TI SN74LV8153PWRG4

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SCLS555 − JUNE 2004
DESCRIPTION
The SN74LV8153 is a serial-to-parallel data converter. It
accepts serial input data and outputs 8-bit parallel data.
The automatic data-rate detection feature of the
SN74LV8153 eliminates the need for an external oscillator
and helps with cost and board real-estate savings.
The OUTSEL pin is used to choose between open
collector and push-pull outputs. The open-collector option
is suitable when this device is used in applications such as
LED interface, where high drive current is required. SOUT
is the output that acknowledges reception of the serial
data.
To ensure the high-impedance state during power up or
power down, OE should be tied to VCC1 through a pullup
resistor; the minimum value of the resistor is determined
by the current-sinking capability of the driver.
FEATURES
D Single-Wire Serial Data Input
D Compatible With UART Serial-Data Format
D Up to Eight Devices (64-Bit Parallel) Can
D
D
D
D
D
D
N OR PW PACKAGE
(TOP VIEW)
VCC1
A0
A1
A2
D
OUTSEL
RESET
OE
SOUT
GND
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
Share the Same Bus by Using Different
Combinations of A0, A1, A2
Up to 40 mA Current Drive in Open-Collector
Mode for Driving LEDs
Outputs Can be Configured as
Open-Collector or Push-Pull
Internal Oscillator and Counter for
Automatic Data-Rate Detection
Output Levels Are Referenced to VCC2 and
Can Be Configured From 3 V to 12 V
Latch-Up Performance Exceeds 250 mA Per
JESD 17
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 1000-V Charged-Device Model (C101)
SUMMARY OF RECOMMENDED
OPERATING CONDITIONS
VCC2
Y0
Y1
Y2
Y3
Y4
Y5
Y6
Y7
GND
PARAMETER
VCC1
VCC2
3 V to 5.5 V
3 V to 13.2 V
IOL
40 mA @ VCC2 = 4.5 V
(open-collector mode)
IOH
−24 mA @ VCC2 = 12 V
(push-pull mode)
Maximum Data Rate
24 Kbps
FUNCTION TABLE
(each buffer)
INPUTS
OUTPUT
Yn
OUTSEL
RESET
OE
Dn
L
H
L
H
L
L
H
L
L
H
L
X
H
X
H
L
L
X
X
H
H
H
L
H
H
H
H
L
L
L
H
X
H
X
Z
H
L
L
X
L
OUTPUT
STRUCTURE
Open collector
Push-pull
In the open-collector mode (OUTSEL = L), the outputs are inverted,
e.g., Y1 = l, when D1 = H
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments
semiconductor products and disclaimers thereto appears at the end of this data sheet.
!"# $"%&! '#( '"!
! $#!! $# )# # #* "# '' +,(
'"! $!#- '# #!#&, !&"'# #- && $##(
Copyright  2004, Texas Instruments Incorporated
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SCLS555 − JUNE 2004
ORDERING INFORMATION
ORDERABLE
PART NUMBER
PACKAGE(1)
TA
PDIP − N
−40°C
−40
C to 85
85°C
C
TSSOP − PW
Tube
SN74LV8153N
Tube
SN74LV8153PW
Tape and reel
SN74LV8153PWR
TOP-SIDE
MARKING
SN74LV8153N
LV8153
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
PIN DESCRIPTION
PIN #
1
I/O
PIN FUNCTION
Power-supply pin (all inputs and outputs except for Y0-Y7)
A0, A1, A2
In
The address pins are used to program the address of the device and allow up to eight
devices to share the same bus.
5
D
In
Serial data input
6
OUTSEL
In
Choose between open-collector and push-pull type outputs (Y0-Y7).
7
RESET
In
Initialize register status
8
OE
In
Force Y0-Y7 to Hi-Z
9
SOUT
Out
Outputs a pulse when latch data is changed. Supplied by VCC1.
12-19
Y0-Y7
Out
Push-pull or open collector parallel data outputs. Supplied by VCC2.
20
VCC2
2-4
2
PIN NAME
VCC1
Power-supply pin for outputs (Y0-Y7). VCC2 can range from 3 V to 13.2 V.
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SCLS555 − JUNE 2004
data transmission protocol
− The serial data should be sent as 2START-3ADDRESS-4DATA-1STOP. Two consecutive serial-data
frames transmit 8 bits of data. The first frame includes the lower four bits of data (D0-D3), and the
second frame includes the upper four bits (D4-D7).
− The three address bits (in the consecutive frame) must be the same as those in the first frame;
otherwise, the data will be dropped.
− The order of the two start bits must be 0, then 1 in any frame; otherwise, the data rate will not be
detected correctly. The period between the falling edge of the first start bit (ST0) and the rising edge of
the second start bit (ST1) is measured to generate an internal-clock synchronized data stream.
