DATA SHEET MOS INTEGRATED CIRCUIT MC-4516DA727XFA 16 M-WORD BY 72-BIT SYNCHRONOUS DYNAMIC RAM MODULE REGISTERED TYPE Description The MC-4516DA727XFA is a 16,777,216 words by 72 bits synchronous dynamic RAM module on which 9 pieces of 128M SDRAM: µPD45128841 are assembled. These modules provide high density and large quantities of memory in a small space without utilizing the surfacemounting technology on the printed circuit board. Decoupling capacitors are mounted on power supply line for noise reduction. Features • 16,777,216 words by 72 bits organization (ECC type) • Clock frequency and access time from CLK. Part number /CAS latency MC-4516DA727XFA-A75 Clock frequency Access time from CLK (MAX.) (MAX.) CL = 3 133 MHz 5.4 ns CL = 2 100 MHz 6.0 ns • Fully Synchronous Dynamic RAM, with all signals referenced to a positive clock edge • Pulsed interface • Possible to assert random column address in every cycle • Quad internal banks controlled by BA0 and BA1 (Bank Select) • Programmable burst-length (1, 2, 4, 8 and Full Page) • Programmable wrap sequence (Sequential / Interleave) • Programmable /CAS latency (2, 3) • Automatic precharge and controlled precharge • CBR (Auto) refresh and self refresh • All DQs have 10 Ω ±10 % of series resistor • Single 3.3 V ±0.3 V power supply • LVTTL compatible • 4,096 refresh cycles/64 ms • Burst termination by Burst Stop command and Precharge command • 168-pin dual in-line memory module (Pin pitch = 1.27 mm) • Registered type • Serial PD The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local Elpida Memory, Inc. for availability and additional information. Document No. E0278N10 (Ver 1.0) Date Published May 2002 (K) Japan URL: http://www.elpida.com Elpida Memory, Inc. 2002 Elpida Memory, Inc. is a joint venture DRAM company of NEC Corporation and Hitachi, Ltd. MC-4516DA727XFA Ordering Information Part number Clock frequency Package Mounted devices MHz (MAX.) MC-4516DA727XFA-A75 133 MHz 168-pin Dual In-line Memory Module 9 pieces of µPD45128841G5 (Rev. P) (Socket Type) (10.16mm (400) TSOP (II)) Edge connector: Gold plated 38.1 mm height 2 Data Sheet E0278N10 (Ver. 1.0) MC-4516DA727XFA Pin Configuration 168-pin Dual In-line Memory Module Socket Type (Edge connector: Gold plated) /xxx indicates active low signal. 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 145 146 147 148 149 150 151 152 153 154 155 156 157 158 159 160 161 162 163 164 165 166 167 168 VSS DQ32 DQ33 DQ34 DQ35 Vcc DQ36 DQ37 DQ38 DQ39 DQ40 VSS DQ41 DQ42 DQ43 DQ44 DQ45 Vcc DQ46 DQ47 CB4 CB5 VSS NC NC Vcc /CAS DQMB4 DQMB5 NC /RAS VSS A1 A3 A5 A7 A9 BA0 (A13) A11 Vcc CLK1 NC VSS CKE0 NC DQMB6 DQMB7 NC Vcc NC NC CB6 CB7 VSS DQ48 DQ49 DQ50 DQ51 Vcc DQ52 NC NC REGE VSS DQ53 DQ54 DQ55 VSS DQ56 DQ57 DQ58 DQ59 Vcc DQ60 DQ61 DQ62 DQ63 VSS CLK3 NC SA0 SA1 SA2 Vcc VSS DQ0 DQ1 DQ2 DQ3 Vcc DQ4 DQ5 DQ6 DQ7 1 2 3 4 5 6 7 8 9 10 DQ8 VSS DQ9 DQ10 DQ11 DQ12 DQ13 Vcc DQ14 DQ15 CB0 CB1 VSS NC NC Vcc /WE DQMB0 DQMB1 /CS0 NC VSS A0 A2 A4 A6 A8 A10 BA1(A12) Vcc 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 Vcc CLK0 VSS NC /CS2 DQMB2 DQMB3 NC Vcc NC NC CB2 CB3 VSS DQ16 DQ17 DQ18 DQ19 Vcc DQ20 NC NC NC VSS DQ21 DQ22 DQ23 VSS DQ24 DQ25 DQ26 DQ27 Vcc DQ28 DQ29 DQ30 DQ31 VSS CLK2 NC WP SDA SCL Vcc 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 A0 - A11 : Address Inputs [Row: A0 - A11, Column: A0 - A9] BA0 (A13), BA1 (A12) : SDRAM Bank Select DQ0-DQ63, CB0-CB7 : Data Inputs/Outputs CLK0 - CLK3 : Clock Input CKE0 : Clock Enable Input WP : Write Protect /CS0, /CS2 : Chip Select Input /RAS : Row Address Strobe /CAS : Column Address Strobe /WE : Write Enable DQMB0 - DQMB7 : DQ Mask Enable SA0 - SA2 : Address Input for EEPROM SDA : Serial Data I/O for PD SCL : Clock Input for PD VCC : Power Supply VSS : Ground REGE : Register / Buffer Enable NC : No Connection Data Sheet E0278N10 (Ver. 1.0) 3 MC-4516DA727XFA Block Diagram /RCS0 RDQMB4 RDQMB0 30 pF 10 Ω DQ 0 DQ 1 DQ 2 DQ 3 DQ 4 DQ 5 DQ 6 DQ 7 DQ 7 DQM DQ 6 DQ 5 DQ 4 D0 DQ 3 DQ 2 DQ 1 DQ 0 /CS DQ 7 DQM /CS RDQMB1 10 Ω 30 pF DQ 32 DQ 33 DQ 34 DQ 35 DQ 36 DQ 37 DQ 38 DQ 39 DQ 0 DQM DQ 1 DQ 2 DQ 3 D5 DQ 4 DQ 5 DQ 6 DQ 7 /CS RDQMB5 10 Ω 15 pF DQ 8 DQ 9 DQ 10 DQ 11 DQ 12 DQ 13 DQ 14 DQ 15 10 Ω 30 pF DQ 6 DQ 5 DQ 4 DQ 3 DQ 2 DQ 1 DQ 0 /CS DQ 0DQM DQ 1 DQ 2 DQ 3 D6 DQ 4 DQ 5 DQ 6 DQ 7 DQ 40 DQ 41 DQ 42 DQ 43 DQ 44 DQ 45 DQ 46 DQ 47 D1 D0 - D8, Register1, Register2, PLL VCC C D0 - D8, Register1, Register2, PLL V SS SERIAL PD 10 Ω 15 pF CB 0 CB 1 CB 2 CB 3 CB 4 CB 5 CB 6 CB 7 DQ 2 DQM DQ 0 DQ 7 DQ 5 D2 DQ 3 DQ 1 DQ 6 DQ 4 /CS DQ 7 DQM /CS SDA SCL A0 A1 WP A2 47 kΩ SA0 SA1 SA2 MC-4516DA727XFB have no this circuit. /RCS2 RDQMB6 RDQMB2 10 Ω 30 pF DQ 16 DQ 17 DQ 18 DQ 19 DQ 20 DQ 21 DQ 22 DQ 23 10 Ω 30 pF DQ 6 DQ 5 DQ 4 DQ 3 DQ 2 DQ 1 DQ 0 DQ 48 DQ 49 DQ 50 DQ 51 DQ 52 DQ 53 DQ 54 DQ 55 D3 RDQMB3 10 Ω /CS DQ 0 DQM DQ 1 DQ 2 DQ 3 D7 DQ 4 DQ 5 DQ 6 DQ 7 12 pF 10 Ω CLK0 CLK : D0,D1,D5 RDQMB7 10 Ω 30 pF DQ 24 DQ 25 DQ 26 DQ 27 DQ 28 DQ 29 DQ 30 DQ 31 A0 - A9 /CS RA0 - RA9 DQ 56 DQ 57 DQ 58 DQ 59 DQ 60 DQ 61 DQ 62 DQ 63 A0 - A9 : D0 - D8 PLL DQ 0 DQM DQ 1 DQ 2 DQ 3 D8 DQ 4 DQ 5 DQ 6 DQ 7 /RRAS /RAS : D0 - D8 CKE0 /RCAS /CAS : D0 - D8 DQMB2, 3, 6, 7 /RWE /WE : D0 - D8 Register1 /CS A10, A11, BA0, BA1 /RAS Register2 /CS2 /LE CLK : Register 1, Register 2 RA10, RA11, RBA0, RBA1 A10, A11, BA0, BA1 : D0 - D8 RCKE0 CKE : D0 - D8 /RCS2 15 pF /RCS0 /CS0 CLK : D4,D7,D8 RDQMB2, 3, 6, 7 RDQMB0, 1, 4, 5 DQMB0, 1, 4, 5 REGE CLK : D2,D3,D6 10 Ω 30 pF DQ 7 DQM DQ 6 DQ 5 DQ 4 D4 DQ 3 DQ 2 DQ 1 DQ 0 /CAS /WE 15 pF /LE VCC 10 kΩ Remarks 1. The value of all resistors of DQs is 10 Ω. 2. D0 - D8: µPD45128841 (4M words × 8 bits × 4 banks) 3. REGE ≤ VIL: Buffer mode REGE ≥ VIH: Register mode 4 CLK1 - CLK3 Data Sheet E0278N10 (Ver. 1.0) MC-4516DA727XFA Electrical Specifications • All voltages are referenced to VSS (GND). • After power up, wait more than 1 ms and then, execute power on sequence and CBR (Auto) refresh before proper device operation is achieved. Absolute Maximum Ratings Parameter Symbol Condition Rating Unit Voltage on power supply pin relative to GND VCC –0.5 to +4.6 V Voltage on input pin relative to GND VT –0.5 to +4.6 V Short circuit output current IO 50 mA Power dissipation PD 10 W Operating ambient temperature TA 0 to +70 °C Storage temperature Tstg –55 to +125 °C Caution Exposing the device to stress above those listed in Absolute Maximum Ratings could cause permanent damage. The device is not meant to be operated under conditions outside the limits described in the operational section of this specification. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Recommended Operating Conditions Parameter Symbol Condition MIN. TYP. MAX. Unit 3.3 3.6 V Supply voltage VCC 3.0 High level input voltage VIH 2.0 VCC + 0.3 V Low level input voltage VIL –0.3 + 0.8 V Operating ambient temperature TA 0 70 °C MAX. Unit pF Capacitance (TA = 25 °C, f = 1 MHz) Parameter Input capacitance Data input/output capacitance Symbol Test condition MIN. TYP. CI1 A0 - A11, BA0 (A13), BA1 (A12), /RAS, /CAS, /WE 4 10 CI2 CLK0 15 25 CI3 CKE0 4 10 CI4 /CS0, /CS2 4 10 CI5 DQMB0 - DQMB7 3 10 CI/O DQ0 - DQ63, CB0 - CB7 5 13 Data Sheet E0278N10 (Ver. 1.0) pF 5 MC-4516DA727XFA DC Characteristics (Recommended Operating Conditions unless otherwise noted) Parameter Operating current Precharge standby current in power down mode Precharge standby current in Symbol ICC1 ICC2P ICC2PS ICC2N non power down mode power down mode Active standby current in ICC3P ICC3PS ICC3N non power down mode MAX. Unit Notes mA Burst length = 1 /CAS latency = 2 -A75 1,300 tRC ≥ tRC (MIN.), IO = 0 mA /CAS latency = 3 -A75 1,345 CKE ≤ VIL (MAX.), tCK = 15 ns 259 CKE ≤ VIL (MAX.), tCK = ∞ 89 CKE ≥ VIH (MIN.), tCK = 15 ns, /CS ≥ VIH (MIN.), 430 CKE ≥ VIH (MIN.), tCK = ∞, Input signals are stable. 152 CKE ≤ VIL (MAX.), tCK = 15 ns 295 CKE ≤ VIL (MAX.), tCK = ∞ 116 CKE ≥ VIH (MIN.), tCK = 15 ns, /CS ≥ VIH (MIN.), 520 ICC4 CKE ≥ VIH (MIN.), tCK = ∞, Input signals are stable. tCK ≥ tCK (MIN.), IO = 0 mA (Burst mode) CBR (Auto) Refresh current MIN. mA mA mA mA ICC5 tRC ≥ tRC (MIN.) 260 /CAS latency = 2 -A75 1,480 /CAS latency = 3 -A75 1,795 /CAS latency = 2 -A75 2,470 /CAS latency = 3 -A75 2,560 Self refresh current ICC6 CKE ≤ 0.2 V Input leakage current II (L) VI = 0 to 3.6 V, All other pins not under test = 0 V Output leakage current IO (L) High level output voltage Low level output voltage mA 2 mA 3 268 mA –10 +10 µA DOUT is disabled, VO = 0 to 3.6 V –1.5 +1.5 µA VOH IO = –4.0 mA 2.4 VOL IO = +4.0 mA V 0.4 V Notes 1. ICC1 depends on output loading and cycle rates. Specified values are obtained with the output open. In addition to this, ICC1 is measured on condition that addresses are changed only one time during tCK (MIN.). 2. ICC4 depends on output loading and cycle rates. Specified values are obtained with the output open. In addition to this, ICC4 is measured on condition that addresses are changed only one time during tCK (MIN.). 3. ICC5 is measured on condition that addresses are changed only one time during tCK (MIN.). 6 1 Input signals are changed one time during 30 ns. ICC3NS Operating current Grade Input signals are changed one time during 30 ns. ICC2NS Active standby current in Test condition Data Sheet E0278N10 (Ver. 1.0) MC-4516DA727XFA AC Characteristics (Recommended Operating Conditions Unless Otherwise Noted) Test Conditions Parameter AC high level input voltage / low level input voltage Input timing measurement reference level Transition time (Input rise and fall time) Output timing measurement reference level Value Unit 2.4 / 0.4 V 1.4 V 1 ns 1.4 V tCK tCH CLK tCL 2.4 V 1.4 V 0.4 V tSETUP tHOLD Input 2.4 V 1.4 V 0.4 V tAC tOH Output Data Sheet E0278N10 (Ver. 1.0) 7 MC-4516DA727XFA Synchronous Characteristics Parameter Symbol -A75 Unit MIN. MAX. tCK3 7.5 (133 MHz) 10 Note Clock cycle time /CAS latency = 3 /CAS latency = 2 tCK2 (100 MHz) ns Access time from CLK /CAS latency = 3 tAC3 5.4 ns 1 /CAS latency = 2 tAC2 6.0 ns 1 50 133 MHz 45 55 Input clock frequency Input CLK duty cycle ns % Data-out hold