LOGIC LF2249QC25

LF2249
LF2249
DEVICES INCORPORATED
12 x 12-bit Digital Mixer
12 x 12-bit Digital Mixer
DEVICES INCORPORATED
FEATURES
DESCRIPTION
user control for subtraction of products. The sum of the products can
also be internally rounded to 16 bits
during the accumulation process.
The LF2249 is a high-speed digital
mixer comprised of two 12-bit
multipliers and a 24-bit accumulator.
All multiplier inputs are user accessible, and each can be updated on
every clock cycle. The LF2249 utilizes
a pipelined architecture with fully
registered inputs and outputs and an
asynchronous three-state output
enable control for optimum flexibility.
❑ 40 MHz Data and Computation Rate
❑ Two 12 x 12-bit Multipliers with
Individual Data Inputs
❑ Separate 16-bit Input Port for
Cascading Devices
❑ Independent, User-Selectable 1–16
Clock Pipeline Delay for Each Data
Input
❑ User-Selectable Rounding of Products
❑ Fully Registered, Pipelined
Architecture
A separate 16-bit input port connected to the accumulator is included
to allow cascading of multiple
LF2249s. Access to all 24 bits of the
accumulator is gained by switching
between upper or lower 16-bit words.
The accumulated output data is
updated on every clock cycle.
Independent input register clock
enables allow the user to hold the
data inputs over multiple clock cycles.
Each multiplier input also includes a
user-selectable 1-16 clock pipeline
delay. The output of each multiplier
can be independently negated under
❑ Three-State Outputs
❑ Fully TTL Compatible
❑ Replaces TRW/Raytheon/Fairchild
TMC2249
❑ 120-pin PQFP
All inputs and outputs of the LF2249
are registered on the rising edge of
clock, except for OE. Internal pipeline
registers for all data and control
inputs are provided to maintain
LF2249 BLOCK DIAGRAM
1
2
3
4
5
6
7
ADEL3-0 A11-0
ENA
BDEL3-0 B11-0
ENB
CDEL3-0 C11-0
ENC
DDEL3-0 D11-0
END
8
1–16
1–16
1–16
1–16
9
CLK
NEG1
4
RND
4
2's COMP
2's COMP
4
NEG2
4
ACC
FT
16
CASEN
SWAP
24
16
3
2:1
CAS15-0
16
MS
1
16
0
2:1
0
LS
1
2:1
OE
16
NOTE: NUMBERS IN REGISTERS INDICATED
NUMBER OF PIPELINE DELAYS.
S15-0
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LF2249
DEVICES INCORPORATED
synchronous operation between the
incoming data and all available
control functions. The LF2249 operates at a clock rate of 40 MHz over the
full commercial temperature and
supply voltage ranges.
12 x 12-bit Digital Mixer
DETAILED VIEW OF BLOCK DIAGRAM OUTLINED AREA
ADEL3-0
A11-0
4
ENA
12
Because of its flexibility, the LF2249 is
ideally suited for applications such as
image switching and mixing, digital
quadrature mixing and modulating,
FIR filtering, and arithmetic function
and waveform synthesis.
R1
R2
SIGNAL DEFINITIONS
Power
VCC and GND
CLK
R16
+5 V power supply. All pins must be
connected.
16 : 1
Clock
CLK — Master Clock
The rising edge of CLK strobes all enabled registers. All timing specifications are referenced to the rising edge of
CLK.
12
FIGURE 1A.
Data Input
Inputs
11 10 9 8 7 6 5 4 3 2 1 0
–211 210 29 28 27 26 25 24 23 22 21 20
A11-0–D11-0 — Data Inputs
A11-0–D11-0 are 12-bit data input registers. Data is latched into the input registers on the rising edge of CLK. The
contents of the input registers are
clocked into the top of the corresponding 16-stage pipeline delay (pushing the
contents of the register stack down one
register position) on the next clock cycle
if the pipeline register stack is enabled.
