TI SN74AUC2G53YZTR

SN74AUC2G53
SINGLE-POLE DOUBLE-THROW (SPDT) ANALOG SWITCH OR
2:1 ANALOG MULTIPLEXER/DEMULTIPLEXER
www.ti.com
SCES484B – AUGUST 2003 – REVISED JANUARY 2007
FEATURES
•
•
•
•
•
•
•
•
DCT OR DCU PACKAGE
(TOP VIEW)
Available in the Texas Instruments
NanoFree™ Package
Operates at 0.8 V to 2.7 V
Sub-1-V Operable
Low Power Consumption, 10 µA at 2.7 V
High On-Off Output Voltage Ratio
High Degree of Linearity
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
COM
INH
GND
GND
1
8
2
7
3
6
4
5
VCC
Y1
Y2
A
YZP PACKAGE
(BOTTOM VIEW)
GND
GND
INH
COM
4 5
3 6
2 7
1 8
A
Y2
Y1
VCC
DESCRIPTION/ORDERING INFORMATION
This analog switch is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.1-V to 2.7-V VCC
operation.
The SN74AUC2G53 can handle both analog and digital signals. The device permits signals with amplitudes of
up to VCC (peak) to be transmitted in either direction.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for
analog-to-digital and digital-to-analog conversion systems.
ORDERING INFORMATION
PACKAGE (1)
TA
–40°C to
85°C
(1)
(2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING (2)
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
Reel of 3000
SN74AUC2G53YZPR
_ _ _U4_
SSOP – DCT
Reel of 3000
SN74AUC2G53DCTR
U53_ _ _
VSSOP – DCU
Reel of 3000
SN74AUC2G53DCUR
U53_
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
FUNCTION TABLE
CONTROL
INPUTS
INH
A
ON
CHANNEL
L
L
L
H
Y1
Y2
H
X
None
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2003–2007, Texas Instruments Incorporated
SN74AUC2G53
SINGLE-POLE DOUBLE-THROW (SPDT) ANALOG SWITCH OR
2:1 ANALOG MULTIPLEXER/DEMULTIPLEXER
www.ti.com
SCES484B – AUGUST 2003 – REVISED JANUARY 2007
LOGIC DIAGRAM (POSITIVE LOGIC)
A
5
SW
SW
INH
7
6
1
2
Y1
Y2
COM
NOTE A: For simplicity, the test conditions shown in Figures 1 through 4 and 6 through 10 are for the demultiplexer configuration. Signals may
be passed from COM to Y1 (Y2) or from Y1 (Y2) to COM.
SIMPLIFIED SCHEMATIC, EACH SWITCH (SW)
COM
Y
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC
Supply voltage range (2)
–0.5
3.6
V
VI
Input voltage range (2) (3)
–0.5
3.6
V
VI/O
Switch I/O voltage range (2) (3)
–0.5
VCC + 0.5
V
IIK
Control input clamp current
VI < 0
–50
mA
II/OK
I/O port diode current
VI/O < 0 or VI/O > VCC
±50
mA
IT
On-state switch current current
VI/O = 0 to VCC
±50
mA
±100
mA
Continuous current through VCC or GND
θJA
Package thermal impedance (4)
Tstg
Storage temperature range
DCT package
220
DCU package
227
YZP package
(1)
(2)
(3)
(4)
2
UNIT
°C/W
102
–65
150
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to ground unless otherwise specified.
The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
The package thermal impedance is calculated in accordance with JESD 51-7.
