TI TS3USBA225RUTR

TS3USBA225
SCDS328 – OCTOBER 2011
www.ti.com
USB 2.0 High-Speed (480 Mbps) and Audio Switches with Negative Signal Capability and
1.8-V Logic Compatibility and Power-Down Mode
Check for Samples: TS3USBA225
FEATURES
•
1
•
•
•
•
•
•
•
2.7V to 4.3V operating power supply (VCC)
High-Speed USB (480Mbps) Switch:
– VI/O accepts signals up to 4.3V
(Independent of VCC)
– 6.5 Ω RDSON Typical
– 3 pF CON Typical
– 1.9GHz Bandwidth (-3 dB)
Audio Switch:
– 2.5 Ω RDSON Typical
– Negative Rail Capability
– Low THD: <0.05%
– Internal Shunt Resistors for Click-and-Pop
Reduction
1.8-V Compatible Control Input (SEL1 and
SEL2) Threshold
Minimized Current Consumption (~5uA) in
Power-Down Mode
Power-Off Protection: All I/O Pins are High-Z
when VCC= 0V
12-Pin QFN Package (2×1.7 mm, 0.4mm pitch)
ESD Performance Tested Per JESD 22
– 2000-V Human-Body Model
(A114-B, Class II)
– 1000-V Charged-Device Model (C101)
APPLICATIONS
•
•
•
•
•
•
Cell phones and Smartphones
Tablet PCs
Portable Instrumentation
Digital Still Cameras
Portable Navigation Devices (GPS)
USB 2.0, MIPI (CSI/DSI), LVDS switching
D0+
USB 2.0
D0+
D+/R
D-/L D1+
D1-
R
L
USB
Connector
USB 2.0
D0-
D0-
D+/R
USB 2.0
(Client or
OTG)
Negative
Audio
SEL1, SEL2
D-/L D1+
D1-
R
USB
Connector
L
UART
Negative
Audio
SEL1, SEL2
USB + AUDIO
USB + UART + AUDIO
DESCRIPTION
The TS3USBA225 is a double-pole, triple throw (DP3T) multiplexer that includes a low-distortion audio switch,
and two USB 2.0 High-Speed (480Mbps) switches in the same package. This configuration allows the system
designer to use a common connector for audio, and USB data. The audio switch is designed to allow audio
signals to swing negatively which makes this common connector configuration possible.
The TS3USBA225 has a VCC range of 2.7V to 4.3V with the capability to pass true-ground audio signals down
to Vcc-4.3V. The device also supports a power-down mode that can be enabled when both SEL controls are low
to minimize current consumption when no signal is transmitting. The TS3USBA225 also features internal shunt
resistors on the audio path to reduce clicks and pops that may be heard when the audio switches are selected.
ORDERING INFORMATION
TA
–40°C to 85°C
(1)
(2)
PACKAGE (1)
(2)
QFN 0.4-mm pitch – RUT (Pb-Free)
Tape and reel
ORDERABLE PART
NUMBER
TOP-SIDE MARKING
TS3USBA225RUTR
LQR
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2011, Texas Instruments Incorporated
TS3USBA225
SCDS328 – OCTOBER 2011
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
SWITCH BLOCK DIAGRAM
D0+
D1+
R
D+/R
Rshunt
D0D1L
D-/L
R shunt
VCC
Charge
Pump
SEL1
Control
Logic
Rpd2
Rpd1
SEL2
TYPICAL APPLICATION BLOCK DIAGRAM
D0+
USB 2.0
D0+
D+/R
D-/L D1+
D1-
R
L
USB
Connector
SEL1, SEL2
USB + AUDIO
2
USB 2.0
D0-
D0-
D+/R
USB 2.0
(Client or
OTG)
Negative
Audio
D-/L D1+
D1-
R
L
USB
Connector
UART
Negative
Audio
SEL1, SEL2
USB + UART + AUDIO
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Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): TS3USBA225
TS3USBA225
SCDS328 – OCTOBER 2011
www.ti.com
PIN CONFIGURATION
QFN PACKAGE
(TOP VIEW)
R
12
11
SEL1
2
10
D+/R
VCC
3
9
GND
D1-
4
8
D-/L
D0-
5
7
SEL2
D0+
1
D1+
6
L
12-Pin QFN Package (2x1.7 mm, 0.4mm pitch)
Space
Space
Space
PIN DESCRIPTION TABLE
PIN
NUMBER NAME
DESCRIPTION
TYPE
1
D0+
I/O
USB/UART Data 1 (Differential +)
2
D1+
I/O
USB/UART Data 2 (Differential +)
3
VCC
Power
4
D1–
I/O
USB/UART Data 2 (Differential –)
5
D0–
I/O
USB/UART Data 1 (Differential –)
6
L
I/O
Left Channel Audio
7
SEL2
8
D–/L
9
GND
10
D+/R
I/O
11
SEL1
Input
12
R
Input
I/O
Power supply
Control Input Select Line 2. The default state for SEL2 is LOW.
