Preliminary 29–32 GHz Surface Mount Medium Power Amplifier AA032P1-A4 Patent Pending Features ■ Surface Mount Package ■ 11 dB Gain ■ 24 dBm P1 dB Output Power ■ 100% DC and RF Testing Description The AA032P1-A4 is a broadband millimeterwave medium power amplifier in a rugged surface mount package that is compatible with high-volume solder installation. The amplifier is designed for use in millimeterwave communication and sensor systems as an output stage or driver in the transmit chain or LO chain when high gain and high linearity is required. The robust ceramic surface mount package provides excellent electrical performance and a high degree of environmental protection for long-term reliability. All amplifiers are screened at the operating frequencies prior to shipment for guaranteed performance. Amplifier is targeted for highvolume millimeterwave applications such as point-to-point and point-to-multipoint wireless communications systems and satellite communication systems. Pin Out VG N/C VD RF In RF Out AA032P1-A4 YYWW Orientation N/C N/C N/C Indicated by Missing Castellations Electrical Specifications at 25°C (VD = 6 V, VG = -1 V) Parameter Symbol Min. BW 29 G 9 11 dB P1 dB 23 24 dBm 9 dB Bandwidth Small Signal Gain1 Output Power at 1 dB Gain Compression2 Input Return Loss4 Output Return RLI Loss4 Temperature Coefficient of Gain4 Typ. Max. Unit 32 GHz RLO 7 dB dG/dT -0.038 dB/C ID 400 Drain Current3 450 mA 1. Small signal gain over entire bandwidth is measured on 100% of parts. 2. Output power P1 dB is measured at 31 GHz on 100% of parts. 3. Drain current is measured on 100% of parts. 4. Not measured on 100% of parts. Alpha Industries, Inc. [978] 241-7000 • Fax [978] 241-7906 • Email [email protected] • www.alphaind.com Specifications subject to change without notice. 1/02A 1 29–32 GHz Surface Mount Medium Power Amplifier AA032P1-A4 Typical Performance Data (VD = 6 V, VG = -1 V) 20 20 -55˚C 10 10 +25˚C +85˚C (dB) (dB) S21 0 S11 -10 0 -10 S22 -20 -20 25 30 35 27 40 29 31 33 Frequency (GHz) Frequency (GHz) S-Parameters Gain vs. Temperature 27 35 26 25 24 P1 dB = 24.3 dBm @ 31GHz 21 P1 dB (dBm) Output Power (dBm) P1 dB = 24.7 dBm @ 30 GHz 18 6.0 V 24 5.5 V 23 22 P1 dB = 23.0 dBm @ 28 GHz 15 21 P1 dB = 23.9 dBm @ 32 GHz 12 20 3 6 9 12 15 18 31 32 Frequency (GHz) Output Power vs. Input Power P1 dB vs. Frequency Absolute Maximum Ratings 0.080 (0.20 mm) 0.291 (7.39 mm) YYWW 0.026 (0.66 mm) 0.153 (3.87 mm) 0.275 (6.98 mm) 0.040 (1.02 mm) Characteristic 0.065 (1.65 mm) 0.040 (1.02 mm) CL 0.014 (0.36 mm) 0.054 (1.37 mm) 2 30 Input Power (dBm) Outline Drawing 0.306 (7.77 mm) 29 0.037 (0.94 mm) CL Value Operating Temperature (TC) -55°C to +85°C Storage Temperature (TST) -65°C to +125°C Bias Voltage (VD) Power In (PIN) 7 VDC 22 dBm 0.145 (3.68 mm) 0.056 (1.42 mm) 0.285 (7.24 mm) Alpha Industries, Inc. [978] 241-7000 • Fax [978] 241-7906 • Email [email protected] • www.alphaind.com Specifications subject to change without notice. 