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SN74AUC2G53
SINGLE-POLE DOUBLE-THROW (SPDT) ANALOG SWITCH OR
2:1 ANALOG MULTIPLEXER/DEMULTIPLEXER
www.ti.com
SCES484B – AUGUST 2003 – REVISED JANUARY 2007
Recommended Operating Conditions
VCC
(1)
Supply voltage
VCC = 0.8 V
VIH
High-level input voltage
MIN
MAX
0.8
2.7
UNIT
V
VCC
VCC = 1.1 V to 1.95 V
0.65 × VCC
VCC = 2.3 V to 2.7 V
V
1.7
VCC = 0.8 V
0
VIL
Low-level input voltage
VCC = 1.1 V to 1.95 V
0.35 × VCC
VI/O
I/O port voltage
0
VCC
V
VI
Control input voltage
0
3.6
V
VCC = 2.3 V to 2.7 V
0.7
VCC = 0.8 V to 1.6 V
∆t/∆v
TA
(1)
Input transition rise or fall rate
V
20
VCC = 1.65 V to 1.95 V
10
VCC = 2.3 V to 2.7 V
3.5
Operating free-air temperature
–40
ns/V
85
°C
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
ron
ron(p)
∆ron
TEST CONDITIONS
On-state switch resistance
VI = VCC or GND,
VINH = VIL
(see Figure 1 and
Figure 2)
Peak on resistance
VI = VCC to GND,
VINH = VIL
(see Figure 1 and
Figure 2)
Difference of on-state resistance
between switches
VI = VCC to GND,
VC = VIH
(see Figure 1 and
Figure 2)
IS = 4 mA
IS = 8 mA
IS = 4 mA
IS = 8 mA
IS = 4 mA
IS = 8 mA
VCC
MIN TYP (1)
1.1 V
1.65 V
MAX
UNIT
40
12.5
20
2.3 V
6
15
1.1 V
131
180
1.65 V
32
80
2.3 V
15
20
1.1 V
4
1.65 V
1
2.3 V
1
Ω
Ω
IS(off)
Off-state switch leakage current
VI = VCC and VO = GND, or
VI = GND and VO = VCC,
VINH = VIH (see Figure 3)
2.7 V
IS(on)
On-state switch leakage current
VI = VCC or GND, VINH = VIL,
VO = Open (see Figure 4)
2.7 V
II
Control input current
VC = VCC or GND
2.7 V
±5
µA
ICC
Supply current
VC = VCC or GND
2.7 V
10
µA
Cic
Control input capacitance
Cio(off)
Switch input/output capacitance
Cio(on)
Switch input/output capacitance
(1)
±1
Ω
2.5 V
Y
2.5 V
COM
2.5 V
±0.1 (1)
±1
±0.1 (1)
2
3
4.5
9
µA
µA
pF
pF
pF
TA = 25°C
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3
SN74AUC2G53
SINGLE-POLE DOUBLE-THROW (SPDT) ANALOG SWITCH OR
2:1 ANALOG MULTIPLEXER/DEMULTIPLEXER
www.ti.com
SCES484B – AUGUST 2003 – REVISED JANUARY 2007
Switching Characteristics
over recommended operating free-air temperature range, CL = 15 pF (unless otherwise noted) (see Figure 5)
PARAMETER
tpd (1)
ten
tdis
FROM
(INPUT)
TO
(OUTPUT)
VCC = 0.8 V
COM or Y
Y or COM
0.3
INH
COM or Y
A
COM or Y
ten
tdis
(1)
TYP
VCC = 1.2 V
± 0.1 V
MIN
MAX
VCC = 1.5 V
± 0.1 V
MIN
0.3
VCC = 1.8 V
± 0.15 V
MAX
MIN
TYP
VCC = 2.5 V
± 0.2 V
MAX
0.3
MIN
0.2
UNIT
MAX
0.1
9.2
0.5
3.5
0.5
2.2
0.5
1
1.9
0.5
1.8
8.1
0.5
4.2
0.5
3.2
0.5
1.9
3.4
0.5
2.6
9.2
0.5
3.6
0.5
2.3
0.5
1.1
1.9
0.5
1.6
10
0.5
3.6
0.5
2.3
0.5
1.1
2
0.5
1.6
ns
ns
ns
The propagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load
capacitance, when driven by an ideal voltage source (zero output impedance).
Switching Characteristics
over recommended operating free-air temperature range, CL = 30 pF (unless otherwise noted) (see Figure 5)
PARAMETER
tpd (1)
ten
tdis
ten
tdis
(1)
FROM
(INPUT)
TO
(OUTPUT)
COM or Y
Y or COM
INH
COM or Y
A
COM or Y
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
MAX
MIN
UNIT
MIN
TYP
0.5
1.6
3.1
0.5
2.2
0.5
2.2
3.4
0.5
2.2
0.5
1.6
3
0.5
2.2
0.5
1.6
3
0.5
2.3
0.4
MAX
0.2
ns
ns
ns
The propagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load
capacitance, when driven by an ideal voltage source (zero output impedance).
Analog Switch Characteristics
TA = 25°C
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
TEST CONDITIONS
CL = 50 pF, RL = 600 Ω,
fin = sine wave
(see Figure 6)
Frequency response (1)
(switch ON)
COM or Y
Y or COM
CL = 5 pF, RL = 50 Ω,
fin = sine wave
(see Figure 6)
(1)
4
Adjust fin voltage to obtain 0 dBm at output. Increase fin frequency until dB meter reads –3 dB.
