TI TPS2817DBV

TPS2816-EP, TPS2817-EP, TPS2818-EP
TPS2819-EP, TPS2828-EP, TPS2829-EP
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SGDS039 – FEBRUARY 2008
SINGLE-CHANNEL HIGH-SPEED MOSFET DRIVER
FEATURES
1
•
•
•
•
•
•
•
•
•
•
•
•
•
(1)
Controlled Baseline
– One Assembly Site
– One Test Site
– One Fabrication Site
Extended Temperature Performance of –55°C
to 125°C
Enhanced Diminishing Manufacturing Sources
(DMS) Support
Enhanced Product-Change Notification
Qualification Pedigree (1)
Low-Cost Single-Channel High-Speed MOSFET
Driver
ICC . . . 15 µA Max (TPS2828, TPS2829)
25 ns Max Rise/Fall Times and 40 ns Max
Propagation Delay . . . 1 nF Load
2 A Peak Output Current
4 V to 14 V Driver Supply Voltage Range;
Internal Regulator Extends Range to 40 V
(TPS2816, TPS2817, TPS2818, TPS2819)
5-pin SOT-23 Package
–55°C to 125°C Ambient-Temperature
Operating Range
Highly Resistant to Latch-ups
TPS2816, TPS2817
TPS2818, TPS2819
DBV PACKAGE
(TOP VIEW)
VDD
1
GND
2
IN
3
5
VCC
4
OUT
TPS2828, TPS2829
DBV PACKAGE
(TOP VIEW)
NC
1
GND
2
IN
3
5
VCC
4
OUT
NC − No internal connection
Component qualification in accordance with JEDEC and
industry standards to ensure reliable operation over an
extended temperature range. This includes, but is not limited
to, Highly Accelerated Stress Test (HAST) or biased 85/85,
temperature cycle, autoclave or unbiased HAST,
electromigration, bond intermetallic life, and mold compound
life. Such qualification testing should not be viewed as
justifying use of this component beyond specified
performance and environmental limits.
DESCRIPTION/ORDERING INFORMATION
The TPS28xx single-channel high-speed MOSFET drivers are capable of delivering peak currents of up to 2 A
into highly capacitive loads. High switching speeds (tr and tf = 14 ns typ) are obtained with the use of BiCMOS
outputs. Typical threshold switching voltages are 2/3 and 1/3 of VCC. The design inherently minimizes
shoot-through current.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
UNLESS OTHERWISE NOTED this document contains
PRODUCTION DATA information current as of publication date.
Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008, Texas Instruments Incorporated
TPS2816-EP, TPS2817-EP, TPS2818-EP
TPS2819-EP, TPS2828-EP, TPS2829-EP
www.ti.com
SGDS039 – FEBRUARY 2008
A regulator is provided on TPS2816 through TPS2819 devices to allow operation with supply inputs between
14 V and 40 V. The regulator output can be used to power other circuits, provided power dissipation does not
exceed package limitations. If the regulator is not required, VDD (the regulator input) should be connected to VCC.
The TPS2816 and TPS2817 input circuits include an active pullup circuit to eliminate the need for an external
resistor when using open-collector PWM controllers. The TPS2818 and TPS2819 are identical to the TPS2816
and TPS2817, except that the active pullup circuit is omitted. The TPS2828 and TPS2829 are identical to the
TPS2818 and TPS2819, except that the internal voltage regulator is omitted, allowing quiescent current to drop
to less than 15 µA when the inputs are high or low.
The TPS28xx series devices are available in 5-pin SOT-23 (DBV) packages and operate over an ambient
temperature range of –55°C to 125°C.
