HITACHI 2SA673

2SA673, 2SA673A
Silicon PNP Epitaxial
Application
• Low frequency amplifier
• Complementary pair with 2SC1213 and 2SC1213A
Outline
TO-92 (1)
1. Emitter
2. Collector
3. Base
3
2
1
2SA673, 2SA673A
Absolute Maximum Ratings (Ta = 25°C)
Item
Symbol
2SA673
2SA673A
Unit
Collector to base voltage
VCBO
–35
–50
V
Collector to emitter voltage
VCEO
–35
–50
V
Emitter to base voltage
VEBO
–4
–4
V
Collector current
IC
–500
–500
mA
Collector power dissipation
PC
400
400
mW
Junction temperature
Tj
150
150
°C
Storage temperature
Tstg
–55 to +150
–55 to +150
°C
Electrical Characteristics (Ta = 25°C)
2SA673
2SA673A
Item
Symbol
Min
Typ
Max
Min
Typ
Max
Unit
Test conditions
Collector to base
breakdown voltage
V(BR)CBO
–35
—
—
–50
—
—
V
I C = –10 µA, IE = 0
Collector to emitter
breakdown voltage
V(BR)CEO
–35
—
—
–50
—
—
V
I C = –1 mA, RBE = ∞
Emitter to base
breakdown voltage
V(BR)EBO
–4
—
—
–4
—
—
V
I E = –10 µA, IC = 0
Collector cutoff current
I CBO
—
—
–0.5
—
—
–0.5
µA
VCB = –20 V, IE = 0
Collector to emitter
saturation voltage
VCE(sat)
—
–0.2
–0.6
—
–0.2
–0.6
V
I C = –150 mA,
I B = –15 mA*2
DC current trnsfer ratio
hFE*1
60
—
320
60
—
320
VCE = –3 V,
I C = –10 mA
DC current trnsfer ratio
hFE
10
—
—
10
—
—
VCE = –3 V,
I C = –500 mA*2
Base to emitter voltage VBE
—
–0.64 —
—
–0.64 —
Notes: 1. The 2SA673 and 2SA673A are grouped by h FE as follows.
2. Pulse test
B
C
D
60 to 120
100 to 200
160 to 320
2
V
VCE = –3 V,
I C =–10 mA
2SA673, 2SA673A
Typical Output Characteristics (1)
–0.7
0
W
m
200
–80
–0.9
–0.8
40
400
0
–1.
=
Collector Current IC (mA)
–100
PC
Collector Power Dissipation PC (mW)
Maximum Collector Dissipation Curve
600
–0.6
–60
–0.5
–0.4
–40
–0.3
–0.2
–20
–0.1 mA
IB = 0
0
100
150
50
Ambient Temperature Ta (°C)
0
–2
–4
–6
–8
–10
Collector to Emitter Voltage VCE (V)
Typical Output Characteristics (2)
Typical Transfer Characteristics
–500
–30
–2
–1 mA
–100
PC = 400 mW
IB = 0
0
–2
–4
–6
–8
–10
Collector to Emitter Voltage VCE (V)
–3
25
–25
–200
–10
Ta = 75°C
–300
–7
–6
–5
–4
–3
Collector Current IC (mA)
Collector Current IC (mA)
VCE = –3 V
–400
–1.0
–0.3
0
–0.2 –0.4 –0.6 –0.8 –1.0
Base to Emitter Voltage VBE (V)
3
2SA673, 2SA673A
DC Current Transfer Ratio vs.
Collector Current
Gain Bandwidth Product vs.
Collector Current
240
VCE = –3 V
Gain Bandwidth Product fT (MHz)
DC Current Transfer ratio hFE
150
75
50
100
25
0
Ta
50
=
°C
–25
0
–2
4
–5 –10 –20
–50 –100 –200
Collector Current IC (mA)
–500
200
VCE = –3 V
160
120
80
40
0
–5
–10 –20
–50 –100 –200
Collector Current IC (mA)
–500
Unit: mm
4.8 ± 0.3
0.7
0.60 Max
0.5 ± 0.1
12.7 Min
2.3 Max
5.0 ± 0.2
3.8 ± 0.3
0.5
1.27
2.54
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
TO-92 (1)
Conforms
Conforms
0.25 g
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
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