The LSBs are A0-D0 (Figure 1a).
CAS15-0 — Cascade Data Input
CAS15-0 is the 16-bit cascade data input
port. Data is latched into the register on
the rising edge of CLK. The LSB is CAS0
(Figure 1a).
INPUT FORMATS
(Sign)
Cascade Input
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
–223 222 221 220 219 218 217 216 215 214 213 212 211 210 29 28
(Sign)
FIGURE 1B.
OUTPUT FORMATS
Sum Output (Upper 16 bits)
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
–223 222 221 220 219 218 217 216 215 214 213 212 211 210 29 28
(Sign)
Sum Output (Lower 16 bits)
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
215 214 213 212 211 210 29 28 27 26 25 24 23 22 21 20
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LF2249
DEVICES INCORPORATED
Outputs
12 x 12-bit Digital Mixer
NEG1–NEG2 — Negate Control
S15-0 — Data Output
The NEG1 and NEG2 controls determine whether a subtraction or accumuThe current 16-bit result is available
lation of products is performed. When
on the S 15-0 outputs. The output data
NEG1 is HIGH, the product A x B is
may be either the upper or lower 16
negated, causing the product to be subbits of the accumulator output, detracted from the accumulator contents.
pending on the state of SWAP. The
Likewise, when NEG2 is HIGH, the
LSB is S0 (Figure 1b).
product C x D is negated, causing the
product to be subtracted as well. NEG1
and NEG2 determine the operation to
Controls
be performed on the data input during
ENA–END — Pipeline Register Enable
the current clock cycle when ADEL–
Input data in the N (N = A, B, C, or D) DDEL = 0000.
input register is latched into the corresponding pipeline register stack on
CASEN — Cascade Enable
each rising edge of CLK for which ENN
is LOW. Data already in the N register When CASEN is LOW, data being instack is pushed down one register posi- put on the CAS15-0 inputs during that
tion. When ENN is HIGH, the data in clock cycle will be registered and accuthe N pipeline register stack does not mulated internally. When CASEN is
change, and the data in the N input HIGH, the CAS15-0 inputs are ignored.
register will not be stored in the register
stack.
FT — Feedthrough Control
When FT is LOW and ADEL–DDEL =
ADEL3-0–DDEL3-0 — Pipeline Delay
0000, data being input on the CAS15-0
Select
inputs is delayed three clock cycles to
NDEL (N = A, B, C, or D) is the 4-bit align the data with the data being input
registered pipeline delay select word. on the A11-0–D11-0 inputs. When FT is
NDEL determines which stage of the N HIGH, the cascade data being input is
pipeline register stack is routed to the routed around the three delay registers
multiplier inputs. The minimum delay to simplify the cascading of multiple
is one clock cycle (NDEL = 0000), and devices.
the maximum delay is 16 clock cycle
(NDEL = 1111). Upon power up, the
values of ADEL–DDEL and the contents of the pipeline register stacks are
unknown and must be initialized by the
user.
ACC — Accumulator Control
The ACC input determines whether internal accumulation is performed on
the data input during the current clock
cycle. If ACC is LOW, no accumulation
is performed, the prior accumulated
sum is cleared, and the current sum of
products is output. When ACC is
HIGH, the emerging products are
added to the sum of the previous products.
1
RND — Rounding Control
3
When RND is HIGH, the sum of the
products of the data being input on
the current clock cycle will be
rounded to 16 bits. To avoid the accumulation of roundoff errors, rounding is only performed during the first
cycle of each accumulation process.
4
5
6
SWAP — Output Select
The SWAP control allows the user to
access all 24 bits of the accumulator
output by switching between upper
and lower 16-bit words. When SWAP
is HIGH, the upper 16 bits of the accumulator are always output. When
SWAP is LOW, the lower 16 bits of the
accumulator are output on every
other clock cycle. As long as SWAP
remains LOW, new output data will
not be clocked into the output registers.