AVAILABLE OPTIONS (1)
TA
–55°C to
125°C
FUNCTION
2
SYMBOL
CHIP FORM
(Y)
PACKAGE ORDER
TPS2816DBV (4)
TBD
TPS2816Y
TPS2816MDBVREP
Noninverting driver with active
pullup input
TPS2817DBV (4)
TBD
TPS2817Y
TPS2817MDBVREP
Inverting driver
TPS2818DBV
PMTM
TPS2818Y
TPS2818MDBVREP
Noninverting driver
TPS2819DBV
PMUM
TPS2819Y
TPS2819MDBVREP
TPS2828DBV
(4)
TBD
TPS2828Y
TPS2828MDBVREP
TPS2829DBV
(4)
TBD
TPS2829Y
TPS2829MDBVREP
Noninverting driver, no
regulator
(2)
(3)
(4)
SOT-23-5 (DBV) (2) (3)
Inverting driver with active
pullup input
Inverting driver, no regulator
(1)
PACKAGED DEVICES
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
The DBV package is available taped and reeled only.
Product Preview
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TPS2819-EP, TPS2828-EP, TPS2829-EP
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SGDS039 – FEBRUARY 2008
FUNCTIONAL BLOCK DIAGRAM
TPS2816, TPS2818
VDD
VREG
TPS2817, TPS2819
VCC
VREG
VDD
Active Pullup
(TPS2816 Only)
VCC
Active Pullup
(TPS2817 Only)
OUT
IN
OUT
IN
GND
GND
TPS2828
TPS2829
VCC
VCC
IN
OUT
OUT
IN
GND
GND
INPUT STAGE DIAGRAM
VCC
OUTPUT STAGE DIAGRAM
VCC
Predrive
To Drive
Stage
IN
OUT
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3
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TPS2819-EP, TPS2828-EP, TPS2829-EP
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SGDS039 – FEBRUARY 2008
TPS28xxY Chip Information
This chip, when properly assembled, displays characteristics similar to those of the TPS28xx. Thermal
compression or ultrasonic bonding may be used on the doped aluminum bonding pads. The chip may be
mounted with conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
(4)
(5)
(4)
(5)
OUT
VCC
(2)
GND
TPS2816Y
(1)
(3)
IN
VDD†
39
†TPS2816
(2)
through TPS2819 only
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4 × 4 MINIMUM
TJ max = 150°C
TOLERANCES ARE ± 10%.
(1)
(3)
ALL DIMENSIONS ARE IN MILS.
39
TERMINAL FUNCTIONS
TPS2816, TPS2818, TPS2828 (Inverting Driver)
TERMINAL
NAME
DESCRIPTION
NO.
VDD
1
Regulator supply voltage input. (Not connected on TPS2828)
GND
2
Ground
IN
3
Driver input.
OUT
4
Driver output, OUT = IN
VCC
5
Driver supply voltage/regulator output voltage
TERMINAL FUNCTIONS
TPS2817, TPS2819, TPS2829 (Noninverting Driver)
TERMINAL
NAME
DESCRIPTION
NO.
VDD
1
Regulator supply voltage input. (Not connected on TPS2829)
GND
2
Ground
IN
3
Driver input.
OUT
4
Driver output, OUT = IN
VCC
5
Driver supply voltage/regulator output voltage
4
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SGDS039 – FEBRUARY 2008
DISSIPATION RATING TABLE (1)
PACKAGE
TA ≤ 25°C
POWER RATING
DERATING FACTOR
ABOVE TA = 25°C
TA = 70°C
POWER RATING
TA = 80°C
POWER RATING
DBV
437 mW
3.5 mW/°C
280 mW
227 mW
(1)
These dissipation ratings are based upon EIA specification JESD51-3, "Low Effective Thermal Conductivity Test Board for Leaded
Surface Mount Packages," in tests conducted in a zero-airflow, wind tunnel environment.
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
(2)
VCC
Supply voltage range
VDD
Regulator supply voltage range (2)
IN
Input voltage range (2)
Output voltage range (pin 4)
(2)
VCC
Continuous regulator output current
OUT
Continuous output current
Continuous total power dissipation
VALUE
UNIT
–0.3 to 15
V
VCC – 0.3 to 42
V
–0.3 to VCC + 0.5
V
–0.5 to VCC + 0.5
V
25
mA
±100
mA
See Dissipation Rating Table
TA
Operating ambient temperature range
–55 to 125
°C
Tstg
Storage temperature range
–65 to 150
°C
260
°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
(1)
(2)
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to device GND terminal.