USB/UART/Audio Common Connector
Ground Ground
I/O
USB/UART/Audio Common Connector
Control Input Select Line 1. The default state for SEL1 is LOW.
Right Channel Audio
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Product Folder Link(s): TS3USBA225
3
TS3USBA225
SCDS328 – OCTOBER 2011
www.ti.com
FUNCTION TABLE
SEL1
SEL2
X
L
L
(1)
VCC
L,R
D0+, D0-
D1+, D1-
Mode
X
L
OFF
OFF
OFF
Hi-Z Mode
L
H
OFF
OFF
OFF
Power-Down Mode
H
H
OFF (1)
ON
OFF
USB Mode 1
H
L
H
ON
OFF
OFF
Audio Mode
H
H
H
OFF (1)
OFF
ON
USB Mode 2
100Ω shunt resistors are enabled in this state.
SUMMARY OF TYPICAL CHARACTERISTICS
USB PATH
Number of switches
AUDIO PATH
4
2
ON-state resistance (ron)
6.5 Ω
2.5 Ω
ON-state resistance match (Δron)
0.1 Ω
0.1 Ω
ON-state resistance flatness (ron(flat))
2Ω
1.5 Ω
ON-state capacitance (CI/O,on)
3 pF
3.5 pF
1.9 GHz
1.2 GHz
N/A
0.05%
Bandwidth (BW)
Total harmonic distortion (THD)
AUDIO PATH SIGNAL SWING
SUPPLY VOLTAGE,
VCC
4
MINIMUM
VD+/R, D-/L, L, R = VCC- 4.3 V
MAXIMUM
VD+/R, D-/L, L, R = VCC
4.3
0
4.3 V
3.3
–1.0 V
3.3 V
3.0
–1.3 V
3.0 V
2.7
–1.8 V
2.7 V
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Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): TS3USBA225
TS3USBA225
SCDS328 – OCTOBER 2011
www.ti.com
ABSOLUTE MAXIMUM RATINGS (1) (2)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC
Supply voltage range
(3)
–0.3
4.6
V
VD0+,
VD0-,
VD1+,
VD1-
High speed differential signal voltage range (3)
–0.3
4.6
V
VR, VL
Audio signal voltage range
VCC –
4.6
VCC
V
IK
Analog port diode current
VI
Digital input voltage range (SEL1, SEL2)
–0.3
IIK
Digital logic input clamp current (3) VI < 0
–50
ICC
Continuous current through VCC
IGND
Continuous current through GND
Tstg
Storage temperature range
(1)
(2)
(3)
VI/O+
,VI/O-
<0
–50
mA
4.6
V
100
mA
–100
–65
UNIT
mA
150
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.
All voltages are with respect to ground, unless otherwise specified.
