SN54ABT541, SN74ABT541B OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS www.ti.com SCBS093L – DECEMBER 1993 – REVISED DECEMBER 2006 FEATURES • • 1 20 VCC 2 19 3 18 4 17 OE2 Y1 Y2 Y3 Y4 Y5 Y6 Y7 Y8 5 16 6 15 7 14 8 13 9 12 10 11 SN54ABT541...FK PACKAGE (TOP VIEW) A3 A4 A5 A6 A7 VCC • OE1 A1 A2 A3 A4 A5 A6 A7 A8 GND 3 2 20 19 18 1 OE2 • SN54ABT541...J OR W PACKAGE SN74ABT541B...DB, DW, N, OR PW PACKAGE (TOP VIEW) A1 OE1 • State-of-the-Art EPIC-IIB™ BiCMOS Design Significantly Reduces Power Dissipation Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17 Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA = 25°C High-Impedance State During Power Up and Power Down High-Drive Outputs (–32-mA IOH, 64-mA IOL) Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), Ceramic Flat (W) Package, and Plastic (N) and Ceramic (J) DIPs A2 • 4 5 17 6 16 7 15 14 8 Y1 Y2 Y3 Y4 Y5 Y6 Y7 A8 GND Y8 9 10 11 12 13 DESCRIPTION/ORDERING INFORMATION The SN54ABT541 and SN74ABT541B octal buffers and line drivers are ideal for driving bus lines or buffering memory address registers. The devices feature inputs and outputs on opposite sides of the package to facilitate printed circuit board layout. ORDERING INFORMATION PACKAGE (1) TA PDIP – N SOIC – DW –40°C to 85°C SSOP – DB (1) Reel of 1000 SN74ABT541BN Tube of 25 SN74ABT541BDW Reel of 2000 SN74ABT541BDWR Reel of 2000 SN74ABT541BDBR SN74ABT541BDBRG4 TOP-SIDE MARKING SN74ABT541BN ABT541B AB541B Reel of 1050 SN74ABT541BPW Reel of 2000 SN74ABT541BPWR CDIP – J Reel of 1000 SNJ54ABT541J SNJ54ABT541J CFP – W Reel of 510 SNJ54ABT541W SNJ54ABT541W LCCC – FK Reel of 2200 SNJ54ABT541FK SNJ54ABT541FK TSSOP – PW –55°C to 125°C ORDERABLE PART NUMBER AB541B Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. EPIC-IIB is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1993–2006, Texas Instruments Incorporated SN54ABT541, SN74ABT541B OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS www.ti.com SCBS093L – DECEMBER 1993 – REVISED DECEMBER 2006 DESCRIPTION/ORDERING INFORMATION (CONTINUED) The 3-state control gate is a two-input AND gate with active-low inputs so that if either output-enable (OE1 or OE2) input is high, all eight outputs are in the high-impedance state. When VCC is between 0 and 2.1 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 2.1 V, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. The SN54ABT541 is characterized for operation over the full military temperature range of –55°C to 125°C. The SN74ABT541B is characterized for operation from –40°C to 85°C. FUNCTION TABLE INPUTS OE2 L L L L L L H H H X X Z X H X Z LOGIC SYMBOL(1) 1 & LOGIC DIAGRAM (POSITIVE LOGIC) OE1 EN OE1 A OUTPUTS Y OE1 19 OE2 1 19 OE2 2 18 1 A1 3 17 4 16 A2 18 Y1 To Seven Other Channels Y3 5 15 6 14 7 13 8 12 9 11 Y4 A4 Y5 A5 Y6 A6 Y7 A7 Y8 A8 2 2 Y2 A3 (1) A1 Y1 This symbol is in accordance ANSI/IEEE Std 91-1984 and Publication 617-12. with IEC Submit Documentation Feedback SN54ABT541, SN74ABT541B OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS www.ti.com SCBS093L – DECEMBER 1993 – REVISED DECEMBER 2006 Absolute Maximum Ratings (1) over recommended operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range –0.5 7 V VI Input voltage range (2) –0.5 7 V VO Voltage range applied to any output in the high or power-off state –0.5 5.5 V IO Current into any output in the low state SN54ABT541 96 SN74ABT541B 128 UNIT mA IIK Input clamp current VI < 0 –18 mA IOK Output clamp current VO < 0 –50 mA θJA Package thermal impedance (3) DB package 115 DW package 97 N package 67 PW package Tstg (1) (2) (3) °C/W 128 Storage temperature range –65 150 °C Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. The package thermal impedance is calculated in accordance with JESD 51, except for through-hole packages, which use a trace length of zero. Recommended Operating Conditions (1) over recommended operating free-air temperature range (unless otherwise noted) SN54ABT541 SN74ABT541B UNIT MIN MAX MIN MAX 4.5 5.5 4.5 5.5 VCC Supply voltage VIH High-level input voltage VIL Low-level input voltage 0.8 0.8 V IOH High-level output current –24 –32 mA IOL Low-level output current 48 64 mA ∆t/∆v Input transition rise or fall rate 5 5 ns/V 2 2 ∆t/∆VCC Power-up ramp rate TA (1) Operating free-air temperature V µs/V 200 –55 125 –40 V 85 °C All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. Submit Documentation Feedback 3 SN54ABT541, SN74ABT541B OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS www.ti.com SCBS093L – DECEMBER 1993 – REVISED DECEMBER 2006 Electrical Characteristics over operating free-air temperature range (unless otherwise noted) PARAMETER TA = 25°C TEST CONDITIONS MIN TYP (1) MIN MIN VCC = 4.5 V, II = –18 mA VOH VCC = 4.5 V, IOH = –3 mA 2.5 2.5 2.5 VCC = 5 V, IOH = –3 mA 3 3 3 VCC = 4.5 V, IOH = –24 mA 2 2 IOH = –32 mA 2 (2) VCC = 4.5 V, –1.2 SN74ABT541B MAX VIK VOL –1.2 MAX –1.2 UNIT V V 2 IOL = 48 mA 0.55 IOL = 64 mA 0.55 (2) Vhys 0.55 0.55 100 VV mV ±1 ±1 ±1 µA VCC = 0 to 2.1 V, VO = 0.5 V to 2.7 V, OE = X ±50 (3) ±50 (3) ±50 µA IOZPD VCC = 2.1 V to 0, VO = 0.5 V to 2.7 V, OE = X ±50 (3) ±50 (3) ±50 µA IOZH VCC = 5.5 V, VO = 2.7 V 10 10 10 µA IOZL VCC = 5.5 V, VO = 0.5 V –10 –10 –10 µA Ioff VCC = 0 V, VI or VO≤ 4.5 V ±100 µA ICEX VCC = 5.5 V, VO = 5.5 V, Outputs high IO VCC = 5.5 V (4), VO = 2.5 V ICC VCC = 5.5 V, IO = 0 V, VI = VCC or GND VCC = 5.5 V, One input at 3.4 V, Other inputs at VCC or GND (5) II VCC = 5.5 V, IOZPU ∆ICC VI = VCC or GND ±100 50 µA –180 mA 250 µA 30 30 mA 250 250 µA 1.5 1.5 mA 50 50 50 µA 1.5 1.2 1.5 mA 50 –140 –180 Outputs high 5 250 Outputs low 22 30 1 250 Outputs enabled 1.5 Outputs disabled Outputs disabled –50 Control Inputs –50 –180 –50 250 Ci VI = 2.5 V or 0.5 V 3 pF Co VO = 2.5 V or 0.5 V 6 pF (1) (2) (3) (4) (5) 4 SN54ABT51 MAX All typical values are at VCC = 5 V. On products compliant to MIL-PRF-38535, this parameter does not apply. On products compliant to MIL-PRF-38535, this parameter is not production tested. Not more than one output should be tested at a time, and the duration of the test should not exceed one second. This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND. Submit Documentation Feedback SN54ABT541, SN74ABT541B OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS www.ti.com SCBS093L – DECEMBER 1993 – REVISED DECEMBER 2006 Switching Characteristics, SN54ABT541 over recommended ranges of supply voltage and operating free-air temperature, CL = 50 pF (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) A Y OE Y OE Y tPLH tPHL tPZH tPZL tPHZ tPLZ VCC = 5 V, TA = 25°C UNIT MIN TYP MAX MIN MAX 1 2.6 4.1 1 4.6 1 2.9 4.2 1 4.7 1.1 3.1 4.8 1.1 5.4 2.1 4.4 5.9 2.1 7 2.1 5.1 6.6 2.1 7.5 1.7 4.7 6.2 1.7 6.7 ns ns ns Switching Characteristics, SN74ABT541B over recommended ranges of supply voltage and operating free-air temperature, CL = 50 pF (unless otherwise noted) (see Figure 1) PARAMETER tPLH tPHL tPZH tPZL tPHZ tPLZ FROM (INPUT) TO (OUTPUT) A Y OE Y OE Y VCC = 5 V, TA = 25°C MIN MAX MIN MAX 1 2 3.2 1 3.9 1 2.6 3.5 1 3.9 2 3.5 4.5 2 4 1.9 4 5.1 1.9 5.9 2.2 4.4 5.4 2.2 5.8 1.5 3 4 1.5 4.4 tsk(o) (1) (1) UNIT TYP 0.5 0.5 ns ns ns ns Skew between any two outputs of the same package switching in the same direction. Submit Documentation Feedback 