TI TXS0101DBVR

TXS0101
www.ti.com ...................................................................................................................................................... SCES638A – OCTOBER 2007 – REVISED MAY 2008
1-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR
FOR OPEN-DRAIN AND PUSH-PULL APPLICATIONS
FEATURES
1
• No Direction-Control Signal Needed
• Max Data Rates
– 24 Mbps (Push Pull)
– 2 Mbps (Open Drain)
• Available in the Texas Instruments NanoFree™
Package
• 1.65 V to 3.6 V on A port and 2.3 V to 5.5 V on
B port (VCCA ≤ VCCB)
• VCC Isolation Feature – If Either VCC Input Is at
GND, Both Ports Are in the High-Impedance
State
• No Power-Supply Sequencing Required Either VCCA or VCCB can be ramped first
• Ioff Supports Partial-Power-Down Mode
Operation
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
2
•
ESD Protection Exceeds JESD 22
– A Port
– 2500-V Human-Body Model (A114-B)
– 200-V Machine Model (A115-A)
– 1500-V Charged-Device Model (C101)
– B Port
– 8-kV Human-Body Model (A114-B)
– 200-V Machine Model (A115-A)
– 1500-V Charged-Device Model (C101)
DBV, DCK, OR DRL PACKAGE
(TOP VIEW)
VCCA
GND
A
1
6
2
5
3
4
VCCB
OE
B
YZP PACKAGE
(BOTTOM VIEW)
A
GND
VCCA
3 4
2 5
1 6
B
OE
VCCB
DESCRIPTION/ORDERING INFORMATION
This one-bit noninverting translator uses two separate configurable power-supply rails. The A port is designed to
track VCCA. VCCA accepts any supply voltage from 1.65 V to 3.6 V. The B port is designed to track VCCB. VCCA
must be less than or equal to VCCB. VCCB accepts any supply voltage from 2.3 V to 5.5 V. This allows for
low-voltage bidirectional translation between any of the 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes.
When the output-enable (OE) input is low, all outputs are placed in the high-impedance state.
To ensure the high-impedance state during power up or power down, OE should be tied to GND through a
pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007–2008, Texas Instruments Incorporated
TXS0101
SCES638A – OCTOBER 2007 – REVISED MAY 2008 ...................................................................................................................................................... www.ti.com
ORDERING INFORMATION
TA
PACKAGE
(1) (2)
ORDERABLE PART NUMBER
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP
(Pb-free)
SOT (SOT-23) – DBV
–40°C to 85°C
SOT (SC-70) – DCK
SOT (SOT-563) – DRL
(1)
(2)
(3)
Reel of 3000
TXS0101YZPR
Reel of 3000
TXS0101DBVR
Reel of 250
TXS0101DBVT
Reel of 3000
TXS0101DCKR
Reel of 250
TXS0101DCKT
Reel of 3000
TXS0101DRLR
Reel of 250
TXS0101DRLT
TOP-SIDE MARKING (3)
_ _ _2G_
2G_
NFF_
2G_
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
DBV/DCK/DRL: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
PIN DESCRIPTION
NO.
NAME
1
VCCA
A-port supply voltage. 1.65 V ≤ VCCA ≤ 3.6 V and VCCA ≤ VCCB
FUNCTION
2
GND
Ground
3
A
Input/output A. Referenced to VCCA.
4
B
Input/output B. Referenced to VCCB.
5
OE
6
VCCB
Output enable. Pull OE low to place all outputs in 3-state mode. Referenced to VCCA.
B-port supply voltage. 2.3 V ≤ VCCB ≤ 5.5 V
TYPICAL OPERATING CIRCUIT
1.8 V
3.3 V
1.8 V
System
Controller
Data
GND
2
VCCA
VCCB
OE
A
B
3.3 V
System
Data
GND
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GND
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Product Folder Link(s): TXS0101
TXS0101
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ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCCA
Supply voltage range
–0.5
4.6
V
VCCB
Supply voltage range
–0.5
6.5
V
VI
Input voltage range (2)
A port
–0.5
4.6
B port, OE
–0.5
6.5
VO
Voltage range applied to any output
in the high-impedance or power-off state (2)
A port
–0.5
4.6
B port
–0.5
6.5
VO
Voltage range applied to any output in the high or low state (2) (3)
A port
–0.5
VCCA + 0.5
B port
–0.5
VCCB + 0.5
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
±50
mA
±100
mA
Continuous current through VCCA, VCCB, or GND
θJA
Package thermal impedance (4)
Tstg
Storage temperature range
DBV package
165
DCK package
259
DRL package
142
YZP package
(1)
(2)
(3)
(4)
UNIT
V
V
V
°C/W
123
–65
150
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
The value of VCCA and VCCB are provided in the recommended operating conditions table.