1st Frame
ST0
A0
A1
A2
2nd Frame
D0
D1
D2
ST0
D3
ST1
SP
A0
A1
A2
D4
D5
D6
D7
ST1
SP
Example of Serial-Data Format
ST0
DATA
ST0
ST1
A0
A1
A2
D0
D1
D2
D3
SP
ST1
A0
A1
A2
D4
D5
D6
D7
SP
Internal Clock
Y0−Y7
SOUT
Timing Chart
(1)Internal clock cannot be observed.
(2)D0 is LSB and D7 is MSB. The data stream should be LSB first.
3
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SCLS555 − JUNE 2004
logic diagram
Power
On
Reset
Data
8-Bit S/R
CLK
OC
Timing
Control
4
Y0
4
8-Bit Register
Timing
and
Address
Verification
4-Bit Register
4 Data
OC
Y7
3
OSC
3
Address Data
A0
A1
A2
3-Bit
Register
SOUT
RESET
OUTSEL
OE
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)(1)
Supply voltage range, VCC1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Supply voltage range, VCC2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 14.5 V
Input voltage range, VI(2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Voltage range applied to any output in the high or low state, VO (SOUT) (2)(3) . . . . −0.5 V to VCC1 + 0.5 V
Voltage range applied to any output in the high-impedance
or power-off state, VO (SOUT) (2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Voltage range, applied to any output in the high or low state, VO (Y0-Y7)(2)(3) . . . . −0.5 V to VCC2 + 0.5 V
Voltage range applied to any output in the high-impedance
or power-off state, VO (Y0-Y7)(2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 14.5 V
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −20 mA
Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 mA
Continuous current, IO (OUTSEL = L, Y0-Y7 = L) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 mA
Package thermal impedance, θJA(4): N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(1)The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
(2)The value of VCC is provided in the recommended operating operating condition table.
(3)The package thermal impedance is calculated in accordance with JESD 51-7.
4
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SCLS555 − JUNE 2004
recommended operating conditions(1)
VCC1
VCC1
VCC2
UNIT
3
5.5
V
3
13.2
V
VIL
Low-level input voltage
VI
Input voltage
OUTSEL = H
High-level output current
SOUT
OUTSEL = H
Yn
Low-level output current
OUTSEL = L
SOUT
VCC × 0.7
VCC × 0.7
3V
3V
4.5 V
4.5 V
3V
3V
4.5 V
4.5 V
0
5.5
4.5 V
4.5 V
0
5.5
12 V
0
13.2
Output voltage
Yn
IOL
MAX
Supply voltage
High-level input voltage
IOH
MIN
Supply voltage
VIH
VO
VCC2
V
VCC × 0.3
VCC × 0.3
3V
3V
−2
4.5 V
4.5 V
−8
4.5 V
12 V
−24
3V
3V
−4
4.5 V
4.5 V
−8
3V
3V
4.5 V
4.5 V
3V
3V
20
4.5 V
4.5 V
40
3V
3V
4
4.5 V
4.5 V
8
V
V
V
mA
mA
2
8
mA
TA
Operating free-air temperature
−40
85
°C
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications
of Slow or Floating CMOS Inputs, literature number SCBA004.
5
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SCLS555 − JUNE 2004
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VT+
Positive-going input threshold
voltage
All inputs
VT−
Negative-going input threshold
voltage
All inputs
∆VT
Hysteresis
(VT+ − VT−)
All inputs
VOH
SOUT
Yn
VOL
SOUT
TYP
MAX
VCC2
3.3 V
3.3 V
2.31
5V
5V
3.5
3.3 V
3.3 V
0.99
5V
5V
1.5
3.3 V
3.3 V
0.33
1.32
5V
5V
0.5
2
UNIT
V
V
V
IOH = −2 mA
IOH = −8 mA
Yn
MIN
VCC1
3V
3V
2.38
4.5 V
4.5 V
3.8
IOH = −24 mA
IOH = −4 mA
4.5 V
12 V
11
3V
3V
2.38
IOH = −8 mA
IOL = 2 mA (OUTSEL = H)
4.5 V
4.5 V
3.8
3V
3V
0.44
IOL = 8 mA (OUTSEL = H)
IOL = 40 mA (OUTSEL = L)
4.5 V
4.5 V
0.44
4.5 V
4.5 V
0.5
3V
3V
0.44
4.5 V
4.5 V
0.44
IOL = 4 mA
IOL = 8 mA
II
IOZ
VI = 5.5 V or GND
VO = VCC or GND (OUTSEL = H)
IOH
VO = 12 V (OUTSEL = L)
V
0 to 5.5 V
±1
µA
5.5 V
5.5 V
±5
µA
5.5 V
5.5 V
5
µA
OUTSEL = H
ICC
VI = VCC or GND, IO = 0
Ioff (except SOUT)
Ci
VI or VO = 0 to 5.5 V, VCC = 0
VI = VCC or GND
OUTSEL = L
V
5
5.5 V
5.5 V
0
0
5V
5V
20
±50
5
TA = 25°C
MIN
TYP
µA
pF
switching characteristics over recommended operating free-air temperature
VCC1 = VCC2 = 3.3 V ± 0.3 V (unless otherwise noted) (see Figures 1 and 2)
range,
FROM
(INPUT)
TO
(OUTPUT)
D7
Y
Pw/2
MAX
(1)
D7
SOUT
Pw/2
(1)
RESET
OE(2)
Y
ten
OE(3)
Y
200
ns
tdis
OE(3)
Y
200
ns
PARAMETER
tpd
tw
Y
SOUT
Data rate
LOAD
CAPACITANCE
mA
MIN
MAX
200
UNIT
ns
200
CL = 50 pF
Pw
(4)
ns
2
24
Kbps
(1) The t
pd is dependent on the data pulse width (Pw), and Y outputs are changed after one-half of Pw, because the internal clock is synchronized
at the middle of the data pulse. Not tested, but specified by design.