RECOMMENDED OPERATING CONDITIONS
VDD
Regulator input voltage range, TPS2816 through TPS2819
VCC
Supply voltage
IN
Input voltage
ICC
Continuous regulator output current
TA
Operating ambient temperature range
Copyright © 2008, Texas Instruments Incorporated
MIN
MAX
8
40
UNIT
V
V
4
14
–0.3
VCC
0
20
mA
–55
125
°C
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V
5
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TPS2819-EP, TPS2828-EP, TPS2829-EP
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SGDS039 – FEBRUARY 2008
TPS28xx ELECTRICAL CHARACTERISTICS
Inputs
over recommended operating ambient temperature range, VCC = 10 V, VDD tied to VCC, CL = 1 nF (unless otherwise specified)
TYP (1)
MAX
VCC = 5 V
3.3
4
VCC = 10 V
6.6
7
VCC = 14 V
9.3
10
PARAMETER
TEST CONDITIONS
Positive-going input threshold voltage
Negative-going input threshold voltage
MIN
VCC = 5 V
1
1.7
VCC = 10 V
2
3.3
VCC = 14 V
2.5
4.6
Input voltage hysteresis
Input current, TPS2818/19/28/29
Input current, TPS2816/17
V
V
1.3
V
Input = 0 V or VCC
0.2
µA
Input = 0 V
650
Input = VCC
15
Input capacitance
(1)
UNIT
µA
5
10
pF
Typical are for TA = 25°C (unless otherwise noted).
Outputs
PARAMETER
TEST CONDITIONS
IO = –1 mA
High-level output voltage
IO = –100 mA
TYP (1)
9.75
9.9
8
9.1
IO = 1 mA
Low-level output voltage
(1)
MIN
IO = 100 mA
MAX
UNIT
V
0.18
0.25
1
2
V
Typical are for TA = 25°C (unless otherwise noted).
Regulator, TPS2816 Through TPS2819
PARAMETER
TEST CONDITIONS
Output voltage
14 ≤ VDD ≤ 40 V,
0 ≤ IO ≤ 20 mA
Output voltage in dropout
IO = 10 mA,
VDD = 10 V
(1)
MIN
TYP (1)
MAX
10
11.5
13
V
10
V
8
UNIT
Typical are for TA = 25°C (unless otherwise noted).
Supply Current
PARAMETER
TPS2816,
TPS2817
Supply current into VCC
TPS2818,
TPS2819
TPS2828,
TPS2829
Supply current into VDD
(1)
6
TYP (1)
MAX
IN = high = 10 V
150
250
IN = low = 0 V
650
1000
25
55
0.1
15
TEST CONDITIONS
IN = high or low,
High = 10 V, Low = 0 V
MIN
TPS2816,
TPS2817
VDD = 20 V,
IN = high = 10 V or low = 0 V
650
1000
TPS2818,
TPS2819
VDD = 20 V,
IN = high = 10 V or low = 0 V
50
400
UNIT
µA
µA
Typical are for TA = 25°C (unless otherwise noted).
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TPS2819-EP, TPS2828-EP, TPS2829-EP
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SGDS039 – FEBRUARY 2008
TPS28xxY ELECTRICAL CHARACTERISTICS
Inputs
over recommended operating ambient temperature range, VCC = 10 V, VDD tied to VCC, CL = 1 nF (unless otherwise specified)
PARAMETER
Positive-going input threshold voltage
Negative-going input threshold voltage
TEST CONDITIONS
MIN
VCC = 5 V
3.3
VCC = 10 V
6.6
VCC = 14 V
9.3
VCC = 5 V
1.7
VCC = 10 V
3.3
VCC = 14 V
4.6
Input voltage hysteresis
Input current, TPS2818/19/28/29
Input current, TPS2816/17
MAX
UNIT
V
V
1.3
V
Input = 0 V or VCC
0.2
µA
Input = 0 V
650
Input = VCC
15
Input resistance
Input capacitance
(1)
TYP (1)
µA
1000
MΩ
5
pF
Typical are for TA = 25°C (unless otherwise noted).
