GP1600FSS18 GP1600FSS18 Single Switch IGBT Module Replaces January 2000 version, DS5136-3.0 FEATURES ■ Non Punch Through Silicon ■ Isolated Copper Baseplate ■ Low Inductance Internal Construction ■ 1600A Per Module DS5176-4.2 January 2001 KEY PARAMETERS VCES (typ) VCE(sat) (max) IC (max) IC(PK) 1800V 3.5V 1600A 3200A APPLICATIONS External connection ■ High Power Inverters ■ Motor Controllers ■ Induction Heating ■ Resonant Converters C1 C2 E1 E2 Aux C G The powerline range of high power modules includes dual and single switch configurations covering voltages from 600V to 3300V and currents up to 4800A. The GP1600FSS18 is a single switch 1800V, n channel enhancement mode, insulated gate bipolar transistor (IGBT) module. The IGBT has a wide reverse bias safe operating area (RBSOA) ensuring reliability in demanding applications. Aux E External connection Fig. 1 Single switch circuit diagram The module incorporates an electrically isolated base plate and low inductance construction enabling circuit designers to optimise circuit layouts and utilise earthed heat sinks for safety. Aux C ORDERING INFORMATION E1 C1 E2 C2 Aux E Order As: GP1600FSS18 Note: When ordering, please use the whole part number. G Outline type code: F (See package details for further information) Fig. 2 Electrical connections - (not to scale) Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures. www.dynexsemi.com 1/9 GP1600FSS18 ABSOLUTE MAXIMUM RATINGS Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. In extreme conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety precautions should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability. Tcase = 25˚C unless stated otherwise Symbol Test Conditions Parameter VCES Collector-emitter voltage VGES Gate-emitter voltage VGE = 0V - Max. Units 1800 V ±20 V Continuous collector current Tcase = 50˚C for Tj = 125˚C 1600 A IC(PK) Peak collector current 1ms, Tcase = 110˚C 2400 A Pmax Max. transistor power dissipation Tcase = 25˚C, Tj = 150˚C 11.4 kW Visol Isolation voltage Commoned terminals to base plate. AC RMS, 1 min, 50Hz 4000 V Min. Max. Units - 11 ˚C/kW - 20 ˚C/kW - 8 ˚C/kW Transistor - 150 ˚C Diode - 125 ˚C –40 125 ˚C Mounting - M6 - 5 Nm Electrical connections - M4 - 2 Nm Electrical connections - M8 - 10 Nm IC THERMAL AND MECHANICAL RATINGS Rth(j-c) Test Conditions Parameter Symbol Thermal resistance - transistor Continuous dissipation junction to case Rth(j-c) Thermal resistance - diode Continuous dissipation junction to case Rth(c-h) Thermal resistance - case to heatsink (per module) Mounting torque 5Nm (with mounting grease) Tj Tstg - 2/9 Junction temperature Storage temperature range Screw torque - Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures. www.dynexsemi.com GP1600FSS18 ELECTRICAL CHARACTERISTICS Tcase = 25˚C unless stated otherwise. Min. Typ. Max. Units VGE = 0V, VCE = VCES - - 2 mA VGE = 0V, VCE = VCES, Tcase = 125˚C - - 50 mA Gate leakage current VGE = ±20V, VCE = 0V - - 8 µA VGE(TH) Gate threshold voltage IC = 80mA, VGE = VCE 4.5 5.5 6.5 V VCE(sat) Collector-emitter saturation voltage VGE = 15V, IC = 1600A - 3.5 4 V VGE = 15V, IC = 1600A, Tcase = 125˚C - 4.3 5 V Parameter Symbol ICES IGES Collector cut-off current Test Conditions IF Diode forward current DC - - 1600 A IFM Diode maximum forward current tp = 1ms - - 3200 A VF Diode forward voltage IF = 1600A - 2.2 2.5 V IF = 1600A, Tcase = 125˚C - 2.3 2.6 V VCE = 25V, VGE = 0V, f = 1MHz - 180 - nF - 15 - nH Cies Input capacitance LM Module inductance - Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures. www.dynexsemi.com 3/9 GP1600FSS18 ELECTRICAL CHARACTERISTICS Tcase = 25˚C unless stated otherwise Min. Typ. Max. Units IC = 1600A - 1500 1650 ns Fall time VGE = ±15V - 200 300 ns EOFF Turn-off energy loss VCE = 900V - 500 650 mJ td(on) Turn-on delay time RG(ON) = RG(OFF) = 2.2Ω - 400 550 ns L ~ 50nH - 300 450 ns - 450 650 mJ IF = 1600A, VR = 50% VCES, - 300 400 µC dIF/dt = 6000A/µs - 750 - A - 200 - mJ Min. Typ. Max. Units IC = 1600A - 1700 1900 ns Fall time VGE = ±15V - 200 330 ns EOFF Turn-off energy loss VCE = 900V - 650 800 mJ td(on) Turn-on delay time RG(ON) = RG(OFF) = 2.2Ω - 500 700 ns L ~ 50nH - 350 500 ns - 600 800 mJ IF = 1600A, VR = 50% VCES, - 550 650 µC dIF/dt = 5000A/µs - 850 - A - 320 - mJ Parameter Symbol td(off) tf tr Turn-off delay time Rise time EON Turn-on energy loss Qrr Diode reverse recovery charge Irr Diode reverse current EREC Test Conditions Diode reverse recovery energy Tcase = 125˚C unless stated otherwise Parameter Symbol td(off) tf tr Turn-off delay time Rise time EON Turn-on energy loss Qrr Diode reverse recovery charge Irr Diode reverse current EREC 4/9 Diode reverse recovery energy Test Conditions Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures. www.dynexsemi.com GP1600FSS18 TYPICAL CHARACTERISTICS Vge = 20/15/12V Vge = 20/15/12V 3200 3200 2800 Common emitter Tcase = 25˚C 2800 2400 Vge = 10V Collector current, IC - (A) Collector current, Ic - (A) 2400 2000 1600 1200 1600 1200 800 400 400 1.0 2.0 3.0 4.0 