7
8
9
10
OE — Output Enable
When the OE signal is LOW, the
current data in the output registers
is available on the S 15-0 pins. When
OE is HIGH, the outputs are in a
high-impedance state.
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LF2249
DEVICES INCORPORATED
12 x 12-bit Digital Mixer
MAXIMUM RATINGS Above which useful life may be impaired (Notes 1, 2, 3, 8)
Storage temperature ........................................................................................................... –65°C to +150°C
Operating ambient temperature ........................................................................................... –55°C to +125°C
VCC supply voltage with respect to ground ............................................................................ –0.5 V to +7.0 V
Input signal with respect to ground ............................................................................... –0.5 V to V CC + 0.5 V
Signal applied to high impedance output ...................................................................... –0.5 V to VCC + 0.5 V
Output current into low outputs ............................................................................................................. 25 mA
Latchup current ............................................................................................................................... > 400 mA
OPERATING CONDITIONS To meet specified electrical and switching characteristics
Mode
Temperature Range (Ambient)
Active Operation, Commercial
Active Operation, Military
Supply Voltage
0°C to +70°C
4.75 V ≤ VCC ≤ 5.25 V
–55°C to +125°C
4.50 V ≤ VCC ≤ 5.50 V
ELECTRICAL CHARACTERISTICS Over Operating Conditions (Note 4)
Symbol
Parameter
Test Condition
Min
VOH
Output High Voltage
Vcc = Min., IOH = –2.0 mA
VOL
Output Low Voltage
Vcc = Min., IOL = 4.0 mA
VIH
Input High Voltage
VIL
Input Low Voltage
(Note 3)
IIX
Input Current
IOZ
Typ
Max
2.4
Unit
V
0.4
V
2.0
VCC
V
0.0
0.8
V
Ground ≤ VIN ≤ VCC (Note 12)
±10
µA
Output Leakage Current
(Note 12)
±40
µA
ICC1
VCC Current, Dynamic
(Notes 5, 6)
100
mA
ICC2
VCC Current, Quiescent
(Note 7)
6
mA
CIN
Input Capacitance
TA = 25°C, f = 1 MHz
10
pF
COUT
Output Capacitance
TA = 25°C, f = 1 MHz
10
pF
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LF2249
DEVICES INCORPORATED
12 x 12-bit Digital Mixer
SWITCHING CHARACTERISTICS
COMMERCIAL OPERATING RANGE (0°C to +70°C) Notes 9, 10 (ns)
Symbol
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40*
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Min
Max
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40
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15
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10
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8
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0
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17
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15
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15
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Parameter
tCYC
Cycle Time
tPWL
Clock Pulse Width, LOW
tPWH
Clock Pulse Width, HIGH
tS
Input Setup Time
tH
Input Hold Time
tD
Output Delay
tENA
Three-State Output Enable Delay (Note 11)
tDIS
Three-State Output Disable Delay (Note 11)
LF224933
Min
Max
25
Min
33
25
15
10
10
10
8
7
0
0
Max
2
3
15
14
15
15
15
15
Parameter
tCYC
Cycle Time
tPWL
Clock Pulse Width, LOW
tPWH
Clock Pulse Width, HIGH
tS
Input Setup Time
tH
Input Hold Time
tD
Output Delay
tENA
Three-State Output Enable Delay (Note 11)
tDIS
Three-State Output Disable Delay (Note 11)
4
5
MILITARY OPERATING RANGE (–55°C to +125°C) Notes 9, 10 (ns)
Symbol
1
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LF224912345678901234567890123456789012
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*
40
33*
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Min
Max
Min
Max
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40
33
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15
15
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10
10
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8
8
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0
0
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17
15
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15
15
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15
15
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6
7
8
9
10
SWITCHING WAVEFORMS
1
2
3
6
7
11
8
CLK
tPWH
tH
A11-0 – D11-0
N
N+1
tPWL
N+2
tS
CONTROLS
(Except OE)
tD
HIGH IMPEDANCE
S15-0*
tDIS
SN
SN + 1
SN + 2
tENA
OE
*Assumes ADEL–DDEL = 0000
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*DISCONTINUED SPEED GRADE
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LF2249
DEVICES INCORPORATED
12 x 12-bit Digital Mixer
NOTES
1. Maximum Ratings indicate stress
specifications only. Functional operation of these products at values beyond
those indicated in the Operating Conditions table is not implied. Exposure to
maximum rating conditions for extended periods may affect reliability.
