TS5V330 www.ti.com .............................................................................................................................................................. SCDS164D – MAY 2004 – REVISED JUNE 2009 QUAD SPDT WIDE-BANDWIDTH VIDEO SWITCH WITH LOW ON-STATE RESISTANCE FEATURES 1 • • • • • 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 VCC EN S1D S2D DD S1C S2C DC RGY PACKAGE (TOP VIEW) S1A S2A DA S1B S2B DB VCC • • • IN S1A S2A DA S1B S2B DB GND 1 16 15 EN 14 S1D 13 S2D 2 3 4 12 DD 11 S1C 5 6 10 S2C 7 8 9 DC • D, DBQ, OR PW PACKAGE (TOP VIEW) IN • • • Low Differential Gain and Phase (DG = 0.64%, DP = 0.1 Degrees Typ) Wide Bandwidth (BW = 300 MHz Min) Low Crosstalk (XTALK = –63 dB Typ) Low Power Consumption (ICC = 3 µA Max) Bidirectional Data Flow With Near-Zero Propagation Delay Low ON-State Resistance (ron = 3 Ω Typ) VCC Operating Range From 4.5 V to 5.5 V Ioff Supports Partial-Power-Down Mode Operation Data and Control Inputs Provide Undershoot Clamp Diode Control Inputs Can Be Driven by TTL or 5-V/3.3-V CMOS Outputs Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Performance Tested Per JESD 22 – 1000-V Charged-Device Model (C101) Suitable for Both RGB and Composite-Video Switching GND • DESCRIPTION/ORDERING INFORMATION The TS5V330 video switch is a 4-bit 1-of-2 multiplexer/demultiplexer with a single switch-enable (EN) input. When EN is low, the switch is enabled and the D port is connected to the S port. When EN is high, the switch is disabled and the high-impedance state exists between the D and S ports. The select (IN) input controls the data path of the multiplexer/demultiplexer. Low differential gain and phase make this switch ideal for composite and RGB video applications. This device has wide bandwidth and low crosstalk, making it suitable for high-frequency applications as well. This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current will not backflow through the device when it is powered down. This switch maintains isolation during power off. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2004–2009, Texas Instruments Incorporated TS5V330 SCDS164D – MAY 2004 – REVISED JUNE 2009 .............................................................................................................................................................. www.ti.com ORDERING INFORMATION PACKAGE (1) TA QFN – RGY SOIC – D –40°C to 85°C SSOP (QSOP) – DBQ TSSOP – PW (1) ORDERABLE PART NUMBER Tape and reel TS5V330RGYR Tube TS5V330D Tape and reel TS5V330DR Tape and reel TS5V330DBQR Tube TS5V330PW Tape and reel TS5V330PWR TOP-SIDE MARKING TE330 TS5V330 TE330 TE330 Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. DESCRIPTION/ORDERING INFORMATION (CONTINUED) To ensure the high-impedance state during power up or power down, EN should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. FUNCTION TABLE INPUTS EN IN INPUT/OUTPUT D FUNCTION L L S1 D port = S1 port L H S2 D port = S2 port H X Z Disconnect xxxx PIN DESCRIPTION PIN 2 DESCRIPTION S1, S2 Analog video I/Os D Analog video I/Os IN Select input EN Switch-enable input Submit Documentation Feedback Copyright © 2004–2009, Texas Instruments Incorporated Product Folder Link(s): TS5V330 TS5V330 www.ti.com .............................................................................................................................................................. SCDS164D – MAY 2004 – REVISED JUNE 2009 PARAMETER DEFINITIONS PARAMETER DESCRIPTION ron Resistance between the D and S ports, with the switch in the ON state IOZ Output leakage current measured at the D and S ports, with the switch in the OFF state IOS Short-circuit current measured at the I/O pins VIN Voltage at IN VEN Voltage at EN CIN Capacitance at the control (EN, IN) inputs COFF Capacitance at the analog I/O port when the switch is OFF CON Capacitance at the analog I/O port when the switch is ON VIH Minimum input voltage for logic high for the control (EN, IN) inputs