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VCC
TYP
0.8 V
90
1.1 V
101
1.4 V
110
1.65 V
122
2.3 V
198
0.8 V
>500
1.1 V
>500
1.4 V
>500
1.65 V
>500
2.3 V
>500
UNIT
MHz
SN74AUC2G53
SINGLE-POLE DOUBLE-THROW (SPDT) ANALOG SWITCH OR
2:1 ANALOG MULTIPLEXER/DEMULTIPLEXER
www.ti.com
SCES484B – AUGUST 2003 – REVISED JANUARY 2007
Analog Switch Characteristics (continued)
TA = 25°C
FROM
(INPUT)
PARAMETER
TO
(OUTPUT)
TEST CONDITIONS
CL = 50 pF, RL = 600 Ω,
fin = 1 MHz (sine wave)
(see Figure 7)
Crosstalk (2)
COM or Y
(between switches)
Y or COM
CL = 5 pF, RL = 50 Ω,
fin = 1 MHz (sine wave)
(see Figure 7)
Crosstalk
(control input to signal output)
INH
CL = 50 pF, RL = 600 Ω,
fin = 1 MHz (square
wave)
(see Figure 8)
COM or Y
CL = 50 pF, RL = 600 Ω,
fin = 1 MHz (sine wave)
(see Figure 9)
Feed-through attenuation (2)
(switch OFF)
COM or Y
Y or COM
CL = 5 pF, RL = 600 Ω,
fin = 1 MHz (sine wave)
(see Figure 9)
CL = 50 pF, RL = 10 kΩ,
fin = 1 kHz (sine wave)
(see Figure 10)
Sine-wave distortion
COM or Y
Y or COM
CL = 50 pF, RL = 10 kΩ,
fin = 10 kHz (sine wave)
(see Figure 10)
(2)
VCC
TYP
0.8 V
–59
1.1 V
–59
1.4 V
–59
1.65 V
–59
2.3 V
–60
0.8 V
–55
1.1 V
–55
1.4 V
–55
1.65 V
–55
2.3 V
–55
0.8 V
0.56
1.1 V
0.68
1.4 V
0.81
1.65 V
0.93
2.3 V
1.5
0.8 V
–60
1.1 V
–60
1.4 V
–60
1.65 V
–60
2.3 V
–60
0.8 V
–59
1.1 V
–59
1.4 V
–59
1.65 V
–59
2.3 V
–59
0.8 V
6.19
1.1 V
0.39
1.4 V
0.06
1.65 V
0.02
2.3 V
0.01
0.8 V
3.55
1.1 V
0.38
1.4 V
0.04
1.65 V
0.02
2.3 V
0.02
UNIT
dB
mV
dB
%
Adjust fin voltage to obtain 0 dBm at input.
Operating Characteristics
for INH input, TA = 25°C
PARAMETER
Cpd
Power dissipation
capacitance
TEST
CONDITIONS
VCC = 0.8 V
VCC = 1.2 V
VCC = 1.5 V
VCC = 1.8 V
VCC = 2.5 V
TYP
TYP
TYP
TYP
TYP
f = 10 MHz
3
3
3
3
3
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UNIT
pF
5
SN74AUC2G53
SINGLE-POLE DOUBLE-THROW (SPDT) ANALOG SWITCH OR
2:1 ANALOG MULTIPLEXER/DEMULTIPLEXER
www.ti.com
SCES484B – AUGUST 2003 – REVISED JANUARY 2007
Operating Characteristics
for A input, TA = 25°C
PARAMETER
Cpd
6
Power
dissipation
capacitance
Outputs
enabled
Outputs
disabled
TEST
CONDITIONS
VCC = 0.8 V
VCC = 1.2 V
VCC = 1.5 V
VCC = 1.8 V
VCC = 2.5 V
TYP
TYP
TYP
TYP
TYP
5.5
5.5
5.5
5.5
5.5
0.5
0.5
0.5
0.5
0.5
f = 10 MHz
UNIT
pF
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SN74AUC2G53
SINGLE-POLE DOUBLE-THROW (SPDT) ANALOG SWITCH OR
2:1 ANALOG MULTIPLEXER/DEMULTIPLEXER
www.ti.com
SCES484B – AUGUST 2003 – REVISED JANUARY 2007
PARAMETER MEASUREMENT INFORMATION
VCC
VIL or VIH
VIL
VI = VCC or GND
VCC
A
VA
INH
Y1
S
VA
1
VIL
2
VIH
1
S
VINH
VO
COM
Y2
(On)
2
GND
IS
V
r on +
VI * VO
W
IS
VI - VO
Figure 1. On-State Resistance Test Circuit
120
100
VCC = 1.1 V
80
60
40
VCC = 1.65 V
20
VCC = 2.3 V
0
0
1
2
3
Figure 2. Typical ron as a Function of Voltage (VI) for VI = 0 to VCC
