SN65ELT22 www.ti.com............................................................................................................................................................................................ SLLS924 – DECEMBER 2008 5-V Dual TTL-to-Differential PECL Translator FEATURES 1 • • • • • 1.1-ns (max) Propagation Delay Operating Range: VCC = 4.2V to 5.7V with GND = 0 V < 50-ps (typ) Output-to-Output Skew Built-In Temperature Compensation Drop-In Compatible to the MC10ELT22, MC100ELT22 PIN ASSIGNMENT D or DGK PACKAGE (TOP VIEW) Q0 1 8 VCC Q0 2 7 D0 Q1 3 6 D1 Q1 4 5 GND APPLICATIONS • • Data and Clock Transmission Over Backplane Signaling Level Conversion for Clock or Data DESCRIPTION The SN65ELT22 is a dual TTL-to-differential PECL translator. It operates on +5-V supply and ground only. The output is undetermined when the inputs are left floating. The low output skew makes the device an ideal solution for clock or data signal translation. The SN65ELT22 is housed in an industry standard SOIC-8 package and is also available in an optional TSSOP-8 package. Table 1. Pin Descriptions PIN FUNCTION D0, D1 TTL inputs Q0, Q0, Q1, Q1 PECL outputs VCC Positive supply GND Ground ORDERING INFORMATION (1) (1) PART NUMBER PART MARKING PACKAGE LEAD FINISH SN65ELT22D SN65ELT22 SOIC NiPdAu SN65ELT22DGK SN65ELT22 SOIC-TSSOP NiPdAu Leaded device options are not initially available; contact a sales representative for further details 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2008, Texas Instruments Incorporated SN65ELT22 SLLS924 – DECEMBER 2008............................................................................................................................................................................................ www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ABSOLUTE MAXIMUM RATINGS (1) VALUE UNIT Absolute PECL mode supply voltage, VCC PARAMETER GND = 0 V CONDITIONS 6 V Input voltage, VIN GND = 0 V GND + 0.025 < VIN < VCC – 0.025 V Output current Continuous 50 Surge 100 mA Operating temperature range –40 to 85 °C Storage temperature range –65 to 150 °C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. POWER DISSIPATION RATINGS PACKAGE CIRCUIT BOARD MODEL POWER RATING TA < 25°C (mW) THERMAL RESISTANCE, JUNCTION-TO-AMBIENT NO AIRFLOW DERATING FACTOR TA > 25°C (mW/°C) POWER RATING TA = 85°C (mW) Low-K 719 139 7 288 High-K 840 119 8 336 Low-K 469 213 5 188 High-K 527 189 5 211 SOIC SOIC-TSSOP THERMAL CHARACTERISTICS PARAMETER θJB Junction-to-board thermal resistance θJC Junction-to-case thermal resistance SOIC SOIC-TSSOP MIN TYP MAX 79 120 SOIC 98 SOIC-TSSOP 74 UNIT °C/W °C/W KEY ATTRIBUTES CHARACTERISTICS VALUE Moisture sensitivity level Level 1 Flammability rating (oxygen index: 28 to 34) UL 94 V-0 at 0.125 in Human body model Electrostatic discharge Charge device model Machine model 4 kV 2 kV 200 V Meets or exceeds JEDEC Spec EIA/JESD78 latchup test 2 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): SN65ELT22 SN65ELT22 www.ti.com............................................................................................................................................................................................ SLLS924 – DECEMBER 2008 PECL DC CHARACTERISTICS At VCC = 5.0 V, GND = 0.0 V (unless otherwise noted) (1) (2) PARAMETER ICC High-level output voltage See VOL Low-level output voltage See (3) TA = 25°C TYP MAX 17.3 VOH (2) (3) MIN Power supply current (3) (1) TA = –40°C TEST CONDITIONS MIN 20 TA = 85°C TYP MAX 18.2 MIN 20 TYP MAX 19.4 UNIT 22 mA 3915 3954 4120 3915 3958 4120 3915 3961 4120 mV 3170 3236 3380 3170 3231 3380 3170 3229 3380 mV The device meets the specifications after thermal balance has been established when mounted in a socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are assured only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. Input and output parameters vary 1:1 with VCC. VCC can vary +0.7 V /–0.8 V. Outputs are terminated through a 50-Ω resistor to VCC – 2.0 V. TTL DC CHARACTERISTICS At VCC = 4.2 V to 5.7 V, TA = –40°C to 85°C (unless otherwise noted) (1) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT IIH High-level