The package thermal impedance is calculated in accordance with JESD 51-7.
THERMAL IMPEDANCE RATINGS
UNIT
θJA
(1)
Package thermal impedance (1)
DBV package
165
DCK package
259
DRL package
142
YEP/YZP package
123
°C/W
The package thermal impedance is calculated in accordance with JESD 51-7.
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TXS0101
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RECOMMENDED OPERATING CONDITIONS (1) (2)
VCCA
VCCA
VCCB
MIN
MAX
1.65
3.6
2.3
5.5
VCCI – 0.2
VCCI
VCCI – 0.4
VCCI
VCCI – 0.4
VCCI
VCCA × 0.65
5.5
0
0.15
Supply voltage (3)
1.65 V to 1.95 V
A-port I/Os
VIH
VCCB
High-level input voltage
2.3 V to 3.6 V
B-port I/Os
OE input
2.3 V to 5.5 V
1.65 V to 3.6 V
2.3 V to 5.5 V
1.65 V to 3.6 V
2.3 V to 5.5 V
A-port I/Os
VIL
Low-level input voltage
B-port I/Os
OE input
0
0.15
0
VCCA × 0.35
A-port I/Os,
push-pull driving
Δt/Δv
Input transition rise or fall
rate
TA
Operating free-air temperature
B-port I/Os,
push-pull driving
V
V
V
10
1.65 V to 3.6 V
2.3 V to 5.5 V
10
Control Input
(1)
(2)
(3)
UNIT
ns/V
10
–40
85
°C
VCCI is the supply associated with the input port.
VCCO is the supply associated with the output port.
VCCA must be less than or equal to VCCB, and VCCA must not exceed 3.6 V.
ELECTRICAL CHARACTERISTICS (1) (2) (3)
over recommended operating free-air temperature range (unless otherwise noted)
TEST
CONDITIONS
VCCA
VCCB
VOHA
IOH = –20 µA,
VIB ≥ VCCB – 0.4 V
1.65 V to 3.6 V
2.3 V to 5.5 V
VOLA
IOL = 1 mA,
VIB ≤ 0.15 V
1.65 V to 3.6 V
2.3 V to 5.5 V
VOHB
IOH = –20 µA,
VIA ≥ VCCA – 0.2 V
1.65 V to 3.6 V
2.3 V to 5.5 V
VOLB
IOL = 1 mA,
VIA ≤ 0.15 V
1.65 V to 3.6 V
2.3 V to 5.5 V
1.65 V to 3.6 V
1.65 V to 5.5 V
A port
0V
B port
0 to 3.6 V
PARAMETER
II
Ioff
IOZ
OE
A or B port
VI = VO = open,
IO = 0
ICCA
VI = VO = open,
IO = 0
ICCB
ICCA + ICCB
CI
Cio
(1)
(2)
(3)
4
VI = VCCI,
IO = 0
OE
A port
B port
TA = 25°C
MIN
–40°C to 85°C
TYP MAX
MIN MAX
VCCA × 0.67
UNIT
V
0.4
VCCB × 0.67
V
V
0.4
V
±1
±2
µA
0 to 5.5 V
±1
±2
µA
0V
±1
±2
µA
1.65 V to 3.6 V
2.3 V to 5.5 V
±1
±2
µA
1.65 V to VCCB
2.3 V to 5.5 V
2.4
3.6 V
0V
2.2
0V
5.5 V
-1
1.65 V to VCCB
2.3 V to 5.5 V
12
3.6 V
0V
-1
0V
5.5 V
1
1.65 V to VCCB
2.3 V to 5.5 V
3.3 V
3.3 V
3.3 V
3.3 V
2.5
5
6
6
7.5
µA
µA
14.4
µA
3.5
pF
pF
VCCI is the VCC associated with the input port.
VCCO is the VCC associated with the output port.
