 I/O5 GND 2 5 I/O4 I/O2 4 I/O3 3 MIL STD 883G- Method 3015-7: class 3B – > 8 kV (human body model) Description Applications Where transient overvoltage protection in ESD sensitive equipment is required, such as: ■ Computers ■ Printers ■ Communication systems ■ Cellular phone handsets and accessories ■ Video equipment The ESDA6V1xxM6 are monolithic arrays designed to protect up to 4 or 5 lines against ESD transients. The device is ideal for applications where both reduced print circuit board space and power absorption capability are required. TM: Transil is a trademark of STMicroelectronics February 2008 Rev 4 1/11 www.st.com 11 Characteristics 1 ESDA6V1M6, ESDA6V1-5M6 Characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol Parameter Value Unit VPP ESD IEC 61000-4-2, air discharge ESD IEC 61000-4-2, contact discharge MIL STD 883G- Method 3015-7: class 3B, (human body model) ±15 ±11 25 kV PPP Peak pulse power dissipation (8/20 µs)(1) 100 W Ipp Repetitive peak pulse current typical value (8/20 µs) 8 A Tj Junction temperature 125 °C -55 to +150 °C 260 °C -40 to +125 °C Tstg TL TOP Tj initial = Tamb Storage temperature range Maximum lead temperature for soldering during 10 s at 5 mm for case Operating temperature range 1. For a surge greater than the maximum values, the diode will fail in short-circuit. Table 2. Electrical characteristics (Tamb = 25 °C) Symbol Parameter VRM Stand-off voltage VBR Breakdown voltage VCL Clamping voltage IF VF VCL VBR VRM IRM Leakage current @ VRM IPP Peak pulse current αT Voltage temperature coefficient VF Forward voltage drop V I RM IR Slope= 1/ Rd Symbol Test Condition I PP Min Typ Max Unit 7.2 V VBR IR = 1 mA IRM VRM = 3 V 500 nA VF IF = 10 mA 1 V Rd αT(1) C 6.1 Ω 1 IR = 1 mA VR =0 V DC, F = 1 MHz, Vosc = 30 mVRMS 1. ΔVBR = αT * (Tamb - 25 °C) * VBR (25 °C) 2/11 I 5 70 10-4/ °C pF ESDA6V1M6, ESDA6V1-5M6 Figure 2. Characteristics Relative variation of peak pulse power versus initial junction temperature Figure 3. Peak pulse power versus exponential pulse duration PP P(W ) PPP [Tj i n iti al ] /PPP [Tj i n iti al = 2 5 °C] 1000 1.1 Tj initial = 25°C 1.0 0.9 0.8 0.7 0.6 100 0.5 0.4 0.3 0.2 0.1 t P (µs) T j (°C) 10 0.0 0 25 Figure 4. 50 75 100 125 1 150 Clamping voltage versus peak pulse current (typical values, 8/20 µs waveform) 10 Figure 5. 100 Forward voltage drop versus peak forward current (typical values) IF M(A) IP P(A) 100.0 1.E+00 8/20µs Tj initial =25°C 10.0 1.E-01 Tj =125°C Tj =25°C 1.0 1.E-02 V CL (V) V FM (V) 0.1 1.E-03 0 10 Figure 6. 20 30 40 50 60 70 Junction capacitance versus reverse voltage applied (typical values) 0.0 0.2 Figure 7. C (p F ) 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 Relative variation of leakage current versus junction temperature (typical values) IR [Tj] / IR [Tj= 2 5 °C ] 80 100 F=1MHz VOSC=30mVRMS Tj=25°C 70 60 VR =3V 50 40 10 30 20 10 V R (V) T j (°C) 1 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 25 50 75 100 125 3/11 Ordering information scheme Figure 8. ESDA6V1M6, ESDA6V1-5M6 S21 attenuation measurement results of each channel Figure 9. dB dB 0.00 0.00 -10.00 -30.00 -20.00 -60.00 -30.00 -90.00 f/Hz f/Hz -40.00 100.0k 1.0M 10.0M 100.0M 1.0G Figure 10. ESD response to IEC 6100-4-2 (+15 kV air discharge) on each channel 2 Analog crosstalk measurements between channels -120.00 100.0k 1.0M 10.0M 100.0M Figure 11. ESD response to IEC 6100-4-2 (-15 kV air discharge) on each channel Ordering information scheme Figure 12. Ordering information scheme ESDA ESD array Breakdown voltage 6V1 = 6.1 Volts min Number of lines blank = 4 line -5 = 5 line protection Package M6 = Micro QFN 6 leads 4/11 1.0G 6V1 xx M6 ESDA6V1M6, ESDA6V1-5M6 3 Package information Package information ● Epoxy