ETC RT8008

RT8008
Preliminary
1.5MHz, 600mA, High Efficiency
PWM Step-Down DC/DC Converter
General Description
Features
The RT8008 is a high-efficiency pulse-width-modulated
(PWM) step-down DC-DC converter. Capable of delivering
600mA output current over a wide input voltage range from
2.2 to 5.5V, the RT8008 is ideally suited for portable
electronic devices that are powered from 1-cell Li-ion
battery or from other power sources within the range such
as cellular phones, PDAs and handy-terminals.
Two operational modes are available: PSM/PWM/
Low-Dropout autoswitch and shut-down modes. Internal
synchronous rectifier with low RDS(ON) dramatically reduces
conduction loss at PWM mode. No external Schottky
diode is required in practical application. The RT8008
automatically turns off the synchronous rectifier while the
inductor current is low and enters discontinuous PWM
mode. This can increase efficiency at light load condition.
The RT8008 enters PSM (Pulse-Skipping Mode) at
extremely light load condition. The equivalent switching
frequency is reduced to increase the efficiency in PSM.
The RT8008 enters Low-Dropout mode when normal PWM
cannot provide regulated output voltage by continuously
turning on the upper P-MOSFET. RT8008 enter shutdown
mode and consumes less than 0.1uA when EN pin is pulled
low.
+2.2V to +5.5V Input Range
Adjustable Output From 0.6V to VIN
1.0V, 1.2V, 1.5V, 1.8V, 2.5V and 3.3V Fixed/
Adjustable Output Voltage
600mA Output Current
95% Efficiency
No Schottky Diode Required
50uA Quiescent Current
1.5MHz Fixed-Frequency PWM Operation
Pulse-skipping Mode Operation During Light Ioad
Small SOT-23-5 and TSOT-23-5 Package
RoHS Compliant and 100% Lead (Pb)-Free
Applications
Cellular Telephones
Personal Information Appliances
Wireless and DSL Modems
MP3 Players
Portable Instruments
Ordering Information
RT8008(-
Package Type
B : SOT-23-5
J5 : TSOT-23-5
Operating Temperature Range
C : Commercial Standard
P : Pb Free with Commercial Standard
The switching ripple is easily smoothed-out by small
package filtering elements due to a fixed operation
frequency of 1.5MHz. This along with small SOT-23-5 and
TSOT-23-5 package provides small PCB area application.
Other features include soft start, lower internal reference
voltage with 2% accuracy, over temperature protection,
and over current protection.
Output Voltage
Default : Adjustable
10 : 1.0V
12 : 1.2V
15 : 1.5V
18 : 1.8V
25 : 2.5V
33 : 3.3V
Pin Configurations
(TOP VIEW)
EN
1
GND
2
LX
3
5
FB/VOUT
)
Note :
RichTek Pb-free products are :
`RoHS compliant and compatible with the current requirements of IPC/JEDEC J-STD-020.
4
VIN
SOT-23-5/TSOT-23-5
DS8008-00
December 2005
`Suitable for use in SnPb or Pb-free soldering processes.
`100% matte tin (Sn) plating.
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RT8008
Preliminary
Typical Application Circuit
4
VIN
2.2V to 5.5V
VIN
CIN
4.7uF
LX
3
L
2.2uH
VOUT
RT8008
1
EN
VOUT
COUT
5
10uF
GND
2
Figure 1. Fixed Voltage Regulator
VIN
2.2V to 5.5V
4
CIN
VIN
LX
VOUT
C1
RT8008
4.7uF
1
EN
FB
GND
2
R1 ⎞
⎛
V OUT = V REF x ⎜ 1 +
⎟
R2
⎝
⎠
3
L
2.2uH
R1
COUT
5
10uF
IR2
R2
with R2 = 300kΩ to 60kΩ so the IR2 = 2μA to 10μA,
and (R1 x C1) should be in the range between 3x10-6 and 6x10-6ΩF for component selection.
