TS3USB31E www.ti.com SCDS256 – OCTOBER 2009 HIGH-SPEED USB 2.0 (480-Mbps) 1-PORT SWITCH WITH SINGLE ENABLE AND ESD PROTECTION Check for Samples: TS3USB31E FEATURES 1 N.C. HSD– D– 8 2 HSD+ GND 3 D+ 1 OE 4 D+ 1 2 3 8 4 GND Routes Signals for USB 1.0, 1.1, and 2.0 DESCRIPTION/ORDERING INFORMATION 7 6 5 D– • 5 RSE PACKAGE (BOTTOM VIEW) VCC APPLICATIONS 6 HSD+ • • VCC 7 HSD– • RSE PACKAGE (TOP VIEW) OE • • • • • VCC Operation 2.25 V to 4.3 V 1.8-V Compatible Control-Pin Inputs IOFF Supports Partial Power-Down Mode Operation ron = 10 Ω Maximum Δron <0.35 Ω Typical Cio(ON) = 6 pF Typical Low Power Consumption (1 μA Maximum) ESD Performance Tested Per JESD 22 – 8000-V Human-Body Model (A114-B, Class II) – 1000-V Charged-Device Model (C101) – 250-V Machine Model (A115-A) ESD Performance COM Port to GND – 15000-V Human-Body Model (A114-B, Class II) Wide –3-dB Bandwidth = 1100 MHz Typical Packaged in 8-Pin TQFN (1.5 mm × 1.5 mm) N.C. • • • The TS3USB31E is a high-bandwidth switch specially designed for the switching of high-speed USB 2.0 signals in handset and consumer applications, such N.C. - No internal connection as cell phones, digital cameras, and notebooks with hubs or controllers with limited USB I/Os. The wide bandwidth (1100 MHz) of this switch allows signals to pass with minimum edge and phase distortion. The switch is bidirectional and offers little or no attenuation of the high-speed signals at the outputs. It is designed for low bit-to-bit skew and high channel-to-channel noise isolation, and is compatible with various standards, such as high-speed USB 2.0 (480 Mbps). Table 1. ORDERING INFORMATION TA –40°C to 85°C (1) (2) PACKAGE QFN – RSE (1) (2) Tape and reel ORDERABLE PART NUMBER TS3USB31ERSER TOP-SIDE MARKING LJ Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2009, Texas Instruments Incorporated TS3USB31E SCDS256 – OCTOBER 2009 www.ti.com PIN DESCRIPTION NAME DESCRIPTION OE Bus-switch enable D+, D–, HSD+, HSD– Data ports NC No connect TRUTH TABLE OE FUNCTION H Disconnect L D+, D– = HSD+, HSD– BLOCK DIAGRAM HSD1+ D+ HSD1– D– OE Control ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) VCC VIN Supply voltage range Control input voltage range (2) (3) (3) (4) MIN MAX –0.5 7 V –0.5 7 V HSD+, HSD– –0.5 VCC + 0.3 D+, D– when VCC > 0 –0.5 VCC + 0.3 UNIT VI/O Switch I/O voltage range (2) D+, D– when VCC = 0 5.25 IIK Control input clamp current VIN < 0 –50 mA II/OK I/O port clamp current VI/O < 0 –50 mA II/O ON-state switch current (5) ±64 mA ±100 mA 150 °C Continuous current through VCC or GND Tstg (1) (2) (3) (4) (5) 2 Storage temperature range –65 V Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to ground, unless otherwise specified. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. VI and VO are used to denote specific conditions for VI/O. II and IO are used to denote specific conditions for II/O. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TS3USB31E TS3USB31E www.ti.com SCDS256 – OCTOBER 2009 PACKAGE THERMAL IMPEDANCE Package thermal impedance (1) θJA (1) TYP UNIT 253 °C/W MIN MAX UNIT 2.25 4.3 RSE package The package thermal impedance is calculated in accordance with JESD 51-7. RECOMMENDED OPERATING CONDITIONS (1) VCC Supply voltage VIH High-level control input voltage VIL Low-level control input voltage VI/O Data input/output voltage TA Operating free-air temperature (1) VCC = 2.3 V to 2.7 V 0.9 VCC = 3 V to 3.6 V 1.3 VCC = 4.3 V 1.7 V V VCC = 2.3 V to 2.7 V 0.4 VCC = 3 V to 3.6 V 0.5 VCC = 4.3 V 0.7 V 0 VCC V –40 85 °C