VCCA must be less than or equal to VCCB, and VCCA must not exceed 3.6 V.
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TIMING REQUIREMENTS
over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted)
VCCB = 2.5 V
± 0.2 V
MIN MAX
Data rate
tw
Pulse duration
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
Data inputs
VCCB = 3.3 V
± 0.3 V
MIN
VCCB = 5 V
± 0.5 V
MAX
MIN
UNIT
MAX
21
22
24
2
2
2
47
45
41
500
500
500
Mbps
ns
TIMING REQUIREMENTS
over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted)
VCCB = 2.5 V
± 0.2 V
MIN MAX
Data rate
tw
Pulse duration
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
Data inputs
VCCB = 3.3 V
± 0.3 V
MIN
VCCB = 5 V
± 0.5 V
MAX
MIN
UNIT
MAX
20
22
24
2
2
1
50
45
41
500
500
500
Mbps
ns
TIMING REQUIREMENTS
over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted)
VCCB = 3.3 V
± 0.3 V
MIN
Data rate
tw
Pulse duration
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
Data inputs
VCCB = 5 V
± 0.5 V
MAX
MIN
UNIT
MAX
23
24
2
2
43
41
500
500
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Mbps
ns
5
TXS0101
SCES638A – OCTOBER 2007 – REVISED MAY 2008 ...................................................................................................................................................... www.ti.com
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
VCCB = 2.5 V
± 0.2 V
MIN
Push-pull driving
tPHL
A
B
tPLH
Open-drain driving
MIN
8.8
45
260
5.3
9.6
36
208
6.8
2.6
4.4
10
7.5
27
4.5
1.1
UNIT
MIN MAX
7.1
4.4
1.9
MAX
VCCB = 5 V
± 0.5 V
5.4
2.4
6.8
Push-pull driving
Open-drain driving
MAX
VCCB = 3.3 V
± 0.3 V
5.3
2.3
Push-pull driving
Open-drain driving
tPHL
ns
198
4.7
1.2
4
B
A
ten
OE
A or B
200
200
200
ns
tdis
OE
A or B
50
40
35
ns
tPLH
Push-pull driving
Open-drain driving
trA
A-port rise time
trB
B-port rise time
tfA
A-port fall time
tfB
B-port fall time
Max data rate
6
TEST
CONDITIONS
5.3
45
175
4.5
36
140
0.5
27
102
Push-pull driving
3.2
9.5
2.3
9.3
2
7.6
Open-drain driving
38
165
30
132
22
95
Push-pull driving
1.1
10.8
1
9.1
1
7.6
Open-drain driving
34
145
23
106
10
76
Push-pull driving
1.9
5.9
1.9
6
1.4
13.3
Open-drain driving
4.4
6.9
4.3
6.4
4.2
6.1
Push-pull driving
2.2
13.8
2.2
16.2
2.6
16.2
Open-drain driving
6.9
13.8
7.5
16.2
7
16.2
Push-pull driving
21
22
24
2
2
2
Open-drain driving
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ns
ns
ns
ns
Mbps
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TXS0101
www.ti.com ...................................................................................................................................................... SCES638A – OCTOBER 2007 – REVISED MAY 2008
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
TEST
CONDITIONS
VCCB = 2.5 V
± 0.2 V
MIN
Push-pull driving
tPHL
A
B
tPLH
Open-drain driving
Open-drain driving
6.3
43
250
4.7
6
36
206
3.8
2.1
4.2
5.8
4.4
27
3.6
1.6
UNIT
MIN MAX
4.1
3
1.8
MAX
VCCB = 5 V
± 0.5 V
3.7
2
3.5
Push-pull driving
tPHL
MIN
3.2
1.7
Push-pull driving
Open-drain driving
MAX
VCCB = 3.3 V
± 0.3 V
ns
190
4.3
1.2
4
B
A
ten
OE
A or B
200
200
200
ns
tdis
OE
A or B
50
40
35
ns
tPLH
Push-pull driving
Open-drain driving
trA
A-port rise time
trB
B-port rise time
tfA
A-port fall time
tfB
B-port fall time
Max data rate
2.5
44
170
1.6
37
140
1
27
103
Push-pull driving
2.8
7.4
2.1
6.6
0.9
5.6
Open-drain driving
34
149
28
121
24
89
Push-pull driving
1.3
8.3
0.9
7.2
0.4
6.1
Open-drain driving
35
151
24
112
12
81
Push-pull driving
1.9
5.7
1.4
5.5
0.8
5.3
Open-drain driving
4.4
6.9
4.3
6.2
4.2
5.8
Push-pull driving
2.2
7.8
2.4
6.7
2.6
6.6
Open-drain driving
5.1
8.8
5.4
9.4
5.4
10.4
Push-pull driving
20
22
24
2
2
2