VIL Minimum input voltage for logic low for the control (EN, IN) inputs Vhys Hysteresis voltage at the control (EN, IN) inputs VIK I/O and control (EN, IN) inputs diode clamp voltage VI Voltage applied to the D or S pins when D or S is the switch input VO Voltage applied to the D or S pins when D or S is the switch output IIH Input high leakage current of the control (EN, IN) inputs IIL Input low leakage current of the control (EN, IN) inputs II Current into the D or S pins when D or S is the switch input IO Current into the D or S pins when D or S is the switch output Ioff Output leakage current measured at the D or S ports, with VCC = 0 tON Propagation delay measured between 50% of the digital input to 90% of the analog output when switch is turned ON tOFF Propagation delay measured between 50% of the digital input to 90% of the analog output when switch is turned OFF BW Frequency response of the switch in the ON state measured at –3 dB XTALK Unwanted signal coupled from channel to channel. Measured in –dB. XTALK = 20 log VO/VI. This is a nonadjacent crosstalk. OIRR Off isolation is the resistance (measured in –dB) between the input and output with the switch OFF. DG Magnitude variation between analog input and output pins when the switch is ON and the dc offset of composite-video signal varies at the analog input pin. In the NTSC standard, the frequency of the video signal is 3.58 MHz, and dc offset is from 0 to 0.714 V. DP Phase variation between analog input and output pins when the switch is ON and the dc offset of composite-video signal varies at the analog input pin. In the NTSC standard, the frequency of the video signal is 3.58 MHz, and dc offset is from 0 to 0.714 V. ICC Static power-supply current ICCD Variation of ICC for a change in frequency in the control (EN, IN) inputs ΔICC This is the increase in supply current for each control input that is at the specified voltage level, rather than VCC or GND. Submit Documentation Feedback Copyright © 2004–2009, Texas Instruments Incorporated Product Folder Link(s): TS5V330 3 TS5V330 SCDS164D – MAY 2004 – REVISED JUNE 2009 .............................................................................................................................................................. www.ti.com FUNCTIONAL DIAGRAM (POSITIVE LOGIC) 2 4 S1A DA 3 S2A 7 DB 5 S1B 6 S2B 9 11 DC 10 12 DD 14 13 IN S1C S2C S1D S2D 1 15 Control Logic EN Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX –0.5 7 V VIN Control input voltage range (2) (3) –0.5 7 V VI/O Switch I/O voltage range (2) (3) (4) –0.5 7 IIK Control input clamp current VIN < 0 –50 mA II/OK I/O port clamp current VI/O < 0 –50 mA ±128 mA ±100 mA VCC II/O Supply voltage range ON-state switch current (5) Continuous current through VCC or GND D package (6) θJA Tstg (1) (2) (3) (4) (5) (6) (7) 4 Package thermal impedance V 73 DBQ package (6) 90 PW package (6) 108 RGY package (7) 39 Storage temperature range UNIT –65 150 °C/W °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to ground, unless otherwise specified. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. VI and VO are used to denote specific conditions for VI/O. II and IO are used to denote specific conditions for II/O. The package thermal impedance is calculated in accordance with JESD 51-7. The package thermal impedance is calculated in accordance with JESD 51-5. Submit Documentation Feedback Copyright © 2004–2009, Texas Instruments Incorporated Product Folder Link(s): TS5V330 TS5V330 www.ti.com .............................................................................................................................................................. SCDS164D – MAY 2004 – REVISED JUNE 2009 Recommended Operating Conditions (1) MIN MAX UNIT VCC Supply voltage range 4 5.5 V VIH High-level control input voltage range (EN, IN) 2 5.5 V VIL Low-level control input voltage range (EN, IN) 0 0.8 V VANALOG Analog I/O voltage range 0 Vcc V TA Operating