5 SN54ABT541, SN74ABT541B OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS www.ti.com SCBS093L – DECEMBER 1993 – REVISED DECEMBER 2006 PARAMETER MEASURMENT INFORMATION 7V 500 Ω From Output Under Test CL = 50 pF (see Note A) S1 TEST Open S1 Open 7V tPLH/tPHL tPLZ/tPZL tPHZ/tPZH GND 500 Ω Open 3V LOAD CIRCUIT Timing Input 1.5 V 0V tW tsu 3V Input th 3V 1.5 V 1.5 V Data Input 1.5 V 1.5 V 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES 3V 1.5 V Input 1.5 V 0V tPLH VOH Output 1.5 V VOL tPHL 1.5 V tPLZ 3.5 V 1.5 V tPZH 1.5 V VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS Output Waveform 2 S1 at Open (see Note B) 1.5 V 0V Output Waveform 1 S1 at 7 V (see Note B) tPLH VOH Output 1.5 V tPZL tPHL VM 3V Output Control VOL + 0.3 V VOL tPHZ VM VOH – 0.3 V VOH »0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR £ 10 MHz, ZO = 50 Ω, tr £ 2.5 ns, tf £ 2.5 ns. D. The outputs are measured one at a time, with one transition per measurement. Figure 1. Load Circuit and Voltage Waveforms 6 Submit Documentation Feedback PACKAGE OPTION ADDENDUM www.ti.com 30-Oct-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 5962-9471801Q2A ACTIVE LCCC FK 20 1 TBD 5962-9471801QRA ACTIVE CDIP J 20 1 TBD 1 Lead/Ball Finish MSL Peak Temp (3) POST-PLATE N / A for Pkg Type A42 SNPB N / A for Pkg Type TBD A42 N / A for Pkg Type TBD Call TI 5962-9471801QSA ACTIVE CFP W 20 SN74ABT541BDBLE OBSOLETE SSOP DB 20 SN74ABT541BDBR ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT541BDBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT541BDBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT541BDW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT541BDWE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT541BDWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT541BDWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT541BN ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74ABT541BNE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74ABT541BNSR ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT541BNSRE4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT541BPW ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT541BPWE4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT541BPWLE OBSOLETE TSSOP PW 20 SN74ABT541BPWR ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT541BPWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SNJ54ABT541FK ACTIVE LCCC FK 20 1 TBD SNJ54ABT541J ACTIVE CDIP J 20 1 TBD A42 SNPB N / A for Pkg Type SNJ54ABT541W ACTIVE CFP W 20 1 TBD A42 N / A for Pkg Type TBD Call TI Call TI Call TI POST-PLATE N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 30-Oct-2006 Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 26-Apr-2007 TAPE AND REEL INFORMATION Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com Device 26-Apr-2007 Package Pins Site Reel Diameter (mm) Reel Width (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74ABT541BDBR DB 20 MLA 330 16 8.2 7.5 2.5 12 16 Q1 SN74ABT541BDWR DW 20 MLA 330 24 10.8 13.0 2.7 12 24 Q1 SN74ABT541BNSR NS 20 MLA 330 24 8.2 13.0 2.5 12 24 Q1 SN74ABT541BPWR PW 20 MLA 330 16 6.95 7.1 1.6 8 16 Q1 TAPE AND REEL BOX INFORMATION Device Package Pins Site Length (mm) Width (mm) Height (mm) SN74ABT541BDBR DB 20 MLA 333.2 333.2 28.58 SN74ABT541BDWR DW 20 MLA 333.2 333.2 31.75 SN74ABT541BNSR NS 20 MLA 333.2 333.2 31.75 SN74ABT541BPWR PW 20 MLA 333.2 333.2 28.58 Pack Materials-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 26-Apr-2007 Pack Materials-Page 3 MECHANICAL DATA MLCC006B – OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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