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SN74AUC2G53
SINGLE-POLE DOUBLE-THROW (SPDT) ANALOG SWITCH OR
2:1 ANALOG MULTIPLEXER/DEMULTIPLEXER
www.ti.com
SCES484B – AUGUST 2003 – REVISED JANUARY 2007
PARAMETER MEASUREMENT INFORMATION
VCC
A
VIL or VIH
VA
INH
VIH
S
VA
1
VIL
2
VIH
1
Y1
S
VINH
VO
COM
A
VI
VCC
Y2
(Off)
2
GND
Condition 1: VI = GND, VO = VCC
Condition 2: VI = VCC, VO = GND
Figure 3. Off-State Switch Leakage-Current Test Circuit
VCC
VA
INH
VIL
VI
VCC
A
VIL or VIH
Y1
1
VIL
2
VIH
S
VO
COM
Y2
2
VI = VCC or GND
(On)
GND
Figure 4. On-State Switch Leakage-Current Test Circuit
8
VA
1
VINH
A
S
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VO = Open
SN74AUC2G53
SINGLE-POLE DOUBLE-THROW (SPDT) ANALOG SWITCH OR
2:1 ANALOG MULTIPLEXER/DEMULTIPLEXER
www.ti.com
SCES484B – AUGUST 2003 – REVISED JANUARY 2007
PARAMETER MEASUREMENT INFORMATION
VLOAD
S1
RL
From Output
Under Test
CL
(see Note A)
Open
GND
RL
LOAD CIRCUIT
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
VLOAD
GND
INPUTS
VCC
0.8 V
1.2 V ± 0.1 V
1.5 V ± 0.1 V
1.8 V ± 0.15 V
2.5 V ± 0.2 V
1.8 V ± 0.15 V
2.5 V ± 0.2 V
VI
tr/tf
VCC
VCC
VCC
VCC
VCC
VCC
VCC
≤2 ns
≤2 ns
≤2 ns
≤2 ns
≤2 ns
≤2 ns
≤2 ns
VM
VLOAD
CL
RL
V∆
VCC/2
VCC/2
VCC/2
VCC/2
VCC/2
VCC/2
VCC/2
2 × VCC
2 × VCC
2 × VCC
2 × VCC
2 × VCC
2 × VCC
2 × VCC
15 pF
15 pF
15 pF
15 pF
15 pF
30 pF
30 pF
2 kΩ
2 kΩ
2 kΩ
2 kΩ
2 kΩ
1 kΩ
500 Ω
0.1 V
0.1 V
0.1 V
0.15 V
0.15 V
0.15 V
0.15 V
VI
Timing Input
VM
0V
tw
tsu
VI
Input
VM
VM
th
VI
Data Input
VM
VM
0V
0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PULSE DURATION
VI
VM
Input
VM
0V
tPLH
VM
VM
VOL
tPHL
VM
VM
0V
Output
Waveform 1
S1 at VLOAD
(see Note B)
tPLH
tPLZ
VLOAD/2
VM
tPZH
VOH
Output
VM
tPZL
tPHL
VOH
Output
VI
Output
Control
VM
VOL
Output
Waveform 2
S1 at GND
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOL + V∆
VOL
tPHZ
VM
VOH − V∆
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, slew rate ≥ 1 V/ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 5. Load Circuit and Voltage Waveforms
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SN74AUC2G53
SINGLE-POLE DOUBLE-THROW (SPDT) ANALOG SWITCH OR
2:1 ANALOG MULTIPLEXER/DEMULTIPLEXER
www.ti.com
SCES484B – AUGUST 2003 – REVISED JANUARY 2007
PARAMETER MEASUREMENT INFORMATION
VCC
VIL or VIH
VIL
0.1 µF
VCC
A
VA
INH
Y1
S
VA
1
VIL
2
VIH
1
S
VINH
VO
COM
Y2
2
RL
fin
(On)
50 Ω
CL
GND
VCC/2
RL/CL: 600 Ω/50 pF
RL/CL: 50 Ω/5 pF
Figure 6. Frequency Response (Switch On)
VCC
VIL or VIH
VCC
A
VA
TEST CONDITION
VIL
20log10(VO2/VI)
VIH
20log10(VO1/VI)
VA
Y1
VIL
0.1 µF
INH
VO1
RL
600 Ω
VINH
CL
50 pF
COM
VCC/2
Rin
600 Ω
fin
50 Ω
Y2
VO2
GND
RL
600 Ω
VCC/2
Figure 7. Crosstalk (Between Switches)
10
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CL
50 pF
SN74AUC2G53
SINGLE-POLE DOUBLE-THROW (SPDT) ANALOG SWITCH OR
2:1 ANALOG MULTIPLEXER/DEMULTIPLEXER