time tOH 2.7 ns Data-out low-impedance time tLZ 0 ns /CAS latency = 3 tHZ3 3.0 5.4 /CAS latency = 2 6.0 Data-out high-impedance time ns tHZ2 3.0 Data-in setup time tDS 1.5 ns ns Data-in hold time tDH 0.8 ns Address setup time tAS 1.5 ns Address hold time tAH 0.8 ns CKE setup time tCKS 1.5 ns CKE hold time tCKH 0.8 ns CKE setup time (Power down exit) tCKSP 1.5 ns Command (/CS0, /CS2, /RAS, /CAS, /WE, tCMS 1.5 ns tCMH 0.8 ns DQMB0 - DQMB7) setup time Command (/CS0, /CS2, /RAS, /CAS, /WE, DQMB0 - DQMB7) hold time Note 1. Output load Z = 50 Ω Output 50 pF Remark These specifications are applied to the monolithic device. 8 Data Sheet E0278N10 (Ver. 1.0) 1 MC-4516DA727XFA Asynchronous Characteristics Parameter Symbol -A75 MIN. Unit MAX. ACT to REF/ACT command period (operation) tRC 67.5 ns REF to REF/ACT command period (refresh) tRC1 67.5 ns ACT to PRE command period tRAS 45 PRE to ACT command period tRP 20 ns Delay time ACT to READ/WRITE command tRCD 20 ns ACT(one) to ACT(another) command period tRRD 15 ns Data-in to PRE command period tDPL 8 ns ns 120,000 ns Data-in to ACT(REF) command /CAS latency = 3 tDAL3 1CLK+22.5 period (Auto precharge) /CAS latency = 2 tDAL2 1CLK+20 ns tRSC 2 CLK tT 0.5 Mode register set cycle time Transition time Refresh time (4,096 refresh cycles) tREF Note 30 ns 64 ms 1 Note1. This device can satisfy the tDAL3 spec of 1CLK+20 ns for up to and including 125 MHz operation. Data Sheet E0278N10 (Ver. 1.0) 9 MC-4516DA727XFA Serial PD Byte No. (1/2) Function Described Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Notes 0 Defines the number of bytes written into serial PD memory 80H 1 0 0 0 0 0 0 0 128 bytes 1 Total number of bytes of serial PD memory 08H 0 0 0 0 1 0 0 0 256 bytes 2 Fundamental memory type 04H 0 0 0 0 0 1 0 0 SDRAM 3 Number of rows 0CH 0 0 0 0 1 1 0 0 12 rows 4 Number of columns 0AH 0 0 0 0 1 0 1 0 10 columns 5 Number of banks 01H 0 0 0 0 0 0 0 1 1 bank 6 Data width 48H 0 1 0 0 1 0 0 0 72 bits 7 Data width (continued) 00H 0 0 0 0 0 0 0 0 0 8 Voltage interface 01H 0 0 0 0 0 0 0 1 LVTTL 9 CL = 3 Cycle time -A75 75H 0 1 1 1 0 1 0 1 7.5 ns 10 CL = 3 Access time -A75 54H 0 1 0 1 0 1 0 0 5.4 ns 11 DIMM configuration type 02H 0 0 0 0 0 0 1 0 ECC 12 Refresh rate/type 80H 1 0 0 0 0 0 0 0 Normal 13 SDRAM width 08H 0 0 0 0 1 0 0 0 x8 14 Error checking SDRAM width 08H 0 0 0 0 1 0 0 0 x8 15 Minimum clock delay 01H 0 0 0 0 0 0 0 1 1 clock 16 Burst length supported 8FH 1 0 0 0 1 1 1 1 1, 2, 4, 8, F 17 Number of banks on each SDRAM 04H 0 0 0 0 0 1 0 0 4 banks 18 /CAS latency supported 06H 0 0 0 0 0 1 1 0 2, 3 19 /CS latency supported 01H 0 0 0 0 0 0 0 1 0 20 /WE latency supported 01H 0 0 0 0 0 0 0 1 0 21 SDRAM module attributes 1FH 0 0 0 1 1 1 1 1 Registered 22 SDRAM device attributes : General 0EH 0 0 0 0 1 1 1 0 23 CL = 2 Cycle time -A75 0AH 0 0 0 0 1 0 1 0 10 ns 24 CL = 2 Access time -A75 60H 0 1 1 0 0 0 0 0 6 ns 00H 0 0 0 0 0 0 0 0 27 tRP(MIN.) -A75 14H 0 0 0 1 0 1 0 0 20 ns 28 tRRD(MIN.) -A75 0FH 0 0 0 0 1 1 1 1 15 ns 29 tRCD(MIN.) -A75 14H 0 0 0 1 0 1 0 0 20 ns 30 tRAS(MIN.) -A75 2DH 0 0 1 0 1 1 0 1 45 ns 31 Module bank density 20H 0 0 1 0 0 0 0 0 128M bytes 25-26 10 Hex Data Sheet E0278N10 (Ver. 1.0) MC-4516DA727XFA (2/2) Byte No. Function Described Hex Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Notes 32 Command and address signal input setup time 15H 0 