RECOMMENDED OPERATING CONDITIONS
VCC
Supply voltage range
VD0+,
VD0-,
VD1+,
VD1-
High speed differential signal voltage range
VR, VL
Audio signal voltage range
IK
Analog port diode current
VI
Digital input voltage range (SEL1, SEL2)
TA
Operating free-air temperature
VI/O+
,VI/O-
<0
MIN
MAX
2.7
4.3
V
0
4.3
V
VCC – 4.3
VCC
V
–50
mA
0
4.3
V
–40
85
°C
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Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): TS3USBA225
UNIT
5
TS3USBA225
SCDS328 – OCTOBER 2011
www.ti.com
ELECTRICAL CHARACTERISTICS
TA = –40°C to 85°C, typical values are at VCC = 3.3 V, TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP MAX
UNIT
USB SWITCH
ON-state resistance
VCC = 3.0 V
VI/O+,I/O- = 0.4 V, ION = 15 mA
6.5
Δron
ON-state resistance match
between channels
VCC = 3.0 V
VI/O+,I/O- = 1.7 V, ION = 15 mA
0.1
Ω
ron (flat)
ON-state resistance flatness
VCC = 3.0 V
VI/O+,I/O- = 0 to 1.7 V, ION = 15 mA
0.5
Ω
VCC = 3.6 V
Switch OFF , VI/O+,I/O- = 0 to 3.6 V, 1789553
VD+/R, D-/L = 0 V
IOZ
OFF leakage current
7.5
Ω
ron
1
µA
3.5
Ω
AUDIO SWITCH
ron
ON-state resistance
VCC = 3.0 V
SEL1=High, SEL2=Low,
VL/R = -2V, 0V, 0.7V,
ION = -26 mA
2.5
Δron
ON-state resistance match
between channels
VCC = 3.0 V
SEL1=High, SEL2=Low,
VL/R = 0.7V, ION = -26 mA
0.1
Ω
ron (flat)
ON-state resistance flatness
VCC = 3.0 V
SEL1=High, SEL2=Low,
VL/R = -2V, 0V, 0.7V, ION = -26 mA
0.1
Ω
rSHUNT
Shunt resistance
Switch OFF, VL/R = 0.7V,
ISHUNT = 10 mA
100
VCC = 2.7 V to 4.3
V
200
Ω
DIGITAL CONTROL INPUTS (SEL1, SEL2)
VIH
Input logic high
VCC = 2.7 V to 4.3
V
VIL
Input logic low
VCC = 2.7 V to 4.3
V
IIN
Input leakage current
VCC = 2.7 V to 4.3
V
rPD1,
rPD2
Internal pulldown resistance
VCC = 2.7 V to 4.3
V
6
1.3
V
0.4
±3
VIN = 4.3V
±0.1
VIN = 0V
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3
V
μA
MΩ
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): TS3USBA225
TS3USBA225
SCDS328 – OCTOBER 2011
www.ti.com
DYNAMIC CHARACTERISTICS
TA = –40°C to 85°C, typical values are at VCC = 3.3 V, TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP MAX
UNIT
USB SWITCH
tpd
Propagation Delay
VCC = 2.7V or 3.3V
tON
Turn-on time
RL = 50Ω, CL = 35pF
VCC = 2.7V
0.25
60
ns
ns
tOFF
Turn-off time
RL = 50Ω, CL = 35pF
VCC = 2.7V
20
ns
tSK(O)
Channel-to-channel skew
VCC = 2.7V or 3.3V
15
ps
tSK(P)
Skew of opposite transitions
of same output
VCC = 2.7V or 3.3V
15
ps
CI/O+(OFF)
CI/O-(OFF)
OFF capacitance
VCC = 2.7V or 3.3V,
VD0+/D0- =0 or 3.3V
Switch OFF
1
pF
CI/O+(ON)
CI/O-(ON)
ON capacitance
VCC =2.7V or 3.3V,
VD0+/D0- = 0 or 3.3V
Switch ON
3
pF
CI
Digital input capacitance
VCC =2.7V or 3.3V, VI = 0 or 3.3V 2.5
BW
Bandwidth
VCC =2.7V or 3.3V, RL = 50Ω
Switch ON
1.9
GHz
OISO
OFF Isolation
VCC =2.7V or 3.3V, RL = 50Ω,
f = 240 MHz
Switch OFF
-35
dB
XTALK
Crosstalk
VCC =2.5V or 3.3V, RL = 50Ω,
f = 240 MHz
Switch ON
-45
dB
pF
AUDIO SWITCH
tON
Turn-on time
RL = 50Ω, CL = 35pF
VCC = 2.7V
40
µs
tOFF
Turn-off time
RL = 50Ω, CL = 35pF
VCC = 2.7V