(2) When outputs are open collector (OUTSEL = L)
(3) When outputs are push-pull (OUTSEL = H)
(4) SOUT goes low when the data is received correctly and maintains a low level for one data-pulse period. Not tested, but specified by design.
6
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SCLS555 − JUNE 2004
switching characteristics over recommended operating free-air temperature
VCC1 = VCC2 = 5 V ± 0.5 V (unless otherwise noted) (see Figures 1 and 2)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
LOAD
CAPACITANCE
TA = 25°C
TYP
D7
Y
Pw/2
MAX
(1)
D7
SOUT
Pw/2
(1)
RESET
OE(2)
Y
ten
OE(3)
Y
tdis
OE(3)
Y
tpd
tw
Data rate
Y
SOUT
MIN
MIN
MAX
150
range,
UNIT
ns
150
CL = 50 pF
Pw
150
ns
150
ns
(4)
ns
2
24
Kbps
(1) The tpd is dependent on the data pulse width (Pw), and Y outputs are changed after one-half of Pw, because the internal clock is synchronized
at the middle of the data pulse. Not tested, but specified by design.
(2) When outputs are open collector (OUTSEL = L)
(3) When outputs are push-pull (OUTSEL = H)
(4) SOUT goes low when the data is received correctly and maintains a low level for one data-pulse period. Not tested, but specified by design.
7
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SCLS555 − JUNE 2004
PARAMETER MEASUREMENT INFORMATION
(PUSH-PULL OUTPUT)
From Output
Under Test
CL = 50 pF
(see Note A)
RL = 1 kΩ
VCC1
Open
S1
TEST
GND
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
VCC1
GND
LOAD CIRCUIT
VCC1
50% VCC1
Input
50% VCC1
tPLH
In-Phase
Output
50% VCC1
VOH
50% VCC1
VOL
VOH
50% VCC1
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
50% VCC1
0V
Output
Waveform 1
S1 at VCC
(see Note B)
tPLH
50% VCC1
50% VCC1
tPZL
tPHL
tPHL
Out-of-Phase
Output
0V
VCC1
Output
Control
tPLZ
≈VCC1
50% VCC1
tPZH
Output
Waveform 2
S1 at GND
(see Note B)
VOL + 0.3 V
VOL
tPHZ
50% VCC1
VOH − 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns.
D. The outputs are measured one at a time, with one input transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPHL and tPLH are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
8
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SCLS555 − JUNE 2004
PARAMETER MEASUREMENT INFORMATION
(OPEN-COLLECTOR OUTPUT)
VCC1
VCC1
RL = 500 Ω
From Output
Under Test
Test
Point
CL
(see Note A)
NOTES: A.
B.
C.
D.
50% VCC1
tPHL
0V
tPLH
≈VCC1
Output
LOAD CIRCUIT FOR
OPEN-COLLECTOR OUTPUTS
50% VCC1
Input
50% VCC1
VOL + 0.3 V
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
CL includes probe and jig capacitance.
All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤
The outputs are measured one at a time, with one input transition per measurement.
tPHL and tPLH are the same as tpd.
Figure 2. Load Circuit and Voltage Waveforms
9
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74LV8153N
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74LV8153NE4
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74LV8153PW
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV8153PWE4
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV8153PWG4
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV8153PWR
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV8153PWRE4
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV8153PWRG4
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN74LV8153 :
• Automotive: SN74LV8153-Q1
NOTE: Qualified Version Definitions:
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Jun-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
SN74LV8153PWR
Package Package Pins
Type Drawing
TSSOP
PW
20
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
2000
330.0
16.4
Pack Materials-Page 1
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
6.95
7.1
1.6
8.0
W
Pin1
(mm) Quadrant
16.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Jun-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74LV8153PWR
TSSOP
PW
20
2000
346.0
346.0
33.0
Pack Materials-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Clocks and Timers
Interface
Logic
Power Mgmt
Microcontrollers
RFID
RF/IF and ZigBee® Solutions
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lprf
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Military
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
www.ti.com/wireless
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