All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. ELECTRICAL CHARACTERISTICS (1) over operating free-air temperature range (unless otherwise noted) PARAMETER VIK IIN IOZ Control inputs (3) IOFF D+ and D– ICC ΔICC (4) Cin Cio(OFF) Cio(ON) ron (5) Δron ron(flat) (1) (2) (3) (4) (5) TEST CONDITIONS UNIT –1.2 V VIN = 0 to 4.3 V ±1 μA VO = 0 to 3.6 V, Switch OFF ±1 μA VCC = 0 V, VI = 0, VO = 0 to 4.3 V, VIN = VCC or GND ±2 μA 1 μA 10 μA II = –18 mA VCC = 4.3 V, 0 V, VCC = 4.3 V, VI = 0, TYP (2) MAX VCC = 3 V, MIN VCC = 4.3 V, II/O = 0, Control inputs VCC = 4.3 V, VIN = 2.6 V Switch ON or OFF Control inputs VCC = 0 V, VIN = VCC or GND 1 VCC = 2.5 V, VI/O = 2.5 V or 0, 2 VCC = 3.3 V, VI/O = 3.3 V or 0, VCC = 2.5 V, VI/O = 2.5 V or 0, VCC = 3.3 V, VI/O = 3.3 V or 0, VCC = 2.5 V, VI = 0.4, VCC = 3 V, VI = 0.4, VCC = 2.5 V, VI = 0.4, VCC = 3 V, VI = 0.4, VCC = 2.5 V, VI = 0 V or 1 V, VCC = 3 V, VI = 0 V or 1 V, Switch OFF Switch ON IO = –8 mA IO = –8 mA IO = –8 mA pF pF 2 6 pF 6 7.5 9 6.5 10 0.4 0.35 0.07 2 Ω Ω Ω VIN and IIN refer to control inputs. VI, VO, II, and IO refer to data pins. All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C. For I/O ports, the parameter IOZ includes the input leakage current. This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND. Measured by the voltage drop between the A and B terminals at the indicated current through the switch. ON-state resistance is determined by the lower of the voltages of the two (A or B) terminals. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TS3USB31E 3 TS3USB31E SCDS256 – OCTOBER 2009 www.ti.com DYNAMIC ELECTRICAL CHARACTERISTICS over operating range, TA = –40°C to 85°C, VCC = 2.5 V ± 10%, GND = 0 V PARAMETER TEST CONDITIONS XTALK Crosstalk RL = 50 Ω, f = 240 MHz, See Figure 9 OISO OFF isolation RL = 50 Ω, f = 240 MHz, See Figure 8 BW Bandwidth (–3 dB) RL = 50 Ω, CL = 5 pF, See Figure 10 (1) TYP (1) UNIT -53 dB -30 dB 1100 MHz For Max or Min conditions, use the appropriate value specified under Electrical Characteristics for the applicable device type. DYNAMIC ELECTRICAL CHARACTERISTICS over operating range, TA = –40°C to 85°C, VCC = 3.3 V ± 10%, GND = 0 V PARAMETER TEST CONDITIONS TYP (1) UNIT XTALK Crosstalk RL = 50 Ω, f = 240 MHz, See Figure 9 OIRR OFF isolation RL = 50 Ω, f = 240 MHz, See Figure 8 –30 dB BW Bandwidth (–3 dB) RL = 50 Ω, CL = 5 pF, See Figure 10 1100 MHz (1) –53 dB For Max or Min conditions, use the appropriate value specified under Electrical Characteristics for the applicable device type. SWITCHING CHARACTERISTICS over operating range, TA = –40°C to 85°C, VCC = 2.5 V ± 10%, GND = 0 V PARAMETER TEST CONDITIONS MIN RL = 50 Ω, CL = 5 pF, See Figure 11 (1) MAX UNIT tpd Propagation delay (2) tON Line enable time, OE to D, nD RL = 50 Ω, CL = 5 pF, See Figure 7 30 ns tOFF Line disable time, OE to D, nD RL = 50 Ω, CL = 5 pF, See Figure 7 25 ns tSK(O) Output skew between center port to any other port (2) RL = 50 Ω, CL = 5 pF, See Figure 12 50 ps tSK(P) Skew between opposite transitions of the same output (tPHL – tPLH) (2) RL = 50 Ω, CL = 5 pF, See Figure 12 20 ps tJ Total jitter (2) RL = 50 Ω, CL = 5 pF, tR = tF = 500 ps at 480 Mbps 200 ps (1) (2) (3) 4 (3) TYP 0.25 ns For Max or Min conditions, use the appropriate value specified under Electrical Characteristics for the applicable device type. Specified by design The bus switch contributes no propagational delay other than the RC delay of the on resistance of the switch and the load capacitance. The time constant for the switch alone is of the order of 0.25 ns for 10-pF load. Since this time constant is much smaller than the rise/fall times of typical driving signals, it adds very little propagational delay to the system. Propagational delay of the bus switch, when used in a system, is determined by the driving circuit on the driving side of the switch and its interactions with the load on the driven side. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TS3USB31E TS3USB31E www.ti.com SCDS256 – OCTOBER 2009 SWITCHING CHARACTERISTICS over operating range, TA = –40°C to 85°C, VCC = 3.3 V ± 10%, GND = 0 V PARAMETER TEST CONDITIONS RL = 50 Ω, CL = 5 pF, See Figure 11 TYP (1) MAX UNIT tpd Propagation delay (2) tON Line enable time, OE to D, nD RL = 50 Ω, CL = 5 pF, See Figure 7 30 ns tOFF Line disable time, OE to D, nD RL = 50 Ω, CL = 5 pF, See Figure 7 25 ns tSK(O) Output skew between center port to any other port (2) RL = 50 Ω, CL = 5 pF, See Figure 12 50 ps tSK(P) Skew between opposite transitions of the same output (tPHL – tPLH) (2) RL = 50 Ω, CL = 5 pF, See Figure 12 20 ps tJ Total jitter (2) RL = 50 Ω, CL = 5 pF, tR = tF = 500 ps at 480 Mbps (PRBS = 215 – 1) 200 ps (1) (2) (3) (3) MIN 0.25 ns For Max or Min conditions, use the appropriate value specified under Electrical Characteristics for the applicable device type. Specified by design The bus switch contributes no propagational delay other than the RC delay of the on resistance of the switch and the load capacitance. The time constant for the switch alone is of the order of 0.25 ns for 10-pF load. Since this time constant is much smaller than the rise/fall times of typical driving signals, it adds very little propagational delay to the system. Propagational delay of the bus switch, when used in a system, is determined by the driving circuit on the driving side of the switch and its interactions with the load on the driven side. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TS3USB31E 5 TS3USB31E SCDS256 – OCTOBER 2009 www.ti.com APPLICATION INFORMATION 0 -1 -2 Magnitude (dB) -3 -4 -5 -6 -7 -8 -9 1.00E+6 10.00E+6 100.00E+6 1.00E+9 10.00E+9 Frequency (Hz) Figure 1. Insertion Loss -13 -23 Magnitude (dB) -33 -43 -53 -63 -73 -83 -93 -103 1.00E+6 10.00E+6 100.00E+6 1.00E+9 10.00E+9 Frequency (Hz) Figure 2. OFF Isolation 6 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TS3USB31E TS3USB31E www.ti.com SCDS256 – OCTOBER 2009 0 -20 Magnitude (dB) -40 -60 -80 -100 -120 1.00E+6 10.00E+6 100.00E+6 1.00E+9 10.00E+9 Frequency (Hz) Figure 3. Crosstalk VCC TS3USB31E USB Connector Base Band Processor or FS USB Controller HS USB Controller Figure 4. Application Diagram Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TS3USB31E 7 TS3USB31E SCDS256 – OCTOBER 2009 www.ti.com 0.5 0.4 Differential Signal (V) 0.3 0.2 0.1 0.0 –0.1 –0.2 –0.3 –0.4 –0.5 0.0 0.2 0.4 0.5 0.8 1.0 1.2 1.4 1.6 1.8 2.0 –9 Time (X 10 ) (s) Figure 5. Eye Pattern: 480-Mbps USB Signal With No Switch (Through Path) 0.5 0.4 Differential Signal (V) 0.3 0.2 0.1 0.0 –0.1 –0.2 –0.3 –0.4 –0.5 0.0 0.2 0.4 0.5 0.8 1.0 1.2 1.4 1.6 1.8 2.0 –9 Time (X 10 ) (s) Figure 6. Eye Pattern: 480-Mbps USB Signal With Switch NO Path 8 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TS3USB31E TS3USB31E www.ti.com SCDS256 – OCTOBER 2009 PARAMETER MEASUREMENT INFORMATION VCC 1D or 2D VOUT1 VIN TEST RL CL VIN tON 50 Ω 5 pF VCC tOFF 50 Ω 5 pF VCC D 1D or 2D VOUT2 CL(2) RL S OE VSEL(1) GND (2) 50% 50% 0 tON VOE(1) (1) 1.8 V Logic RL Input (VSEL or V OE) CL(2) tOFF Switch Output (VOUT1 or V OUT2) 90% 90% VOH VOL