0 0 1 0 1 0 1 1.5 ns 33 Command and address signal input hold time 08H 0 0 0 0 1 0 0 0 0.8 ns 34 Data signal input setup time 15H 0 0 0 1 0 1 0 1 1.5 ns 35 Data signal input hold time 08H 0 0 0 0 1 0 0 0 0.8 ns 00H 0 0 0 0 0 0 0 0 02H 0 0 0 0 0 0 1 0 3AH 0 0 1 1 1 0 1 0 64H 0 1 1 0 0 1 0 0 85H 1 0 0 0 0 1 0 1 36-61 62 SPD revision 63 Checksum for bytes 0 - 62 64-71 72 73-90 91 -A75 JEDEC 2 Manufacture’s JEDEC ID code Manufacturing location Manufacture’s P/N Revision Code 93-94 Manufacturing date 95-98 Assembly serial number 99-125 Mfg specific 126 Intel specification frequency 127 Intel specification /CAS -A75 100 MHz latency support Timing Chart Refer to the µPD45128441, 45128841, 45128163 Data sheet (E0031N). Data Sheet E0278N10 (Ver. 1.0) 11 MC-4516DA727XFA Package Drawing MC-4516DA727XFA Front side Unit: mm (DATUM -A-) 4.00 max 3.0 min 3.00 4.00 min Component area (Front) 1 8.89 84 11.43 B C A 24.495 1.27 ± 0.1 54.61 36.83 42.18 133.35 ± 0.13 Back side 85 38.1 ± 0.13 17.78 168 4.0 ± 0.10 2 – φ 3.00 Component area (Back) R2.0 (DATUM -A-) Detail B R FULL Detail C (DATUM -A-) 1.00 2.0 R FULL 6.35 3.125 6.35 3.125 1.27(T.P.) 0.20 ± 0.15 2.54 ± 0.10 Detail A 4.175 2.0 1.00 ± 0.05 Note: Tolerance on all dimensions ± 0.15 unless otherwise specified. ECA-TS2-0054-01 12 Data Sheet E0278N10 (Ver. 1.0) MC-4516DA727XFA CAUTION FOR HANDLING MEMORY MODULES When handling or inserting memory modules, be sure not to touch any components on the modules, such as the memory ICs, chip capacitors and chip resistors. It is necessary to avoid undue mechanical stress on these components to prevent damaging them. In particular, do not push module cover or drop the modules in order to protect from mechanical defects, which would be electrical defects. When re-packing memory modules, be sure the modules are not touching each other. Modules in contact with other modules may cause excessive mechanical stress, which may damage the modules. MDE0202 NOTES FOR CMOS DEVICES 1 PRECAUTION AGAINST ESD FOR MOS DEVICES Exposing the MOS devices to a strong electric field can cause destruction of the gate oxide and ultimately degrade the MOS devices operation. Steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it, when once it has occurred. Environmental control must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using insulators that easily build static electricity. MOS devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement tools including work bench and floor should be grounded. The operator should be grounded using wrist strap. MOS devices must not be touched with bare hands. Similar precautions need to be taken for PW boards with semiconductor MOS devices on it. 2 HANDLING OF UNUSED INPUT PINS FOR CMOS DEVICES No connection for CMOS devices input pins can be a cause of malfunction. If no connection is provided to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused pin should be connected to VDD or GND with a resistor, if it is considered to have a possibility of being an output pin. The unused pins must be handled in accordance with the related specifications. 