TXS0206 www.ti.com ....................................................................................................................................... SCES697A – NOVEMBER 2008 – REVISED DECEMBER 2008 MMC, SD CARD, Memory Stick™ VOLTAGE-TRANSLATION TRANSCEIVER WITH ESD PROTECTION AND EMI FILTERING FEATURES 1 • Level Translator – VCCA and VCCB Range of 1.1 V to 3.6 V – Fast Propagation Delay (4 ns Max When Translating Between 1.8 V and 3 V) • Integrated EMI Filtering and ESD Protection Circuitry • ESD Protection Exceeds JESD 22 (A Port) – 2500-V Human-Body Model (A114-B) – 250-V Machine Model (A115-A) – 1500-V Charged-Device Model (C101) • IEC 61000-4-2 ESD (B Port) – ±8-kV Contact Discharge – ±4-kV Air-Gap Discharge YFP PACKAGE (TOP VIEW) 2 1 2 3 4 A B C D E TERMINAL ASSIGNMENTS 1 2 3 4 A DAT2A VCCA WP DAT2B B DAT3A CD VCCB DAT3B C CMDA GND GND CMDB D DAT0A CLKA CLKB DAT0B E DAT1A CLK-f EN DAT1B DESCRIPTION/ORDERING INFORMATION The TXS0206 is a level shifter for interfacing microprocessors with MultiMediaCards (MMCs), secure digital (SD) cards, and Memory Stick™ cards. It includes a high-speed level translator along with ESD protection and EMI filtering circuitry. The voltage-level translator has two supply voltage pins. VCCA as well as VCCB can be operated over the full range of 1.1 V to 3.6 V. The TXS0206 enables system designers to easily interface applications processors or digital basebands to memory cards and SDIO peripherals operating at a different I/O voltage level. Memory card standards recommend high-ESD protection for devices that connect directly to the external memory card. To meet this need, the TXS0206 incorporates ±15-kV Air-Gap Discharge and ±8-kV Contact Discharge protection on the card side. The TXS0206 is offered in a 20-bump wafer chip scale package (WCSP). This package has dimensions of 1.96 mm × 1.56 mm, with a 0.4-mm ball pitch for effective board-space savings. Memory cards are widely used in mobile phones, PDAs, digital cameras, personal media players, camcorders, set-top boxes, etc. Low static power consumption and small package size make the TXS0206 an ideal choice for these applications. ORDERING INFORMATION TA –40°C to 85°C (1) (2) (3) PACKAGE WCSP – YFP (Pb-free) (1) (2) Tape and reel ORDERABLE PART NUMBER TXS0206YFPR TOP-SIDE MARKING (3) _ _ _3T_ For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. YFP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, •= Pb-free). 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2008, Texas Instruments Incorporated TXS0206 SCES697A – NOVEMBER 2008 – REVISED DECEMBER 2008 ....................................................................................................................................... www.ti.com REFERENCE DESIGN VCCA VCCB C3 0.1 µF U1A VCCB C4 0.1 µF C1 0.1 µF J1 U2 VDDA DAT0 DAT1 DAT2 DAT3 CMD CLK CLKin GND WP A2 D1 E1 A1 B1 C1 D2 E2 C2 C3 VCCA VCCB DAT0A DAT1A DAT2A DAT3A CMDA CLKA CLK-f B3 D4 DAT0B DAT0B DAT1B E4 DAT1B DAT2B A4 DAT2B DAT3B B4 DAT3B CLKB DAT0B DAT1B C4 CMDB CMDB D3 CLKB CLKB CD A3 WP WP B2 CD CD WP GND GND CD Processor SD/SDIO MMC DAT2B DAT3B CMDB 0 1 2 3 4 5 6 7 8 9 10 11 12 13 DAT2 DAT3 CMD VSS1 VDD CLK VSS2 DAT0 DAT1 WP/CD (Physical) CD (Physical) GND GND WP (Physical) 54794-0978 SD/SDIO Card Connector TXS0206 Figure 1. Interfacing With SD/SDIO Card 2 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TXS0206 TXS0206 www.ti.com ....................................................................................................................................... SCES697A – NOVEMBER 2008 – REVISED DECEMBER 2008 VCCA VCCB VCCB C3 0.1 µF U1A C4 0.1 µF C1 0.1 µF U2 VDDA DAT0 DAT1 DAT2 DAT3 CMD CLK CLKin GND A2 D1 E1 A1 B1 C1 D2 E2 C2 C3 VCCA VCCB DAT0A CMDB 2 DAT1B 3 E4 DAT1B DAT1B A4 DAT2B DAT2B B4 DAT3B DAT3B DAT0B 4 DAT2B 5 CD 6 C4 CMDB CMDB D3 CLKB CLKB DAT3B 7 CLKB 8 DAT0B D4 DAT0B DAT1A DAT2A DAT3A CMDA CLKA CLK-f 1 B3 GND 9 GND CD CD Memory Stick™ Controller B2 CD 10 TXS0206 VSS BS DATA1 (see Note) DATA0/SDIO (see Note) DATA2 (see Note) INS DATA3 (see Note) SCLK VCC VSS Memory Stick™ Connector NOTE: The TXS0206 has integrated pullup resistor values that dynamically change value depending on whether a low or high signal is being transmitted through the device. When the output is low, the TXS0206 internal pullup value is 40 kΩ, and when the output is high, the internal pullup value change to a value of 4 kΩ. For MSA and MSH Memory Stick™ memory cards, to ensure that a valid VIH (i.e., receiver input voltage