All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z O = 50 Ω, t r < 5 ns, tf < 5 ns. CL includes probe and jig capacitance. Figure 7. Turn-On (tON) and Turn-Off Time (tOFF) VCC Network Analyzer Channel OFF: 1D to D 50 W VOUT1 1D VSEL = VCC D Source Signal 50 W VIN 2D Network Analyzer Setup Source Power = 0 dBm (632-mV P-P at 50-W load) VSEL S 50 W + GND DC Bias = 350 mV Figure 8. OFF Isolation (OIRR) Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TS3USB31E 9 TS3USB31E SCDS256 – OCTOBER 2009 www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) VCC Network Analyzer Channel ON: 1D to D 50 W VOUT1 1D Channel OFF: 2D to D VIN Source Signal VSEL = VCC VOUT2 2D 50 W Network Analyzer Setup 50 W VSEL S + Source Power = 0 dBm (632-mV P-P at 50-W load) GND DC Bias = 350 mV Figure 9. Crosstalk (XTALK) VCC Network Analyzer 50 W VOUT1 1D Channel ON: 1D to D D Source Signal VIN VCTRL = GND 2D Network Analyzer Setup 50 W VSEL Source Power = 0 dBm (632-mV P-P at 50-W load) S GND GND DC Bias = 350 mV Figure 10. Bandwidth (BW) 400 mV Figure 11. Propagation Delay 10 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TS3USB31E TS3USB31E www.ti.com SCDS256 – OCTOBER 2009 PARAMETER MEASUREMENT INFORMATION (continued) VOH VOL Pulse Skew tSK(P) VOH VOL VOH VOL Output Skew tSK(P) Figure 12. Skew Test Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TS3USB31E 11 TS3USB31E SCDS256 – OCTOBER 2009 www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) VCC VOUT1 1D D + VIN Channel ON VOUT2 2D r on + VSEL IIN S VIN * VOUT2 or VOUT1 W IIN VSEL = VIH or VIL + GND Figure 13. ON-State Resistance (ron) VCC VOUT1 1D VIN D + VOUT2 2D VSEL + S OFF-State Leakage Current Channel OFF VSEL = VIH or VIL + GND Figure 14. OFF-State Leakage Current VCC VOUT1 1D Capacitance Meter VBIAS = VCC or GND VOUT2 2D VSEL = VCC or GND VIN D VBIAS Capacitance is measured at 1D, 2D, D, and S inputs during ON and OFF conditions. VSEL S GND Figure 15. Capacitance 12 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TS3USB31E PACKAGE OPTION ADDENDUM www.ti.com 8-Dec-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing TS3USB31ERSER ACTIVE UQFN RSE Pins Package Eco Plan (2) Qty 8 3000 Green (RoHS & no Sb/Br) Lead/Ball Finish CU NIPDAU MSL Peak Temp (3) Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 20-Jul-2010 TAPE AND REEL INFORMATION *All dimensions are nominal Device TS3USB31ERSER Package Package Pins Type Drawing UQFN RSE 8 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 3000 180.0 8.4 Pack Materials-Page 1 1.6 B0 (mm) K0 (mm) P1 (mm) 1.6 0.66 4.0 W Pin1 (mm) Quadrant 8.0 Q2 PACKAGE MATERIALS INFORMATION www.ti.com 20-Jul-2010 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TS3USB31ERSER UQFN RSE 8 3000 202.0 201.0 28.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DLP® Products www.dlp.com Communications and Telecom www.ti.com/communications DSP dsp.ti.com Computers and Peripherals www.ti.com/computers Clocks and Timers www.ti.com/clocks Consumer Electronics www.ti.com/consumer-apps Interface interface.ti.com Energy www.ti.com/energy Logic logic.ti.com Industrial www.ti.com/industrial Power Mgmt power.ti.com Medical www.ti.com/medical Microcontrollers microcontroller.ti.com Security www.ti.com/security RFID www.ti-rfid.com Space, Avionics & Defense www.ti.com/space-avionics-defense RF/IF and ZigBee® Solutions www.ti.com/lprf Video and Imaging www.ti.com/video Wireless www.ti.com/wireless-apps Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2010, Texas Instruments Incorporated