3 STATUS BEFORE INITIALIZATION OF MOS DEVICES Power-on does not necessarily define initial status of MOS devices. Production process of MOS does not define the initial operation status of the device. Immediately after the power source is turned ON, the MOS devices with reset function have not yet been initialized. Hence, power-on does not guarantee output pin levels, I/O settings or contents of registers. MOS devices are not initialized until the reset signal is received. Reset operation must be executed immediately after power-on for MOS devices having reset function. CME0107 Data Sheet E0278N10 (Ver. 1.0) 13 MC-4516DA727XFA The information in this document is subject to change without notice. Before using this document, confirm that this is the latest version. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of Elpida Memory, Inc. Elpida Memory, Inc. does not assume any liability for infringement of any intellectual property rights (including but not limited to patents, copyrights, and circuit layout licenses) of Elpida Memory, Inc. or third parties by or arising from the use of the products or information listed in this document. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of Elpida Memory, Inc. or others. Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of the customer's equipment shall be done under the full responsibility of the customer. Elpida Memory, Inc. assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. [Product applications] Elpida Memory, Inc. makes every attempt to ensure that its products are of high quality and reliability. However, users are instructed to contact Elpida Memory's sales office before using the product in aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment, medical equipment for life support, or other such application in which especially high quality and reliability is demanded or where its failure or malfunction may directly threaten human life or cause risk of bodily injury. [Product usage] Design your application so that the product is used within the ranges and conditions guaranteed by Elpida Memory, Inc., including the maximum ratings, operating supply voltage range, heat radiation characteristics, installation conditions and other related characteristics. Elpida Memory, Inc. bears no responsibility for failure or damage when the product is used beyond the guaranteed ranges and conditions. Even within the guaranteed ranges and conditions, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-safes, so that the equipment incorporating Elpida Memory, Inc. products does not cause bodily injury, fire or other consequential damage due to the operation of the Elpida Memory, Inc. product. [Usage environment] This product is not designed to be resistant to electromagnetic waves or radiation. This product must be used in a non-condensing environment. If you export the products or technology described in this document that are controlled by the Foreign Exchange and Foreign Trade Law of Japan, you must follow the necessary procedures in accordance with the relevant laws and regulations of Japan. Also, if you export products/technology controlled by U.S. export control regulations, or another country's export control laws or regulations, you must follow the necessary procedures in accordance with such laws or regulations. If these products/technology are sold, leased, or transferred to a third party, or a third party is granted license to use these products, that third party must be made aware that they are responsible for compliance with the relevant laws and regulations. M01E0107