high) is achieved, the internal pulldown resistors for these memory cards are not smaller than a 10-kΩ value. See the Application Information section of this data sheet, which explains the impact of adding too heavy (i.e., <10-kΩ value) of a pulldown resistor to the data lines of the TXS0206 device and the resulting 4-kΩ pullup/10-kΩ pulldown voltage divider network, which has a direct impact on the VIH of the signal being sent into the Memory Stick™. Figure 2. Interfacing With Memory Stick™ Card Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TXS0206 3 TXS0206 SCES697A – NOVEMBER 2008 – REVISED DECEMBER 2008 ....................................................................................................................................... www.ti.com ESD – ±8-kV Contact Discharge ±4-kV Air-Gap Discharge ESD – 2 kV 1.8 V A Side B Side 2.9 V CLK CLK Feedback CLK CMD CMD Data 0–3 CPU Data 0–3 Level-Shifter Integrated ASIP Antenna Pins 10, 11 EN WP, CD MMC, SD Card, or MS Card WP, CD 1.8-V Pullup WP, CD Integrated Pullup/Pulldown Resistors Figure 3. Typical Application Circuit LOGIC TABLE 4 EN TRANSLATOR I/Os L Disabled, pulled to VCCA, VCCB through 40 kΩ H Active Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TXS0206 TXS0206 www.ti.com ....................................................................................................................................... SCES697A – NOVEMBER 2008 – REVISED DECEMBER 2008 TERMINAL FUNCTIONS TERMINAL TYPE DESCRIPTION NO. NAME A1 DAT2A I/O Data bit 2 connected to host. Referenced to VCCA. Includes a 40-kΩ pullup resistor to VCCA. A2 VCCA Pwr A-port supply voltage. VCCA powers all A-port I/Os and control inputs. A3 WP O Connected to write protect on the mechanical connector. The WP pin has an internal 100-kΩ pullup resistor to VCCA. A4 DAT2B I/O Data bit 2 connected to memory card. Referenced to VCCB. Includes a 40-kΩ pullup resistor to VCCB. B1 DAT3A I/O Data bit 3 connected to host. Referenced to VCCA. Includes a 40-kΩ pullup resistor to VCCA. B2 CD O Connected to card detect on the mechanical connector. The CD pin has an internal 100-kΩ pullup resistor to VCCA. B3 VCCB Pwr B-port supply voltage. VCCB powers all B-port I/Os. B4 DAT3B I/O Data bit 3 connected to memory card. Referenced to VCCB. Includes a 40-kΩ pullup resistor to VCCB. I/O Command bit connected to host. Referenced to VCCA. Includes a 40-kΩ pullup resistor to VCCA. C1 CMDA C2, C3 GND C4 CMDB I/O Command bit connected to memory card. Referenced to VCCB. Includes a 40-kΩ pullup resistor to VCCB. D1 DAT0A I/O Data bit 0 connected to host. Referenced to VCCA. Includes a 40-kΩ pullup resistor to VCCA. D2 CLKA I Clock signal connected to host. Referenced to VCCA. D3 CLKB O Clock signal connected to memory card. Referenced to VCCB. D4 DAT0B I/O Data bit 0 connected to memory card. Referenced to VCCB. Includes a 40-kΩ pullup resistor to VCCB. E1 DAT1A I/O Data bit 1 connected to host. Referenced to VCCA. Includes a 40-kΩ pullup resistor to VCCA. E2 CLK-f O Clock feedback to host for resynchronizing data to a processor. Leave unconnected if not used. E3 EN I Enable/disable control. Pull EN low to place all outputs in Hi-Z state. Referenced to VCCA. E4 DAT1B I/O Ground Data bit 1 connected to memory card. Referenced to VCCB. Includes a 40-kΩ pullup resistor to VCCB. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TXS0206 5 TXS0206 SCES697A – NOVEMBER 2008 – REVISED DECEMBER 2008 ....................................................................................................................................... www.ti.com VCCA VCCB EN VCCA Bias CMDA VCCA VCCB Bias DAT0B DAT0A VCCA VCCB Bias DAT1A VCCA DAT1B VCCB Bias DAT2A VCCA DAT2B VCCB Bias DAT3B DAT3A CLKA CLKB CLK-f VCCA 100 kW WP 100 kW CD Figure 4. Logic Diagram 6 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TXS0206 TXS0206 www.ti.com ....................................................................................................................................... SCES697A – NOVEMBER 2008 – REVISED DECEMBER 2008 VCCB R7 R8 R9 R10 R11 HOST CARD R1 CLKB CLK R2 CMD CMDB R3 Data0 DAT0B R4 DAT1B Data1 R5 DAT2B Data2 R6 Data3 DAT3B GND GND BIDIRECTIONAL ZENER DIODES RESISTORS R1, R2, R3, R4, R5, R6 40 Ω Vbr min 14 V at 1 mA Tolerance ±20% Line capacitance <20 pF R7, R8, R9, R10, R11 40 kΩ Tolerance ±30% Figure 5. ASIP Block Diagram VCCA RCD RWP WP CD RESISTORS RWP, RCD 100 kΩ Tolerance ±30% Figure 6. WP, CD Pullup Resistors Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TXS0206 