Outputs
PARAMETER
High-level output voltage
Low-level output voltage
(1)
TEST CONDITIONS
MIN
TYP (1)
IO = –1 mA
9.9
IO = –100 mA
9.1
IO = 1 mA
MAX
V
0.18
IO = 100 mA
UNIT
V
1
Typical are for TA = 25°C (unless otherwise noted).
Regulator, TPS2816 Through TPS2819
PARAMETER
TEST CONDITIONS
Output voltage
14 ≤ VDD ≤ 40 V,
0 ≤ IO ≤ 20 mA
Output voltage in dropout
IO = 10 mA,
VDD = 10 V
(1)
MIN
TYP (1)
MAX
UNIT
11.5
V
9
V
Typical are for TA = 25°C (unless otherwise noted).
Supply Current
PARAMETER
TEST CONDITIONS
TPS2816,
TPS2817
Supply current into VCC
TPS2818,
TPS2819
TPS2828,
TPS2829
Supply current into VDD
(1)
MIN
TYP (1)
IN = high = 10 V
150
IN = low = 0 V
650
IN = high or low,
High = 10 V, Low = 0 V
MAX
25
UNIT
µA
0.1
TPS2816,
TPS2817
VDD = 20 V,
IN = high = 10 V or low = 0 V
650
TPS2818,
TPS2819
VDD = 20 V,
IN = high = 10 V or low = 0 V
50
µA
Typical are for TA = 25°C (unless otherwise noted).
Copyright © 2008, Texas Instruments Incorporated
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SGDS039 – FEBRUARY 2008
SWITCHING CHARACTERISTICS
for all devices over recommended operating ambient temperature range, VCC = 10 V, VDD tied to VCC, CL = 1 nF
(unless otherwise specified)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
VCC = 14 V
tr
Rise time
VCC = 10 V
14
VCC = 5 V
Fall time
VCC = 10 V
VCC = 10 V
VCC = 10 V
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ns
40
24
VCC = 5 V
8
45
50
VCC = 14 V
Propagation delay time, low-to-high-level output
ns
40
24
VCC = 5 V
tPLH
30
35
VCC = 14 V
Propagation delay time, high-to-low-level output
ns
25
14
VCC = 5 V
tPHL
30
35
VCC = 14 V
tf
UNIT
25
45
ns
50
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SGDS039 – FEBRUARY 2008
PARAMETER MEASUREMENT INFORMATION
50%
IN
50%
0V
tf
90%
OUT
tr
90%
50%
50%
10%
10%
tPHL
0V
tPLH
Figure 1. Typical Timing Diagram (TPS2816)
TPS2816
1
5
Regulator
0.1 µF
10 V
+
4.7 µF
2
3
4
Output
Input
50 Ω
1 nF
Figure 2. Switching Time Test Setup
TPS2816
VCC
0−10 Vdc
Current
Loop
OUT
10 V
+
0.1 µF
4.7 µF
Figure 3. Shoot-Through Current Test Setup
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SGDS039 – FEBRUARY 2008
TYPICAL CHARACTERISTICS
Table of Graphs
FIGURE
10
Rise time
vs Supply voltage
4
Fall time
vs Supply voltage
5
Propagation time (L > H)
vs Supply voltage
6
Propagation Time (H > L)
vs Supply voltage
7
Rise time
vs Ambient temperature
8
Fall time
vs Ambient temperature
9
Propagation time (L > H)
vs Supply voltage
10
Propagation time (H > L)
vs Ambient temperature
11
Supply current (VCC)
vs Supply voltage
12
Supply current (VCC)
vs Load capacitance
13
Supply current (VCC)
vs Ambient temperature
14
Input threshold voltage
vs Supply voltage
15
Regulator output voltage
vs Regulator supply voltage
16
Regulator quiescent current
vs Regulator supply voltage
17
Shoot-through current
vs Input voltage (L > H)
18
Shoot-through current
vs Input voltage (H > L)
19
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SGDS039 – FEBRUARY 2008
RISE TIME
vs
SUPPLY VOLTAGE
FALL TIME
vs
SUPPLY VOLTAGE
35
30
TA = 25°C
TA = 25°C
30
25
CL = 2200 pF
CL = 2200 pF
t f − Fall Time − ns
t r − Rise Time − ns
25
20
15
CL = 1000 pF
20
15
10
CL = 1000 pF
10
5
5
CL = 0
CL = 0
0
0
4
6
8
10
12
VCC − Supply Voltage − V
14
4
6
Figure 4.