free-air temperature range –40 85 °C (1) All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. Electrical Characteristics over recommended operating free-air temperature range, VCC = 5 V ±10% (unless otherwise noted) TEST CONDITIONS (1) PARAMETER VIK EN, IN Vhys EN, IN VCC = 4.5 V, IIH EN, IN VCC = 5.5 V, VIN and VEN = VCC IIL EN, IN MIN TYP (2) MAX IIN = –18 mA –1.8 VCC = 5.5 V, VIN and VEN = GND VCC = 5.5 V, VO = 0 to 5.5 V, VI = 0, Switch OFF IOS (4) VCC = 5.5 V, VO = 0.5 VCC, VI = 0, Switch ON Ioff VCC = 0 V, VO = 0 to 5.5 V, VI = 0 VCC = 5.5 V, II/O = 0, Switch ON or OFF VCC = 5.5 V, One input at 3.4 V, Other inputs at VCC or GND ΔICC EN, IN ICCD CIN COFF CON ron (5) (1) (2) (3) (4) (5) D port S port mV ±1 µA ±1 µA 50 mA µA 1 VIN of VEN = 0, f = 1 MHz 3 µA 2.5 mA 0.25 mA/MHz 3.5 pF 6 VI = 0, f = 1 MHz, Outputs open, Switch OFF VI = 0, f = 1 MHz, Outputs open, Switch ON 14 VI = 1 V, IO = 13 mA, RL = 75 Ω 3 7 VI = 2 V, IO = 26 mA, RL = 75 Ω 7 10 VCC = 4.5 V µA ±1 VEN = GND, VCC = 5.5 V, D and S ports open, VIN input switching 50% duty cycle EN, IN V 150 IOZ (3) ICC UNIT pF 4 pF Ω VI, VO, II, and IO refer to I/O pins. All typical values are at VCC = 5 V (unless otherwise noted), TA = 25°C. For I/O ports, IOZ includes the input leakage current. The IOS test is applicable to only one ON channel at a time. The duration of this test is less than 1 s. Measured by the voltage drop between the D and S terminals at the indicated current through the switch. ON-state resistance is determined by the lower of the voltages of the two (D or S) terminals. Submit Documentation Feedback Copyright © 2004–2009, Texas Instruments Incorporated Product Folder Link(s): TS5V330 5 TS5V330 SCDS164D – MAY 2004 – REVISED JUNE 2009 .............................................................................................................................................................. www.ti.com Switching Characteristics over recommended operating free-air temperature range, VCC = 5 V ± 10%, RL = 75 Ω, CL = 20 pF (unless otherwise noted) (see Figure 5) PARAMETER FROM (INPUT) TO (OUTPUT) tON S tOFF S MIN TYP MAX UNIT D 2.5 6 ns D 1.1 6 ns Dynamic Characteristics over recommended operating free-air temperature range, VCC = 5 V ± 10% (unless otherwise noted) PARAMETER 6 MIN TYP (1) MAX UNIT RL = 150 Ω, f = 3.58 MHz, See Figure 6 0.64 % DP (2) RL = 150 Ω, f = 3.58 MHz, See Figure 6 0.1 Deg DG (1) (2) TEST CONDITIONS (2) BW RL = 150 Ω, See Figure 7 XTALK RL = 150 Ω, f = 10 MHz, RIN = 10 Ω, OIRR RL = 150 Ω, f = 10 MHz, See Figure 9 300 See Figure 8 MHz –63 dB –60 dB All typical values are at VCC = 5 V (unless otherwise noted), TA = 25°C. DG and DP are expressed in absolute magnitude. Submit Documentation Feedback Copyright © 2004–2009, Texas Instruments Incorporated Product Folder Link(s): TS5V330 TS5V330 www.ti.com .............................................................................................................................................................. SCDS164D – MAY 2004 – REVISED JUNE 2009 OPERATING CHARACTERISTICS 0 0 −1 −10 Phase −20 −3 −30 −4 −40 −5 Gain Phase − Deg Gain − dB −2 −50 −6 −7 1 −60 1000 10 100 Frequency − MHz Phase at −3-dB Frequency, 35 Degrees Gain −3 dB at 460 MHz Figure 1. Gain/Phase vs Frequency 0.08 0.0 0.07 Differential Phase −0.2 0.06 −0.3 0.05 −0.4 0.04 −0.5 0.03 −0.6 0.02 −0.7 Differential Gain −0.8 0.01 −0.9 0.00 Differential Phase − Deg Differential Gain − % −0.1 −0.01 −1.0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 VBIAS − V Differential Phase at 0.714, 0.056 Degrees Differential Gain at 0.714, −0.63% Figure 2. Differential Gain/Phase vs VBIAS Submit Documentation Feedback Copyright © 2004–2009, Texas Instruments Incorporated Product Folder Link(s): TS5V330 7 TS5V330 SCDS164D – MAY 2004 – REVISED JUNE 2009 .............................................................................................................................................................. www.ti.com