7 TXS0206 SCES697A – NOVEMBER 2008 – REVISED DECEMBER 2008 ....................................................................................................................................... www.ti.com ABSOLUTE MAXIMUM RATINGS (1) Level Translator over operating free-air temperature range (unless otherwise noted) MIN MAX VCCA Supply voltage range –0.5 4.6 V VCCB Supply voltage range –0.5 4.6 V I/O ports (A port) –0.5 4.6 I/O ports (B port) –0.5 4.6 Control inputs –0.5 4.6 A port –0.5 4.6 B port –0.5 4.6 A port –0.5 4.6 B port –0.5 4.6 VI Input voltage range UNIT V VO Voltage range applied to any output in the high-impedance or power-off state VO Voltage range applied to any output in the high or low state IIK Input clamp current VI < 0 –50 mA IOK Output clamp current VO < 0 –50 mA IO Continuous output current ±50 mA ±100 mA 150 °C Continuous current through VCCA or GND Tstg (1) Storage temperature range –65 V V Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. THERMAL IMPEDANCE RATINGS UNIT θJA (1) 8 Package thermal impedance (1) 117 °C/W The package thermal impedance is calculated in accordance with JESD 51-7. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TXS0206 TXS0206 www.ti.com ....................................................................................................................................... SCES697A – NOVEMBER 2008 – REVISED DECEMBER 2008 RECOMMENDED OPERATING CONDITIONS (1) Level Translator VCCA VCCB MIN MAX UNIT VCCA Supply voltage 1.1 3.6 V VCCB Supply voltage 1.1 3.6 V VIH High-level input voltage VCCI – 0.65 3.6 V VIL Low-level input voltage 0 VCCI – 0.35 V VO Output voltage Active state 0 VCCO 3-state 0 3.6 IOH High-level output current (CLK-f output) 1.1 V to 3.6 V –100 1.1 V to 1.3 V –0.5 1.4 V to 1.6 V 1.65 V to 1.95 V Low-level output current (CLK-f output) –2 –8 1.1 V to 3.6 V 100 1.1 V to 1.3 V 0.5 1.4 V to 1.6 V 2 IOL Low-level output current (CLK output) Δt/Δv Input transition rise or fall rate TA Operating free-air temperature (1) 1.1 V to 3.6 V 1.1 V to 3.6 V mA 4 3 V to 3.6 V High-level output current (CLK output) µA 1 1.1 V to 3.6 V 2.3 V to 2.7 V IOH mA –4 3 V to 3.6 V 1.65 V to 1.95 V µA –1 1.1 V to 3.6 V 2.3 V to 2.7 V IOL V 8 1.1 V to 3.6 V –100 1.1 V to 1.3 V –0.5 1.4 V to 1.6 V –1 1.65 V to 1.95 V –2 2.3 V to 2.7 V –4 3 V to 3.6 V –8 1.1 V to 3.6 V 100 1.1 V to 1.3 V 0.5 1.4 V to 1.6 V 1 1.65 V to 1.95 V 2 2.3 V to 2.7 V 4 3 V to 3.6 V 8 –40 µA mA µA mA 5 ns/V 85 °C All unused data inputs of the device must be held at VCCI or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TXS0206 9 TXS0206 SCES697A – NOVEMBER 2008 – REVISED DECEMBER 2008 ....................................................................................................................................... www.ti.com ELECTRICAL CHARACTERISTICS Level Translator over recommended operating free-air temperature range (unless otherwise noted) PARAMETER A port (CLK-f output) VOH A port (DAT and CMD outputs) A port (CLK-f output) VOL TEST CONDITIONS VCCA VCCB MIN VOH B port (CLK output) B port (DAT output) (1) 10 MAX IOH = –100 µA 1.1 V to 3.6 V IOH = –0.5 mA 1.1 V 0.8 IOH = –1 mA 1.4 V 1.05 IOH = –2 mA 1.65 V IOH = –4 mA 2.3 V IOH = –8 mA 3V IOH = –20 µA 1.1 V to 3.6 V IOL = 100 µA 1.1 V to 3.6 V IOL = 0.5 mA 1.1 V IOL = 1 mA 1.4 V IOL = 2 mA 1.65 V IOL = 4 mA 2.3 V 0.55 IOL = 8 mA 3V 0.7 1.2 1.1 V to 3.6 V V 1.75 2.3 VCCA × 0.8 VCCA × 0.8 0.35 0.35 1.1 V to 3.6 V 0.45 0.4 1.1 V to 3.6 V 0.4 IOL = 300 µA 0.4 IOL = 400 µA 0.55 IOH = –100 µA 1.1 V to 3.6 V IOH = –0.5 mA 1.1 V 0.8 IOH = –1 mA 1.4 V 1.05 IOH = –2 mA V 0.4 IOL = 180 µA IOL = 220 µA UNIT VCCA * 0.8 IOL = 135 µA A port (DAT and CMD outputs) TYP (1) VCCA × 0.8 1.65 V 1.2 IOH = –4 mA 2.3 V 1.75 IOH = –8 mA 3V 2.3 IOH = –20 µA 1.1 V to 3.6 V 1.1 V to 3.6 V V V VCCA × 0.8 All typical values are at TA = 25°C. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TXS0206 TXS0206 www.ti.com ....................................................................................................................................... SCES697A – NOVEMBER 2008 – REVISED DECEMBER 2008 ELECTRICAL CHARACTERISTICS Level Translator (continued) over recommended operating free-air temperature range (unless otherwise noted) PARAMETER B port VOL B port (DAT output) II Control inputs ICCA ICCB Cio Ci TEST CONDITIONS VCCA VCCB MIN TYP (1) MAX IOL = 100 µA 1.1 V to 3.6 V IOL = 0.5 mA 1.1 V 0.35 IOL = 1 mA 1.4 V 0.35 1.65 V 0.45 IOL = 4 mA 2.3 V 0.55 IOL = 8 mA 3V 0.7 IOL = 135 µA 1.1 V to 3.6 V 0.4 IOL = 180 µA 1.4 V 0.4 1.65 V 0.4 1.1 V to 3.6 V IOL = 2 mA IOL = 220 µA 1.1 V to 3.6 V IOL = 300 µA 2.3 V 0.4 IOL = 400 µA 3V 0.55 V 1.1 V to 3.6 V ±1 µA IO = 0 1.1 V to 3.6 V 1.1 V to 3.6 V 6 µA VI = VCCI or GND, IO = 0 1.1 V to 3.6 V 1.1 V to 3.6 V 5 µA 5.5 6.5 B port 15 17.5 3.5 4.5 3 4 Clock input V VI = VCCI or GND, VI = VCCA or GND A port Control inputs UNIT VCCA × 0.8 VI = VCCA or GND Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TXS0206 pF pF 11 TXS0206 SCES697A – NOVEMBER 2008 – REVISED DECEMBER 2008 ....................................................................................................................................... www.ti.com TIMING REQUIREMENTS VCCA = 1.2 V ± 0.1 V over recommended operating free-air temperature range (unless otherwise noted) VCCB = 1.2 V ± 0.1 V MIN Command Data rate Clock Data tW Command Pulse duration Clock Data VCCB = 1.5 V ± 0.1 V MAX MIN MAX VCCB = 1.8 V ± 0.15 V MIN VCCB = 2.5 V ± 0.2 V MAX MIN MAX VCCB = 3.3 V ± 0.3 V MIN UNIT MAX Push-pull driving 30 40 40 40 40 Open-drain driving 0.9 1 1 1 1 30 40 50 60 60 MHz 30 40 40 40 40 Mbps Push-pull driving Push-pull driving Open-drain driving Push-pull driving Mbps 33 25 25 25 25 ns 1 1 1 1 1 µs 16.7 12.5 10 8.3 8.3 ns 33 25 25 25 25 ns TIMING REQUIREMENTS VCCA = 1.5 V ± 0.1 V over recommended operating free-air temperature range (unless otherwise noted) VCCB = 1.2 V ± 0.1 V MIN Command Data rate Clock Data Command tW Pulse duration Clock Data Push-pull driving MAX Push-pull driving Open-drain driving Push-pull driving MIN MAX VCCB = 1.8 V ± 0.15 V MIN VCCB = 2.5 V ± 0.2 V MAX MIN MAX VCCB = 3.3 V ± 0.3 V MIN UNIT MAX 30 60 60 60 60 1 1 1 1 1 50 60 60 60 60 MHz 30 60 60 60 60 Mbps Open-drain driving Push-pull driving VCCB = 1.5 V ± 0.1 V 33 17 17 17 Mbps 17 ns 1 1 1 1 1 µs 10 8.3 8.3 8.3 8.3 ns 33 17 17 17 17 ns TIMING REQUIREMENTS VCCA = 1.8 V ± 0.15 V over recommended operating free-air temperature range (unless otherwise noted) VCCB = 1.2 V ± 0.1 V MIN Command Data rate Clock Data Command tW Pulse duration Clock Data 12 Push-pull driving Open-drain driving Push-pull driving Push-pull driving Open-drain driving Push-pull driving VCCB = 1.5 V ± 0.1 V MAX MIN MAX VCCB = 1.8 V ± 0.15 V MIN VCCB = 2.5 V ± 0.2 V MAX MIN MAX VCCB = 3.3 V ± 0.3 V MIN UNIT MAX 30 60 60 60 60 1 1 1 1 1 50 60 60 60 60 MHz 60 Mbps 30 60 60 60 Mbps 33 17 17 17 17 ns 1 1 1 1 1 µs 10 8.3 8.3 8.3 8.3 ns 33 17 17 17 17 ns Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TXS0206 TXS0206 www.ti.com ....................................................................................................................................... SCES697A – NOVEMBER 2008 – REVISED DECEMBER 2008 TIMING REQUIREMENTS VCCA = 2.5 V ± 0.2 V over recommended operating free-air temperature range (unless otherwise noted) VCCB = 1.2 V ± 0.1 V MIN Command Data rate Clock Data tW Command Pulse duration Clock Data Push-pull driving MAX Push-pull driving Open-drain driving Push-pull driving MIN MAX VCCB = 1.8 V ± 0.15 V MIN VCCB = 2.5 V ± 0.2 V MAX MIN MAX VCCB = 3.3 V ± 0.3 V MIN UNIT MAX 30 60 60 60 60 1 1 1 1 1 60 60 60 60 60 MHz 30 60 60 60 60 Mbps Open-drain driving Push-pull driving VCCB = 1.5 V ± 0.1 V Mbps 33 17 17 17 17 ns 1 1 1 1 1 µs 8.3 8.3 8.3 8.3 8.3 ns 33 17 17 17 17 ns TIMING REQUIREMENTS VCCA = 3.3 V ± 0.3 V over recommended operating free-air temperature range (unless otherwise noted) VCCB = 1.2 V ± 0.1 V MIN Command Data rate Clock Data Command tW Pulse duration Clock Data MAX VCCB = 1.5 V ± 0.1 V MIN MAX VCCB = 1.8 V ± 0.15 V MIN VCCB = 2.5 V ± 0.2 V MAX MIN MAX VCCB = 3.3 V ± 0.3 V MIN UNIT MAX Push-pull driving 30 60 60 60 60 Open-drain driving 0.9 1 1 1 1 55 55 55 55 55 MHz 30 60 60 60 60 Mbps Push-pull driving Push-pull driving Open-drain driving Push-pull driving Mbps 33 17 17 17 17 ns 1 1 1 1 1 µs 9 9 9 9 9 ns 33 17 17 17 17 ns Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TXS0206 13 TXS0206 SCES697A – NOVEMBER 2008 – REVISED DECEMBER 2008 ....................................................................................................................................... www.ti.com SWITCHING CHARACTERISTICS VCCA = 1.2 V ± 0.1 V over recommended operating free-air temperature range (unless otherwise noted) PARAMETER FROM (INPUT) TO (OUTPUT) TEST CONDITIONS VCCB = 1.2 V ± 0.1 V MIN Push-pull driving CMDA CMDB CMDB ten tdis CMDA CLKA CLKB DATA DATB DATB DATA CLKA CLK-f EN 15.3 MIN 10.4 UNIT MAX 10.8 4.1 16.6 