meets UL94, V0 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com. Table 3. Package dimensions Dimensions D Ref N Millimeters E 1 2 A Inches Min Typ Max Min Typ Max A 0.50 0.55 0.60 0.020 0.022 0.024 A1 0.00 0.02 0.05 0.000 0.001 0.002 b 0.18 0.25 0.30 0.007 0.010 0.012 A1 1 D(1) 1.45 0.057 E(1) 1.00 0.039 e(2) 0.50 0.020 2 L k b e k 0.20 L 0.30 0.008 0.35 0.40 0.012 0.014 0.016 1. ± 0.1 mm 2. ± 0.05 mm Figure 13. Footprint dimensions in mm [inches] 0.50 [0.020] 0.25 [0.010] 0.65 [0.026] 0.30 1.60 [0.012] [0.063] 5/11 Package information ESDA6V1M6, ESDA6V1-5M6 Figure 14. Tape and reel specification Dot identifying Pin A1 location 3.5 +/- 0.03 1.65 8.0 +/- 0.3 0.75 6/11 X X 1.20 X: Marking Note: φ 1.5 +/- 0.1 4.00+/-0.1 1.75 +/- 0.1 2.0+/-0.05 X 4.00 User direction of unreeling Product marking may be rotated by 90° for assembly plant differentiation. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose. ESDA6V1M6, ESDA6V1-5M6 Recommendation on PCB assembly 4 Recommendation on PCB assembly 4.1 Stencil opening design 1. General recommendation on stencil opening design a) Stencil opening dimensions: L (Length), W (Width), T (Thickness). Figure 15. Stencil opening dimensions L T b) W General design rule Stencil thickness (T) = 75 ~ 125 µm W Aspect Ratio = ----- ≥ 1.5 T L× W Aspect Area = ---------------------------- ≥ 0.66 2T ( L + W ) 2. Reference design a) Stencil opening thickness: 100 µm b) Stencil opening for leads: Opening to footprint ratio is 90%. Figure 16. Recommended stencil window position 7 µm 7 µm 620 µm 650 µm 15 µm 236 µm 15 µm 250 µm Footprint Stencil window Footprint 7/11 Recommendation on PCB assembly 4.2 4.3 4.4 8/11 ESDA6V1M6, ESDA6V1-5M6 Solder paste 1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004. 2. “No clean” solder paste is recommended. 3. Offers a high tack force to resist component movement during high speed. 4. Solder paste with fine particles: powder particle size is 20-45 µm. Placement 1. Manual positioning is not recommended. 2. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering. 3. Standard tolerance of ± 0.05 mm is recommended. 4. 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. PCB design preference 1. To control the solder paste amount, the closed via is recommended instead of open vias. 2. The position of tracks and open vias in the solder area should be well balanced. The symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. ESDA6V1M6, ESDA6V1-5M6 4.5 Recommendation on PCB assembly Reflow profile Figure 17. ST ECOPACK® recommended soldering reflow profile for PCB mounting Temperature (°C) 260°C max 255°C 220°C 180°C 125 °C 2°C/s recommended 2°C/s recommended 6°C/s max 6°C/s max 3°C/s max 3°C/s max 0 0 1 2 3 4 5 10-30 sec 90 to 150 sec Note: 6 7 Time (min) 90 sec max Minimize air convection currents in the reflow oven to avoid component movement. 9/11 Ordering information 5 ESDA6V1M6, ESDA6V1-5M6 Ordering information Table 4. Ordering information Order code Marking Package Weight Base qty Delivery mode ESDA6V1M6 I(1) Micro QFN 2.2 mg 3000 Tape and reel ESDA6V1-5M6 J(1) Micro QFN 2.2 mg 3000 Tape and reel 1. The marking can be rotated by 90° to differentiate assembly location 6 Revision history Table 5. 10/11 Document revision history Date Revision Changes 19-Sep-2005 1 Initial release. 10-Oct-2005 2 Package title changed from DFN to QFN. No technical changes. 01-Feb-2007 3 Reformatted to current standard. Added note on marking rotation in section 3. Package information. 18-Feb-2008 4 Reformatted to current standards. Corrected inch measurements in Table 3 on page 5. Added Section 4: Recommendation on PCB assembly. ESDA6V1M6, ESDA6V1-5M6 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 11/11