8
10
12
VCC − Supply Voltage − V
Figure 5.
PROPAGATION DELAY TIME,
HIGH-TO-LOW-LEVEL OUTPUT
vs
SUPPLY VOLTAGE
PROPAGATION DELAY TIME,
LOW-TO-HIGH-LEVEL OUTPUT
vs
SUPPLY VOLTAGE
40
40
TA = 25°C
TA = 25°C
35
35
t PHL− Propagation Delay Time,
High-To-Low-Level Output − ns
t PLH − Propagation Delay Time,
Low-To-High-Level Output − ns
14
30
25
CL = 2200 pF
20
15
CL = 1000 pF
10
CL = 0
5
CL = 2200 pF
30
25
20
CL = 1000 pF
15
10
CL = 0
5
0
0
4
6
8
10
12
VCC − Supply Voltage − V
Figure 6.
Copyright © 2008, Texas Instruments Incorporated
14
4
6
8
10
12
VCC − Supply Voltage − V
14
Figure 7.
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11
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SGDS039 – FEBRUARY 2008
RISE TIME
vs
AMBIENT TEMPERATURE
FALL TIME
vs
AMBIENT TEMPERATURE
20
19
VCC = 10 V
Load = 1000 pF
f = 100 kHz
19
18
17
17
t f − Fall Time − ns
t r − Rise Time − ns
18
VCC = 10 V
Load = 1000 pF
f = 100 kHz
16
15
16
15
14
13
12
14
11
13
−50
−25
0
25
50
75
Ambient Temperature − °C
100
10
−50
125
−25
0
25
50
75
Ambient Temperature − °C
Figure 8.
PROPAGATION DELAY TIME,
HIGH-TO-LOW-LEVEL OUTPUT
vs
AMBIENT TEMPERATURE
20
19
VCC = 10 V
Load = 1000 pF
f = 100 kHz
19
t PHL− Propagation Delay Time,
High-To-Low-Level Output − ns
t PLH − Propagation Delay Time,
Low-To-High-Level Output − ns
125
Figure 9.
PROPAGATION DELAY TIME,
LOW-TO-HIGH-LEVEL OUTPUT
vs
SUPPLY VOLTAGE
18
100
17
16
15
18
VCC = 10 V
Load = 1000 pF
f = 100 kHz
17
16
15
14
13
12
14
11
13
−50
−25
0
25
50
75
100
TA − Ambient Temperature − °C
Figure 10.
12
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125
10
−50
−25
0
25
50
75
100
TA − Ambient Temperature − °C
125
Figure 11.
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SGDS039 – FEBRUARY 2008
SUPPLY CURRENT
vs
LOAD CAPACITANCE
SUPPLY CURRENT
vs
SUPPLY VOLTAGE
4
16
Load = 1000 pF
Duty Cycle = 50%
VCC = 10 V
f = 100 kHz
Duty Cycle = 50%
3.5
f = 1 MHz
12
I CC − Supply Current − mA
I CC − Supply Current − mA
14
10
8
f = 500 kHz
6
4
f = 40 kHz
f = 100 kHz
2
3
2.5
2
1.5
1
0.5
0
0
4
6
8
10
12
VCC − Supply Voltage − V
0
14
1000
CL − Load Capacitance − pF
Figure 12.