5.0 Collector-emitter voltage, Vce - (V) 6.0 Vge = 10V 2000 800 0 0 Common emitter Tcase = 125˚C 0 0 7.0 1.0 Fig. 3 Typical output characteristics 1800 Tcase = 125˚C VGE = ±15V VCE = 900V Rg = 2.2Ω Diode turn-off energy, Eoff(diode) - (mJ) 1600 1400 Energy - (mJ) 500 EOFF Tcase = 125˚C VGE = ±15V VCE = 900V IT = 1600A EON 1200 EON 400 1000 EREC 300 200 EOFF 800 600 400 EREC 100 0 0 9.0 10.0 Fig. 4 Typical output characteristics 700 600 2.0 3.0 4.0 5.0 6.0 7.0 8.0 Collector-emitter voltage, Vce - (V) 200 0 200 400 600 800 1000 1200 1400 Collector current, IC - (A) 1600 Fig. 5 Typical switching energy vs collector current 0 1 2 3 4 5 7 8 9 10 Fig. 6 Typical switching energy vs gate resistance Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures. www.dynexsemi.com 6 5/9 GP1600FSS18 3500 3200 2800 3000 Tj = 25˚C 2400 Collector current, IC - (A) Foward current, IF - (A) 2500 2000 Tj = 125˚C 2000 1600 1500 1200 1000 800 500 400 0 0 Conditions: Tcase = 125˚C, Vge = 15V, Rg(off) = 2.2Ω 0 0.5 2.0 1.0 1.5 2.5 Foward voltage, VF - (V) 3.0 0 3.5 Fig. 8 Reverse bias safe operating area IC max. (single pulse) Collector current, IC - (A) IC m ax .D C 50µs (c 100µs on tin uo us ) tp = 1ms 10 1 1 10 100 1000 Collector-emitter voltage, Vce - (V) Fig. 9 Forward bias safe operating area 6/9 10000 Transient thermal impedance, Zth(j-c) - (˚C/kW) 100 10000 100 600 800 1000 1200 1400 1600 1800 2000 Collector-emitter voltage, Vce - (V) Fig. 7 Diode typical forward characteristics 1000 200 400 Diode 10 Transistor 1 0.1 0.001 0.01 0.1 Pulse width, tp - (s) 1 10 Fig. 10 Transient thermal impedance Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures. www.dynexsemi.com GP1600FSS18 PACKAGE DETAILS For further package information, please visit our website or contact your nearest Customer Service Centre. All dimensions in mm, unless stated otherwise. DO NOT SCALE. 62 62 15 15 5 E1 C1 E2 C2 65 6 57 18 Aux E 18.5 16 2.5 Aux C 14.5 11 43.3 57 65 G 20 35 6x Ø7 4x M8 38 28 31.5 6x M4 5 140 Nominal weight: 1600g Module outline type code: F Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures. www.dynexsemi.com 7/9 GP1600FSS18 ASSOCIATED PUBLICATIONS Title Application Note Number Electrostatic handling precautions AN4502 An introduction to IGBTs AN4503 IGBT ratings and characteristics AN4504 Heatsink requirements for IGBT modules AN4505 Calculating the junction temperature of power semiconductors AN4506 Gate drive considerations to maximise IGBT efficiency AN4507 Parallel operation of IGBTs – punch through vs non-punch through characteristics AN4508 Guidance notes for formulating technical enquiries AN4869 Principle of rating parallel connected IGBT modules AN5000 Short circuit withstand capability in IGBTs AN5167 Driving Dynex Semincoductor IGBT modules with Concept gate drivers AN5384 POWER ASSEMBLY CAPABILITY The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink and clamping systems in line with advances in device voltages and current capability of our semiconductors. We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of our customers. Using the latest CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete Solution (PACs). HEATSINKS The Power Assembly group has its own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request. For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or customer service office. 8/9 Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures. www.dynexsemi.com GP1600FSS18 http://www.dynexsemi.com e-mail: [email protected] HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln. Lincolnshire. LN6 3LF. United Kingdom. Tel: 00-44-(0)1522-500500 Fax: 00-44-(0)1522-500550 DYNEX POWER INC. 99 Bank Street, Suite 410, Ottawa, Ontarion, Canada, K1P 6B9 Tel: 613.723.7035 Fax: 613.723.1518 Toll Free: 1.888.33.DYNEX (39639) CUSTOMER SERVICE CENTRES Central Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33 North America Tel: 011-800-5554-5554. Fax: 011-800-5444-5444 UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 SALES OFFICES Central Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33 North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) / Tel: (949) 733-3005. Fax: (949) 733-2986. UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 These offices are supported by Representatives and Distributors in many countries world-wide. © Dynex Semiconductor 2001 Publication No. DS5176-4 Issue No. 4.2 January 2001 TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM Datasheet Annotations: Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started. Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change. Advance Information: The product design is complete and final characterisation for volume production is well in hand. No Annotation: The product parameters are fixed and the product is available to datasheet specification. This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request. All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners. Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures. www.dynexsemi.com 9/9