www.ti.com
SCES484B – AUGUST 2003 – REVISED JANUARY 2007
PARAMETER MEASUREMENT INFORMATION
VCC
VCC
A
VIL or VIH
VA
INH
Y1
S
VA
1
VIL
2
VIH
1
S
VINH
VO
Y2
50 Ω
COM
(On)
2
RL
600 Ω
CL
50 pF
GND
VCC/2
Rin
600 Ω
VCC/2
Figure 8. Crosstalk (Control Input, Switch Output)
VCC
VCC
A
VIL or VIH
S
VA
1
VIL
2
VIH
VA
INH
VIL
Y1
1
S
VINH
0.1 µF
VO
COM
Y2
2
RL
fin
50 Ω
RL
(Off)
CL
GND
VCC/2
VCC/2
RL/CL: 600 Ω/50 pF
RL/CL: 50 Ω/5 pF
Figure 9. Feedthrough (Switch Off)
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SN74AUC2G53
SINGLE-POLE DOUBLE-THROW (SPDT) ANALOG SWITCH OR
2:1 ANALOG MULTIPLEXER/DEMULTIPLEXER
www.ti.com
SCES484B – AUGUST 2003 – REVISED JANUARY 2007
PARAMETER MEASUREMENT INFORMATION
VCC
VIL or VIH
VIL
10 µF
VCC
A
VA
INH
Y1
600 Ω
VA
1
VIL
2
VIH
1
10 µF
S
VINH
VO
COM
fin
S
Y2
(On)
2
RL
10 kΩ
GND
VCC/2
VCC = 0.8 V, VI = 0.7 VP-P
VCC = 1.1 V, VI = 1 VP-P
VCC = 1.4 V, VI = 1.2 VP-P
VCC = 1.65 V, VI = 1.4 VP-P
VCC = 2.3 V, VI = 2 VP-P
Figure 10. Sine-Wave Distortion
12
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CL
50 pF
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74AUC2G53DCTR
ACTIVE
SM8
DCT
8
3000
Pb-Free
(RoHS)
CU NIPDAU
Level-1-260C-UNLIM
SN74AUC2G53DCTRE4
ACTIVE
SM8
DCT
8
3000
Pb-Free
(RoHS)
CU NIPDAU
Level-1-260C-UNLIM
SN74AUC2G53DCUR
ACTIVE
US8
DCU
8
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AUC2G53DCURE4
ACTIVE
US8
DCU
8
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AUC2G53DCURG4
ACTIVE
US8
DCU
8
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AUC2G53YZPR
ACTIVE
WCSP
YZP
8
3000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
SN74AUC2G53YZTR
ACTIVE
DSBGA
YZT
8
3000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
22-Oct-2007
TAPE AND REEL BOX INFORMATION
Device
Package Pins
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN74AUC2G53DCUR
DCU
8
SITE 35
180
9
2.25
3.35
1.05
4
8
Q3
SN74AUC2G53YZPR
YZP
8
SITE 12
180
8
1.1
2.1
0.56
4
8
Q1
SN74AUC2G53YZTR
YZT
8
SITE 12
180
8
1.1
2.1
0.7
4
8
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
22-Oct-2007
Device
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
SN74AUC2G53DCUR
DCU
8
SITE 35
202.0
201.0
28.0
SN74AUC2G53YZPR
YZP
8
SITE 12
220.0
220.0
0.0
SN74AUC2G53YZTR
YZT
8
SITE 12
220.0
220.0
0.0
Pack Materials-Page 2
MECHANICAL DATA
MPDS049B – MAY 1999 – REVISED OCTOBER 2002
DCT (R-PDSO-G8)
PLASTIC SMALL-OUTLINE PACKAGE
0,30
0,15
0,65
8
0,13 M
5
0,15 NOM
ÇÇÇÇÇ
ÇÇÇÇÇ
ÇÇÇÇÇ
ÇÇÇÇÇ
2,90
2,70
4,25
3,75
Gage Plane
PIN 1
INDEX AREA
1
0,25
4
0° – 8°
3,15
2,75
0,60
0,20
1,30 MAX
Seating Plane
0,10
0,10
0,00
NOTES: A.
B.
C.
D.
4188781/C 09/02
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion
Falls within JEDEC MO-187 variation DA.
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• DALLAS, TEXAS 75265
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