ETC SFH9310

Gabellichtschranke
Slotted Interrupter
SFH 9310
Wesentliche Merkmale
Features
• Kompaktes Gehäuse
• GaAs-IR-Sendediode (950 nm)
• Si-Fototransistor mit Tageslichtsperrfilter
• Compact type
• GaAs infrared emitter (950 nm)
• Silicon phototransistor detector with
daylight-cutoff filter
Anwendungen
Applications
• Geschwindigkeitsüberwachung
• Motorsteuerung
• Überwachung des Papiervorschubs in
Druckern, Kopier- und Faxgeräten
• Speicherlaufwerke
• Steuerung des Druckkopfes in Druckern
• Münzdetektion
• Optoelektronische Schalter
• Speed control
• Motor control
• Monitoring of paper feed in printers, copiers,
facsimiles
• Disk drives
• Control of print head in printers
• Coin detection
• Optoelectronic switches
Typ
Type
Bestellnummer
Ordering Code
Gehäuse
Package
SFH 9310
Q62702-P5214
Schwarzes Polykarbonat Plastikgehäuse, Anschlüsse im 2.54-mm
Raster, Senderseite durch Buchstaben „E“, Empfängerseite durch
Buchstaben „S“ gekennzeichnet, Kathode / Transistoremitter durch
schräge Kante gekennzeichnet.
Black polycarbonate plastic material housing, solder tabs 2.54-mm
(1/10”) spacing, emitter side marked with letter “E”, sensor side
marked with letter “S”, cathode / emitter of transistor marked with edge
at an angle.
2001-02-22
1
SFH 9310
Grenzwerte TA = 25 °C
Maximum Ratings
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Sperrspannung
Reverse voltage
VR
5
V
Durchlaßstrom
Forward current
IF (DC)
60
mA
Verlustleistung
Power dissipation
Ptot
100
mW
Wärmewiderstand
Thermal resistance
RthJA
280
K/W
Kollektor-Emitter-Spannung
Collector-emitter voltage
VCE
30
V
Kollektor-Emitter-Spannung, (t ≤ 2 min)
Collector-emitter voltage, (t ≤ 2 min)
VCE
70
Emitter-Kollektor-Spannung
Emitter-collector voltage
VEC
7
Kollektorstrom
Collector current
IC
50
mA
Verlustleistung
Total power dissipation
Ptot
150
mW
Wärmewiderstand
Thermal resistance
RthJA
280
K/W
Lagertemperatur
Storage temperature range
Tstg
– 40 … + 85
°C
Betriebstemperatur
Operating temperature range
Top
– 40 … + 85
Elektrostatische Entladung
Electrostatic discharge
ESD
2
Sender (GaAs-Diode)
Emitter (GaAs Diode)
Empfänger (Si-Fototransistor)
Detector (Silicon Phototransistor)
Gabellichtschranke
Slotted Interrupter
2001-02-22
2
kV
SFH 9310
Kennwerte TA = 25 °C
Characteristics
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Wellenlänge der Strahlung
Wavelength of peak emission
λpeak
950
nm
Durchlaβspannung
Forward voltage
IF = 20 mA, tp = 20 ms
VF
1.2 (≤ 1.4)
V
Sperrstrom
Reverse current
VR = 5 V
IR
0.01 (≤ 1)
µA
Kapazität
Capacitance
VR = 0 V, f = 1 MHz
C0
16
pF
Wellenlänge der max. Fotoempfindlichkeit
Wavelength of max. sensitivity
λS max
920
nm
Spectr. Bereich der Fotoempfindlichkeit
Spectral range of sensitivity
S = 10% of Smax
λ
840 … 1080
nm
Kapazität
Capacitance
VCE = 0 V, f = 1 MHz, E = 0
CCE
6.5
pF
Dunkelstrom
Dark current
VCE = 20 V
ICEO
2 (≤ 50)
nA
Sender (GaAs-Diode)
Emitter (GaAs Diode)
Empfänger (Si-Fototransistor)
Detector (Silicon Phototransistor)
2001-02-22
3
SFH 9310
Kennwerte TA = 25 °C
Characteristics (cont’d)
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Kollektor-Emitterstrom
Collector-emitter current
IF = 20 mA; VCE = 5 V
ICE min.
ICE typ.
> 0.7
mA
Kollektor-Emitter-Sättigungsspannung
Collector-emitter-saturation voltage
IF = 20 mA; IC = 0.2 mA
VCE sat
≤ 0.4
V
Anstiegs- und Abfallzeit
Rise and fall time
VCC = 5 V, IC = 1 mA, RL = 1 kΩ
tr
tf
13
17
µs
µs
Gabellichtschranke
Slotted interrupter
2001-02-22
4
SFH 9310
Forward Current IF = f (VF)
Single pulse, tp = 20 µs
OHF00367
10 4
mA
ΙF
Max. Permissible Forward Current
IF = f (TA)
OHF00372
90
70
10
10 2
R thJA = 280 K/W
2
OHF00380
10 3
nA
Ι CEO
Ι F mA
10 3
Dark Current ICEO = f (TA)
VCE = 20 V, E = 0
60
50
10 1
10 1
40
10 0
30
10 0
20
10
-1
10
10 -2
0
0.5
1
1.5
2
2.5
3
V
VF
4
0
0
20
40
60
Total Power Dissipation for
Emitter and Detector Ptot = f (TA)
OHF00410
160
P tot
Detector
140
120
Emitter
100
80
60
40
20
0
0
20
2001-02-22
40
60
80 ˚C 100
TA
5
80
C
TA
120
10 -1
0
20
40
60
80 ˚C 100
TA
SFH 9310
Maßzeichnung
Package Outlines
2
1
3
4
14.4 (0.567)
4.8 (0.189)
3.5 (0.138)
2.5 (0.098)
5.8 (0.228)
7.8 (0.307)
10.1 (0.398)
0.3 (0.012)
10.5 (0.413)
10.5 (0.413)
0.5 (0.020)
2.34 (0.092)
8.0 (0.315)
2.74 (0.108)
Marking
this side
0.6 (0.024)
0.4 (0.016)
2.54 (0.100)
2.0 (0.079)
10.1 (0.398)
Emitter
1
Circuitry
4
2
Sensor
3
GPXY6010
Maße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
2001-02-22
6
7.7 (0.303)
6.2 (0.244)
0.6 (0.024)
0.4 (0.016)
Optical axis
14.0 (0.551)
5.2 (0.205)
SFH 9310
Löthinweise
Soldering Conditions
Bauform
Type
SFH 9310
Tauch-, Schwalllötung
Dip, Wave Soldering
Reflowlötung
Reflow Soldering
Kolbenlötung
Iron Soldering
Peak Temp.
(solderbath)
Max. Time in
Peak Zone
Peak Temp.
(package
temp.)
Max. Time in
Peak Zone
(Iron temp.)
260 °C
10 s
n. a.
–
300 °C < 5 s
Published by OSRAM Opto Semiconductors GmbH & Co. OHG
Wernerwerkstrasse 2, D-93049 Regensburg
© All Rights Reserved.
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our Sales Organization.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical
components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS.
1
A critical component is a component usedin a life-support device or system whose failure can reasonably be expected
to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system.
2
Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain
and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.
2001-02-22
7