3.7 12.6 3.4 11.5 3.3 10.6 3.2 10.3 Open-drain driving (L-to-H) 204 308 164 256 133 224 95 175 71 147 19.7 15.1 13.4 12 11.2 Open-drain driving (H-to-L) 4.7 19.4 3.8 12.4 3.4 10.5 3.1 9.2 2.9 9.4 Open-drain driving (L-to-H) 211 353 170 304 139 282 101 243 77 204 10.9 11.7 10.7 11.1 18.2 14.3 12.8 11.5 10.6 Push-pull driving 37.9 30.7 26.8 24.7 24.2 B-port Push-pull driving 1 1 1 1 1 EN A-port Push-pull driving 1 1 1 1 1 EN B-port Push-pull driving 68 55 46 40 38 EN A-port Push-pull driving 62 56 48 40 37 CMDA fall time CLK-f fall time DATAx fall time CMDB fall time CLKB fall time DATBx fall time Channel-to-channel skew Command Clock Data 14 10.8 MAX 11.2 DATBx rise time Max data rate MIN 11.5 CLKB rise time tSK(O) 12.2 MAX 12.6 CMDB rise time tfB MIN 12.3 DATAx rise time tfA MAX VCCB = 3.3 V ± 0.3 V 15.9 CLK-f rise time trB MIN VCCB = 2.5 V ± 0.2 V 15.6 CMDA rise time trA MAX VCCB = 1.8 V ± 0.15 V Open-drain driving (H-to-L) Push-pull driving tpd VCCB = 1.5 V ± 0.1 V Push-pull driving Push-pull driving Push-pull driving 1.7 14.1 1.5 13 1.5 12.7 1.6 12.2 1.9 Open-drain driving 170 260 128 205 96 171 57 120 32 91 0.6 10.6 0.6 10.9 0.6 12 0.6 12.3 0.6 12.7 11.5 Push-pull driving 1.7 13.7 1.5 12.6 1.5 12 1.6 11.6 1.9 1.9 12.4 2.3 9.2 1.9 7.3 1.8 6.7 1.7 3.9 Open-drain driving 175 300 145 261 118 245 86 214 66 181 1 7.7 0.8 7.1 0.8 6.2 1.7 4.8 1.7 4.3 2.9 11.8 2.3 8.9 1.9 7.4 0.9 4.7 0.4 6.8 Push-pull driving Open-drain driving Push-pull driving 1 8 1 5.4 1 4.5 1 3.9 0.8 4 2.3 8.3 1.9 4.9 1.7 4.4 1.6 3.9 1.6 3.7 1 5.8 1 4.6 1 4.1 1 3.8 1 4 1.8 8 1.3 5.4 1 4.5 1 3.9 1 3.8 Push-pull driving 2.1 7.9 1.8 5.2 1.7 4.6 1.6 4.5 1.5 4.3 Open-drain driving 1.9 8.3 1.5 5.9 1.3 5.1 1.1 4.3 1 4.2 2 7.1 1.8 5.4 1.8 4.5 1.7 4 1.6 3.9 2.1 8.5 1.1 6.4 0.9 5 1 3.9 1.1 4.8 Push-pull driving Push-pull driving µs ns 11.9 Push-pull driving Push-pull driving ns ns ns ns ns 1 1 1 1 1 Push-pull driving 30 40 40 40 40 Open-drain driving 0.9 1 1 1 1 30 40 50 60 60 MHz 30 40 40 40 40 Mbps Push-pull driving Submit Documentation Feedback ns Mbps Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TXS0206 TXS0206 www.ti.com ....................................................................................................................................... SCES697A – NOVEMBER 2008 – REVISED DECEMBER 2008 SWITCHING CHARACTERISTICS VCCA = 1.5 V ± 0.1 V over recommended operating free-air temperature range (unless otherwise noted) PARAMETER FROM (INPUT) TO (OUTPUT) TEST CONDITIONS VCCB = 1.2 V ± 0.1 V MIN Push-pull driving CMDA CMDB ten tdis CMDB CMDA CLKA CLKB DATA DATB DATB DATA CLKA CLK-f EN 12 6.9 MAX MIN 6.1 UNIT MAX 6 3.7 12.8 3.2 8.7 2.9 7.6 2.7 6.6 2.7 6.5 Open-drain driving (L-to-H) 192 297 191 295 157 252 112 180 83 138 15.2 9.8 8 6.8 6.3 Open-drain driving (H-to-L) 3.7 20.4 2.9 11.8 2.5 9.4 2.2 7.3 2.1 6.6 Open-drain driving (L-to-H) 199 337 196 316 162 282 117 214 87 177 6.1 6.2 7.2 6.2 6.1 13.9 9.2 7.6 6.5 6.1 Push-pull driving 29 20 16 13 12 B-port Push-pull driving 1 1 1 1 1 EN A-port Push-pull driving 1 1 1 1 1 EN B-port Push-pull driving 57 53 46 39 37 EN A-port Push-pull driving 58 54 46 38 35 CLK-f rise time CLKB rise time CLK-f fall time DATAx fall time CMDB fall time CLKB fall time DATBx fall time Channel-to-channel skew Command Max data rate MIN 7.7 CMDA fall time tSK(O) 8.6 MAX 8.9 DATBx rise time tfB MIN 8.7 CMDB rise time tfA MAX VCCB = 3.3 V ± 0.3 V 12.5 DATAx rise time trB MIN VCCB = 2.5 V ± 0.2 V 12.3 CMDA rise time trA MAX VCCB = 1.8 V ± 0.15 V Open-drain driving (H-to-L) Push-pull driving tpd VCCB = 1.5 V ± 0.1 V Clock Data Push-pull driving Push-pull driving Push-pull driving 1.6 10.5 0.4 9.5 0.2 8.9 0.4 8.3 1 Open-drain driving 166 254 157 247 121 203 74 127 44 85 0.5 5.5 0.5 5.5 0.5 6.2 0.5 7 0.5 7.2 8.3 Push-pull driving 2 10.3 0.7 9.4 0.5 8.9 0.6 8.4 0.7 1.9 11.2 2 8 1.9 6.5 0.5 5.6 0.5 3.1 Open-drain driving 157 273 163 264 135 253 96 196 71 165 1.3 7.5 0.6 6.7 0.4 5.9 1.5 4.9 1.9 4.3 2.2 10.9 2 8.4 1.7 6.9 0.8 5 0.6 4 Push-pull driving 1.5 5.5 1.3 3.8 0.9 2.9 0.8 2.3 0.8 2.3 Open-drain driving 2.3 8 2 4.8 1.8 4.2 1.7 3.7 1.6 3.5 0.4 3.9 0.4 3.7 0.4 4 0.4 3.7 0.4 6.8 0.8 6 0.6 4.8 0.1 4.1 0.1 3.8 0.1 3.8 1 11.6 1.5 7.1 1.5 5.8 1.4 5.4 1.6 3.6 1.7 5.2 1.5 3.8 1.2 3 1 2.3 0.9 2.3 1.1 10.8 1 8.8 1.8 6 1.7 4.1 1.6 3.9 1.1 13.3 1.2 7.7 1.2 6.5 2.3 4.3 2.5 4.2 Push-pull driving Push-pull driving Open-drain driving Push-pull driving µs ns 7.9 Push-pull driving Push-pull driving ns ns ns ns ns Push-pull driving 1 1 1 1 1 Push-pull driving 