Figure 13.
SUPPLY CURRENT
vs
AMBIENT TEMPERATURE
INPUT THRESHOLD VOLTAGE
vs
SUPPLY VOLTAGE
3
9
VCC = 10 V
Load = 1000 pF
f = 100 kHz
Duty Cycle = 50%
8
2.5
VIT − Input Threshold Voltage−V
I CC − Supply Current − mA
2000
2
1.5
7
Positive Going
6
5
4
Negative Going
3
2
1
1
−50
0
−25
0
25
50
75
TA − Ambient Temperature − °C
Figure 14.
Copyright © 2008, Texas Instruments Incorporated
100
125
4
6
8
10
12
VCC − Supply Voltage − V
14
Figure 15.
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13
TPS2816-EP, TPS2817-EP, TPS2818-EP
TPS2819-EP, TPS2828-EP, TPS2829-EP
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SGDS039 – FEBRUARY 2008
REGULATOR OUTPUT VOLTAGE
vs
REGULATOR SUPPLY VOLTAGE
REGULATOR QUIESCENT CURRENT
vs
REGULATOR SUPPLY VOLTAGE
12
670
µA
Regulator Quiescent Current −
Regulator Output Voltage − V
10
9
8
7
6
Load = 10 kΩ
5
4
TPS2816,17 only
No Load
665
11
660
655
650
645
640
635
630
625
620
4
8
12
16
20
24
28
32
36
40
4
VDD − Regulator Supply Voltage − V
8
12
24
28
32
36
40
Figure 17.
SHOOT-THROUGH CURRENT
vs
INPUT VOLTAGE LOW-TO-HIGH
SHOOT-THROUGH CURRENT
vs
INPUT VOLTAGE HIGH-TO-LOW
7
7
VCC = 10 V
No Load
TA = 25°C
VCC = 10 V
No Load
TA = 25°C
6
Shoot-Through Current − mA
6
Shoot-Through Current − mA
20
VDD − Regulator Supply Voltage − V
Figure 16.
5
4
3
2
5
4
3
2
1
1
0
0
0
2
4
6
VI − Input Voltage − V
Figure 18.
14
16
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8
10
0
2
4
6
VI − Input Voltage − V
8
10
Figure 19.
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TPS2816-EP, TPS2817-EP, TPS2818-EP
TPS2819-EP, TPS2828-EP, TPS2829-EP
www.ti.com
SGDS039 – FEBRUARY 2008
APPLICATION INFORMATION
MOSFETs are voltage-driven devices that require very little steady-state drive current. However, the large input
capacitance (200 pF to 3000 pF or greater) of these devices requires large current surges to reduce the turn-on
and turn-off times. The TPS2816 series of high-speed drivers can supply up to 2 A to a MOSFET, greatly
reducing the switching times. The fast rise times and fall times and short propagation delays allow for operation
in today's high-frequency switching converters.
In addition, MOSFETs have a limited gate-bias voltage range, usually less than 20 V. The TPS2816 series of
drivers extends this operating range by incorporating an on-board series regulator with an input range up to 40 V.
This regulator can be used to power the drivers, the PWM chip, and other circuitry, providing the power
dissipation rating is not exceeded.
When using these devices, care should be exercised in the proper placement of the driver, the switching
MOSFET, and the bypass capacitor. Because of the large input capacitance of the MOSFET, the driver should
be placed close to the gate to eliminate the possibility of oscillations caused by trace inductance ringing with the
gate capacitance of the MOSFET. When the driver output path is longer than approximately 2 inches, a resistor
in the range of 10 Ω should be placed in series with the gate drive as close as possible to the MOSFET. A
ceramic bypass capacitor is also recommended to provide a source for the high-speed current transients that the
MOSFET requires. This capacitor should be placed between VCC and GND of the driver (see Figure 20 and
Figure 21).