OPERATING CHARACTERISTICS 0 160 −10 140 120 −30 100 Phase −40 80 −50 60 −60 Off Isolation −70 Phase − Deg Off Isolation − dB −20 40 20 −80 0 1000 −90 1 10 100 Frequency − MHz Phase at 10 MHz, 88.5 Degrees Off Isolation at 10 MHz, −60 dB Figure 3. Off Isolation vs Frequency 250 0 −10 200 −20 150 −40 −50 Phase 100 −60 Crosstalk −70 Phase − Deg Crosstalk − dB −30 50 −80 −90 1 10 0 1000 100 Frequency − Mhz Phase at 10 MHz, −90.4 Degrees Crosstalk at 10 MHz, −63.9 dB Figure 4. Crosstalk vs Frequency 8 Submit Documentation Feedback Copyright © 2004–2009, Texas Instruments Incorporated Product Folder Link(s): TS5V330 TS5V330 www.ti.com .............................................................................................................................................................. SCDS164D – MAY 2004 – REVISED JUNE 2009 PARAMETER MEASUREMENT INFORMATION VCC Input Generator VIN 50 Ω IN 50 Ω VG1 S1 DUT VS1 VO D S2 CL (see Note A) EN RL VS2 TEST VCC RL CL VS1 VS2 tON 5 V ± 0.5 V 5 V ± 0.5 V 75 75 20 20 GND 3V 3V GND tOFF 5 V ± 0.5 V 5 V ± 0.5 V 75 75 20 20 GND 3V 3V GND TEST CIRCUIT 3V Output Control (VIN) 50% 50% 0V tON Analog Output Waveform (VO) tOFF 90% 90% VOH 0V VOLTAGE WAVEFORMS tON AND tOFF TIMES NOTES: A. CL includes probe and jig capacitance. B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns. C. The outputs are measured one at a time, with one transition per measurement. Figure 5. Test Circuit and Voltage Waveforms Submit Documentation Feedback Copyright © 2004–2009, Texas Instruments Incorporated Product Folder Link(s): TS5V330 9 TS5V330 SCDS164D – MAY 2004 – REVISED JUNE 2009 .............................................................................................................................................................. www.ti.com PARAMETER MEASUREMENT INFORMATION EXT TRIGGER VBIAS BIAS Network Analyzer (HP8753ES) P1 P2 Sawtooth Waveform Generator VCC S1A DA RL = 150 Ω IN DUT VIN EN VEN NOTE A: For additional information on measurement method, refer to the TI application report, Measuring Differential Gain and Phase, literature number SLOA040. Figure 6. Test Circuit for Differential Gain/Phase Measurement Differential gain and phase are measured at the output of the ON channel. For example, when VIN = 0, VEN = 0, and DA is the input, the output is measured at S1A. HP8753ES Setup Average = 20 RBW = 300 Hz ST = 1.381 s P1 = –7 dBM CW frequency = 3.58 MHz Sawtooth Waveform Generator Setup VBIAS = 0 to 1 V Frequency = 0.905 Hz 10 Submit Documentation Feedback Copyright © 2004–2009, Texas Instruments Incorporated Product Folder Link(s): TS5V330 TS5V330 www.ti.com .............................................................................................................................................................. SCDS164D – MAY 2004 – REVISED JUNE 2009 PARAMETER MEASUREMENT INFORMATION EXT TRIGGER BIAS VBIAS Network Analyzer (HP8753ES) P1 P2 VCC DA S1A RL = 150 Ω IN DUT VIN EN VEN Figure 7. Test Circuit for Frequency Response (BW) Frequency response is measured at the output of the ON channel. For example, when VIN = 0, VEN = 0, and DA is the input, the output is measured at S1A. All unused analog I/O ports are left open. HP8753ES Setup Average = 4 RBW = 3 Hz VBIAS = 0.35 V ST = 2 s P1 = 0 dBM Submit Documentation Feedback Copyright © 2004–2009, Texas Instruments Incorporated Product Folder Link(s): TS5V330 11 TS5V330 SCDS164D – MAY 2004 – REVISED JUNE 2009 .............................................................................................................................................................. www.ti.com PARAMETER MEASUREMENT INFORMATION EXT TRIGGER BIAS VBIAS Network Analyzer (HP8753ES) P1 P2 VCC DA S1A RL = 150 Ω IN 50 Ω(1) VIN EN DUT VEN DB S1B RIN = 10 Ω RL = 150 Ω (1) A 50-Ω termination resistor is needed for the network analyzer. Figure 8. Test Circuit for Crosstalk (XTALK) Crosstalk is measured at the output of the nonadjacent ON channel. For