30 60 60 60 60 1 1 1 1 1 50 60 60 60 60 MHz 30 60 60 60 60 Mbps Open-drain driving Push-pull driving Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TXS0206 ns Mbps 15 TXS0206 SCES697A – NOVEMBER 2008 – REVISED DECEMBER 2008 ....................................................................................................................................... www.ti.com SWITCHING CHARACTERISTICS VCCA = 1.8 V ± 0.15 V over recommended operating free-air temperature range (unless otherwise noted) PARAMETER FROM (INPUT) TO (OUTPUT) TEST CONDITIONS VCCB = 1.2 V ± 0.1 V MIN Push-pull driving CMDA CMDB CMDB ten tdis CMDA CLKA CLKB DATA DATB DATB DATA CLKA CLK-f EN 11.3 MIN 4.6 UNIT MAX 4.4 3.4 11.8 2.9 7.6 2.7 6.5 2.5 5.5 2.4 5.1 Open-drain driving (L-to-H) 179 286 183 288 168 286 121 201 89 151 13.2 8.3 6.5 5.2 4.8 Open-drain driving (H-to-L) 3.5 19.7 2.8 11.1 2.4 8.6 2.1 6.4 2 5.7 Open-drain driving (L-to-H) 186 323 190 304 173 303 125 215 93 166 4.7 4.5 4.7 4.4 12.1 7.9 6.3 5 4.6 Push-pull driving 25.1 16.5 12 8.9 7.9 B-port Push-pull driving 1 1 1 1 1 EN A-port Push-pull driving 1 1 1 1 1 EN B-port Push-pull driving 39 37 37 35 35 EN A-port Push-pull driving 49 47 47 38 35 CMDA fall time CLK-f fall time DATAx fall time CMDB fall time CLKB fall time DATBx fall time Channel-to-channel skew Command Clock Data 16 5.7 MAX 5.8 DATBx rise time Max data rate MIN 6.2 CLKB rise time tSK(O) 7.3 MAX 7.5 CMDB rise time tfB MIN 7.7 DATAx rise time tfA MAX VCCB = 3.3 V ± 0.3 V 11.7 CLK-f rise time trB MIN VCCB = 2.5 V ± 0.2 V 11.6 CMDA rise time trA MAX VCCB = 1.8 V ± 0.15 V Open-drain driving (H-to-L) Push-pull driving tpd VCCB = 1.5 V ± 0.1 V Push-pull driving Push-pull driving Push-pull driving 1.8 8.4 1.2 6.8 1.1 5.9 1.1 5.9 1.6 Open-drain driving 154 246 155 262 135 238 85 150 52 99 0.4 4 0.4 4.3 0.4 4.7 0.4 4.5 0.4 4.1 6.1 Push-pull driving 1.9 8.6 1.2 7.1 0.9 6.8 1 6.3 1.3 1.8 10.2 2 7.7 1.7 6.5 1 5.2 1.7 3.1 Open-drain driving 137 251 148 245 141 251 100 184 73 142 1.5 7.3 0.7 6.6 0.4 5.9 1.5 4.9 1.9 4.3 2.3 10.3 1.8 8 1.5 6.8 0.9 5.2 0.2 5 Push-pull driving 0.6 4.5 0.4 3.8 0.2 3.3 0.2 2.9 0.2 3.1 Open-drain driving 2.3 7.9 2 4.8 1.8 4.2 1.7 3.7 1.6 3.5 0.1 2 0.2 2.2 0.7 1.6 0.7 1.5 0.1 3 1 4.3 0.8 3.6 1 2.7 0.1 2.7 0.2 2.6 1 10.3 1.4 6.8 1.8 5.4 1.6 5 1.6 3.6 1.4 4 1.3 3 1.2 2.6 0.9 1.9 0.8 1.8 1.1 10.8 1 10.3 1.4 6.3 1.8 4.2 1.7 4 1 11.8 15 7 1.2 6.3 1.6 4.9 0.8 3.6 Push-pull driving Push-pull driving Open-drain driving Push-pull driving µs ns 5.8 Push-pull driving Push-pull driving ns ns ns ns ns Push-pull driving 1 1 1 1 1 Push-pull driving 30 60 60 60 60 1 1 1 1 1 50 60 60 60 60 MHz 30 60 60 60 60 Mbps Open-drain driving Push-pull driving Submit Documentation Feedback ns Mbps Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TXS0206 TXS0206 www.ti.com ....................................................................................................................................... SCES697A – NOVEMBER 2008 – REVISED DECEMBER 2008 SWITCHING CHARACTERISTICS VCCA = 2.5 V ± 0.2 V over recommended operating free-air temperature range (unless otherwise noted) PARAMETER FROM (INPUT) TO (OUTPUT) TEST CONDITIONS VCCB = 1.2 V ± 0.1 V MIN Push-pull driving CMDA CMDB ten tdis CMDB CMDA CLKA CLKB DATA DATB DATB DATA CLKA CLK-f EN 10.6 4.9 MAX MIN 3.7 UNIT MAX 3.3 3.2 10.9 2.7 6.7 2.4 5.5 2.2 4.4 2.1 4.1 Open-drain driving (L-to-H) 156 253 162 258 149 261 126 249 98 190 12.5 7.4 5.6 4.1 3.6 Open-drain driving (H-to-L) 3.5 19.2 2.7 10.5 2.3 7.9 2 5.7 1.9 4.8 Open-drain driving (L-to-H) 163 295 169 273 158 274 131 261 99 202 3.7 3.4 5 3.7 3.3 11.5 7.1 5.4 3.9 3.5 Push-pull driving 23.7 14.9 10.2 6.8 5.7 B-port Push-pull driving 1 1 1 1 1 EN A-port Push-pull driving 1 1 1 1 1 EN B-port Push-pull driving 48 45 45 38 36 EN A-port Push-pull driving 45 38 38 38 35 CLK-f rise time CLKB rise time CLK-f fall time DATAx fall time CMDB fall time CLKB fall time DATBx fall time Channel-to-channel skew Command Max data rate MIN 5.4 CMDA fall time tSK(O) 6.5 MAX 6.7 DATBx rise time tfB MIN 6.8 CMDB rise time tfA MAX VCCB = 3.3 V ± 0.3 V 10.9 DATAx rise time trB MIN VCCB = 2.5 V ± 0.2 V 10.8 CMDA rise time trA MAX VCCB = 1.8 V ± 0.15 V Open-drain driving (H-to-L) Push-pull driving tpd VCCB = 1.5 V ± 0.1 V Clock Data Push-pull driving Push-pull driving Push-pull driving 1.9 4.7 1.7 4.4 1.7 3.8 1.9 3.2 2.3 3.3 Open-drain driving 135 216 136 237 121 228 96 201 62 141 0.8 1.6 0.3 1.9 0.6 1.8 0.7 1.5 0.7 1.3 4.2 Push-pull driving 1.9 6.1 1.8 4.5 1.7 4.1 1.9 4 1.8 