9. AC specifications are tested with
input transition times less than 3 ns,
output reference levels of 1.5 V (except
tDIS test), and input levels of nominally
0 to 3.0 V. Output loading may be a
resistive divider which provides for
specified IOH and IOL at an output
voltage of VOH min and VOL max
2. The products described by this spec- respectively. Alternatively, a diode
ification include internal circuitry de- bridge with upper and lower current
signed to protect the chip from damagsources of IOH and I OL respectively,
ing substrate injection currents and ac- and a balancing voltage of 1.5 V may be
cumulations of static charge. Neverthe- used. Parasitic capacitance is 30 pF
less, conventional precautions should minimum, and may be distributed.
be observed during storage, handling,
and use of these circuits in order to This device has high-speed outputs caavoid exposure to excessive electrical pable of large instantaneous current
stress values.
pulses and fast turn-on/turn-off times.
As a result, care must be exercised in the
3. This device provides hard clamping of testing of this device. The following
transient undershoot and overshoot. In- measures are recommended:
put levels below ground or above VCC
will be clamped beginning at –0.6 V and a. A 0.1 µF ceramic capacitor should be
VCC + 0.6 V. The device can withstand installed between VCC and Ground
indefinite operation with inputs in the leads as close to the Device Under Test
range of –0.5 V to +7.0 V. Device opera- (DUT) as possible. Similar capacitors
tion will not be adversely affected, how- should be installed between device VCC
ever, input current levels will be well in and the tester common, and device
ground and tester common.
excess of 100 mA.
4. Actual test conditions may vary from b. Ground and VCC supply planes
those designated but operation is guar- must be brought directly to the DUT
anteed as specified.
socket or contactor fingers.
5. Supply current for a given applica- c. Input voltages should be adjusted to
tion can be accurately approximated by: compensate for inductive ground and VCC
noise to maintain required DUT input
NCV2 F
levels relative to the DUT ground pin.
4
where
10. Each parameter is shown as a minN = total number of device outputs
C = capacitive load per output
V = supply voltage
F = clock frequency
6. Tested with all outputs changing every cycle and no load, at a 25 MHz clock
rate.
7. Tested with all inputs within 0.1 V of
VCC or Ground, no load.
8. These parameters are guaranteed
but not 100% tested.
11. For the tENA test, the transition is
measured to the 1.5 V crossing point
with datasheet loads. For the tDIS test,
the transition is measured to the
±200mV level from the measured
steady-state output voltage with
±10mA loads. The balancing voltage, V TH , is set at 3.5 V for Z-to-0
and 0-to-Z tests, and set at 0 V for Zto-1 and 1-to-Z tests.
12. These parameters are only tested at
the high temperature extreme, which is
the worst case for leakage current.
FIGURE A. OUTPUT LOADING CIRCUIT
S1
DUT
IOL
VTH
CL
IOH
FIGURE B. THRESHOLD LEVELS
tENA
OE
Z
tDIS
1.5 V
1.5 V
3.5V Vth
0
1.5 V
1.5 V
Z
1
VOL*
0.2 V
VOH*
0.2 V
0
Z
1
Z
0V Vth
VOL* Measured VOL with IOH = –10mA and IOL = 10mA
VOH* Measured VOH with IOH = –10mA and IOL = 10mA
imum or maximum value. Input requirements are specified from the point
of view of the external system driving
the chip. Setup time, for example, is
specified as a minimum since the external system must supply at least that
much time to meet the worst-case requirements of all parts. Responses from
the internal circuitry are specified from
the point of view of the device. Output
delay, for example, is specified as a
maximum since worst-case operation of
any device always provides data within
that time.