1/02A 29–32 GHz Surface Mount Medium Power Amplifier AA032P1-A4 Typical S-Parameters at 25°C (VD = 6 V, VG = -1 V) S11 S21 S12 S22 Frequency (GHz) Mag. (dB) 10 -0.5 -94 -35.3 12 -0.7 -158 -50.8 14 -1.0 111 -56.9 16 -1.3 39 -43.2 18 -0.8 -36 -40.3 31 -45.1 20 -0.6 -109 -29.3 17 -39.2 22 -1.0 -165 -15.8 -76 -52.1 24 -2.4 77 -3.6 171 -38.7 25 -2.8 -7 1.4 106 -46.4 -65 -3.3 -55 26 -3.1 -75 5.3 43 -39.8 -37 -2.7 -105 27 -3.5 -136 9.8 -24 -32.0 -75 -2.8 -152 28 -6.1 159 12.7 -104 -28.7 -156 -6.7 162 29 -8.7 121 13.1 179 -28.4 132 -17.0 145 30 -7.8 60 12.6 111 -28.0 77 -16.3 -177 31 -5.7 1 12.1 51 -28.6 22 -19.6 177 32 -5.0 -52 11.9 -13 -28.4 -23 -26.1 118 33 -6.6 -86 10.5 -71 -28.9 -66 -14.2 14 34 -7.5 -129 10.3 -124 -27.7 -114 -9.4 -10 Ang. (Deg.) Mag. (dB) Ang. (Deg.) Mag. (dB) Ang. (Deg.) Mag. (dB) Ang. (Deg.) 4 -61.1 -154 -51.1 -114 -0.5 44 176 -0.3 100 0 -55.0 99 -0.4 -37 83 -43.0 84 -0.9 -96 8 -1.3 -147 62 -1.1 166 41 -2.1 104 -48 -3.3 -3 35 -9.8 167 11.0 178 -26.9 -177 -10.8 -39 36 -13.4 143 10.7 111 -26.1 123 -16.7 -114 37 -7.6 163 8.8 39 -26.1 65 -11.9 149 38 -5.8 129 6.3 -25 -23.7 25 -10.7 99 39 -8.7 77 2.2 -87 -21.4 -16 -11.5 47 40 -4.8 23 -0.4 -141 -19.8 -72 -9.2 9 Biasing For biasing on, adjust VG from 0 to approximately -1 V. Adjust VD from 0 to desired value (5 V–6 V recommended). Adjust VG to achieve desired ID (400 mA recommended). For biasing off, reverse the biasing on procedure. Alpha Industries, Inc. [978] 241-7000 • Fax [978] 241-7906 • Email [email protected] • www.alphaind.com Specifications subject to change without notice. 1/02A 3 29–32 GHz Surface Mount Medium Power Amplifier AA032P1-A4 Alpha-2TM Surface Mount Package Handling and Mounting Millimeterwave components require careful mounting design to maintain optimal performance. The Alpha-2TM surface mount package (patent pending) provides a rugged and repeatable electrical connection using standard solder techniques. The -A4 package is one of several parts in the Alpha-2TM surface mount package family. DC Connections Via Holes to Ground RF In RF Out Handling The -A4 surface mount package is very rugged. However, due to ceramic’s brittle nature, one should exercise care when handling with metal tools. Do not apply heavy pressure to the lid. Vacuum tools may be used to pick and place this part. Only personnel trained in both ESD precautions and handling precautions should be allowed to handle these packages. Package Construction The -A4 surface mount package consists of a base and a lid. The package base is ceramic with filled vias and plated castellations. The package lid is unplated alumina. The lid seal is epoxy. Mounting Design The -A4 surface mount package is installed on top of a printed circuit board on a specially designed footprint. DC Connections Footprint Geometry for -A4 Surface Mount Package. Mounting footprint geometry for the -A4 package will be supplied by Alpha Industries in electronic format upon request. Mounting the Package The -A4 surface mount package is compatible with highvolume surface mount installation using solder. RF and DC connections are accomplished with metallized edge castellations that hold solder fillets. Ground connections are accomplished by both metallized edge castellations and filled vias to the bottom of the package. Care should be taken to ensure that there are no voids or gaps in the solder so that good RF, DC and ground contact is maintained. DC Bias Lines (Up to 3 per side) Electrically & Thermally Conductive Ground Plane RF In RF Out DC Bias Lines (Up to 3 per side) Printed Circuit Board Rogers 4003, 0.008" (0.20 mm) Thick or Equivalent -A4 Surface Mount Package Installation. 4 Alpha Industries, Inc. [978] 241-7000 • Fax [978] 241-7906 • Email [email protected] • www.alphaind.com Specifications subject to change without notice. 1/02A