15
ns
CL(OFF),
CR(OFF)
L , R OFF capacitance
VCC = 2.7V to 4.3V, f = 20 kHz
Switch OFF
1.0
pF
CL(ON),
CR(ON)
L, R ON capacitance
VCC = 2.7V to 4.3V, f = 20 kHz
Switch ON
3.5
pF
OISO
OFF Isolation
VCC = 3.3V, RL = 50Ω, f = 20 kHz
Switch OFF
-85
dB
XTALK
Crosstalk
VCC = 3.3V, RL = 50Ω, f = 20 kHz
Switch ON
-95
dB
Total harmonic distortion
VCC = 3.3V, SEL1=High, SEL2=Low,
f = 20Hz to 20kHz, RL = 600Ω, VIN = 2Vpp
Switch ON
0.05%
THD
SUPPLY
VCC
Power supply voltage
2.7
4.3
V
25
50
µA
5
µA
ICC
Positive supply current
VCC = 2.7V, 3.6V, VIN=VCC or GND, VI/O=0V,
Switch ON or OFF
ICC, PD
Positive supply current
(Power-Down Mode)
VCC = 2.7V, 3.6V, VIN=VCC or GND, VI/O=0V,
SEL1 and SEL2 = Low
3
IOFF
Power off leakage current
VCC = 0V, VD+/R, D-/L, D0+, D0-, D1+, D1-, L,
R = 0 to 4.3V
±0.1
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µA
7
TS3USBA225
SCDS328 – OCTOBER 2011
www.ti.com
2.8
7
2.6
On-State Resistance (Ω)
On-State Resistance (Ω)
TYPICAL CHARACTERISTICS
7.5
6.5
6
5.5
5
4.5
4
3.5
2.4
2.2
2
1.8
1.6
1.4
1.2
0
0.5
1
1.5
2
Input Voltage (V)
2.5
3
1
3.5
−2
−1
G001
Figure 1. ON Resistance vs VI for USB Switch
0
Input Voltage (V)
1
2
G002
Figure 2. ON Resistance vs VI for Audio Switch
0
0
−1
−2
−4
−3
Gain (dB)
Gain (dB)
−2
−4
−5
−6
−8
−6
−10
−7
−8
100k
1M
10M
100M
Frequency (Hz)
1G
−12
100k
10G
0
0
−20
−20
−40
−40
−60
−80
−120
−120
1G
10G
−140
100k
G005
Figure 5. Off Isolation vs Frequency for USB Switch
8
10G
G004
−80
−100
10M
100M
Frequency (Hz)
1G
−60
−100
1M
10M
100M
Frequency (Hz)
Figure 4. Gain vs Frequency for Audio Switch
Crosstalk (dB)
Isolation (dB)
Figure 3. Gain vs Frequency for USB Switch
−140
100k
1M
G003
1M
10M
100M
Frequency (Hz)
1G
10G
G006
Figure 6. Cross Talk vs Frequency for USB Switch
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Product Folder Link(s): TS3USBA225
TS3USBA225
SCDS328 – OCTOBER 2011
www.ti.com
TYPICAL CHARACTERISTICS (continued)
Figure 7. Eye Pattern: 480-Mbps USB 2.0 Eye Pattern (No
Switch)
Figure 8. Eye Pattern: 480-Mbps USB 2.0 Eye Pattern for
USB Switch
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Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): TS3USBA225
9
PACKAGE OPTION ADDENDUM
www.ti.com
20-Oct-2011
PACKAGING INFORMATION
Orderable Device
TS3USBA225RUTR
Status
(1)
ACTIVE
Package Type Package
Drawing
UQFN
RUT
Pins
Package Qty
12
3000
Eco Plan
(2)
Green (RoHS
& no Sb/Br)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
CU NIPDAU Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Mar-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
TS3USBA225RUTR
UQFN
RUT
12
3000
180.0
9.5
1.9
2.3
0.75
4.0
8.0
Q1
TS3USBA225RUTR
UQFN
RUT
12
3000
180.0
8.4
1.95
2.3
0.75
4.0
8.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Mar-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TS3USBA225RUTR
UQFN
RUT
12
3000
180.0
180.0
30.0
TS3USBA225RUTR
UQFN
RUT
12
3000
202.0
201.0
28.0
Pack Materials-Page 2
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