Open-drain driving
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ns
ns
ns
ns
ns
Mbps
7
TXS0101
SCES638A – OCTOBER 2007 – REVISED MAY 2008 ...................................................................................................................................................... www.ti.com
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
TEST
CONDITIONS
VCCB = 3.3 V
± 0.3 V
MIN
Push-pull driving
tPHL
A
B
tPLH
Open-drain driving
Open-drain driving
3.1
1.4
4.2
36
Push-pull driving
tPHL
4.2
204
124
4.6
4.4
28
2.5
1
UNIT
MIN MAX
2.4
1.3
Push-pull driving
Open-drain driving
MAX
VCCB = 5 V
± 0.5 V
ns
165
3.3
1
97
B
A
ten
OE
A or B
200
200
ns
tdis
OE
A or B
40
35
ns
tPLH
Push-pull driving
Open-drain driving
trA
A-port rise time
trB
B-port rise time
tfA
A-port fall time
tfB
B-port fall time
Max data rate
2.5
3
139
2.6
3
105
Push-pull driving
2.3
5.6
1.9
4.8
Open-drain driving
25
116
19
85
Push-pull driving
1.6
6.4
0.6
7.4
Open-drain driving
26
116
14
72
Push-pull driving
1.4
5.4
1
5
Open-drain driving
4.3
6.1
4.2
5.7
Push-pull driving
2.3
7.4
2.4
7.6
5
7.6
4.8
8.3
Open-drain driving
Push-pull driving
Open-drain driving
23
24
2
2
ns
ns
ns
ns
ns
Mbps
PRINCIPLES OF OPERATION
Applications
The TXS0101 can be used in level-translation applications for interfacing devices or systems operating at
different interface voltages with one another. The TXS0101 is ideal for use in applications where an open-drain
driver is connected to the data I/Os. The TXB0101 can also be used in applications where a push-pull driver is
connected to the data I/Os, but the TXB0102 might be a better option for such push-pull applications.
Architecture
The TXS0101 architecture (see Figure 1) does not require a direction-control signal to control the direction of
data flow from A to B or from B to A.
8
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VCCB
VCCA
T1
Oneshot
Oneshot
10k
T2
10k
Gate Bias
A
B
Figure 1. Architecture of a TXS01xx Cell
Each A-port I/O has an internal 10-kΩ pullup resistor to VCCA, and each B-port I/O has an internal 10-kΩ pullup
resistor to VCCB. The output one-shots detect rising edges on the A or B ports. During a rising edge, the one-shot
turns on the PMOS transistors (T1,T2) for a short duration, which speeds up the low-to-high transition.
Input Driver Requirements
The fall time (tfA, tfB) of a signal depends on the output impedance of the external device driving the data I/Os of
the TXS0101. Similarly, the tPHL and max data rates also depend on the output impedance of the external driver.
The values for tfA, tfB, tPHL, and maximum data rates in the data sheet assume that the output impedance of the
external driver is less than 50 Ω.
Power Up
During operation, ensure that VCCA ≤ VCCB at all times. During power-up sequencing, VCCA ≥ VCCB does not
damage the device, so any power supply can be ramped up first.
Enable and Disable
The TXS0101 has an OE input that is used to disable the device by setting OE low, which places all I/Os in the
Hi-Z state. The disable time (tdis) indicates the delay between the time when OE goes low and when the outputs
actually get disabled (Hi-Z). The enable time (ten) indicates the amount of time the user must allow for the
one-shot circuitry to become operational after OE is taken high.
Pullup or Pulldown Resistors on I/O Lines
Each A-port I/O has an internal 10-kΩ pullup resistor to VCCA, and each B-port I/O has an internal 10-kΩ pullup
resistor to VCCB. If a smaller value of pullup resistor is required, an external resistor must be added from the I/O
to VCCA or VCCB (in parallel with the internal 10-kΩ resistors).