TPS2816
VCC
1
Regulator
5
Load
2
0.1 µF
3
Input
4
Figure 20. VCC < 14 V
VDD
1
TPS2816
Regulator
5
+
0.1 µF
Input
2
3
Load
4.7 µF
4
Figure 21. VCC > 14 V
The on-board series regulator supplies approximately 20 mA of current at 11.5 V, some of which can be used for
Copyright © 2008, Texas Instruments Incorporated
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15
TPS2816-EP, TPS2817-EP, TPS2818-EP
TPS2819-EP, TPS2828-EP, TPS2829-EP
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SGDS039 – FEBRUARY 2008
external circuitry, providing the power dissipation rating for the driver is not exceeded. When using the on-board
series regulator, an electrolytic output capacitor of 4.7 µF or larger is recommended. Although not required, a
0.1 µF ceramic capacitor on the input of the regulator can help suppress transient currents (see Figure 22).
When not used, the regulator should be connected to VCC. Grounding VDD will result in destruction of the
regulator.
34 VDC
0.1 µF
+
0.1 µF
VCC
4.7 µF
TPS2816
PWM
Controller
1
Regulator
5
0.1 µF
2
VO
Out
3
4
10 µF
GND
Figure 22. Boost Application
The TPS2816 and TPS2818 drivers include active pullup circuits on the inputs to eliminate the need for external
pullup resistors when using controllers with open-collector outputs (such as the TL5001). The TPS2817 and
TPS2819 drivers have standard CMOS inputs providing a total device operating current of less than 50 µA. All
devices switch at standard CMOS logic levels of approximately 2/3 VCC with positive-going input levels, and
approximately 1/3 VCC with negative-going input levels. Being CMOS drivers, these devices will draw relatively
large amounts of current (Approximately 5 mA) when the inputs are in the range of one-half of the supply
voltage. In normal operation, the driver input is in this range for a very short time. Care should be taken to avoid
use of very low slew-rate inputs, used under normal operating conditions. Although not destructive to the device,
slew rates slower than 0.1 V/µs are not recommended.
The BiCMOS output stage provides high instantaneous drive current to rapidly toggle the power switch, and very
low drop to each rail to ensure proper operation at voltage extremes.
Low-voltage circuits (less than 14 V) that require very low quiescent currents can use the TPS2828 and
TPS2829 drivers. These drivers use typically 0.2 µA of quiescent current (with inputs high or low). They do not
have the internal regulator or the active pullup circuit, but all other specifications are the same as for the rest of
the family.
2.5-V/3.3-V, 3-A Application
Figure 23 illustrates the use of the TPS2817 with a TL5001 PWM controller and a TPS1110 in a simple
step-down converter application. The converter operates at 275 kHz and delivers either 2.5 V or 3.3 V
(determined by the value of R6) at 3 A (5 A peak) from a 5-V supply. The bill of materials is provided in Table 1.
16
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TPS2819-EP, TPS2828-EP, TPS2829-EP
www.ti.com
SGDS039 – FEBRUARY 2008
Q1
TPS1110D
4.5 V to 7 V
L1
VO
3 A Continuous
5 A Peak
+
C7
C8
R5
U1
TPS2817DBV
+
CR1
1
C5
Regulator
5
C9
C10
+
C12
C13
2
GND
3
4
R4
GND
U2
TL5001CD
2
R1
+
5
SCP
VCC
GND
DTC
6
C9
1
OUT
C2
COMP
3
FB
4
C3
R7
C11
C6
R6
8
RT
7
R3
R2
C4
Figure 23. Step-Down Application
NOTE:
If the parasitics of the external circuit cause the voltage to violate the Absolute
Maximum Rating for the Output pins, Schottky diodes should be added from ground to
output and from output to VCC.
