TS3USBA225 SCDS328 – OCTOBER 2011 www.ti.com USB 2.0 High-Speed (480 Mbps) and Audio Switches with Negative Signal Capability and 1.8-V Logic Compatibility and Power-Down Mode Check for Samples: TS3USBA225 FEATURES • 1 • • • • • • • 2.7V to 4.3V operating power supply (VCC) High-Speed USB (480Mbps) Switch: – VI/O accepts signals up to 4.3V (Independent of VCC) – 6.5 Ω RDSON Typical – 3 pF CON Typical – 1.9GHz Bandwidth (-3 dB) Audio Switch: – 2.5 Ω RDSON Typical – Negative Rail Capability – Low THD: <0.05% – Internal Shunt Resistors for Click-and-Pop Reduction 1.8-V Compatible Control Input (SEL1 and SEL2) Threshold Minimized Current Consumption (~5uA) in Power-Down Mode Power-Off Protection: All I/O Pins are High-Z when VCC= 0V 12-Pin QFN Package (2×1.7 mm, 0.4mm pitch) ESD Performance Tested Per JESD 22 – 2000-V Human-Body Model (A114-B, Class II) – 1000-V Charged-Device Model (C101) APPLICATIONS • • • • • • Cell phones and Smartphones Tablet PCs Portable Instrumentation Digital Still Cameras Portable Navigation Devices (GPS) USB 2.0, MIPI (CSI/DSI), LVDS switching D0+ USB 2.0 D0+ D+/R D-/L D1+ D1- R L USB Connector USB 2.0 D0- D0- D+/R USB 2.0 (Client or OTG) Negative Audio SEL1, SEL2 D-/L D1+ D1- R USB Connector L UART Negative Audio SEL1, SEL2 USB + AUDIO USB + UART + AUDIO DESCRIPTION The TS3USBA225 is a double-pole, triple throw (DP3T) multiplexer that includes a low-distortion audio switch, and two USB 2.0 High-Speed (480Mbps) switches in the same package. This configuration allows the system designer to use a common connector for audio, and USB data. The audio switch is designed to allow audio signals to swing negatively which makes this common connector configuration possible. The TS3USBA225 has a VCC range of 2.7V to 4.3V with the capability to pass true-ground audio signals down to Vcc-4.3V. The device also supports a power-down mode that can be enabled when both SEL controls are low to minimize current consumption when no signal is transmitting. The TS3USBA225 also features internal shunt resistors on the audio path to reduce clicks and pops that may be heard when the audio switches are selected. ORDERING INFORMATION TA –40°C to 85°C (1) (2) PACKAGE (1) (2) QFN 0.4-mm pitch – RUT (Pb-Free) Tape and reel ORDERABLE PART NUMBER TOP-SIDE MARKING TS3USBA225RUTR LQR Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2011, Texas Instruments Incorporated TS3USBA225 SCDS328 – OCTOBER 2011 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. SWITCH BLOCK DIAGRAM D0+ D1+ R D+/R Rshunt D0D1L D-/L R shunt VCC Charge Pump SEL1 Control Logic Rpd2 Rpd1 SEL2 TYPICAL APPLICATION BLOCK DIAGRAM D0+ USB 2.0 D0+ D+/R D-/L D1+ D1- R L USB Connector SEL1, SEL2 USB + AUDIO 2 USB 2.0 D0- D0- D+/R USB 2.0 (Client or OTG) Negative Audio D-/L D1+ D1- R L USB Connector UART Negative Audio SEL1, SEL2 USB + UART + AUDIO Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TS3USBA225 TS3USBA225 SCDS328 – OCTOBER 2011 www.ti.com PIN CONFIGURATION QFN PACKAGE (TOP VIEW) R 12 11 SEL1 2 10 D+/R VCC 3 9 GND D1- 4 8 D-/L D0- 5 7 SEL2 D0+ 1 D1+ 6 L 12-Pin QFN Package (2x1.7 mm, 0.4mm pitch) Space Space Space PIN DESCRIPTION TABLE PIN NUMBER NAME DESCRIPTION TYPE 1 D0+ I/O USB/UART Data 1 (Differential +) 2 D1+ I/O USB/UART Data 2 (Differential +) 3 VCC Power 4 D1– I/O USB/UART Data 2 (Differential –) 5 D0– I/O USB/UART Data 1 (Differential –) 6 L I/O Left Channel Audio 7 SEL2 8 D–/L 9 GND 10 D+/R I/O 11 SEL1 Input 12 R Input I/O Power supply Control Input Select Line 2. The default state for SEL2 is LOW. USB/UART/Audio Common Connector Ground Ground I/O USB/UART/Audio Common Connector Control Input Select Line 1. The default state for SEL1 is LOW. Right Channel