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TXS0101
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PARAMETER MEASUREMENT INFORMATION
VCCI
VCCO
VCCI
VCCO
DUT
IN
DUT
IN
OUT
OUT
1 MW
15 pF
1 MW
15 pF
DATA RATE, PULSE DURATION, PROPAGATION DELAY,
OUTPUT RISE AND FALL TIME MEASUREMENT USING
AN OPEN-DRAIN DRIVER
DATA RATE, PULSE DURATION, PROPAGATION DELAY,
OUTPUT RISE AND FALL TIME MEASUREMENT USING
A PUSH-PULL DRIVER
2 × VCCO
50 kW
From Output
Under Test
15 pF
S1
Open
50 kW
LOAD CIRCUIT FOR ENABLE/DISABLE
TIME MEASUREMENT
TEST
S1
tPZL/tPLZ
tPHZ/tPZH
2 × VCCO
Open
tw
VCCI
VCCI/2
Input
VCCI/2
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VCCA
Output
Control
(low-level
enabling)
VCCA/2
0V
tPLZ
tPZL
VCCI
Input
VCCI/2
VCCI/2
0V
tPLH
Output
tPHL
VCCO/2
0.9 y VCCO
0.1 y VCCO
VOH
VCCO/2
VOL
Output
Waveform 1
S1 at 2 × VCCO
(see Note B)
Output
Waveform 2
S1 at GND
(see Note B)
VCCA/2
VCCO
VCCO/2
0.1 y VCCO
VOL
tPHZ
tPZH
VOH
0.9 y VCCO
VCCO/2
0V
tf
tr
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRRv10 MHz, ZO = 50 Ω, dv/dt ≥ 1 V/ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. VCCI is the VCC associated with the input port.
I. VCCO is the VCC associated with the output port.
J. All parameters and waveforms are not applicable to all devices.
Figure 2. Load Circuit and Voltage Waveforms
10
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Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s): TXS0101
PACKAGE OPTION ADDENDUM
www.ti.com
22-Jul-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TXS0101DBVR
ACTIVE
SOT-23
DBV
6
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TXS0101DBVRG4
ACTIVE
SOT-23
DBV
6
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TXS0101DBVT
ACTIVE
SOT-23
DBV
6
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TXS0101DBVTG4
ACTIVE
SOT-23
DBV
6
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TXS0101DCKR
ACTIVE
SC70
DCK
6
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TXS0101DCKRG4
ACTIVE
SC70
DCK
6
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TXS0101DCKT
ACTIVE
SC70
DCK
6
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TXS0101DCKTG4
ACTIVE
SC70
DCK
6
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TXS0101DRLR
ACTIVE
SOT
DRL
6
4000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TXS0101DRLRG4
ACTIVE
SOT
DRL
6
4000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TXS0101YZPR
ACTIVE
DSBGA
YZP
6
3000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
22-Jul-2008
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
22-Jul-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
TXS0101DBVR
SOT-23
3000
180.0
DBV
6
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
9.2
3.23
3.17
1.37
4.0
8.0
Q3
TXS0101DBVT
SOT-23
DBV
6
250
180.0
9.2
3.23
3.17
1.37
4.0
8.0
Q3
TXS0101DCKR
SC70
DCK
6
3000
179.0
8.4
2.2
2.5
1.2
4.0
8.0
Q3
TXS0101DCKT
SC70
DCK
6
250
179.0
8.4
2.2
2.5
1.2
4.0
8.0
Q3
TXS0101DRLR
SOT
DRL
6
4000
180.0
9.2
1.78
1.78
0.69
4.0
8.0
Q3
TXS0101YZPR
DSBGA
YZP
6
3000
180.0
8.4
1.02
1.52
0.66
4.0
8.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
22-Jul-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TXS0101DBVR
SOT-23
DBV
6
3000
202.0
201.0
28.0
TXS0101DBVT
SOT-23
DBV
6
250
202.0
201.0
28.0
TXS0101DCKR
SC70
DCK
6
3000
195.0
200.0
45.0
TXS0101DCKT
SC70
DCK
6
250
195.0
200.0
45.0
TXS0101DRLR
SOT
DRL
6
4000
202.0
201.0
28.0
TXS0101YZPR
DSBGA
YZP
6
3000
220.0
220.0
34.0
Pack Materials-Page 2
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