Push-pull driving 1.7 10.8 2.9 7.6 1.8 6.6 1.5 5.2 1.5 3.8 Open-drain driving 102 205 116 197 112 207 101 214 76 165 1.6 7.3 0.5 6.8 0.4 5.8 1.6 5 1.7 4.4 2.2 10.3 1.9 7.9 1.8 6.6 1.4 5.3 0.9 4.4 Push-pull driving 0.4 2.4 0.4 1.6 0.4 1.5 0.5 1.5 0.3 1.4 Open-drain driving 2.2 7.6 1.9 4.8 1.8 4.2 1.7 3.7 1.6 3.5 0.3 2.2 0.3 2.7 0.3 2.6 0.3 2.4 0.3 2.8 Push-pull driving Push-pull driving 0.4 4 0.4 3.6 0.4 3.2 0.5 2.9 0.3 2.6 Push-pull driving 1 13.4 1.8 7.2 1.7 6.3 1.6 5.6 1.6 3.7 Open-drain driving 1 2.3 1 1.7 1 1.7 1 1.6 0.8 1.4 1.1 12.7 1 11.3 0.9 8.7 1.8 4.5 1.7 4.1 1 16 0.7 9 08 7 0.8 4.9 0.2 4 Push-pull driving ns µs ns ns ns ns ns Push-pull driving 1 1 1 1 1 Push-pull driving 30 60 60 60 60 1 1 1 1 1 50 60 60 60 60 MHz 30 60 60 60 60 Mbps Open-drain driving Push-pull driving Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TXS0206 ns Mbps 17 TXS0206 SCES697A – NOVEMBER 2008 – REVISED DECEMBER 2008 ....................................................................................................................................... www.ti.com SWITCHING CHARACTERISTICS VCCA = 3.3 V ± 0.3 V over recommended operating free-air temperature range (unless otherwise noted) PARAMETER FROM (INPUT) TO (OUTPUT) TEST CONDITIONS VCCB = 1.2 V ± 0.1 V MIN Push-pull driving CMDA CMDB CMDB ten tdis CMDA CLKA CLKB DATA DATB DATB DATA CLKA CLK-f EN 12.5 MIN 3.8 UNIT MAX 3.2 3.2 10.6 2.7 6.4 2.4 5.2 2.1 4.1 2 3.7 Open-drain driving (L-to-H) 136 212 141 235 129 235 112 233 101 201 10.7 6.6 5.1 3.4 3 Open-drain driving (H-to-L) 4.3 16.4 3.3 8.7 2.8 6.6 2.4 4.6 2.2 3.6 Open-drain driving (L-to-H) 142 273 148 246 139 248 122 248 105 212 3.5 3.1 3.7 3.2 23.6 14.4 9.6 6.2 5.1 Push-pull driving 17.1 9.1 6.8 4.8 4.2 B-port Push-pull driving 1 1 1 1 1 EN A-port Push-pull driving 1 1 1 1 1 EN B-port Push-pull driving 38 34 34 34 34 EN A-port Push-pull driving 45 37 36 36 35 CMDA fall time CLK-f fall time DATAx fall time CMDB fall time CLKB fall time DATBx fall time Channel-to-channel skew Command Clock Data 18 5.3 MAX 5.1 DATBx rise time Max data rate MIN 4.8 CLKB rise time tSK(O) 7.2 MAX 6.9 CMDB rise time tfB MIN 6.5 DATAx rise time tfA MAX VCCB = 3.3 V ± 0.3 V 11.5 CLK-f rise time trB MIN VCCB = 2.5 V ± 0.2 V 10.8 CMDA rise time trA MAX VCCB = 1.8 V ± 0.15 V Open-drain driving (H-to-L) Push-pull driving tpd VCCB = 1.5 V ± 0.1 V Push-pull driving Push-pull driving Push-pull driving 0.7 5.6 0.7 5 0.7 4.2 0.8 4.1 1 4.2 Open-drain driving 117 178 118 213 104 206 85 194 74 155 0.7 1.5 0.5 1.7 0.7 1.5 0.7 1.4 0.7 1.4 3 Push-pull driving 0.9 5 1.1 3.9 1.3 3.4 1.4 3.3 1.1 Push-pull driving 1.7 10.8 2.3 7.4 2.2 6.4 2 5 1.9 4 Open-drain driving 69 167 84 156 83 167 79 185 79 166 1 7.7 0.3 7.1 0.5 5.9 1.6 5.1 1.9 4.4 2.1 10.5 2 7.9 2 6.6 1.8 5.3 1 14 0.3 2.8 0.4 2.4 0.4 2 0.4 2 1 2.3 2 7.6 1.8 5 1.7 4.4 1.6 3.9 1.6 3.7 0.6 1.3 0.6 1.3 0.6 1.3 0.6 1.3 0.6 1.3 0.3 2.7 0.4 2.3 0.4 1.4 0.4 1.8 0.5 1.7 1 13.3 0.7 7.9 0.9 6.2 0.8 6.3 1 5 0.7 1.5 0.7 1.4 0.8 1.4 0.9 1.3 0.9 1.3 1 15.5 1 9.1 0.9 7.8 0.9 5.1 0.9 4.3 1 15 0.9 6.8 0.9 6.8 0.8 6.9 0.8 5 Push-pull driving Push-pull driving Open-drain driving Push-pull driving Push-pull driving Open-drain driving Push-pull driving Push-pull driving ns µs ns ns ns ns ns 1 1 1 1 1 Push-pull driving 30 60 60 60 60 Open-drain driving 0.9 1 1 1 1 55 55 55 55 55 MHz 30 60 60 60 60 Mbps Push-pull driving Submit Documentation Feedback ns Mbps Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TXS0206 TXS0206 www.ti.com ....................................................................................................................................... SCES697A – NOVEMBER 2008 – REVISED DECEMBER 2008 OPERATING CHARACTERISTICS TA = 25°C, VCCA = 1.2 V PARAMETER TEST CONDITIONS 1.5 V 1.8 V 2.5 V 3V 3.3 V 15 15 14.9 14.9 15 15 6.3 6.4 6.5 6.5 6.5 6.5 12.5 12.3 12.3 12.1 12 11.9 0.2 0.2 0.2 0.3 0.3 0.3 1.2 1.2 1.2 1.2 1.2 1.2 B-port input, DATA A-port Disabled output 0.2 0.2 0.2 0.3 0.3 0.3 A-port input, DATA B-port Enabled output 26.2 27.3 28.2 29.7 30 31.2 25.7 25.6 25.6 26.4 27 28.1 13.7 12.2 11.4 12 12.5 12.9 CLK A-port input, Enabled B-port DATA output Enabled CpdA (1) CpdB (1) B-port input, DATA A-port Enabled output CLK A-port input, Disabled B-port DATA output Disabled CLK B-port input, Enabled A-port DATA output Enabled A-port input, DATA B-port Disabled output CL = 0, f = 10 MHz, tr = tf = 1 ns CL = 0, f = 10 MHz, tr = tf = 1 ns CLK B-port input, Disabled A-port DATA output Disabled (1) VCCB TYP 1.2 V UNIT pF pF 0.6 0.5 0.5 0.5 