Audio Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TS3USBA225 3 TS3USBA225 SCDS328 – OCTOBER 2011 www.ti.com FUNCTION TABLE SEL1 SEL2 X L L (1) VCC L,R D0+, D0- D1+, D1- Mode X L OFF OFF OFF Hi-Z Mode L H OFF OFF OFF Power-Down Mode H H OFF (1) ON OFF USB Mode 1 H L H ON OFF OFF Audio Mode H H H OFF (1) OFF ON USB Mode 2 100Ω shunt resistors are enabled in this state. SUMMARY OF TYPICAL CHARACTERISTICS USB PATH Number of switches AUDIO PATH 4 2 ON-state resistance (ron) 6.5 Ω 2.5 Ω ON-state resistance match (Δron) 0.1 Ω 0.1 Ω ON-state resistance flatness (ron(flat)) 2Ω 1.5 Ω ON-state capacitance (CI/O,on) 3 pF 3.5 pF 1.9 GHz 1.2 GHz N/A 0.05% Bandwidth (BW) Total harmonic distortion (THD) AUDIO PATH SIGNAL SWING SUPPLY VOLTAGE, VCC 4 MINIMUM VD+/R, D-/L, L, R = VCC- 4.3 V MAXIMUM VD+/R, D-/L, L, R = VCC 4.3 0 4.3 V 3.3 –1.0 V 3.3 V 3.0 –1.3 V 3.0 V 2.7 –1.8 V 2.7 V Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TS3USBA225 TS3USBA225 SCDS328 – OCTOBER 2011 www.ti.com ABSOLUTE MAXIMUM RATINGS (1) (2) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range (3) –0.3 4.6 V VD0+, VD0-, VD1+, VD1- High speed differential signal voltage range (3) –0.3 4.6 V VR, VL Audio signal voltage range VCC – 4.6 VCC V IK Analog port diode current VI Digital input voltage range (SEL1, SEL2) –0.3 IIK Digital logic input clamp current (3) VI < 0 –50 ICC Continuous current through VCC IGND Continuous current through GND Tstg Storage temperature range (1) (2) (3) VI/O+ ,VI/O- <0 –50 mA 4.6 V 100 mA –100 –65 UNIT mA 150 °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum. All voltages are with respect to ground, unless otherwise specified. RECOMMENDED OPERATING CONDITIONS VCC Supply voltage range VD0+, VD0-, VD1+, VD1- High speed differential signal voltage range VR, VL Audio signal voltage range IK Analog port diode current VI Digital input voltage range (SEL1, SEL2) TA Operating free-air temperature VI/O+ ,VI/O- <0 MIN MAX 2.7 4.3 V 0 4.3 V VCC – 4.3 VCC V –50 mA 0 4.3 V –40 85 °C Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TS3USBA225 UNIT 5 TS3USBA225 SCDS328 – OCTOBER 2011 www.ti.com ELECTRICAL CHARACTERISTICS TA = –40°C to 85°C, typical values are at VCC = 3.3 V, TA = 25°C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT USB SWITCH ON-state resistance VCC = 3.0 V VI/O+,I/O- = 0.4 V, ION = 15 mA 6.5 Δron ON-state resistance match between channels VCC = 3.0 V VI/O+,I/O- = 1.7 V, ION = 15 mA 0.1 Ω ron (flat) ON-state resistance flatness VCC = 3.0 V VI/O+,I/O- = 0 to 1.7 V, ION = 15 mA 0.5 Ω VCC = 3.6 V Switch OFF , VI/O+,I/O- = 0 to 3.6 V, 1789553 VD+/R, D-/L = 0 V IOZ OFF leakage current 7.5 Ω ron 1 µA 3.5 Ω AUDIO SWITCH ron ON-state resistance VCC = 3.0 V SEL1=High, SEL2=Low, VL/R = -2V, 0V, 0.7V, ION = -26 mA 2.5 Δron ON-state resistance match between channels VCC = 3.0 V SEL1=High, SEL2=Low, VL/R = 0.7V, ION = -26 mA 0.1 Ω ron (flat) ON-state resistance flatness VCC = 3.0 V SEL1=High, SEL2=Low, VL/R = -2V, 0V, 0.7V, ION = -26 mA 0.1 Ω rSHUNT Shunt resistance Switch OFF, VL/R = 0.7V, ISHUNT = 10 mA 100 VCC = 2.7 V to 4.3 V 200 Ω DIGITAL CONTROL INPUTS (SEL1, SEL2) VIH Input logic high VCC = 2.7 V to 4.3 V VIL Input logic low VCC = 2.7 V to 4.3 V IIN Input leakage current VCC = 2.7 V to 4.3 V rPD1, rPD2 Internal pulldown resistance VCC = 2.7 V to 4.3 V 6 1.3 V 0.4 ±3 VIN = 4.3V ±0.1 VIN = 0V Submit Documentation Feedback 3 V μA MΩ Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TS3USBA225 TS3USBA225 SCDS328 – OCTOBER 2011 www.ti.com DYNAMIC CHARACTERISTICS TA = –40°C to 85°C, typical values are at VCC = 3.3 V, TA = 25°C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT USB SWITCH tpd Propagation Delay VCC = 2.7V or 3.3V tON Turn-on time RL = 50Ω, CL = 35pF