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LF2249
DEVICES INCORPORATED
12 x 12-bit Digital Mixer
D5
D6
D7
D8
GND
D9
D10
D11
VCC
C11
C10
C9
C8
C7
C6
C5
C4
C3
C2
C1
120
119
118
117
116
115
114
113
112
111
110
109
108
107
106
105
104
103
102
101
100
99
98
97
96
95
94
93
92
91
120-pin
D4
DDEL0
DDEL1
DDEL2
DDEL3
END
D0
D1
D2
D3
ORDERING INFORMATION
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
2
3
4
5
6
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
Top
View
1
C0
ENC
CDEL3
CDEL2
CDEL1
CDEL0
FT
CASEN
CAS0
CAS1
CAS2
CAS3
CAS4
CAS5
CAS6
CAS7
CAS8
CAS9
GND
CAS10
CAS11
CAS12
CAS13
CAS14
CAS15
NC
ADEL0
ADEL1
ADEL2
ADEL3
7
BDEL2
BDEL3
ENB
B0
B1
B2
B3
B4
B5
B6
B7
GND
B8
B9
B10
VCC
B11
A11
A10
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
ENA
CLK
ACC
NEG1
NEG2
RND
S15
S14
GND
S13
S12
S11
VCC
S10
S9
S8
GND
S7
S6
S5
VCC
S4
S3
S2
GND
S1
S0
OE
SWAP
BDEL0
BDEL1
8
Plastic Quad Flatpack
(Q1)
Speed
9
0°C to +70°C — COMMERCIAL SCREENING
33 ns
25 ns
LF2249QC33
LF2249QC25
10
11
–40°C to +85°C — COMMERCIAL SCREENING
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LF2249
DEVICES INCORPORATED
12 x 12-bit Digital Mixer
ORDERING INFORMATION
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120-pin
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1
2
3
4
5
6
7
8
9
10
11
12
13
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A
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D4
D7
D8
D10 C11 C9
DDEL0 DDEL3 END D2
C6
C3
C0
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B
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D9
D11 C10
D3
D6
NEG1 ACC DDEL1 D0
C7
C5
C2 CDEL2
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C
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D5 GND VCC C8
S15 RND CLK DDEL2 D1
C4
C1 ENC CDEL1
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D
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CDEL3 CDEL0 CASEN
S13 S14 NEG2
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KEY
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E
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FT CAS0 CAS1
S11 S12 GND
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F
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Top View
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S9
S10 VCC
CAS2 CAS3 CAS4
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Through Package
G
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S7
S8 GND
CAS6 CAS7 CAS5
(i.e., Component Side Pinout)
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H
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S6
S5 VCC
GND CAS9 CAS8
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J
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CAS13 CAS11 CAS10
S4
S3 GND
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K
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S2
S1 SWAP
ADEL0 CAS14 CAS12
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L
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B4 GND VCC A9
A5
S0 BDEL0 BDEL2 B0
A1 ADEL3 NC CAS15
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M
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B3
B6
B10 A10
A7
B8
OE BDEL3 B1
A4
A0 ADEL2 ADEL1
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N
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B5
B7
B9
B11 A11
A8
BDEL1 ENB B2
A6
A3
A2 ENA
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Discontinued Package
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Ceramic Pin Grid Array
(G4)
Speed
0°C to +70°C — COMMERCIAL SCREENING
–55°C to +125°C — COMMERCIAL SCREENING
–55°C to +125°C — MIL-STD-883 COMPLIANT
Video Imaging Products
8
08/16/2000–LDS.2249-J