Figure 2. Adjustable Voltage Regulator
Functional Pin Description
Pin Number
Pin Name
Pin Function
1
EN
Chip Enable (Active High)
2
GND
Ground
3
LX
Pin for Switching
4
VIN
Power Input
5
FB/VOUT
Feedback Input Pin
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DS8008-00
December 2005
RT8008
Preliminary
Function Block Diagram
VIN
EN
RS1
OSC &
Shutdown
Control
Slope
Compensation
FB/VOUT
Error
Amplifier
Current
Limit
Detector
PSM/PWM
Mode Detector
Current
Sense
Control
Logic
PWM
Comparator
Driver
LX
RC
COMP
UVLO &
Power Good
Detector
Zero
Detector
RS2
VREF
GND
DS8008-00
December 2005
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RT8008
Preliminary
Absolute Maximum Ratings
(Note 1)
Supply Input Voltage -----------------------------------------------------------------------------------------------------Enable, FB Voltage ------------------------------------------------------------------------------------------------------Power Dissipation, PD @ TA = 25°C
SOT-23-5, TSOT-23-5 ----------------------------------------------------------------------------------------------------Package Thermal Resistance (Note 4)
SOT-23-5, TSOT-23-5, θJA ----------------------------------------------------------------------------------------------SOT-23-5, TSOT-23-5, θJC ----------------------------------------------------------------------------------------------Junction Temperature Range -------------------------------------------------------------------------------------------Lead Temperature (Soldering, 10 sec.) ------------------------------------------------------------------------------Storage Temperature Range -------------------------------------------------------------------------------------------ESD Susceptibility (Note 2)
HBM (Human Body Mode) ---------------------------------------------------------------------------------------------MM (Machine Mode) ------------------------------------------------------------------------------------------------------
Recommended Operating Conditions
6.5V
VIN + 0.6V
0.4W
250°C/W
130°C/W
150°C
260°C
−65°C to 150°C
2kV
200V
(Note 3)
Supply Input Voltage ------------------------------------------------------------------------------------------------------ 2.2V to 5.5V
Operating Ambient Temperature Range ------------------------------------------------------------------------------ −40°C to 85°C
Operating Junction Temperature Range ------------------------------------------------------------------------------ −40°C to 125°C
Electrical Characteristics
(VIN = 3.6V, VOUT = 2.5V, VREF = 0.6V, L = 2.2μH, CIN = 4.7μF, COUT = 10μF, TA = 25°C, IMAX = 600mA unless otherwise specified)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Units
2.2
--
5.5
V
Input Voltage Range
VIN
Quiescent Current
IQ
IOUT = 0mA, VFB = VREF + 5%
--
50
100
μA
Shutdown Current
IQ(SD)
EN = GND
--
0.1
1
μA
Reference Voltage
VREF
For adjustable output voltage
0.588
0.6
0.612
V
Adjustable Output Range
VOUT
VREF
--
VIN
V
Output Voltage Accuracy
FB Input Current
ΔVOUT
VIN = 2.2 to 5.5V, VOUT = 1.0V
0mA < IOUT < 600mA
-3
--
+3
%
ΔVOUT
VIN = 2.2 to 5.5V, VOUT = 1.2V
0mA < IOUT < 600mA
-3
--
+3
%
ΔVOUT
VIN = 2.2 to 5.5V, VOUT = 1.5V
0mA < IOUT < 600mA
-3
--
+3
%
ΔVOUT
VIN = 2.2 to 5.5V, VOUT = 1.8V
0mA < IOUT < 600mA
-3
--
+3
%
ΔVOUT
VIN = 2.8 to 5.5V, VOUT = 2.5V
0mA < IOUT < 600mA
-3
--
+3
%
ΔVOUT
VIN = 3.5 to 5.5V, VOUT = 3.3V
0mA < IOUT < 600mA
-3
--
+3
%
ΔVOUT
VIN = VOUT + 0.2V to 5.5V
0mA < IOUT < 600mA
-3
--
+3
%
IFB
VFB = VIN
-50
--
50
nA
To be continued
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DS8008-00
December 2005
RT8008
Preliminary
Parameter
Symbol
Test Conditions
Min
Typ
Max
VIN = 3.6V
--
0.35
--
VIN = 2.5V
--
0.45
--
VIN = 3.6V
--
0.30
--
VIN = 2.5V
--
0.40
--
Units
Ω
PMOSFET RON
PRDS(ON) IOUT = 200mA
NMOSFET RON
NRDS(ON) IOUT = 200mA
P-Channel Current Limit
IP(LM)
VIN = 2.2 to 5.5 V
0.8
--
1.8
A
EN High-Level Input Voltage
VENH
VIN = 2.2V to 5.5V
1.5
--
--
V
EN Low-Level Input Voltage
VENL
VIN = 2.2V to 5.5V
--
--
0.4
V
Undervoltage Lock Out threshold
--
1.8
--
V
Hysteresis
--
0.1
--
V
1.2
1.5
1.8
MHz
--
160
--
°C
--
50
--
ns
100
--
--
%
-1
--
1
μA
Oscillator Frequency
fOSC
Thermal Shutdown Temperature
TSD
VIN = 3.6V, IOUT = 100mA
Min. On Time
Max. Duty Cycle
LX Leakage Current
VIN = 3.6V, VLX = 0V or VLX = 3.6V
Ω
Note 1. Stresses listed as the above “Absolute Maximum Ratings” may cause permanent damage to the device. These are for
stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended
periods may remain possibility to affect device reliability.