VCC = 2.7V 0.25 60 ns ns tOFF Turn-off time RL = 50Ω, CL = 35pF VCC = 2.7V 20 ns tSK(O) Channel-to-channel skew VCC = 2.7V or 3.3V 15 ps tSK(P) Skew of opposite transitions of same output VCC = 2.7V or 3.3V 15 ps CI/O+(OFF) CI/O-(OFF) OFF capacitance VCC = 2.7V or 3.3V, VD0+/D0- =0 or 3.3V Switch OFF 1 pF CI/O+(ON) CI/O-(ON) ON capacitance VCC =2.7V or 3.3V, VD0+/D0- = 0 or 3.3V Switch ON 3 pF CI Digital input capacitance VCC =2.7V or 3.3V, VI = 0 or 3.3V 2.5 BW Bandwidth VCC =2.7V or 3.3V, RL = 50Ω Switch ON 1.9 GHz OISO OFF Isolation VCC =2.7V or 3.3V, RL = 50Ω, f = 240 MHz Switch OFF -35 dB XTALK Crosstalk VCC =2.5V or 3.3V, RL = 50Ω, f = 240 MHz Switch ON -45 dB pF AUDIO SWITCH tON Turn-on time RL = 50Ω, CL = 35pF VCC = 2.7V 40 µs tOFF Turn-off time RL = 50Ω, CL = 35pF VCC = 2.7V 15 ns CL(OFF), CR(OFF) L , R OFF capacitance VCC = 2.7V to 4.3V, f = 20 kHz Switch OFF 1.0 pF CL(ON), CR(ON) L, R ON capacitance VCC = 2.7V to 4.3V, f = 20 kHz Switch ON 3.5 pF OISO OFF Isolation VCC = 3.3V, RL = 50Ω, f = 20 kHz Switch OFF -85 dB XTALK Crosstalk VCC = 3.3V, RL = 50Ω, f = 20 kHz Switch ON -95 dB Total harmonic distortion VCC = 3.3V, SEL1=High, SEL2=Low, f = 20Hz to 20kHz, RL = 600Ω, VIN = 2Vpp Switch ON 0.05% THD SUPPLY VCC Power supply voltage 2.7 4.3 V 25 50 µA 5 µA ICC Positive supply current VCC = 2.7V, 3.6V, VIN=VCC or GND, VI/O=0V, Switch ON or OFF ICC, PD Positive supply current (Power-Down Mode) VCC = 2.7V, 3.6V, VIN=VCC or GND, VI/O=0V, SEL1 and SEL2 = Low 3 IOFF Power off leakage current VCC = 0V, VD+/R, D-/L, D0+, D0-, D1+, D1-, L, R = 0 to 4.3V ±0.1 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TS3USBA225 µA 7 TS3USBA225 SCDS328 – OCTOBER 2011 www.ti.com 2.8 7 2.6 On-State Resistance (Ω) On-State Resistance (Ω) TYPICAL CHARACTERISTICS 7.5 6.5 6 5.5 5 4.5 4 3.5 2.4 2.2 2 1.8 1.6 1.4 1.2 0 0.5 1 1.5 2 Input Voltage (V) 2.5 3 1 3.5 −2 −1 G001 Figure 1. ON Resistance vs VI for USB Switch 0 Input Voltage (V) 1 2 G002 Figure 2. ON Resistance vs VI for Audio Switch 0 0 −1 −2 −4 −3 Gain (dB) Gain (dB) −2 −4 −5 −6 −8 −6 −10 −7 −8 100k 1M 10M 100M Frequency (Hz) 1G −12 100k 10G 0 0 −20 −20 −40 −40 −60 −80 −120 −120 1G 10G −140 100k G005 Figure 5. Off Isolation vs Frequency for USB Switch 8 10G G004 −80 −100 10M 100M Frequency (Hz) 1G −60 −100 1M 10M 100M Frequency (Hz) Figure 4. Gain vs Frequency for Audio Switch Crosstalk (dB) Isolation (dB) Figure 3. Gain vs Frequency for USB Switch −140 100k 1M G003 1M 10M 100M Frequency (Hz) 1G 10G G006 Figure 6. Cross Talk vs Frequency for USB Switch Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TS3USBA225 TS3USBA225 SCDS328 – OCTOBER 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) Figure 7. Eye Pattern: 480-Mbps USB 2.0 Eye Pattern (No Switch) Figure 8. Eye Pattern: 480-Mbps USB 2.0 Eye Pattern for USB Switch Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TS3USBA225 9 PACKAGE OPTION ADDENDUM www.ti.com 20-Oct-2011 PACKAGING INFORMATION Orderable Device TS3USBA225RUTR Status (1) ACTIVE Package Type Package Drawing UQFN RUT Pins Package Qty 12 3000 Eco Plan (2) Green (RoHS & no Sb/Br) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) CU NIPDAU Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 30-Mar-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TS3USBA225RUTR UQFN RUT 12 3000 180.0 9.5 1.9 2.3 0.75 4.0 8.0 Q1 TS3USBA225RUTR UQFN RUT 12 3000 180.0 8.4 1.95 2.3 0.75 4.0 8.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 30-Mar-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TS3USBA225RUTR UQFN RUT 12 3000 180.0 180.0 30.0 TS3USBA225RUTR UQFN RUT 12 3000 202.0 201.0 28.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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