input current VIN = 2.7 V, VIN = (VCC – 0.025) V 20 µA IIHH High-level input current VIN = VCC 20 µA IIL Low-level input current VIN = 0.5 V, VIN = (GND + 0.025) V –200 µA VIK Input clamp diode voltage IIN = –18 mA –1.2 V VIH High-level input voltage 2.0 Vcc– 0.025 V VIL Low-level input voltage GND + 0.025 0.8 V (1) The device meets the specifications after thermal balance has been established when mounted in a socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are assured only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously AC CHARACTERISTICS At VCC = 4.2 V to 5.7 V, GND = 0.0 V (unless otherwise noted) (1) PARAMETER fMAX tPLH tPHL tSKEW 1.5 V to 50% Within device skew See (3) Device-to-device skew See tr/tf Output rise/fall times TYP TA = 25°C MAX MIN 500 Propagation delay time Random clock jitter (RMS) (2) (3) (4) TA = –40°C MIN Max switching frequency (2), see Figure 5 tJITTER (1) TEST CONDITIONS 0.6 0.83 0.5 (4) 0.7 MIN 490 1.1 0.6 0.9 0.5 0.84 TYP MAX 470 1.1 0.6 0.9 0.5 0.85 1.1 0.9 90 25 90 25 90 25 100 25 100 25 100 1.1 0.5 0.7 1.1 0.7 UNIT MHz 25 0.5 Q (20%–80%) TA = 85°C TYP MAX ns ps 0.5 ps 1.1 ns The device meets the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are assured only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. Maximum switching frequency measured at output amplitude of 300 mVpp. Measured between outputs under the identical transitions and conditions on any one device. Device-to-device skew for identical transitions at identical VCC levels. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): SN65ELT22 3 SN65ELT22 SLLS924 – DECEMBER 2008............................................................................................................................................................................................ www.ti.com Typical Termination for Output Driver ZO = 50 W P P Driver Receiver N N ZO = 50 W 50 W 50 W VTT VTT = VCC - 2 V Figure 1. Typical Termination for Driver 1.5 V 1.5 V IN OUT OUT tPLH tPHL Figure 2. Output Propagation Delay 80% 20% tr tf Figure 3. Output Rise and Fall Times 4 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): SN65ELT22 SN65ELT22 www.ti.com............................................................................................................................................................................................ SLLS924 – DECEMBER 2008 1.5V 1.5V IN QO QO tPLH0 tPHL0 Q1 Q1 tPLH1 tPHL1 Device Skew = Higher [(tPLH1 - tPLH0), (tPLH1 - tPLH0)] Figure 4. Device Skew 1000 VCC = 4.2 V GND = 0 V Vswing = 0.8 V–2 V 900 Output Amplitude – mV 800 TA = 85°C 700 600 TA = 25°C 500 400 300 TA = –40°C 200 100 0 0 100 200 300 400 f – Frequency – MHz 500 600 Figure 5. Output Amplitude vs. Frequency Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): SN65ELT22 5 PACKAGE OPTION ADDENDUM www.ti.com 2-Jan-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN65ELT22D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65ELT22DGK ACTIVE MSOP DGK 8 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65ELT22DGKR ACTIVE MSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65ELT22DR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 31-Dec-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN65ELT22DGKR MSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 SN65ELT22DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 31-Dec-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN65ELT22DGKR MSOP DGK 8 2500 346.0 346.0 29.0 SN65ELT22DR SOIC D 8 2500 346.0 346.0 29.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Amplifiers Data Converters DLP® Products DSP Clocks and Timers Interface Logic Power Mgmt Microcontrollers RFID RF/IF and ZigBee® Solutions amplifier.ti.com dataconverter.ti.com www.dlp.com dsp.ti.com www.ti.com/clocks interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti-rfid.com www.ti.com/lprf Applications Audio Automotive Broadband Digital Control Medical Military Optical Networking Security Telephony Video & Imaging Wireless www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/medical www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2009, Texas Instruments Incorporated