Note 2. Devices are ESD sensitive. Handling precaution recommended.
Note 3. The device is not guaranteed to function outside its operating conditions.
Note 4. θJA is measured in the natural convection at TA = 25°C on a low effective single layer thermal conductivity test board of
JEDEC 51-3 thermal measurement standard. Pin 2 of SOT-23-5/TSOT-23-5 packages is the case position for θJC
measurement.
DS8008-00
December 2005
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RT8008
Preliminary
Typical Operating Characteristics
Efficiency vs. Input Voltage
Efficiency vs. Output Current
100
100%
100
100%
VOUT = 1.8V
90
90%
95
95%
80
80%
Efficiency (%)
Efficiency (%)
70
70%
IOUT = 150mA
90
90%
VOUT = 1.2V
60
60%
50
50%
40
40%
30
30%
IOUT = 300mA
85
85%
80
80%
75
75%
IOUT = 1mA
70%
70
20
20%
65%
65
10
10%
VOUT = 1.2V
VIN = 3.3V
0%0
60%
60
0.1
1
10
100
1000
2.5
3
4.5
5
5.5
Switching Frequency vs. Temperature
Quiescent Current vs. Input Voltage
1.7
Switching Frequency (MHz)
55
53
51
49
47
1.65
1.6
1.55
1.5
1.45
1.4
1.35
VIN = 3.3V, IOUT = 300mA
TA = 25°C
1.3
45
2.5
3
3.5
4
4.5
5
-40 -30 -20 -10
5.5
0
10 20 30 40 50 60 70 80
Temperature (°C)
Input Voltage(V)
Output Voltage vs. Output Current
Output Voltage vs. Output Current
1.25
1.84
1.24
1.83
1.82
Output Voltage (V)
1.23
Output Voltage (V)
4
Input Voltage (V)
Output Current (mA)
Quiescent Current (uA)
3.5
1.22
1.21
1.2
1.19
1.18
1.17
1.81
1.8
1.79
1.78
1.77
1.76
1.75
1.74
1.16
VIN = 3.3V
1.15
1.73
VIN = 3.3V
1.72
0
50 100 150 200 250 300 350 400 450 500 550 600
Output Current (mA)
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0
50 100 150 200 250 300 350 400 450 500 550 600
Output Current (mA)
DS8008-00
December 2005
Preliminary
I LOAD
(500mA/Div)
Load Transient Response
Load Transient Response
VIN = 5V, VOUT = 1.2V, IOUT = 300mA to 50mA
VOUT
(50mV/Div)
VIN = 3.3V, VOUT = 1.2V, IOUT = 600mA to 300mA
I LOAD
(500mA/Div)
I LOAD
(500mA/Div)
Time (250μs/Div)
Time (250μs/Div)
Load Transient Response
Load Transient Response
VIN = 5V, VOUT = 1.2V, IOUT = 600mA to 300mA
I LOAD
(500mA/Div)
VIN = 5V, VOUT = 1.2V, IOUT = 600mA to 50mA
VOUT
(100mV/Div)
VOUT
(100mV/Div)
Time (250μs/Div)
I LOAD
(500mA/Div)
VOUT
(100mV/Div)
VIN = 3.3V, VOUT = 1.2V, IOUT = 600mA to 50mA
Time (250μs/Div)
Time (250μs/Div)
DS8008-00
Load Transient Response
VOUT
(100mV/Div)
VIN = 3.3V, VOUT = 1.2V, IOUT = 300mA to 50mA
I LOAD
(500mA/Div)
VOUT
(100mV/Div)
Load Transient Response
RT8008
December 2005
Time (250μs/Div)
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RT8008
Preliminary
VOUT
EN
(1V/Div) (2V/Div)
Start-Up
VIN = 2.2V, VOUT = 1.2V, IOUT = 600mA
Time (1ms/Div)
ILX
(500mA/Div)
ILX
(500mA/Div)
VOUT
EN
(1V/Div) (2V/Div)
Start-Up
VIN = 3.3V, VOUT = 1.2V, IOUT = 600mA
Time (1ms/Div)
ILX
(500mA/Div)
VOUT
EN
(1V/Div) (5V/Div)
Start-Up
VIN = 5V, VOUT = 1.2V, IOUT = 600mA
Time (1ms/Div)
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DS8008-00
December 2005
Preliminary
Applications Information
RT8008
The maximum power dissipation depends on the thermal
resistance of IC package, PCB layout, the rate of
surroundings airflow and temperature difference between
junction to ambient. The maximum power dissipation can
be calculated by following formula :
The value of junction to case thermal resistance θJC is
popular for users. This thermal parameter is convenient
for users to estimate the internal junction operated
temperature of packages while IC operating. It's
independent of PCB layout, the surroundings airflow effects
and temperature difference between junction to ambient.