example, when VIN = 0, VEN = 0, and DA is the input, the output is measured at S1B. All unused analog input (D) ports and output (S) ports are connected to GND through 10-Ω and 50-Ω pulldown resistors, respectively. HP8753ES Setup Average = 4 RBW = 3 kHz VBIAS = 0.35 V ST = 2 s P1 = 0 dBM 12 Submit Documentation Feedback Copyright © 2004–2009, Texas Instruments Incorporated Product Folder Link(s): TS5V330 TS5V330 www.ti.com .............................................................................................................................................................. SCDS164D – MAY 2004 – REVISED JUNE 2009 PARAMETER MEASUREMENT INFORMATION EXT TRIGGER BIAS VBIAS Network Analyzer (HP8753ES) P1 P2 VCC S1A DA RL = 150 Ω IN DUT VIN S2A EN RL = 150 Ω 50 Ω(1) VEN (1) A 50-Ω termination resistor is needed for the network analyzer. Figure 9. Test Circuit for Off Isolation (OIRR) Off isolation is measured at the output of the OFF channel. For example, when VIN = VCC, VEN = 0, and DA is the input, the output is measured at S1A. All unused analog input (D) ports are left open, and output (S) ports are connected to GND through 50-Ω pulldown resistors. HP8753ES Setup Average = 4 RBW = 3 kHz VBIAS = 0.35 V ST = 2 s P1 = 0 dBM Submit Documentation Feedback Copyright © 2004–2009, Texas Instruments Incorporated Product Folder Link(s): TS5V330 13 PACKAGE OPTION ADDENDUM www.ti.com 21-Dec-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TS5V330D ACTIVE SOIC D 16 TS5V330DBQR ACTIVE SSOP/ QSOP DBQ TS5V330DBQRE4 ACTIVE SSOP/ QSOP TS5V330DBQRG4 ACTIVE TS5V330DE4 40 Lead/Ball Finish MSL Peak Temp (3) Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR DBQ 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR SSOP/ QSOP DBQ 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS5V330DG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS5V330DR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS5V330DRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS5V330DRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS5V330PW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS5V330PWE4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS5V330PWG4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS5V330PWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS5V330PWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS5V330PWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS5V330RGYR ACTIVE VQFN RGY 16 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TS5V330RGYRG4 ACTIVE VQFN RGY 16 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 21-Dec-2009 retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 21-Dec-2009 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing TS5V330DR SOIC TS5V330PWR TS5V330RGYR SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 TSSOP PW 16 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1 VQFN RGY 16 3000 180.0 12.4 3.8 4.3 1.5 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 21-Dec-2009 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TS5V330DR SOIC D 16 2500 333.2 345.9 28.6 TS5V330PWR TSSOP PW 16 2000 346.0 346.0 29.0 TS5V330RGYR VQFN RGY 16 3000 190.5 212.7 31.8 Pack Materials-Page 2 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DLP® Products www.dlp.com Communications and Telecom www.ti.com/communications DSP dsp.ti.com Computers and Peripherals www.ti.com/computers Clocks and Timers www.ti.com/clocks Consumer Electronics www.ti.com/consumer-apps Interface interface.ti.com Energy www.ti.com/energy Logic logic.ti.com Industrial www.ti.com/industrial Power Mgmt power.ti.com Medical www.ti.com/medical Microcontrollers microcontroller.ti.com Security www.ti.com/security RFID www.ti-rfid.com Space, Avionics & Defense www.ti.com/space-avionics-defense RF/IF and ZigBee® Solutions www.ti.com/lprf Video and Imaging www.ti.com/video Wireless www.ti.com/wireless-apps Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2010, Texas Instruments Incorporated