TPD6F002 www.ti.com SLLS876A – AUGUST 2008 – REVISED NOVEMBER 2009 SIX-CHANNEL EMI FILTER FOR LCD DISPLAY/KEYPAD APPLICATION Check for Samples: TPD6F002 FEATURES 1 • • • Six-Channel EMI Filtering for Data Ports Robust ESD Protection Exceeds IEC61000-4-2 (Level 4) – ±15-kV Human-Body Model (HBM) – ±20-kV IEC 61000-4-2 Contact Discharge – ±30-kV IEC 61000-4-2 Air-Gap Discharge Pi-Style (C-R-C) Filter Configuration (R = 100 Ω, CTOTAL = 34 pF) Less than 20-nA Leakage Current Across Temperature and Process Variation – -35 dB Insertion Loss at 800 MHz – -57 dB Crosstalk Attenuation at 100 MHz – -35 dB Insertion Loss at 800 MHz – -3 dB Bandwidth 100 MHz Space-Saving SON Package (3 mm × 1.35 mm) and Flow-Through Pin Mapping Provides Optimum Filter Performance DSV PACKAGE (TOP VIEW) Ch1_In Ch1_Out Ch2_In Ch2_Out Ch3_In Ch3_Out Ch4_In GND • • Ch4_Out Ch5_In Ch5_Out Ch6_In Ch6_Out APPLICATIONS • • • • LCD Display Interface Keypad SVGA Video Connections Memory Interface DESCRIPTION/ORDERING INFORMATION The TPD6F002 is a six-channel EMI filter in a space-saving DSV package. This low-pass filter array reduces EMI emissions and provides system-level ESD protection at the data ports. Because of its small package and easy-to-use pin assignments, this device is suitable for a wide array of applications such as mobile handsets, PDAs, video consoles, notebook computers, etc. In particular, the TPD6F002 is ideal for EMI filtering and protecting data lines from ESD at the LCD display, keypad, and memory interfaces. The pi-style (C-R-C) filter provides at least 35 dB attenuation in the carrier frequency range. The TPD6F002 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interferences. This filter includes ESD protection circuitry that prevents damage to the application when subjected to ESD up to IEC 61000-4-2 ±20 kV Contact ESD and ±30 kV Air-Gap ESD. The TPD6F002 is specified for –40°C to 85°C operation. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2008–2009, Texas Instruments Incorporated TPD6F002 SLLS876A – AUGUST 2008 – REVISED NOVEMBER 2009 www.ti.com ORDERING INFORMATION PACKAGE (1) TA –40°C to 85°C (1) (2) (2) 0.5-mm pitch SON – DSV PACKAGE DIMENSION Length = 3 mm, Width = 1.35 mm, Pitch = 0.5 mm, Height = 0.75 mm) ORDERABLE PART NUMBER TOP-SIDE MARKING TPD6F002DSVR YM3NS For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. EQUIVALENT SCHEMATIC REPRESENTATION 100Ω Ch_In C1 =17pF Ch_Out C2=17pF GND ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) MIN VIO IO to GND Tstg Storage temperature range TJ Junction temperature Lead temperature (soldering, 10 s) (1) MAX –65 UNIT 6 V 150 °C 150 °C 300 °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS TA = –40°C to 85°C (Unless otherwise noted) PARAMETER TEST CONDITIONS IIO = 10 μA MIN TYP (1) MAX UNIT 100 115 Ω 20 nA VBR DC breakdown voltage R Resistance C Capacitance (C1 or C2) VIO = 2.5 V 17 IIO Channel leakage current VIO = 3.3 V 1 fC Cut-off frequency ZSOURCE = 50 Ω, ZLOAD = 50 Ω (1) 6 85 V pF 100 MHz Typical values are at TA = 25°C. ESD PROTECTION PARAMETER TYP UNIT HBM ±15 kV IEC 61000-4-2 Contact Discharge ±20 kV IEC 61000-4-2 Air-Gap Discharge ±30 kV 2 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TPD6F002 TPD6F002 www.ti.com SLLS876A – AUGUST 2008 – REVISED NOVEMBER 2009 TYPICAL OPERATING CHARACTERISTCS 1.00E-05 8.00E-06 6.00E-06 -40C 25C 85C 4.00E-06 C u r re n t ( µ A ) 2.00E-06 0.00E+00 -2.00E-06 -4.00E-06 -6.00E-06 -8.00E-06 -1.00E-05 -7 -5 -3 -1 1 3 5 7 Voltage (V) Figure 1. DC Voltage-Current Sweep across Input, Output Pins Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TPD6F002 3 TPD6F002 SLLS876A – AUGUST 2008 – REVISED NOVEMBER 2009 www.ti.com 150 R e s is t a n c e ( o h m s ) 100 50 0 -40 25 85 Temp (C) Figure 2. Series Resistance vs Temperature 4 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TPD6F002 TPD6F002 www.ti.com SLLS876A – AUGUST 2008 – REVISED NOVEMBER 2009 0 -10 -20 -30 S 4 1 (d B ) -40 -50 -60 -70 -80 -90 -100 1.00E+06 1.00E+07 1.00E+08 1.00E+09 frequency (Hz) Figure 3. Channel-to-Channel Crosstalk Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TPD6F002 5 TPD6F002 SLLS876A – AUGUST 2008 – REVISED NOVEMBER 2009 www.ti.com 0 -5 -10 I n s e rt io n L o s s ( d B ) -15 -20 -25 -30 -35 -40 -45 1.00E+06 1.00E+07 1.00E+08 1.00E+09 Frequency (Hz) Figure 4. TPD6F002 Typical Insertion-loss Characteristics (TA = 25°C, DC Bias = 0 V, 50 Ω Environment) 6 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TPD6F002 TPD6F002 www.ti.com SLLS876A – AUGUST 2008 – REVISED NOVEMBER 2009 30 C1 C2 25 C a p a c i ta n c e (p F ) 20 15 10 5 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 Voltage Bias (V) Figure 5. Capacitance (C1 or C2) vs. Bias Voltage Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TPD6F002 7 PACKAGE OPTION ADDENDUM www.ti.com 12-Mar-2010 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing TPD6F002DSVR ACTIVE SON DSV Pins Package Eco Plan (2) Qty 12 3000 Green (RoHS & no Sb/Br) Lead/Ball Finish CU NIPDAU MSL Peak Temp (3) Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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