The operated junction temperature can be calculated by
following formula :
PD(MAX) = ( TJ(MAX) - TA ) / θJA
TJ = TC + PD x θJC
Where T J(MAX) is the maximum operation junction
temperature 125°C, TA is the ambient temperature and the
θJA is the junction to ambient thermal resistance.
Where TC is the package case (Pin 2 of package leads)
temperature measured by thermal sensor, PD is the power
dissipation defined by user's function and the θJC is the
junction to case thermal resistance provided by IC
manufacturer. Therefore it's easy to estimate the junction
temperature by any condition.
Thermal Considerations
For recommended operating conditions specification of
RT8008 DC/DC converter, where TJ (MAX) is the maximum
junction temperature of the die (125°C) and TA is the
maximum ambient temperature. The junction to ambient
thermal resistance θ JA is layout dependent. For
SOT-23-5/TSOT-23-5 packages, the thermal resistance θJA
is 250° C/W on the standard JEDEC 51-3 single-layer
thermal test board. The maximum power dissipation at
TA = 25°C can be calculated by following formula :
PD(MAX) = ( 125°C - 25°C ) / 250 = 0.4 W for SOT-23-5/
TSOT-23-5 packages
The maximum power dissipation depends on operating
ambient temperature for fixed T J(MAX) and thermal
resistance θJA. For RT8008 packages, the Figure 1 of
derating curves allows the designer to see the effect of
rising ambient temperature on the maximum power
allowed.
Maximum Power Dissipation (mW)
450
Single Layer PCB
400
350
SOT-23-5, TSOT-23-5 Packages
300
250
200
150
100
50
0
0
20
40
60
80
100
120
140
Ambient Temperature (°C)
Figure 1. Derating Curves for RT8008 Package
DS8008-00
December 2005
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RT8008
Preliminary
Outline Dimension
H
D
L
B
C
b
A
A1
e
Symbol
Dimensions In Millimeters
Dimensions In Inches
Min
Max
Min
Max
A
0.889
1.295
0.035
0.051
A1
0.000
0.152
0.000
0.006
B
1.397
1.803
0.055
0.071
b
0.356
0.559
0.014
0.022
C
2.591
2.997
0.102
0.118
D
2.692
3.099
0.106
0.122
e
0.838
1.041
0.033
0.041
H
0.080
0.254
0.003
0.010
L
0.300
0.610
0.012
0.024
SOT-23-5 Surface Mount Package
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DS8008-00
December 2005
RT8008
Preliminary
H
D
L
B
C
b
A
A1
e
Symbol
Dimensions In Millimeters
Dimensions In Inches
Min
Max
Min
Max
A
0.700
1.000
0.028
0.039
A1
0.000
0.100
0.000
0.004
B
1.397
1.803
0.055
0.071
b
0.300
0.559
0.012
0.022
C
2.591
3.000
0.102
0.118
D
2.692
3.099
0.106
0.122
e
0.838
1.041
0.033
0.041
H
0.080
0.254
0.003
0.010
L
0.300
0.610
0.012
0.024
TSOT-23-5 Surface Mount Package
RICHTEK TECHNOLOGY CORP.
RICHTEK TECHNOLOGY CORP.
Headquarter
Taipei Office (Marketing)
5F, No. 20, Taiyuen Street, Chupei City
8F-1, No. 137, Lane 235, Paochiao Road, Hsintien City
Hsinchu, Taiwan, R.O.C.
Taipei County, Taiwan, R.O.C.
Tel: (8863)5526789 Fax: (8863)5526611
Tel: (8862)89191466 Fax: (8862)89191465
Email: [email protected]
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December 2005
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