0.5 0.6 0.6 0.5 0.5 0.5 0.5 0.6 1.2 1.2 1.2 1 1 0.9 Power dissipation capacitance per transceiver Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TXS0206 19 TXS0206 Attenuation (dB) SCES697A – NOVEMBER 2008 – REVISED DECEMBER 2008 ....................................................................................................................................... www.ti.com Frequency (Hz) Figure 7. Typical ASIP EMI Filter Frequency Response 20 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TXS0206 TXS0206 www.ti.com ....................................................................................................................................... SCES697A – NOVEMBER 2008 – REVISED DECEMBER 2008 PARAMETER MEASUREMENT INFORMATION VCCI VCCO VCCI VCCO DUT IN DUT IN OUT OUT 1 MW 15 pF 1 MW 15 pF DATA RATE, PULSE DURATION, PROPAGATION DELAY, OUTPUT RISE AND FALL TIME MEASUREMENT USING AN OPEN-DRAIN DRIVER DATA RATE, PULSE DURATION, PROPAGATION DELAY, OUTPUT RISE AND FALL TIME MEASUREMENT USING A PUSH-PULL DRIVER 2 × VCCO 50 kW From Output Under Test 15 pF S1 Open 50 kW LOAD CIRCUIT FOR ENABLE/DISABLE TIME MEASUREMENT TEST S1 tPZL/tPLZ tPHZ/tPZH 2 × VCCO Open tw VCCI VCCI/2 Input VCCI/2 0V VOLTAGE WAVEFORMS PULSE DURATION VCCA Output Control (low-level enabling) VCCA/2 0V tPLZ tPZL VCCI Input VCCI/2 VCCI/2 0V tPLH Output tPHL VCCO/2 0.9 y VCCO 0.1 y VCCO VOH VCCO/2 VOL Output Waveform 1 S1 at 2 × VCCO (see Note B) Output Waveform 2 S1 at GND (see Note B) VCCA/2 VCCO VCCO/2 0.1 y VCCO VOL tPHZ tPZH VOH 0.9 y VCCO VCCO/2 0V tf tr VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRRv10 MHz, ZO = 50 Ω, dv/dt ≥ 1 V/ns. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. VCCI is the VCC associated with the input port. I. VCCO is the VCC associated with the output port. J. All parameters and waveforms are not applicable to all devices. Figure 8. Load Circuit and Voltage Waveforms Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TXS0206 21 TXS0206 SCES697A – NOVEMBER 2008 – REVISED DECEMBER 2008 ....................................................................................................................................... www.ti.com APPLICATION INFORMATION The TXS0206 has integrated pullup resistors on the data and command ports and their values dynamically change. When the port is in a low signal state, there is a nominal pullup resistor value of 40 kΩ, and power consumption is minimized. When the port is in a high signal state, the the nominal pullup resistor value changes to 4 kΩ, and simultaneous switching performance is improved as a result. The threshold at which the resistance changes is approximately VCCx/2. When using the TXS0206 device with MMCs, SD, and Memory Stick™ to ensure that a valid receiver input voltage high (VIH) is achieved, the value of any pulldown resistors (external or internal to a memory card) must not be smaller than a 10-kΩ value. The impact of adding too heavy (i.e., <10-kΩ value) a pulldown resistor to the data and command lines of the TXS0206 device and the resulting 4-kΩ pullup / 10-kΩ pulldown voltage divider network has a direct impact on the VIH of the signal being sent into the memory card and its associated logic. The resulting VIH voltage for the 10-kΩ pulldown resistor value would be: VCC × 10 kΩ / (10 kΩ+ 4 kΩ) = 0.714 × VCC This is marginally above a valid input high voltage for a 1.8-V signal (i.e., 0.65 × VCC). The resulting VIH voltage for 20-kΩ pulldown resistor value would be: VCC × 20 kΩ / (20 kΩ + 4 kΩ) = 0.833 × VCC Which is above the valid input high voltage for a 1.8-V signal of 0.65 × VCC. 22 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TXS0206 PACKAGE OPTION ADDENDUM www.ti.com 25-Nov-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing TXS0206YFPR ACTIVE DSBGA YFP Pins Package Eco Plan (2) Qty 20 3000 Green (RoHS & no Sb/Br) Lead/Ball Finish SNAGCU MSL Peak Temp (3) Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 25-Nov-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device TXS0206YFPR Package Package Pins Type Drawing SPQ DSBGA 3000 YFP 20 Reel Reel Diameter Width (mm) W1 (mm) 180.0 8.4 Pack Materials-Page 1 A0 (mm) B0 (mm) K0 (mm) P1 (mm) 1.65 2.05 0.6 4.0 W Pin1 (mm) Quadrant 8.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 25-Nov-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TXS0206YFPR DSBGA YFP 20 3000 220.0 220.0 34.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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