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17
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TPS2819-EP, TPS2828-EP, TPS2829-EP
www.ti.com
SGDS039 – FEBRUARY 2008
Table 1. Bill of Materials
REF DES
PART NO.
DESCRIPTION
MFR
U1
TPS2817DBV
IC, MOSFET driver, single noninverting
TI
U2
TL5001CD
IC, PWM controller
TI
Q1
TPS1110D
MOSFET, p-channel, 6 A, 7 V, 75 mΩ
TI
C1, C2, C5, C8
Capacitor, ceramic, 0.1 µF, 50 V, X7R, 1206
C3
Capacitor, ceramic, 0.033 µF, 50 V, X7R, 1206
C4
Capacitor, ceramic, 2200 pF, 50 V, X7R, 0805
C6
ECS-T1CY105R
Capacitor, tantalum, 1.0 µF, 16 V, A case
Panasonic
C7
10SC47M
Capacitor, OS-Con, 47 µF, 10 V
Sanyo
C9
Capacitor, ceramic, 1000 pF, 50 V, X7R, 0805
C10, C12
Capacitor, OS-Con, 220 µF, 10 V
10SA220M
Sanyo
Capacitor, ceramic, 0.022 µF, 50 V, X7R, 0805
C11
Capacitor, ceramic, 47 µF, 50 V, X7R
C13
CR1
50WQ03F
Diode, Schottky, D-pak, 5 A 30 V
IR
L1
SML3723
Inductor, 27 µH, ±20%, 3 A
Nova Magnetics
R1
Resistor, CF, 47 kΩ, 1/10 W, 5%, 0805
R2
Resistor, CF, 1.5 kΩ, 1/10 W, 5%, 0805
R3
Resistor, MF, 30.1 kΩ, 1/10 W, 1%, 0805
R4
Resistor, MF, 1.00 kΩ, 1/10 W, 1%, 0805
R5
Resistor, CF, 47 Ω, 1/10 W, 5%, 0805
R6 (3.3-V)
Resistor, MF, 2.32 kΩ, 1/10 W, 1%, 0805
R6 (2.5-V)
Resistor, MF, 1.50 kΩ, 1/10 W, 1%, 0805
R7
Resistor, CF, 100 Ω, 1/10 W, 5%, 0805
As shown in Figure 24 and Figure 25, the TPS2817 turns on the TPS1110 power switch in less than 20 ns and
off in 25 ns.
Q1 Gate
Q1 Drain
2 V/div
Q1 Drain
2 V/div
Q1 Gate
12.5 ns/div
Figure 24. Q1 Turn-On Waveform
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2 V/div
2 V/div
12.5 ns/div
Figure 25. Q1 Turn-Off Waveform
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www.ti.com
SGDS039 – FEBRUARY 2008
The efficiency for various output currents, with a 5.25-V input, is shown in Figure 26. For a 3.3-V output, the
efficiency is greater than 90% for loads up to 2 A – exceptional for a simple, inexpensive design.
95
VO = 3.3 V
90
Efficiency − %
VI = 5.25 V
TA = 25°C
85
VO = 2.5 V
80
75
70
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
Load Current − A
Figure 26. Converter Efficiency
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19
PACKAGE OPTION ADDENDUM
www.ti.com
11-Feb-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TPS2818MDBVREP
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS2819MDBVREP
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
V62/08601-03XE
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
V62/08601-04XE
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
TPS2818MDBVREP
SOT-23
DBV
5
3000
180.0
TPS2819MDBVREP
SOT-23
DBV
5
3000
180.0
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
9.0
3.15
3.2
1.4
4.0
8.0
Q3
9.0
3.15
3.2
1.4
4.0
8.0
Q3
Pack Materials-Page 1
W
Pin1
(mm) Quadrant
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPS2818MDBVREP
SOT-23
DBV
5
3000
182.0
182.0
20.0
TPS2819MDBVREP
SOT-23
DBV
5
3000
182.0
182.0
20.0
Pack Materials-Page 2
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